CN112788469A

CN112788469A - Earphone and electronic equipment

Info

Publication number: CN112788469A
Application number: CN202110223300.6A
Authority: CN
Inventors: 冯海彬
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-03-01
Filing date: 2021-03-01
Publication date: 2021-05-11

Abstract

The application discloses an earphone and electronic equipment, wherein the earphone comprises a shell, a moving coil unit, a micro electro mechanical system unit and an audio cavity bracket; the moving coil unit is arranged in the shell; the sound cavity support is arranged in the shell and divides the shell into a first cavity and a second cavity which are communicated; the micro-electro-mechanical system unit is arranged on the sound cavity bracket and can emit sound waves to the first cavity and the second cavity; at least part of sound waves emitted to the first cavity by the micro-electro-mechanical system unit can enter the second cavity and can be offset with at least part of sound waves emitted to the second cavity by the micro-electro-mechanical system unit. The earphone provided by the embodiment of the application perfectly combines the high-frequency advantage of the micro electro mechanical system unit and the medium-low frequency advantage of the moving coil unit, and medium-low frequency sound waves of the micro electro mechanical system unit are offset, so that the problem of unnatural connection of medium-low frequency waves is avoided, and a high-fidelity tone quality curve can be presented.

Description

Earphone and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to an earphone and electronic equipment.

Background

Along with the market sales of wireless bluetooth earphones, more and more users use the earphones, and the requirement of the users on the tone quality of the earphones due to the improvement of the music appreciation capability is continuously improved, so that the tone quality becomes the most important function point for the users to purchase the earphones.

In the related art, the design of the high-fidelity headset mainly comprises the following two schemes:

the first design scheme is a single speaker unit, but it is difficult for one speaker unit to simultaneously achieve the sound quality of low, medium and high frequencies, and the main difficulty is the speaker diaphragm. Therefore, high-fidelity earphones usually select very special materials as the diaphragms, but such diaphragms have low manufacturing yield and are expensive.

The second kind is a plurality of loudspeaker unit combination design scheme, and more common is that the complex moving coil unit of structural design and moving iron unit cooperation scheme utilize moving iron unit high pitch advantage and the bass advantage of moving coil unit to present high assurance tone quality, but the sound of moving iron unit and moving coil unit at low and medium frequency links up unnaturally, the power of forming an image is not enough.

Disclosure of Invention

The application aims to provide an earphone and electronic equipment, and at least solves the technical problems that in the related technology, the sound connection of a moving iron unit and a moving coil unit at medium and low frequencies is not natural and the imaging force is not enough.

In order to solve the technical problem, the present application is implemented as follows:

in a first aspect, an embodiment of the present application provides an earphone, which includes a housing, a moving coil unit, a mems unit, and an audio cavity support; the moving coil unit is arranged in the shell; the sound cavity support is arranged in the shell and divides the shell into a first cavity and a second cavity which are communicated; the micro-electro-mechanical system unit is arranged on the sound cavity bracket and can emit sound waves to the first cavity and the second cavity; at least part of sound waves emitted to the first cavity by the micro-electro-mechanical system unit can enter the second cavity and can be offset with at least part of sound waves emitted to the second cavity by the micro-electro-mechanical system unit.

In a second aspect, an embodiment of the present application provides an electronic device, including an earphone according to the foregoing technical solution.

In the embodiment of the application, the sound cavity bracket divides the shell into a first cavity and a second cavity which are communicated; the micro electro mechanical system unit can emit sound waves to the first cavity and the second cavity, and medium and low frequency sound waves emitted to the first cavity by the micro electro mechanical system unit can enter the second cavity and can be offset with the medium and low frequency sound waves emitted to the second cavity by the micro electro mechanical system unit.

Therefore, the high-frequency sound wave generated by the micro electro mechanical system unit and the medium-low frequency sound wave generated by the moving coil unit are mutually superposed, and finally, the high-fidelity sound performance is obtained. Moreover, the low-and-medium frequency sound waves of the micro electro mechanical system unit are mutually offset, the problem that the low-and-medium frequency connection is unnatural in double-unit combination in the related technology can not occur, the high-frequency advantage of the micro electro mechanical system unit and the low-and-medium frequency advantage of the moving coil unit are perfectly combined, and finally, a high-fidelity tone quality curve is presented.

In addition, the earphone that this application embodiment provided is very simple on structural design and assembly process, only needs the casing of a sound chamber support of design and earphone to carry out the structure matching, just can obtain the earphone of the double unit combination that has high fidelity performance, and the volume production of the earphone of being convenient for can reduce the cost of earphone simultaneously.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a headset according to one embodiment of the present application;

fig. 2 is an exploded view of the headset of fig. 1;

fig. 3 is a cross-sectional view of the first housing and the MEMS unit module of the headset of fig. 2 after assembly;

fig. 4 is a sectional view of the earphone of fig. 2 after the first housing, the MEMS unit module, and the moving coil unit are assembled;

fig. 5 is a schematic structural view of the earphone shown in fig. 2 after the MEMS unit module is assembled with the housing;

fig. 6 is a schematic structural view of a sound cavity holder in the earphone shown in fig. 2;

FIG. 7 is a schematic diagram of the MEMS unit of the headset shown in FIG. 2;

FIG. 8 is a graph comparing the acoustic effect of the sound-guiding channel on the MEMS unit in the earphone according to the embodiment of the present application;

fig. 9 is a diagram of the final sound wave effect of the earphone according to the embodiment of the present application.

Reference numerals in fig. 1 to 7:

102 shell, 104 moving coil unit, 106 micro-electro-mechanical system unit, 108 sound cavity support, 110 first cavity, 112 second cavity, 114 support body, 116 sound guide channel, 118 positioning part, 120 assembling groove, 122 through hole, 124 sound outlet channel, 126 first shell, 128 second shell, 130MEMS unit module.

Detailed Description

Reference will now be made in detail to the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description and claims of this application, the term "plurality" means two or more unless otherwise specified. Further, "and/or" in the specification and claims means at least one of the connected objects.

In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be taken as limiting the present application.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The following describes an earphone and an electronic device according to an embodiment of the present application with reference to fig. 1 to 9. Wherein, the arrows in fig. 4 indicate the transmission direction of the medium and low frequency sound waves, and the areas a and B indicate the sound wave short circuit phenomenon; in fig. 8, a line L1 represents an acoustic wave curve when the acoustic wave short circuit phenomenon occurs, and a line L2 represents an acoustic wave curve when the acoustic wave short circuit phenomenon does not occur; in fig. 9, a line L3 represents the acoustic wave curve of the moving coil unit 104 mixed with the mems unit 106, and a line L4 represents the acoustic wave curve of the moving coil unit 104.

As shown in fig. 1, fig. 2 and fig. 3, a first embodiment of the present application provides a headset, which includes a housing 102, a moving coil unit 104, a Micro-Electro-Mechanical System unit 106(Micro-Electro-Mechanical System, MEMS unit 106 for short), and an acoustic cavity support 108. As shown in fig. 3 and 4, the moving coil unit 104 is installed in the housing 102, the mems unit 106 is installed in the housing 102 through the sound cavity bracket 108, and the sound cavity bracket 108 divides the housing 102 into a first chamber 110 and a second chamber 112 which are communicated with each other; the mems unit 106 may emit sound waves into the first and

second chambers

110 and 112, and the low and medium frequency sound waves emitted from the mems unit 106 into the first chamber 110 may enter the second chamber 112 and cancel the low and medium frequency sound waves emitted from the mems unit 106 into the second chamber 112.

As shown in fig. 7, the mems unit 106 and the moving coil unit 104 are sound generating devices that convert electrical signals into sound waves and are used in combination. Specifically, the mems unit 106 employs an inverse piezoelectric effect, and a voltage is applied to the piezoelectric crystal to generate a corresponding mechanical deformation, so as to drive the diaphragm of the mems unit 106 to vibrate to generate sound waves, and the piezoelectric crystal of the mems unit 106 has a very good transient vibration characteristic and a high vibration frequency. The mems unit 106 has more excellent high frequency performance than the conventional moving coil unit or moving iron unit. Therefore, the embodiment of the application can greatly improve the sound quality of the earphone in the middle and high frequency band by the matching use of the micro electro mechanical system unit 106 and the moving coil unit 104.

In addition, as shown in fig. 4 and fig. 8, the middle and low frequency sound waves emitted from the mems unit 106 to the first cavity 110 can enter the second cavity 112, and the sound waves interfere with the middle and low frequency sound waves emitted from the mems unit 106 to the second cavity 112 to form a sound wave short circuit phenomenon, which can attenuate the middle and low frequency performance of the mems unit 106; as shown in fig. 9, the low-and-medium frequency performance of the whole earphone is realized by the moving coil unit 104, so that the high-frequency sound wave generated by the mems unit 106 and the low-and-medium frequency sound wave generated by the moving coil unit 104 are superimposed, and finally, the high-fidelity sound performance is obtained. Moreover, the low-and-medium frequency sound waves of the micro electro mechanical system unit 106 are mutually offset, the problem that the low-and-medium frequency connection is unnatural in the double-unit combination in the related technology cannot occur, the high-frequency advantage of the micro electro mechanical system unit 106 and the low-and-medium frequency advantage of the moving coil unit 104 are perfectly combined, and finally, a high-fidelity sound quality curve is presented.

Therefore, the acoustic performance of the earphone provided by the embodiment of the application in the middle and low frequency bands of 20Hz to 1kHz basically inherits the performance of the moving coil unit 104, and the problem that the middle and low frequency sound waves of the moving coil unit 104 are not naturally connected with the pilot frequency sound waves of the micro electro mechanical system unit 106 does not exist. In addition, the acoustic performance of the earphone in a high-frequency band is obviously improved, and the earphone is ensured to finally present a high-fidelity tone quality curve due to the superposition of high-frequency sound waves generated by the micro electro mechanical system unit 106.

In addition, the earphone provided by the embodiment of the application is very simple in structural design and assembly process, and the earphone with high fidelity performance and double-unit combination can be obtained only by designing one sound cavity support 108 to be structurally matched with the casing 102 of the earphone, so that the volume production of the earphone is facilitated, and the cost of the earphone can be reduced.

As a possible embodiment, as shown in fig. 2, 3 and 4, a sound guide channel 116 is disposed in the housing 102, and the sound guide channel 116 is communicated with the first chamber 110 and the second chamber 112. The sound guide channel 116 has two functions, one function is that the sound wave of the moving coil unit 104 can be conducted to the outside through the sound guide channel 116, and the other function is that the low and medium frequency sound wave emitted by the micro electro mechanical system unit 106 to the first cavity 110 can be conducted to the second cavity 112 through the sound guide channel 116 to form a sound wave short circuit phenomenon, so that the sound wave short circuit phenomenon is similar to a filter function, the low and medium frequency sound wave of the micro electro mechanical system unit 106 can be filtered, and the problem that the low and medium frequency sound wave of the micro electro mechanical system unit 106 and the moving coil unit 104 cannot be jointed naturally can be solved.

As a possible embodiment, as shown in fig. 2, 3 and 4, the sound cavity holder 108 includes a holder body 114. The sound guide channel 116 is formed between the bracket body 114 and the inner wall of the housing 102. As shown in fig. 3, 4 and 5, the sound guide channel 116 is directly defined by the support body 114 and the inner wall of the housing 102, so that the design requirement and the assembly process requirement for the sound cavity support 108 are reduced, and the structure of the sound cavity support 108 can be simplified, which is beneficial to reducing the cost of the earphone.

As a possible embodiment, as shown in fig. 5 and 6, the outer side wall of the bracket body 114 is provided with a positioning portion 118, and the positioning portion 118 is provided protruding from the outer side wall of the bracket body 114, and is installed in the housing 102 through the bracket body 114 by the positioning portion 118. Thus, after the bracket body 114 is installed, the gap between two adjacent positioning portions 118 can be used as the sound guide channel 116, so as to ensure the communication relationship between the first chamber 110 and the second chamber 112, and simultaneously ensure that the sound wave of the moving coil unit 104 can be conducted outwards through the sound guide channel 116, so as to ensure that the middle and low frequency sound wave of the mems unit 106 can be filtered.

As a possible implementation, as shown in fig. 5 and fig. 6, a mounting groove 120 is provided on the stand body 114, and the mems unit 106 is mounted in the mounting groove 120, so that the structure of the mems unit 106 and the sound cavity stand 108 after assembly is minimized, and a miniaturized design of the earphone is realized.

As a possible embodiment, as shown in fig. 3, 4 and 6, the mems unit 106 is located in the second chamber 112, and the middle of the bracket body 114 is provided with a through hole 122. Specifically, the through hole 122 opens at the bottom wall of the fitting groove 120, and communicates with both the first chamber 110 and the second chamber 112. Thus, when the mems unit 106 is mounted to the bracket body 114, sound waves can be generated to the first and

second cavities

110 and 112 simultaneously.

As a possible implementation mode, the sound cavity support comprises a support body, and the sound guide channel is directly formed in the support body. Particularly, the sound guide channel is directly formed on the support body, so that a gap between the support body and the inner wall of the shell 102 is avoided, the sound cavity support 108 and the compact design are ensured, and the miniaturization design of the earphone is realized.

As a possible implementation manner, as shown in fig. 3 and 4, the housing 102 is provided with a sound outlet channel 124, and the sound outlet channel 124 is communicated with the first chamber 110 to ensure that the sound waves generated by the moving coil unit 104 and the mems unit 106 can be transmitted out through the sound outlet channel 124. In addition, from the mems unit 106 to the inlet end of the sound outlet channel 124, the inner wall of the housing 102 is in a tapered state, and the inlet end of the sound outlet channel 124 is ensured to correspond to the middle of the mems unit 106, so as to ensure that the middle and low frequency sound waves generated by the mems unit 106 can enter the second chamber 112 through the sound guide channel 116, and ensure that the high frequency sound waves generated by the mems unit 106 can be conducted out through the sound outlet channel 124.

As one possible embodiment, as shown in fig. 2, 3 and 4, the housing 102 includes a first housing 126 and a second housing 128 connected, and the first chamber 110 and the second chamber 112 are formed within the first housing 126. In the process of assembling the earphone, firstly, the mems unit 106 is mounted on the sound cavity bracket 108, and the sound cavity bracket 108 and the mems unit 106 are integrally mounted in the first shell 126; the moving coil unit 104 is then mounted to the first housing 126; finally, the second housing 128 is connected to the first housing 126 to complete the overall assembly of the headset.

In a specific embodiment, as shown in fig. 2, the first housing 126 is a rear cover of the headset and the second housing 128 is a front cover of the headset.

As a possible embodiment, the housing 102 is a plastic housing 102, and may be formed by injection molding using ABS, PC, or ABS + PC composite.

As a possible implementation manner, the sound cavity support 108 is a plastic support, and may specifically be formed by injection molding of ABS, PC, or ABS + PC composite material.

As a possible embodiment, the sound cavity bracket 108 and the housing 102 are a split structure and assembled in the above manner, and the sound cavity bracket 108 and the housing 102 can be directly designed as an integral structure.

In particular embodiments, the headset may be a wired headset or a wireless headset.

A second embodiment of the present application provides an electronic device including a headset according to the above-mentioned embodiment. Therefore, all the advantages of the earphone are achieved, and the discussion is omitted.

In a specific embodiment, the electronic device may be: mobile phones, tablet computers, notebook computers, desktop computers, and the like.

An object of the embodiment of the application is to provide a novel high-fidelity earphone, integrate moving coil unit 104 and micro electro mechanical system unit 106 in the earphone, cooperation sound chamber support 108 can be fine combine together the high frequency advantage of micro electro mechanical system unit 106 and the well low frequency advantage of moving coil unit 104, demonstrate the tone quality effect of high-fidelity to the unnatural problem of low frequency link up in the prior art scheme can not appear, whole structural design is simple moreover, and the manufacturing and processing cost is low.

Specifically, as shown in fig. 1, fig. 2 and fig. 3, the earphone proposed in the embodiment of the present application includes a first housing 126, a second housing 128, a sound cavity support 108, a mems unit 106, and a moving coil unit 104; specifically, as shown in fig. 3 and 4, the mems unit 106 and the moving coil unit 104 are integrated within the first housing 126; the mems unit 106 and the moving coil unit 104 are sound generating devices that convert electrical signals into sound signals.

The mems unit 106 is a novel sound generating device, and can convert an electrical signal into a sound wave signal; the mems unit 106 employs an inverse piezoelectric effect, and a voltage is applied to the piezoelectric crystal to cause the piezoelectric crystal to generate a corresponding mechanical deformation, so as to drive the diaphragm of the mems unit 106 to vibrate to generate sound waves, and the piezoelectric crystal of the mems unit 106 has a very good transient vibration characteristic and a high vibration frequency. The mems unit 106 has more excellent high frequency performance than the conventional moving coil unit or moving iron unit. Therefore, the embodiment of the application can greatly improve the sound quality of the earphone in the middle and high frequency band by the matching use of the micro electro mechanical system unit 106 and the moving coil unit 104.

In the process of assembling the earphone, firstly, the MEMS unit 106 is mounted on the sound cavity bracket 108 to form the MEMS unit module 130, and then the MEMS unit module 130 is assembled with the first housing 126; further, the moving coil unit 104 is assembled with the first housing 126, so that the moving coil unit 104 and the mems unit 106 are integrated on the first housing 126; finally, the second housing 128 is assembled with the first housing 126 to form the earphone.

As shown in fig. 3, 4, and 5, after the MEMS unit module 130 and the first housing 126 are assembled, the sound guide channel 116 is designed, the sound guide channel 116 has two functions, one is that sound waves of the moving coil unit 104 can be conducted to the outside through the channel, and the other is that the first cavity 110 and the second cavity 112 are communicated to form a sound wave short circuit, which functions like a filter, and can filter the medium and low frequency sound waves of the MEMS unit 106, so that the unnatural problem of sound wave connection between the MEMS unit 106 and the moving coil unit 104 can be solved.

In an embodiment, the first housing 126 and the second housing 128 are plastic housings 102, and may be formed by injection molding using ABS, PC, or ABS + PC composite.

In the embodiment, as shown in fig. 5, 6 and 7, the sound cavity bracket 108 is designed to match with the shape of the MEMS unit 106, the bracket body 114 of the sound cavity bracket 108 is provided with an assembling groove 120 and a positioning portion 118, and the MEMS unit 106 is mounted in the assembling groove 120 to form the MEMS unit module 130. Further, the MEMS unit module 130 is assembled with the first housing 126 through the positioning portion 118, and the sound guide channel 116 is formed between the outer wall of the frame body and the inner wall of the first housing 126. Then, the moving coil unit 104 is assembled with the first shell 126 to form an earphone front cover body; the first shell 126 is further assembled with the front cover body of the earphone, thereby completing the integral assembly of the earphone.

In a specific embodiment, as shown in fig. 3, a space between the MEMS unit module 130 and the moving coil unit 104 is referred to as a second chamber 112, and a space between the MEMS unit 106 and the inlet end of the sound outlet channel 124 of the first housing 126 is referred to as a first chamber 110, due to the existence of the sound guide channel 116, the first chamber 110 and the second chamber 112 are communicated with each other, so that the low-and-medium-frequency sound waves emitted by the MEMS unit 106 in the first chamber 110 are conducted to the second chamber 112 through the sound guide channel 116, and interfere with the low-and-medium-frequency sound waves in the rear cavity of the MEMS unit 106 in the region a and the region B to form a sound wave short circuit phenomenon, which can attenuate the low-and medium-frequency performance of the MEMS unit 106 itself, as can be seen in fig. 8, compared with the sound wave short circuit phenomenon, the MEMS unit 106 is significantly lowered in the frequency band below.

In addition, the sound wave generated by the moving coil unit 104 is normally propagated into the sound outlet channel 124 of the earphone through the sound guide channel 116, so that the medium and low frequency sound wave of the moving coil unit 104 and the high frequency sound wave of the micro electro mechanical system unit 106 are mutually superposed, and finally the high fidelity sound performance is obtained; as the low and medium frequency sound waves of the mems unit 106 are mutually offset after the acoustic short circuit, the problem of unnatural low frequency connection in the dual-unit combination in the related technical scheme is not caused, as can be seen from fig. 9, the acoustic performance of the earphone provided by the embodiment of the present application in the low and medium frequency band of 20Hz to 1kHz basically inherits the performance of the moving coil unit 104 itself, so that the problem of connection with the mems unit 106 does not exist, and in addition, the acoustic performance in the high frequency band is significantly improved, which is benefited by the superposition of the sound waves of the mems unit 106, and finally, a high-fidelity sound quality curve is presented.

Moreover, the earphone provided by the embodiment of the application is very simple in structural design and assembly process, and a dual-unit combined earphone with high fidelity performance can be obtained only by designing one sound cavity support 108 to match with the first shell 126 for structural matching.

Other configurations of … …, such as … … and … …, and the like and operation according to embodiments of the present application are known to those of ordinary skill in the art and will not be described in detail herein.

In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An earphone is characterized in that a plurality of earphones are arranged on the earphone body,

the earphone comprises a shell, a moving coil unit, a micro electro mechanical system unit and an audio cavity bracket;

the moving coil unit is arranged in the shell;

the sound cavity support is arranged in the shell and divides the shell into a first cavity and a second cavity which are communicated with each other;

the micro-electro-mechanical system unit is arranged on the sound cavity bracket and can emit sound waves to the first cavity and the second cavity;

at least part of the sound wave emitted by the micro electro mechanical system unit to the first chamber can enter the second chamber and can be cancelled with at least part of the sound wave emitted by the micro electro mechanical system unit to the second chamber.

2. The headset of claim 1,

a sound guide channel is arranged in the shell and communicated with the first cavity and the second cavity;

at least part of the sound wave emitted by the micro-electro-mechanical system unit to the first chamber can enter the second chamber through the sound guide channel.

3. The headset of claim 2,

the sound cavity support comprises a support body, and the sound guide channel is formed between the support body and the inner wall of the shell.

4. The headset of claim 3,

the outer wall of the support body is provided with positioning parts, the support body is installed in the shell through the positioning parts, and the sound guide channels are located between the adjacent positioning parts.

5. The headset of claim 3,

the bracket body is provided with an assembly groove, and the micro-electro-mechanical system unit is arranged in the assembly groove.

6. The headset of claim 3,

the micro-electro-mechanical system unit is positioned in the second chamber;

the middle part of the bracket body is provided with a through hole, and the micro electro mechanical system unit can emit the sound wave to the first cavity through the through hole.

7. The headset of claim 2,

the sound cavity support comprises a support body, and the sound guide channel is arranged on the support body.

8. The headset according to any one of claims 1 to 7,

a sound outlet channel is arranged on the shell and communicated with the first cavity;

wherein an inner wall of the housing is tapered from the mems unit to an inlet end of the sound outlet channel.

9. The headset according to any one of claims 1 to 7,

the housing comprises a first housing and a second housing; wherein the sound cavity bracket and the moving coil unit are mounted on the first shell to form the first cavity; the second housing is connected to the first housing and forms the second chamber.

10. The headset according to any one of claims 1 to 7,

the shell is a plastic shell;

the sound cavity bracket is a plastic bracket;

the sound cavity support and the shell are of a split structure or an integrated structure.

11. An electronic device, characterized in that it comprises a headset according to any of claims 1 to 10.