CN112788869A - Plate pressing method - Google Patents
Plate pressing method Download PDFInfo
- Publication number
- CN112788869A CN112788869A CN202011264471.5A CN202011264471A CN112788869A CN 112788869 A CN112788869 A CN 112788869A CN 202011264471 A CN202011264471 A CN 202011264471A CN 112788869 A CN112788869 A CN 112788869A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- steel plate
- plate
- integral
- accommodating hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003825 pressing Methods 0.000 title claims abstract description 24
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 48
- 239000010959 steel Substances 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 19
- 238000009826 distribution Methods 0.000 claims abstract description 18
- 238000010030 laminating Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 abstract description 7
- 230000004308 accommodation Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The pressing plate method provided by the invention comprises the following steps that S1, accommodating holes are formed in the matched pressing plate, and the thickness of the matched pressing plate is equal to that of the integral superposed circuit board; s2, placing the pressure distribution plate with the containing holes on the bottom steel plate; s3, placing the integral superposed circuit board in the accommodating hole; s4, covering the containing plate and the integral superposed circuit board with the other steel plate as a top steel plate; and S5, pressing. The matching and pressing plate with the same thickness as the integral superposed circuit board is adopted, the distance between each side wall of the accommodating hole and the closest integral superposed circuit board is 0.8-1.2cm, the projection of the matching and pressing plate is positioned in the projection of the bottom steel plate and the top steel plate along the vertical direction, the deformation of the bottom steel plate at the edge of the integral superposed circuit board is avoided, the glue amount of the edge of the integral superposed circuit board is stable, and the thickness uniformity of the circuit board is ensured.
Description
Technical Field
The invention belongs to the technical field of PCBs, and particularly relates to a pressing plate method.
Background
Printed circuit board (pcb), also called printed circuit board (pcb), printed circuit board (pcb) for short, or circuit board, which uses an insulating board as a substrate, cut into a certain size, and attached with at least one conductive pattern and distributed with holes (such as component holes, fastening holes, metalized holes, etc.), so as to replace the chassis of the electronic components of the prior art and realize the interconnection between the electronic components.
In the traditional production flow of printed circuit board, besides the main processes of X-ray target drilling, edge cutting and the like, the pressing plate is also an important process.
The pressing plate is a process for pressing a core plate which is pretreated by inner layer drying, copper etching, AOI inspection, surface browning treatment and the like, a copper foil and a prepreg (PP glue) into a multilayer circuit board. In the conventional press plate process, a rigid bottom support is usually formed by a steel plate to ensure the smoothness of the printed circuit board.
In the pressfitting process, need high temperature high pressure so that PP glues and takes place to flow, fill the space between the core board, reach the purpose that each core board coheres into a board, nevertheless, under the pressure effect, the steel sheet takes place to deform because of lacking the support in the flange department of circuit board, leads to the flange limit atress of circuit board uneven, and on the other hand, the flow of PP is inhomogeneous, and more PP glues can be in circuit board limit department overflow, and PP glues remaining thickness also inhomogeneous, consequently, can't guarantee circuit board thickness homogeneity.
Disclosure of Invention
The invention mainly aims to provide a pressing plate method for ensuring the thickness uniformity of a circuit board.
In order to achieve the above main object, the pressing plate method provided by the present invention includes step S1, forming a receiving hole in the pressure distribution plate, wherein the receiving hole penetrates the pressure distribution plate, and the thickness of the pressure distribution plate is equal to the thickness of the integral laminated circuit board; s2, placing the pressure distribution plate with the containing holes on the bottom steel plate; s3, placing the integral superposed circuit board in the containing hole, wherein the distance between each side wall of the containing hole and the integral superposed circuit board closest to the side wall of the containing hole is 0.8-1.2 cm; s4, covering the containing plate and the integral superposed circuit board with the other steel plate as a top steel plate; and S5, pressing.
It can be seen from the above-mentioned scheme that, adopt the join in marriage the clamp plate with the equal thickness of whole coincide circuit board, the distance of each lateral wall of accommodation hole and the whole coincide circuit board nearest thereto is 0.8-1.2cm, along vertical direction, the projection of joining in marriage the clamp plate is located the projection of end steel sheet and top steel sheet, guarantee to have the support of joining in marriage the clamp plate between the flange department of whole coincide circuit board and the end steel sheet on the one hand, avoid end steel sheet to take place the deformation in the flange department of whole coincide circuit board, on the other hand, can make the PP of the flange department overflow of whole coincide circuit board glue and be pressed between the flange of accommodation hole lateral wall and whole coincide circuit board, so that the flange gluing volume of whole coincide circuit board is stable, thereby guarantee circuit board.
Preferably, the receiving hole is a rectangular hole.
Further, the integral laminated circuit board is a rectangular board.
Furthermore, the distance between each side wall of the accommodating hole and the nearest integral laminated circuit board is 1 cm.
Further, the thickness of the integral laminated circuit board is 2 mm.
Furthermore, the bottom steel plate, the integral superposed circuit board and the top steel plate form a laminating unit, the laminating units are superposed in sequence, and the top steel plate of each laminating unit is the bottom steel plate of the adjacent laminating unit above the laminating unit.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a flow chart of one embodiment of a platen method according to the present invention.
FIG. 2 is a schematic diagram of the placement of a bottom steel plate, a pressing plate and an integrated laminated circuit board to which an embodiment of the pressing plate method of the present invention is applied.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2, the platen pressing method provided in this embodiment includes:
step S1, forming an accommodating hole 2 in the pressure distribution plate 1, wherein the accommodating hole 2 penetrates through the pressure distribution plate 1, and the thickness of the pressure distribution plate 1 is equal to that of the integral superposed circuit board 3;
step S2, placing the pressure distribution plate 1 with the containing holes 2 on the bottom steel plate 5; step S3, placing the integral superposed circuit board 3 in the accommodating hole 2, wherein the distance L1 between each side wall of the accommodating hole 2 and the closest integral superposed circuit board 3 is 0.8-1.2cm, and preferably, the distance L1 between each side wall of the accommodating hole 2 and the closest integral superposed circuit board 3 is 1 cm;
step S4, the top steel plate is covered, and the other steel plate is used as the top steel plate to cover the containing plate and the integral superposed circuit board 3;
and step S5, pressing, namely pressing the integral laminated circuit board 3, wherein the pressing device applies force to the bottom steel plate 5 and the top steel plate, and the acting force from the pressing device acts on the integral laminated circuit board 3 through the bottom steel plate 5 and the top steel plate.
The accommodating holes 2 are rectangular holes, the integral laminated circuit board 3 is a rectangular plate, the thickness of the integral laminated circuit board 3 is 2mm, and the laminating device adopted in the embodiment is a known laminating machine.
The method comprises the following steps of pre-treating and riveting a plurality of pre-treated prefabricated circuit boards which are subjected to pre-treatment such as drying, copper etching, AOI (automated optical inspection) and surface browning treatment to form an integral superposed circuit board 3, wherein a prepreg is arranged between every two adjacent prefabricated circuit boards, and each integral superposed circuit board 3 comprises 50-60 layers of prefabricated circuit boards.
In step S5, a bottom steel plate 5, an integral stacked circuit board 3 and a top steel plate form a stacked unit, a plurality of stacked units are stacked in sequence, the top steel plate of each stacked unit is the bottom steel plate 5 of the adjacent stacked unit above the top steel plate, and the stacked units are stacked to achieve stacking of the integral stacked circuit board 3 in each stacked unit, wherein the number of the stacked units is 50-60.
Adopt the distribution board 1 with the thickness such as whole coincide circuit board 3, the distance L1 of each lateral wall of accommodation hole 2 and the whole coincide circuit board 3 nearest thereto is 0.8-1.2cm, along vertical direction, the projection of distribution board 1 is located the projection of end steel sheet 5 and top steel sheet, guarantee to have the support of distribution board 1 between the flange department of whole coincide circuit board 3 and end steel sheet 5 on the one hand, avoid end steel sheet 5 to take place the deformation in the flange department of whole coincide circuit board 3, on the other hand, the PP that can make the flange department overflow of whole coincide circuit board 3 glues and is pressed between the flange of accommodation hole 2 lateral wall and whole coincide circuit board 3, avoid the volume of gluing to reduce, so that the flange gluing volume of whole coincide circuit board 3 is stable, thereby guarantee circuit board thickness homogeneity.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the invention have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A method of pressing a plate, comprising:
s1, forming an accommodating hole, forming the accommodating hole in the pressure distribution plate, wherein the accommodating hole penetrates through the pressure distribution plate, and the thickness of the pressure distribution plate is equal to that of the integral superposed circuit board;
s2, placing the pressure distribution plate provided with the accommodating holes on a bottom steel plate, wherein the projection of the pressure distribution plate along the vertical direction is positioned in the projection of the bottom steel plate along the vertical direction;
s3, placing the integral superposed circuit board in the accommodating hole, wherein the distance between each side wall of the accommodating hole and the integral superposed circuit board closest to the side wall of the accommodating hole is 0.8-1.2 cm;
s4, covering the containing plate and the integral superposed circuit board with another steel plate as a top steel plate, wherein the projection of the pressure distribution plate along the vertical direction is positioned in the projection of the top steel plate along the vertical direction;
and S5, pressing.
2. The platen method of claim 1, wherein:
the accommodating hole is a rectangular hole.
3. The platen method of claim 2, wherein:
the integral superposed circuit board is a rectangular board.
4. The platen method of claim 3, wherein:
the distance between each side wall of the accommodating hole and the closest integral laminated circuit board is 1 cm.
5. The platen method of claim 4, wherein:
the top steel plate covers the bottom steel plate.
6. The platen method according to any one of claims 1 to 5, wherein:
the thickness of the integral laminated circuit board is 2 mm.
7. The platen method of claim 6, wherein:
the bottom steel plate, the integral superposed circuit board and the top steel plate form a laminating unit, a plurality of laminating units are superposed in sequence, and the top steel plate of each laminating unit is the bottom steel plate of the laminating unit which is positioned above and adjacent to the laminating unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011264471.5A CN112788869A (en) | 2020-11-11 | 2020-11-11 | Plate pressing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011264471.5A CN112788869A (en) | 2020-11-11 | 2020-11-11 | Plate pressing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112788869A true CN112788869A (en) | 2021-05-11 |
Family
ID=75750490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011264471.5A Pending CN112788869A (en) | 2020-11-11 | 2020-11-11 | Plate pressing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112788869A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004074573A (en) * | 2002-08-19 | 2004-03-11 | Asahi Kasei Chemicals Corp | Resin extruded sheet with protective paper stuck on surface, and manufacturing method therefor |
| CN103209550A (en) * | 2013-04-16 | 2013-07-17 | 汕头超声印制板（二厂）有限公司 | Lamination structure for multilayer printed board and lamination thickness control method |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| US20180063965A1 (en) * | 2016-08-29 | 2018-03-01 | At & S Austria Technologie & Systemtechnik Aktieng | Matching Inclination of Cavity Sidewall and Medium Supply Device for Manufacturing Component Carrier |
| DE102018104631A1 (en) * | 2017-03-31 | 2018-10-04 | Intel Corporation | A method of forming a substrate structure for an electric component and apparatus for applying a pressure to a core substrate of a heat-insulating electrically insulating laminate |
-
2020
- 2020-11-11 CN CN202011264471.5A patent/CN112788869A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004074573A (en) * | 2002-08-19 | 2004-03-11 | Asahi Kasei Chemicals Corp | Resin extruded sheet with protective paper stuck on surface, and manufacturing method therefor |
| CN103209550A (en) * | 2013-04-16 | 2013-07-17 | 汕头超声印制板（二厂）有限公司 | Lamination structure for multilayer printed board and lamination thickness control method |
| CN105636368A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Control method for uniformly laminating multi-layered PCB |
| US20180063965A1 (en) * | 2016-08-29 | 2018-03-01 | At & S Austria Technologie & Systemtechnik Aktieng | Matching Inclination of Cavity Sidewall and Medium Supply Device for Manufacturing Component Carrier |
| DE102018104631A1 (en) * | 2017-03-31 | 2018-10-04 | Intel Corporation | A method of forming a substrate structure for an electric component and apparatus for applying a pressure to a core substrate of a heat-insulating electrically insulating laminate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210511 |