CN112795342A - Epoxy resin building joint adhesive capable of being polished and preparation method thereof - Google Patents
Epoxy resin building joint adhesive capable of being polished and preparation method thereof Download PDFInfo
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- CN112795342A CN112795342A CN202011579850.3A CN202011579850A CN112795342A CN 112795342 A CN112795342 A CN 112795342A CN 202011579850 A CN202011579850 A CN 202011579850A CN 112795342 A CN112795342 A CN 112795342A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a polishable epoxy resin building joint adhesive and a preparation method thereof. The sandable epoxy resin building joint glue comprises a component A and a component B, wherein the component A comprises 30-70% of epoxy resin, 1-5% of diluent, 0.1-2% of active agent, 0.5-8% of light filler and 20-70% of filler A by weight percentage; the component B comprises 20 to 70 percent of curing agent, 0.1 to 5 percent of active agent, 1 to 4 percent of thixotropic agent, 10 to 25 percent of flame retardant, 2 to 5 percent of pigment and 10 to 60 percent of B filler; wherein the component A and the component B are mixed according to the ratio of NCO equivalent to NH equivalent of 1: 0.9-1.1. The polishable epoxy resin building joint adhesive has the characteristics of good adhesion and crack resistance, higher tensile strength and compressive strength, polishable modeling of the repaired surface and the like, is simple in construction, good in repairing operability and excellent in durability, and is particularly suitable for repairing construction of building engineering including cultural engineering.
Description
Technical Field
The invention belongs to the field of building material application, and relates to a building joint glue capable of polishing epoxy resin and a preparation method thereof.
Background
In recent years, base materials such as GRC (glass fiber reinforced concrete) and FRP (fiber reinforced composite) have been widely used in the field of building industry due to their excellent usability, but due to the influence of the environmental conditions of buildings and special construction requirements, joint seams are very common at the joints of such prefabricated building materials, including the peripheries of door and window frames and the gaps between the outer walls of buildings, and it is usually necessary to seal the joints to meet the requirements of use and beauty of buildings. The most common repair sealants in the construction industry generally mainly comprise three types of polyurethane, silicone and acrylic, but the traditional solvent-type sealants have the defects of high shrinkage, high solvent content, odor, cracking, lack of stability and flexibility under the action of long-term ultraviolet rays, incapability of polishing and carving the repaired surface and the like.
The anti-sagging single-component polyurethane sealant for the fabricated building disclosed in CN110760285A comprises a polyurethane prepolymer, a prefabricated anti-sagging agent, an incremental filler, a coupling agent, a curing accelerator and the like, and the anti-sagging performance is fully exerted by esterification modification of hydrogenated castor oil in the prefabricated anti-sagging agent, so that the obtained polyurethane sealant has strong adhesion to a building base layer, high elongation, good anti-sagging performance and weather resistance, and is suitable for vertical construction of fabricated building joints. However, the sculpturing property of the repaired surface of the polyurethane sealant is not clear, and according to the formula, the polyurethane sealant has excellent elongation and certain strength and sculpturing property are greatly sacrificed.
In recent years, epoxy resin adhesives have been widely used for sealing repaired joints of building materials such as GRC and FRP, because of their excellent adhesion, repairability, sandability, good shear strength, good adhesive strength, and stable properties in all respects. Compared with the traditional seam repair adhesive, the epoxy resin adhesive has the characteristics of low curing condition, aging resistance, easy thixotropy, operable repair surface and the like, and the excellent service performance ensures that the epoxy resin adhesive is gradually applied to the bonding repair of building structures.
The epoxy resin glue for repairing the seam commonly used in the prior art mainly comprises epoxy resin, a curing agent, a diluent, an active agent, various fillers and the like.
The epoxy resin adhesive for repairing cracks disclosed in CN109694680A comprises epoxy resin, a defoaming agent, a diluent, a curing agent, zeolite powder filler, a surfactant and the like, and the surfactant is utilized to uniformly disperse zeolite in a system so as to realize the filling and reinforcing effects of zeolite, so that the epoxy resin adhesive has the advantages of high strength, high toughness, high elongation at break and the like. However, the zeolite powder needs to be soaked in hydrochloric acid for 10-60 min during preparation, and the surfactant is stirred and dissolved in ethanol, the preparation process is slightly complex in steps and long in required time, in addition, although the zeolite is added, the mechanical properties such as tensile strength and the like of the epoxy resin adhesive are improved, the constructability during seam repair and whether the crack repair surface can be polished and carved are not clearly and specifically described in detail, and the repair adhesive without the engravability easily enables the repair surface not to be polished well so as to greatly reduce the modeling and artistic effects of buildings due to the fact that special building places such as theme parks and the like have strict aesthetic requirements on construction.
The building industry has high requirements on the comprehensive performance of the building structure adhesive, not only requires good constructability, but also requires that the adhesive has good mechanical properties such as tensile property, compressive property and the like and excellent aging resistance, so that a novel repair adhesive for the building industry is needed to meet the process requirements, and has the characteristics of good constructability, light weight, high strength, excellent mechanical property, good durability and the like.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a sandable epoxy building joint compound.
The invention also aims to provide a preparation method of the sandable epoxy resin building joint glue.
In order to achieve the purpose, the invention adopts the following technical scheme:
the polishable epoxy resin building joint adhesive is characterized by comprising a component A and a component B:
the A component comprises, in weight percent, based on the total weight of the A component:
the component B comprises the following components in percentage by weight based on the total weight of the component B:
wherein, the ratio of NCO equivalent to NH equivalent of the component A to the component B is 1:0.9 to 1.1.
In a preferred embodiment of the present invention, the sandable epoxy resin building joint compound of the present invention is characterized by comprising a component a and a component b:
the A component comprises, in weight percent, based on the total weight of the A component:
the component B comprises the following components in percentage by weight based on the total weight of the component B:
wherein, the ratio of the A component to the B component is 1: 1, mixing uniformly.
In the invention, the epoxy resin can be one or a mixture of more of bisphenol A epoxy resin, bisphenol F epoxy resin, hydrogenated epoxy resin, polyurethane modified epoxy resin, organosilicon modified epoxy resin, liquid rubber modified epoxy resin and petroleum resin; such as one or a mixture of epoxy resins of the E51 type, epoxy resins of the E44 type, and other epoxy resins of the bisphenol F type.
The diluent can be one or a mixture of more of allyl glycidyl ether, benzyl glycidyl ether, butyl glycidyl ether, dodecyl glycidyl ether, tetrahydrophthalic acid diglycidyl ester, phthalic acid diglycidyl ester, 4, 5-epoxycyclohexane-1, 2-dicarboxylic acid diglycidyl ester, polypropylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether and the like.
The activator can be one or a mixture of more of aniline methyl triethoxysilane, diethylenetriaminopropyl triethoxysilane, glycidol ether oxypropyl trimethoxysilane, aniline methyl trimethoxysilane, titanate coupling agents, aluminate coupling agents and wetting and dispersing agents, such as KH550, KH560, wetting and activating agents with acid-based copolymers, Disponer9250, Disponer 9850 and Disponer 904S produced by Hamming moded.
The light filler can be one or a mixture of hollow glass microspheres and phenolic resin hollow microspheres.
The filler A and the filler B can be one or a mixture of more of heavy calcium, kaolin, diatomite, light calcium, talcum powder, mica powder, silica micropowder, crystal whisker, titanium dioxide and barite powder.
The curing agent can be one or a mixture of more of aliphatic amine normal-temperature curing agents and alicyclic amine normal-temperature curing agents, such as: amido amine curing agents (trade name EVONIK-Ancamide 506 curing agent); modified fatty amine-based curing agent (trade name EVONIK-Ancamide 2636 curing agent); modified polyamide-based curing agent (trade name EVONIK-Ancamide 2784 curing agent); a modified polyamine-based curing agent (trade name EVONIK-Ancamide 2766 curing agent), and the like.
The thixotropic agent may be one or a mixture of fumed silica and organobentonite powder.
The flame retardant can be one or a mixture of more of antimony trioxide, magnesium hydroxide, molybdenum oxide, zirconium hydroxide and aluminum hydroxide.
The pigment can be one or a mixture of several of iron oxide red, iron oxide blue, pigment carbon black and iron oxide yellow.
According to another aspect of the present invention, there is provided a method for preparing the above sandable epoxy resin building joint compound, the method comprising:
1. preparation of the first component
Respectively weighing epoxy resin, a diluent, an activator, a light filler and a first filler with corresponding contents according to the composition of the first component of the epoxy resin building seam adhesive capable of being polished, adding the epoxy resin, the diluent and the activator into a vacuum stirrer, stirring at the rotating speed of 800-1400 rpm for 5-10 minutes, reducing the rotating speed to 400-600 rpm, sequentially adding the light filler and the first filler, after all the components are added, increasing the rotating speed of the stirrer to 800-1700 rpm, continuously stirring for 10-15 minutes, starting the vacuum mode of the stirrer to-98 Kpa, continuously stirring for 5-10 minutes, and obtaining the first component after stirring;
2. preparation of component B
Respectively weighing a curing agent, an active agent, a thixotropic agent, a flame retardant, a pigment and a filler B with corresponding contents according to the composition of the component B of the epoxy resin building joint adhesive capable of being polished, adding the curing agent and the active agent into a vacuum stirrer, stirring at the rotating speed of 800-1400 rpm for 5-10 minutes, reducing the rotating speed to 400-600 rpm, sequentially adding the thixotropic agent, the flame retardant, the pigment and the filler B, after all the components are added, increasing the rotating speed of the stirrer to 800-1700 rpm, continuously stirring for 10-15 minutes, starting the vacuum mode of the stirrer to-98 Kpa, continuously stirring for 5-10 minutes, and obtaining the component B after stirring;
3. modulated polishable epoxy resin building joint glue
Mixing the prepared component A and the component B according to the ratio of NCO equivalent to NH equivalent of 1: 0.9-1.1, and uniformly mixing to obtain the building joint glue capable of polishing the epoxy resin.
The invention has the beneficial effects that:
compared with the application of the traditional sealant such as polyurethane, silicone and the like in the joints of building base materials, the polishable epoxy resin building joint adhesive has the characteristics of good adhesion, crack resistance, higher tensile strength and compressive strength, polishable modeling of the repaired surface and the like, is simple in construction, good in repairing operability and excellent in durability, and is particularly suitable for repairing construction of building engineering including cultural engineering.
Detailed Description
The invention is further illustrated below with reference to specific examples, which are intended to be illustrative only and the scope of the invention is not limited thereto.
The composition of the sandable epoxy building joint compound is shown in table 1 below:
TABLE 1 formulation composition of polishable epoxy resin building joint compound
Description of the drawings:
the epoxy resin in example 1 was a mixture of 40% bisphenol A type epoxy resin (E51 epoxy resin) and 60% urethane-modified epoxy resin (trade name: 102C-4R (manufactured: constant insulation materials, Inc., Tanzhou));
the epoxy resin in example 2 was a mixture of 30% bisphenol A type epoxy resin (E51 epoxy resin) and 70% urethane-modified epoxy resin (trade name: 102C-4R (manufactured: constant insulation materials, Inc., Tanzhou));
the epoxy resin in example 3 was a mixture of 20% bisphenol A type epoxy resin (E51 epoxy resin) and 80% urethane-modified epoxy resin (trade name: 102C-4R (manufactured: constant insulation materials, Inc., Tanzhou));
the epoxy resin in the a component in comparative example 1 was a bisphenol a type epoxy resin (E51 epoxy resin);
the epoxy resin of the A component in comparative example 2 was a mixture of 20% bisphenol A type epoxy resin (E51 epoxy resin) and 80% urethane-modified epoxy resin (trade name: 102C-4R (manufactured by constant insulation Co., Ltd., Tanzhou));
the epoxy resin of the A component in comparative example 3 was a mixture of 30% bisphenol A type epoxy resin (E51 epoxy resin) and 70% urethane-modified epoxy resin (trade name: 102C-4R (manufactured by constant insulation Co., Ltd., Tanzhou));
the diluent is allyl glycidyl ether;
the active agent is Disponer9250 produced by Hamming modesty;
the light filler is hollow glass microspheres;
the filler A is a mixture consisting of 19% of heavy calcium carbonate, 68% of talcum powder and 13% of diatomite;
the curing agent in the component B is a mixture of 18 percent of amido amine curing agent (trade name is EVONIK-Ancamide 506 curing agent) and 82 percent of modified polyamine curing agent (EVONIK-Ancamide 2766 curing agent).
The active agent is Disponer9250 produced by Hamming modesty;
the thixotropic agent is a mixture consisting of 24% fumed silica and 76% organobentonite;
the flame retardant is aluminum hydroxide;
the pigment is brown iron oxide, Bayer 4686 toner in Germany;
the filler B is a mixture of 19% heavy calcium carbonate, 68% talc and 13% diatomaceous earth.
The preparation method of the polished epoxy resin building joint glue of the embodiment and the comparative example of the invention is as follows:
1. preparation of the first component
Epoxy resin, a diluent, an active agent, a light filler and a first filler are weighed according to the components of the component A of the sandable epoxy resin building joint glue shown in the table 1. Firstly, adding epoxy resin, a diluent and an active agent into a vacuum stirrer, stirring at the rotating speed of 1000rpm for 5 minutes, reducing the rotating speed to 500rpm, and sequentially adding the light filler and the A filler with corresponding contents. After all the components are added, the rotating speed of the stirrer is increased to 1500rpm and stirring is continued for 15 minutes, the vacuum mode of the stirrer is started to-98 Kpa, stirring is continued for 5 minutes, and the component A is obtained after stirring is completed.
2. Preparation of component B
The curable epoxy resin building joint compound was prepared by weighing the corresponding amounts of curing agent, activator, thixotropic agent, flame retardant, pigment and filler b, respectively, as set forth in table 1. Firstly, adding a curing agent and an active agent into a vacuum stirrer, stirring for 5 minutes at the rotating speed of 1000, reducing the rotating speed to 500rpm, and sequentially adding a thixotropic agent, a flame retardant, a pigment and a B filler in corresponding contents. After all the components are added, the rotation speed of the stirrer is increased to 1500rpm and stirring is continued for 15 minutes, then the vacuum mode of the stirrer is started to-98 Kpa, and stirring is continued for 5 minutes. And (4) obtaining the component B after stirring.
3. Modulated polishable epoxy resin building substrate joint glue
Mixing the prepared component A and the component B according to the ratio of NCO equivalent to NH equivalent of 1: 1, uniformly mixing to obtain the building joint glue capable of polishing the epoxy resin.
The performance test of the prepared sandable epoxy resin building joint adhesive is carried out, and the performance test mainly refers to GB/T1728 determination method for drying time of paint films and putty films, GB/T2793 determination method for content of non-volatile matters in 1995 adhesive, GB/T6753.3-1986 test method for storage stability of paint, GB/T8624 and 2012 classification of combustion performance of building materials and products, GB/T6329 and 1996 adhesive determination method for tensile strength of butt joints, and GB/T2567 and 2008 resin casting body performance test general rule. The results are shown in table 2:
TABLE 2 result of performance test of epoxy resin building joint glue capable of polishing
From the test results shown in table 2, it can be seen that:
1. adopts light filler and thixotropic agent modification technology
Comparative example 2 is similar to the formulation of example 3, both variables being the absence of lightweight filler and thixotropic agent in comparative example 2, and the experimental results demonstrate that comparative example 2 appears to be poorly constructed: easy-to-stick knife and knife coating are difficult to smear.
The comparison of comparative example 3 with example 2 shows that the content of the light filler and the content of the thixotropic agent in comparative example 3 are the same except for the content of the light filler and the content of the thixotropic agent, and the result shows that the construction property of the comparative example is extremely poor, the knife is easily stuck, and the construction is affected.
The application utilizes the light microspheres and the thixotropic agent as the filler, solves the problem of opposite properties of the viscosity of the epoxy adhesive and the workability of smearing, blade coating and the like, and realizes the water-carrying construction of the joint adhesive; meanwhile, the epoxy joint glue has excellent thixotropy and does not flow and fall, can meet the joint construction requirements under the working conditions of building facades and the like, realizes the carving of the joint surface and meets the requirement of attractive appearance. The light filler and the thixotropic agent are mainly applied to the construction, so that the thixotropic property of the light filler and the thixotropic agent is enhanced, the vertical surface of the light filler is not smeared to flow and fall, and the light filler and the thixotropic agent are smooth and barrier-free to operate.
2. Adopts flexible resin toughening modification technology
Comparative example 1 has the same composition as example 1 except that comparative example 1 has no flexible resin, and the experiment proves that the toughness is poor and no data is available for measuring the elongation at break.
According to the invention, the epoxy resin is not selected as one of curing systems, but another flexible resin polyurethane modified epoxy resin is added simultaneously, so that excellent toughness of the daub in joint construction is realized, the crack generation of the joint glue in a working environment after curing can be reduced, and the weather resistance and durability of the product are enhanced.
In addition, the sandable epoxy resin building joint glue disclosed by the invention has the advantages that one filler or a mixture of a plurality of fillers is added into the component A and the component B, and the proportion of the resin in a cured product is reduced due to the addition of the fillers, so that the curing heat release of the resin is reduced, the curing reaction of the system can be relatively stable, the shrinkage of the resin during curing is reduced, and the possibility of cracking of the resin system is reduced to a certain extent; the added filler can not only realize certain functional enhancement in the epoxy resin adhesive, but also improve the viscosity, thixotropic property and the like of the epoxy resin adhesive, improve the operability of a resin system under working conditions such as crack repair and the like, and lead the epoxy resin adhesive to be capable of being polished and carved on the repaired surface due to good thixotropy brought by the filler, thereby meeting the construction requirements of artistic modeling, attractiveness and the like.
The polishable epoxy resin building joint adhesive can meet the requirements of building repair adhesive on good adhesion and repair, polishability and carving, light weight, high strength, aging resistance, flame retardance and the like, and is a polishable resin joint adhesive which has simple construction mode, low construction cost and high efficiency and can meet the construction requirements. In addition, the building base material seam adhesive capable of polishing has good base material repairing surface constructability while effectively meeting the mechanical property requirements of the building seam adhesive on the base material such as bonding shear strength, tensile strength and the like, so that the building shape in construction places with attractive requirements such as theme parks, urban landscapes, journey and vacation areas and the like can be met, and the building artistic effect is realized.
Claims (10)
1. A sandable epoxy resin building joint adhesive is characterized by comprising a component A and a component B,
the component A comprises the following components in percentage by weight, based on the total weight of the component A:
the component B comprises the following components in percentage by weight based on the total weight of the component B:
wherein, the ratio of NCO equivalent to NH equivalent of the component A to the component B is 1:0.9 to 1.1.
2. The sandable epoxy building joint compound of claim 1 comprising a component A and a component B,
the A component comprises, in weight percent, based on the total weight of the A component:
the component B comprises the following components in percentage by weight based on the total weight of the component B:
3. the polishable epoxy resin building joint compound of claim 1, wherein the a component and the b component are mixed in a ratio of NCO equivalent to NH equivalent of 1: 1, mixing.
4. The sandable epoxy building joint compound of claim 1 wherein the lightweight filler is one or a mixture of hollow glass microspheres and phenolic resin hollow microspheres.
5. The polishable epoxy resin building joint compound of claim 1, wherein the epoxy resin is one or a mixture of bisphenol a epoxy resin, bisphenol F epoxy resin, hydrogenated epoxy resin, urethane-modified epoxy resin, silicone-modified epoxy resin, liquid rubber-modified epoxy resin, and petroleum resin.
6. The polishable epoxy building joint compound of claim 1, wherein the epoxy is a bisphenol a type epoxy and a polyurethane modified epoxy.
7. The sandable epoxy building joint compound of claim 1 wherein said thixotropic agent is one or a mixture of fumed silica and organobentonite powder.
8. The polishable epoxy resin building joint compound according to claim 1, wherein the filler A and the filler B are one or a mixture of several of heavy calcium carbonate, kaolin, diatomite, light calcium carbonate, talcum powder, mica powder, silica micropowder, whiskers, titanium dioxide and barite powder.
9. A method of making a sandable epoxy building joint compound according to any one of claims 1 to 8, comprising:
1. preparation of the first component
Respectively weighing epoxy resin, a diluent, an activator, a light filler and a first filler with corresponding contents according to the composition of the first component of the epoxy resin building seam adhesive capable of being polished, adding the epoxy resin, the diluent and the activator into a vacuum stirrer, stirring at the rotating speed of 800-1400 rpm for 5-10 minutes, reducing the rotating speed to 400-600 rpm, sequentially adding the light filler and the first filler, after all the components are added, increasing the rotating speed of the stirrer to 800-1700 rpm, continuously stirring for 10-15 minutes, starting the vacuum mode of the stirrer to-98 Kpa, continuously stirring for 5-10 minutes, and obtaining the first component after stirring;
2. preparation of component B
Respectively weighing a curing agent, an active agent, a thixotropic agent, a flame retardant, a pigment and a filler B with corresponding contents according to the composition of the component B of the epoxy resin building joint adhesive capable of being polished, adding the curing agent and the active agent into a vacuum stirrer, stirring at the rotating speed of 800-1400 rpm for 5-10 minutes, reducing the rotating speed to 400-600 rpm, sequentially adding the thixotropic agent, the flame retardant, the pigment and the filler B, after all the components are added, increasing the rotating speed of the stirrer to 800-1700 rpm, continuously stirring for 10-15 minutes, starting the vacuum mode of the stirrer to-98 Kpa, continuously stirring for 5-10 minutes, and obtaining the component B after stirring;
3. modulated polishable epoxy resin building joint glue
Mixing the prepared component A and the component B according to the ratio of NCO equivalent to NH equivalent of 1: 0.9-1.1, and uniformly mixing to obtain the building joint glue capable of polishing the epoxy resin.
10. The method according to claim 9, wherein the ratio of NCO equivalent to NH equivalent of the component A to the component B is 1: 1, mixing.
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| CN113480956A (en) * | 2021-06-29 | 2021-10-08 | 山西工程科技职业大学 | Petroleum resin-based pavement crack pouring adhesive and preparation method thereof |
| CN114958263A (en) * | 2022-07-15 | 2022-08-30 | 湖北三棵树新材料科技有限公司 | Epoxy adhesive for quick joint of plate ceiling and preparation method thereof |
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