CN112827318A - Carbon nanotube sponge low-temperature adsorption plate without adhesive - Google Patents
Carbon nanotube sponge low-temperature adsorption plate without adhesive Download PDFInfo
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- CN112827318A CN112827318A CN202110183324.3A CN202110183324A CN112827318A CN 112827318 A CN112827318 A CN 112827318A CN 202110183324 A CN202110183324 A CN 202110183324A CN 112827318 A CN112827318 A CN 112827318A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 172
- 239000002041 carbon nanotube Substances 0.000 title claims abstract description 127
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims abstract description 126
- 238000001179 sorption measurement Methods 0.000 title claims abstract description 116
- 239000000853 adhesive Substances 0.000 title claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- 239000010935 stainless steel Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 9
- 239000010963 304 stainless steel Substances 0.000 description 34
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 32
- 239000007789 gas Substances 0.000 description 32
- 235000013162 Cocos nucifera Nutrition 0.000 description 15
- 244000060011 Cocos nucifera Species 0.000 description 15
- 239000001307 helium Substances 0.000 description 14
- 229910052734 helium Inorganic materials 0.000 description 14
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 14
- 239000003463 adsorbent Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000921 elemental analysis Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052722 tritium Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000013590 bulk material Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
- B01D53/0407—Constructional details of adsorbing systems
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B37/00—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00
- F04B37/06—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means
- F04B37/08—Pumps having pertinent characteristics not provided for in, or of interest apart from, groups F04B25/00 - F04B35/00 for evacuating by thermal means by condensing or freezing, e.g. cryogenic pumps
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21B—FUSION REACTORS
- G21B1/00—Thermonuclear fusion reactors
- G21B1/11—Details
- G21B1/17—Vacuum chambers; Vacuum systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
- B01D2253/10—Inorganic adsorbents
- B01D2253/102—Carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
- B01D2253/30—Physical properties of adsorbents
- B01D2253/302—Dimensions
- B01D2253/304—Linear dimensions, e.g. particle shape, diameter
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2253/00—Adsorbents used in seperation treatment of gases and vapours
- B01D2253/30—Physical properties of adsorbents
- B01D2253/34—Specific shapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/10—Single element gases other than halogens
- B01D2257/108—Hydrogen
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/10—Single element gases other than halogens
- B01D2257/11—Noble gases
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Abstract
The invention provides a carbon nanotube sponge low-temperature adsorption plate without an adhesive, which comprises: the low-temperature adsorption plate comprises a low-temperature adsorption plate main body, carbon nanotube sponge and a metal wire grid assembly; the carbon nanotube sponge is arranged between the low-temperature adsorption plate main body and the metal wire grid assembly and is fixed on the surface of the low-temperature adsorption plate main body through the metal wire grid assembly; the periphery of the metal wire grid assembly is fixedly connected to the surface of the low-temperature adsorption plate main body. Compared with the prior art, the carbon nanotube sponge is fixed on the surface of the low-temperature adsorption plate main body in a mechanical fixing mode, so that the carbon nanotube sponge is prevented from falling off in the use process of the low-temperature pump, and is convenient to maintain and replace; the carbon nanotube sponge and the low-temperature adsorption plate main body are in direct contact, so that an inorganic adhesive can be prevented from being introduced; moreover, the carbon nanotube sponge has excellent adsorption capacity and lower impurity content, and can improve the safety of a low-temperature pump and subsequent processes.
Description
Technical Field
The invention belongs to the technical field of nuclear fusion, and particularly relates to a carbon nanotube sponge low-temperature adsorption plate without an adhesive.
Background
The fusion energy is expected to end up the energy crisis as nuclear energy. At present, China is developing the research work of a new generation of advanced fusion reactor CFETR (China fusion engineering experimental reactor), aiming at building a safe, reliable, stable and continuous fusion experimental device and laying a technical foundation for solving the energy problem in the future.
The CFETR overall vacuum system consists of several cryopumps (cryopump body structure see fig. 1) that provide stable pumping speed and vacuum by alternating operation, each cryopump being equipped with 28 cryopumps, each having its surface coated with a cryosorbent for adsorbing the difficult-to-condense gaseous hydrogen isotopes and helium at a temperature of 4.5K.
The traditional low-temperature adsorption plate adopts coconut shell type activated carbon as a low-temperature adsorption material and is fixed by an inorganic adhesive. However, the coconut shell type activated carbon as a low-temperature adsorbent has the problems of non-uniform structure, high impurity content, easy shedding and pulverization, poor heat-conducting property and the like.
Disclosure of Invention
In view of the above, the present invention provides a carbon nanotube sponge low temperature adsorption plate without using an adhesive.
The invention provides a carbon nanotube sponge low-temperature adsorption plate without an adhesive, which comprises:
the low-temperature adsorption plate comprises a low-temperature adsorption plate main body, carbon nanotube sponge and a metal wire grid assembly;
the carbon nanotube sponge is arranged between the low-temperature adsorption plate main body and the metal wire grid assembly and is fixed on the surface of the low-temperature adsorption plate main body through the metal wire grid assembly;
the periphery of the metal wire grid assembly is fixedly connected to the surface of the low-temperature adsorption plate main body.
Preferably, the low-temperature adsorption plate main body is of a hollow structure, and two ends perpendicular to the surface of the sponge contacting the carbon nanotubes are respectively provided with a supercritical gas inlet and a supercritical gas outlet.
Preferably, the outer diameters of the supercritical gas inlet and the supercritical gas outlet are respectively and independently 5-10 mm; the inner diameters are each independently 2 to 7 mm.
Preferably, the radius of the metal wires in the metal wire grid assembly is 0.2-2 mm.
Preferably, the width and the length of the grids in the metal wire grid assembly are respectively and independently 5-15 mm.
Preferably, the thickness of the carbon nanotube sponge is 10-20 mm.
Preferably, the thickness of the low-temperature adsorption plate main body is 15-25 mm.
Preferably, the metal wire grid assembly is a stainless steel grid assembly.
Preferably, the specification of the low-temperature adsorption plate main body is 1000 × 200 × 20 mm; the specification of the carbon nano tube sponge is 900 multiplied by 170 multiplied by 15 mm; the specification of the wire grid assembly is 920 multiplied by 180 multiplied by 16 mm.
The invention also provides an application of the carbon nanotube sponge low-temperature adsorption plate in CFETR.
The invention provides a carbon nanotube sponge low-temperature adsorption plate without an adhesive, which comprises: the low-temperature adsorption plate comprises a low-temperature adsorption plate main body, carbon nanotube sponge and a metal wire grid assembly; the carbon nanotube sponge is arranged between the low-temperature adsorption plate main body and the metal wire grid assembly and is fixed on the surface of the low-temperature adsorption plate main body through the metal wire grid assembly; the periphery of the metal wire grid assembly is fixedly connected to the surface of the low-temperature adsorption plate main body. Compared with the prior art, the carbon nanotube sponge is fixed on the surface of the low-temperature adsorption plate main body in a mechanical fixing mode, so that the carbon nanotube sponge is prevented from falling off in the use process of the low-temperature pump, and is convenient to maintain and replace when the low-temperature pump fails; the carbon nanotube sponge and the low-temperature adsorption plate main body are in direct contact, so that an inorganic adhesive can be prevented from being introduced; moreover, the carbon nanotube sponge has excellent adsorption capacity and lower impurity content, and can improve the safety of a low-temperature pump and subsequent processes.
Drawings
FIG. 1 is a block diagram of a CFETR cryopump body;
FIG. 2 is a schematic structural diagram of a carbon nanotube sponge low-temperature adsorption plate provided by the present invention;
FIG. 3 is a schematic structural diagram of a carbon nanotube sponge low-temperature adsorption plate according to the present invention;
FIG. 4 is a three-dimensional rendering of the carbon nanotube sponge low-temperature adsorption plate provided by the present invention;
FIG. 5 is a diagram of a carbon nanotube sponge according to the present invention;
fig. 6 is a diagram of a carbon nanotube sponge low-temperature adsorption plate provided in embodiment 1 of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a carbon nanotube sponge low-temperature adsorption plate without an adhesive, which comprises:
the low-temperature adsorption plate comprises a low-temperature adsorption plate main body, carbon nanotube sponge and a metal wire grid assembly;
the carbon nanotube sponge is arranged between the low-temperature adsorption plate main body and the metal wire grid assembly and is fixed on the surface of the low-temperature adsorption plate main body through the metal wire grid assembly;
the periphery of the metal wire grid assembly is fixedly connected to the surface of the low-temperature adsorption plate main body.
Referring to fig. 2 to 4, fig. 2 and 3 are schematic structural diagrams of the carbon nanotube sponge low-temperature adsorption plate without an adhesive according to the present invention, in fig. 3, a is a top view of the carbon nanotube sponge low-temperature adsorption plate, B is a plan view of the carbon nanotube sponge low-temperature adsorption plate in different directions, and fig. 4 is a three-dimensional rendering view of the carbon nanotube sponge low-temperature adsorption plate according to the present invention; wherein 1 is a low-temperature adsorption plate main body, 2 is a carbon nano tube sponge, 3 is a metal wire grid component, 4 is a supercritical gas inlet, and 5 is a supercritical gas outlet.
The carbon nanotube sponge low-temperature adsorption plate provided by the invention comprises a low-temperature adsorption plate main body, wherein the low-temperature adsorption plate main body is of a main body structure of the carbon nanotube sponge low-temperature adsorption plate and is used for bearing a carbon nanotube sponge and a metal wire grid assembly; the low-temperature adsorption plate main body is preferably a stainless steel low-temperature adsorption plate main body; the length of the low-temperature adsorption plate main body is preferably 800-1500 mm, more preferably 800-1200 mm, and further preferably 1000 mm; the width of the low-temperature adsorption plate is preferably 100-300 mm, more preferably 150-250 mm, and further preferably 200 mm; the thickness of the low-temperature adsorption plate main body is preferably 15-25 mm, and more preferably 20 mm; the low-temperature adsorption plate main body is preferably of a hollow structure, and forms a flow channel of supercritical gas by injecting high-pressure water; the two ends of the low-temperature adsorption plate main body along the supercritical gas flow channel in the hollow structure, namely the two ends vertical to the surface contacting the carbon nanotube sponge, are preferably provided with a supercritical gas inlet and a supercritical gas outlet respectively; the supercritical gas inlet and the hollow structure are communicated with the supercritical gas outlet and used for cooling the surface of the low-temperature adsorption plate main body through supercritical gas; after flowing out from the supercritical gas outlet, the supercritical gas can also flow into the next low-temperature adsorption plate main body; the supercritical gas is preferably supercritical helium, and the surface of the low-temperature adsorption plate body can be cooled to 4.5K so as to adsorb helium and hydrogen isotopes which are difficult to condense; the supercritical gas inlet and the supercritical gas outlet are preferably tubular, more preferably stainless steel tubes, and further preferably 304 stainless steel tubes; the outer diameters of the supercritical gas inlet and the supercritical gas outlet are respectively and independently preferably 5-10 mm, and more preferably 6-8 mm; in the embodiment provided by the invention, the outer diameters of the supercritical gas inlet and the supercritical gas outlet are both 7 mm; the inner diameters of the supercritical gas inlet and the supercritical gas outlet are respectively and independently preferably 2-7 mm, and more preferably 3-6 mm; in the embodiment provided by the invention, the inner diameters of the supercritical gas inlet and the supercritical gas outlet are both 5 mm; the lengths of the supercritical gas inlet and the supercritical gas outlet are respectively and independently preferably 50-80 mm, more preferably 50-70 mm, and further preferably 50-60 mm; in the embodiment provided by the invention, the length of each of the supercritical gas inlet and the supercritical gas outlet is 55 mm.
The surface of the low-temperature adsorption plate main body, namely the surface formed by the length and the width, is provided with carbon nanotube sponge which is tightly attached to the surface of the low-temperature adsorption plate main body and is used for adsorbing isotopes of helium and hydrogen which are gases difficult to condense. The carbon nanotube sponge is a porous spongy carbon nanotube bulk material, and referring to fig. 5, fig. 5 is a physical diagram of the carbon nanotube sponge, which has excellent adsorption capacity, mechanical properties and electrical properties. The carbon nanotube sponge and the coconut shell type activated carbon are physically adsorbed, the carbon content is higher than that of the coconut shell type activated carbon, and the coconut shell type activated carbon has the characteristics of controllable structure, uniform appearance, high porosity, low impurity content, low density, good heat conductivity and the like, can replace the coconut shell type activated carbon to serve as a novel low-temperature adsorbent, can avoid impurities harmful to a low-temperature pump main body and a subsequent flow, and improves the safety of the low-temperature pump and the subsequent flow. The thickness of the carbon nanotube sponge is preferably 10-20 mm, more preferably 13-18 mm, and further preferably 15 mm; the distances between the carbon nanotube sponge and the peripheral edges of the low-temperature adsorption plate main body are respectively and independently preferably 10-50 mm; in the embodiment provided by the invention, the specification of the carbon nanotube sponge is 900 × 170 × 15 mm; the whole carbon nanotube sponge is adopted, so that the carbon nanotube sponge can be prevented from falling off in use and is convenient to replace.
The carbon nanotube sponge is fixed through the metal wire grid assembly, namely one surface of the carbon nanotube sponge is tightly attached to the low-temperature adsorption plate main body, and the opposite surface of the carbon nanotube sponge is in contact with the metal grid assembly, so that the contact area of the carbon nanotube sponge and the low-temperature adsorption plate main body is increased, and the contact thermal resistance is reduced; the periphery of the metal grid assembly is fixedly connected to the surface of the low-temperature adsorption plate main body, preferably fixedly connected to the surface of the low-temperature adsorption plate main body through welding; the wire mesh assembly is preferably a stainless steel wire mesh assembly, more preferably a 304 stainless steel wire mesh assembly; the radius of each metal wire in the metal wire grid assembly is preferably 0.2-2 mm, and more preferably 0.5-2 mm; in the embodiments provided by the present invention, the radius of the metal wire is specifically 0.5mm, 1mm or 2 mm; the width and the length of each grid in the metal wire grid assembly are respectively and independently preferably 5-15 mm, more preferably 8-12 mm, and further preferably 10 mm; the specification of the metal wire grid assembly is determined according to the specification of the low-temperature adsorption plate main body and the specification of the carbon nanotube sponge, so that the carbon nanotube sponge is only fixed on the surface of the low-temperature adsorption plate main body; in the invention, the distances between the edge of the metal wire grid component and the peripheral edge of the carbon nano tube are respectively and independently preferably 4-10 mm; in the embodiment provided by the invention, the specification of the wire grid assembly is specifically 920 × 180 × 16 mm.
According to the invention, the carbon nanotube sponge is fixed on the surface of the low-temperature adsorption plate main body in a mechanical fixing manner, so that the phenomenon that the carbon nanotube sponge falls off in the use process of the low-temperature pump is avoided, and the carbon nanotube sponge is convenient to maintain and replace when the low-temperature pump fails; the carbon nanotube sponge and the low-temperature adsorption plate main body are in direct contact, so that an inorganic adhesive can be prevented from being introduced; moreover, the carbon nanotube sponge has excellent adsorption capacity and lower impurity content, and can improve the safety of a low-temperature pump and subsequent processes.
The carbon nanotube sponge low-temperature adsorption plate provided by the invention has the advantages of reasonable design, simple structure, no electric equipment, high safety performance, low engineering difficulty, accordance with the operation mode of a low-temperature pump, and suitability for popularization and application.
The invention also provides application of the carbon nanotube sponge low-temperature adsorption plate in CFETR.
The carbon nanotube sponge low-temperature adsorption plate provided by the invention takes the carbon nanotube sponge as the low-temperature adsorbent and does not need an inorganic adhesive, so that the rapid heat exchange from the adsorption plate main body to the low-temperature adsorbent is realized, the harm of high harmful impurity content in the low-temperature adsorbent to a low-temperature pump and subsequent processes is avoided, and the problem that the activated carbon is easy to fall off when being taken as the low-temperature adsorbent is thoroughly solved.
In order to further illustrate the present invention, the following will describe the carbon nanotube sponge low temperature adsorption plate without adhesive in detail with reference to the following examples.
The reagents used in the following examples are all commercially available.
Example 1
Providing the carbon nanotube sponge low-temperature adsorption plate shown in fig. 2, which comprises a low-temperature adsorption plate main body, carbon nanotube sponge and a metal wire grid assembly; fig. 6 is a diagram of a carbon nanotube sponge low-temperature adsorption plate. The low-temperature adsorption plate main body-1 is formed by welding two 304 stainless steel plates with the thickness of 2mm, high-pressure water is introduced into the low-temperature adsorption plate main body to enable the inside of the low-temperature adsorption plate main body to form a supercritical helium flow channel, and two ends of the supercritical helium flow channel are respectively communicated with a supercritical helium inlet pipe-4 and a supercritical helium outlet pipe-5 and used for allowing 4.2K supercritical helium to pass through. The main body-1 of the low-temperature adsorption plate made of 304 stainless steel forms a main body structure of the low-temperature adsorption plate, and is used for bearing low-temperature adsorbent carbon nanotube sponge-2, a 304 stainless steel wire network-3, a supercritical helium inlet pipeline-4 and a supercritical helium outlet pipeline-5, and the basic specification is 1000 multiplied by 200 multiplied by 20 mm. One side of the block-shaped low-temperature adsorbent carbon nanotube sponge-2 is tightly attached to the surface of the low-temperature adsorption plate main body-1 and used for adsorbing helium and hydrogen isotopes which are not easy to condense, the basic specification is 900 multiplied by 170 multiplied by 15mm, the other side is tightly attached to a 304 stainless steel wire network-3, the specification of the 304 stainless steel wire network-3 is 920 multiplied by 180 multiplied by 16mm, the radius of each steel wire is 1mm, and the steel wires are separated by 10 mm.
The contact mode of the main body-1 of the 304 stainless steel low-temperature adsorption plate and the low-temperature adsorbent carbon nanotube sponge-2 is direct contact without any adhesive between the two. The low-temperature adsorbent carbon nanotube sponge-2 is in direct contact with the 304 stainless steel wire network-3 without any adhesive between the two. The contact mode of the main body-1 of the 304 stainless steel low-temperature adsorption plate and the 304 stainless steel wire network-3 is welding. The contact mode of the main body-1 of the 304 stainless steel low-temperature adsorption plate with the 4.2K supercritical helium inlet pipeline-4 and the 4.2K supercritical helium outlet pipeline-5 is welding.
The experimental temperature is 25 ℃, the carbon nanotube sponge, the 304 stainless steel plate and the carbon nanotube sponge-304 stainless steel plate composite material are respectively measured by a flash method heat conduction instrument to obtain the thermal diffusion coefficient alphaCNT、α304And alpha304-CNT. Specific heat C is carried out on carbon nanotube sponge and 304 stainless steel platepMeasuring to obtain specific heat CpCNTAnd Cp304. Measuring the contact thermal resistance R of the carbon nanotube sponge-304 stainless steel composite materialcAccording to the known sponge density rho of the carbon nano tubeCNT304 stainless Steel Density ρ304And a heat conductivity coefficient lambda calculation formula:
λ(T)=α(T)·ρ(T)·Cp(T) (I)
lambda-coefficient of thermal conductivity
Coefficient of alpha-thermal diffusion
Rho-density
CpSpecific heat
T-temperature
Calculating to obtain the heat conductivity coefficient lambda of the carbon nanotube spongeCNTAnd 304 stainless steel heat conductivity coefficient lambda304. According to the thermal resistance R of the single-layer materialthCalculating the formula:
Rth-thermal resistance
L-thickness
Lambda-coefficient of thermal conductivity
Calculating to obtain the carbon nano tube sponge thermal resistance RthCNTAnd 304 stainless steel thermal resistance Rth304. According to the effective thermal conductivity coefficient lambdaeCalculating the formula:
λeeffective coefficient of thermal conductivity
LtotalTotal thickness of bilayer material
RthCNTCarbon nanotube sponge thermal resistance
Rth304304 stainless steel thermal resistance
RcThermal contact resistance
Calculating to obtain the effective thermal conductivity lambda of the carbon nanotube sponge-304 stainless steel composite materiale。
The results of the tests and calculations are shown in tables 1 and 2.
TABLE 1 thermal parameters of carbon nanotube sponge, 304 stainless steel plate, carbon nanotube sponge-304 stainless steel plate composite
TABLE 2 thermal parameters of carbon nanotube sponge, 304 stainless steel plate, carbon nanotube sponge-304 stainless steel plate composite
As can be seen from Table 1, the thermal diffusion coefficient α of the carbon nanotube sponge-304 stainless steel composite material304-CNTThermal diffusivity alpha of 304 stainless steel304Are all 4.04mm2·s-1And thermal diffusion coefficient alpha with carbon nanotube spongeCNTClose to and far greater than the thermal diffusion coefficient of 0.226mm of the activated carbon2·s-1It is demonstrated that the ability of the carbon nanotube sponge to approach temperature uniformity during heating or cooling is much higher than that of activated carbon.
Calculating the effective heat conductivity coefficient lambda of the carbon nanotube sponge-304 stainless steel composite material by the formula (3)e=0.26W·m-1·K-1Thermal conductivity of carbon nanotube spongeCNT=0.15W·m-1·K-1304 stainless Steel thermal conductivity factor λCNT=160.15W·m-1·K-1All are larger than the heat conductivity coefficient of the activated carbon by 0.104 W.m-1·K-1The heat transfer capability of the carbon nanotube sponge, the 304 stainless steel and the carbon nanotube sponge-304 stainless steel composite material is higher than that of the activated carbon under the condition of stable heat transfer.
Because of the surface roughness of the material, a gap exists at the contact interface of the carbon nanotube sponge and the 304 stainless steel, heat passes through the gap layer in a heat conduction mode, the transfer resistance is increased compared with the ideal complete contact between the materials, and the thermal contact resistance R of the carbon nanotube sponge and the 304 stainless steel is measuredc=5.59×10-5m2·K·W-1Far less than the thermal resistance R of carbon nanotube spongethCNTThermal resistance R of 304 stainless steelth304The air gap layer between the carbon nanotube sponge and the activated carbon hardly affects the heat conduction.
Respectively putting a low-temperature adsorbing material carbon nanotube sponge and a traditional low-temperature adsorbing material coconut shell type activated carbon into a sample tube for pretreatment, and in the first stage, heating to 80 ℃ at a heating rate of 1 ℃/min and keeping for 60 min; in the second stage, the sample in the sample tube is pumped out for 50 times at 80 ℃, nitrogen is filled for 40 times, and the filling temperature is 40 ℃. The BET specific surface area of the carbon nanotube sponge and the coconut shell type activated carbon was then determined using a specific surface area meter, and the test results are shown in Table 3.
TABLE 3 specific surface area test results
As can be seen from the BET specific surface area measurement results of table 3, the BET specific surface area of the carbon nanotube sponge can reach 34.4% of that of the coconut shell type activated carbon, considering that the conventional coconut shell type activated carbon must be bonded to a low temperature adsorption plate using an inorganic binder during application, resulting in considerable loss of the effective specific surface area, while the fixing mode of the carbon nanotube sponge in the examples is such that the effective specific surface area is hardly lost. In practical application, the carbon nanotube sponge has a large effective specific surface area and a strong physical adsorption capacity.
XRF elemental analysis was performed on the carbon nanotube sponge and the conventional coconut shell type activated carbon, and the test results are shown in tables 4 and 5, respectively.
TABLE 4 content of each element in the carbon nanotube sponge
TABLE 5 content of each element in coconut shell type activated carbon
Table 4 and table 5 show the content of the elements higher than 0.1% in the carbon nanotube sponge and the coconut shell type activated carbon, respectively. From the analysis results, it can be seen that the carbon content of the carbon nanotube sponge is 93.4%, which is higher than 90.27% of the coconut shell type activated carbon. The carbon element is an effective element determining the physical adsorption capacity of the adsorption material, and the effective adsorption capacity of the carbon nanotube sponge is higher.
From the XRF elemental analysis results in tables 4 and 5, it can be seen that the content of the impurity in the carbon nanotube sponge is 6.6%, the main impurity is iron element, the content is 5.88%, and the main materials of the cryopump main body and the cryoadsorption plate are both stainless steel, so that the iron element does not affect the cryopump main body, the cryoadsorption plate main body and the subsequent processes. The content of impurities in the coconut shell type activated carbon is 9.73 percent, wherein the content of phosphorus and sulfur are both higher than 1 percent, and phosphorus and sulfur are easy to combine with tritium in gas to be treated to cause difficulty in subsequent tritium recovery. The above shows that the carbon nanotube sponge is cleaner and safer than the traditional activated carbon.
Claims (10)
1. A carbon nanotube sponge low-temperature adsorption plate without an adhesive is characterized by comprising:
the low-temperature adsorption plate comprises a low-temperature adsorption plate main body, carbon nanotube sponge and a metal wire grid assembly;
the carbon nanotube sponge is arranged between the low-temperature adsorption plate main body and the metal wire grid assembly and is fixed on the surface of the low-temperature adsorption plate main body through the metal wire grid assembly;
the periphery of the metal wire grid assembly is fixedly connected to the surface of the low-temperature adsorption plate main body.
2. The carbon nanotube sponge low-temperature adsorption plate of claim 1, wherein the low-temperature adsorption plate body is a hollow structure, and a supercritical gas inlet and a supercritical gas outlet are respectively arranged at two ends perpendicular to the surface contacting the carbon nanotube sponge.
3. The carbon nanotube sponge low-temperature adsorption plate of claim 2, wherein the supercritical gas inlet and the supercritical gas outlet have outer diameters of 5-10 mm, respectively; the inner diameters are each independently 2 to 7 mm.
4. The carbon nanotube sponge low-temperature adsorption plate of claim 1, wherein the radius of the metal wires in the metal wire grid assembly is 0.2-2 mm.
5. The carbon nanotube sponge low-temperature adsorption plate of claim 1, wherein the width and length of the grid in the metal wire grid assembly are 5-15 mm respectively and independently.
6. The carbon nanotube sponge low-temperature adsorption plate of claim 1, wherein the thickness of the carbon nanotube sponge is 10-20 mm.
7. The carbon nanotube sponge low-temperature adsorption plate of claim 1, wherein the thickness of the low-temperature adsorption plate body is 15-25 mm.
8. The carbon nanotube sponge low-temperature adsorption plate of claim 1, wherein the metal wire mesh assembly is a stainless steel mesh assembly.
9. The carbon nanotube sponge low-temperature adsorption plate as claimed in claim 1, wherein the specification of the low-temperature adsorption plate body is 1000 x 200 x 20 mm; the specification of the carbon nano tube sponge is 900 multiplied by 170 multiplied by 15 mm; the specification of the wire grid assembly is 920 multiplied by 180 multiplied by 16 mm.
10. Use of the carbon nanotube sponge low temperature adsorption plate of any one of claims 1 to 9 in CFETR.
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