CN112779493A - Preparation method of CrN coating for surface of gravure printing plate based on GIS and HIPIMS technology - Google Patents
Preparation method of CrN coating for surface of gravure printing plate based on GIS and HIPIMS technology Download PDFInfo
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- CN112779493A CN112779493A CN202010847279.2A CN202010847279A CN112779493A CN 112779493 A CN112779493 A CN 112779493A CN 202010847279 A CN202010847279 A CN 202010847279A CN 112779493 A CN112779493 A CN 112779493A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
- C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a preparation method of a CrN coating on the surface of an intaglio printing plate based on GIS and HIPIMS technology, which adopts Gas Ion Source Etching cleaning technology (GISETCH) and High-Power Impulse magnetron sputtering technology (HIPIMS) to plate a High-quality Cr + CrN coating on the surface of the intaglio printing plate to replace the original water electroplating process. After analyzing the performances of the coating in various aspects such as ball pit test, roughness test, scratch test, hardness test, surface appearance observation and the like, the Cr + CrN coating prepared by the GISETCH and HIPIMS technology has stronger film base binding force, finer surface crystal grains, less defects and compact section structure, and the printing resistance rate exceeds the water electroplating level through the actual printing test.
Description
Technical Field
The invention belongs to the technical field of functional coatings, and particularly relates to a preparation method of a CrN coating for the surface of a gravure printing plate based on GIS and HIPIMS technologies.
Background
The intaglio printing uses pits engraved according to the image and text of the original manuscript to carry ink, the thickness of lines and the gradation of the ink can be controlled at will during engraving, and the intaglio printing is not easy to imitate and forge and is more and more widely applied. Conventional gravure printing plate coatings employ a metal layer such as electroplated copper or chromium to increase the lifetime. The electroplating process is seriously polluted and the surface of the coating is uneven. In recent years, the Physical Vapor Deposition (PVD) technology is utilized to prepare coatings, the application is wide, the existing mature micro direct current magnetron sputtering technology and the electric arc ion plating technology are poor in binding force between film bases in the common magnetron sputtering technology, the coatings are prone to peeling and failure, the electric arc ion plating technology has the advantages of high metal ionization rate and strong film base binding force, but a large number of macro particles easily generated in the deposition process are accumulated, the surfaces of the coatings are rough, the internal stress of the coatings is high, and the printing resistance is low. Therefore, there is a need to develop a process for preparing a coating for a high-performance gravure printing plate.
Disclosure of Invention
The invention adopts a Gas Ion Source Etching and cleaning technology (GISETCH) and a High-Power Impulse magnetron sputtering technology (HIPIMS) to plate a High-quality Cr + CrN coating on the surface of the gravure printing plate, which is used for replacing the original water electroplating process, the film-substrate binding force is stronger, the surface crystal grains are finer, the defects are fewer, the section structure is compact, and the printing resistance rate exceeds the water electroplating level through the actual printing test.
In order to achieve the purpose, the invention provides the following technical scheme: the method comprises the steps of cleaning and drying the surface of a nickel plate by taking the nickel plate as a substrate, fixing the nickel plate on a coating machine rotating frame, setting a certain temperature and bias voltage after the coating machine is vacuumized, introducing a certain amount of argon and hydrogen, ionizing Ar atoms and H atoms into Ar ions and H ions under high voltage through a Gas Ion Source Etching cleaning technology (GISETCH), bombarding and activating the nickel plate by the Ar ions and the H ions under the action of the bias voltage to finish Etching and cleaning the surface of the nickel plate, and then finishing the preparation of the Cr + CrN composite coating under a coating process.
As a preferred technical scheme of the invention, the substrate is a nickel plate, and the nickel plate is ultrasonically cleaned for 15-20 min by using an acetone solution and an industrial absolute ethyl alcohol reagent before being installed and clamped and is dried in a drying oven. The CrN coating preparation adopts a high-purity Cr target with the purity of more than 99.9 percent.
As a preferred technical scheme of the invention, the effective coating space of the coating machine is phi 1100mm multiplied by 1100mm, and a HIPIMS high-energy pulse magnetron power supply is arranged in a vacuum chamber.
As a preferred technical scheme of the invention, the gas ion source etching cleaning technology comprises the steps of setting the rotating speed of a rotating frame to be 1-2r/min, and vacuumizing to 3.0 x 10 before deposition is started-3The deposition temperature is below Pa and is 150-180 ℃; introducing pure Ar into the vacuum chamber until the air pressure of the cavity reaches 0.5pa, adjusting the bias voltage to-400V, and bombarding the nickel plate by utilizing Ar ions for 60-90min under the bias voltage condition to finish the surface cleaning of the nickel plate.
As a preferred technical scheme of the invention, the coating process specifically comprises the following steps: plating a Cr layer as a bottom layer, and then plating a CrN layer. Controlling the deposition time of the bottom layer to be 30-40 min; and introducing nitrogen gas when the CrN layer is deposited, wherein the nitrogen gas flow is set to be 30-40 sccm, the high pulse target sputtering power is 10kW, and the substrate bias is-70 to-90V. The multilayer structure coating is deposited in a mode that a layer of Cr and a layer of CrN are mutually overlapped, and the deposition time of each layer is controlled to be 8-10 min.
Compared with the prior art, the invention has the beneficial effects that: the invention adopts a Gas Ion Source Etching cleaning technology (GISETCH) and a High-Power Impulse magnetron sputtering technology (HIPIMS) to plate a High-quality Cr + CrN coating on the surface of the gravure printing plate for replacing the original water electroplating process. The Cr + CrN film layer is more compact, and the brightness and the compactness of the film layer are better than those of other magnetron sputtering technologies. Through analysis of ball pit test, roughness test, scratch test, hardness test, surface appearance observation and the like, the Cr + CrN coating prepared by GISETCH and HIPIMS technologies has stronger film base binding force, finer surface crystal grains, less defects and compact section tissue, and the printing resistance rate is far higher than the water electroplating level through actual printing test.
Drawings
FIG. 1 is a diagram of a ball pit of a CrN coating ball mill;
FIG. 2 is a comparative plot of CrN coating preparation;
FIG. 3 is a graph of a CrN coating scratch trace and a scratch parameter curve;
FIG. 4 is a graph of a scratch trace and a scratch parameter curve of a CrN coating in other processes;
FIG. 5 is a photograph of the microstructure of the surface of a CrN coating in a deposited state;
FIG. 6 is a photograph of the microstructure of the surface of a CrN coating layer deposited by other processes
FIG. 7 is a microstructure photograph of a cross section of a as-deposited CrN coating;
Detailed Description
A preparation method of a CrN coating for the surface of a gravure printing plate based on GIS and HIPIMS technology is characterized by comprising the following specific steps: the method comprises the steps of cleaning and drying the surface of a nickel plate by taking the nickel plate as a substrate, fixing the nickel plate on a coating machine rotating frame, setting a certain temperature and bias voltage after the coating machine is vacuumized, introducing a certain amount of argon and hydrogen, ionizing Ar atoms and H atoms into Ar ions and H ions under high voltage through a Gas Ion Source Etching cleaning technology (GISETCH), bombarding and activating the nickel plate by the Ar ions and the H ions under the action of the bias voltage to finish Etching and cleaning the surface of the nickel plate, and then finishing the preparation of the Cr + CrN composite coating under a coating process.
As a preferred technical scheme of the invention, the substrate is a nickel plate, and the nickel plate is ultrasonically cleaned for 15-20 min by using an acetone solution and an industrial absolute ethyl alcohol reagent before being installed and clamped and is dried in a drying oven. The CrN coating preparation adopts a high-purity Cr target with the purity of more than 99.9 percent.
As a preferred technical scheme of the invention, the effective coating space of the coating machine is phi 1100mm multiplied by 1100mm, and a HIPIMS high-energy pulse magnetron power supply is arranged in a vacuum chamber.
As a preferred technical scheme of the invention, the gas ion source etching cleaning technology comprises the steps of setting the rotating speed of a rotating frame to be 1-2r/min, and vacuumizing to 3.0 x 10 before deposition is started-3Pa below, deposition temperature of 150 to180 ℃; introducing pure Ar into the vacuum chamber until the air pressure of the cavity reaches 0.5pa, adjusting the bias voltage to-400V, and bombarding the nickel plate by utilizing Ar ions for 60-90min under the bias voltage condition to finish the surface cleaning of the nickel plate.
As a preferred technical scheme of the invention, the coating process specifically comprises the following steps: plating a Cr layer as a bottom layer, and then plating a CrN layer. Controlling the deposition time of the bottom layer to be 30-40 min; and introducing nitrogen gas when the CrN layer is deposited, wherein the nitrogen gas flow is set to be 30-400 sccm, the high pulse target sputtering power is 10kW, and the substrate bias is-70 to-90V. The multilayer structure coating is deposited in a mode that a layer of Cr and a layer of CrN are mutually overlapped, and the deposition time of each layer is controlled to be 8-10 min.
As a preferred technical scheme of the invention, the coating process specifically comprises the following steps: plating a Cr layer as a bottom layer, and then plating a CrN layer. Controlling the deposition time of the bottom layer to be 30-40 min; and introducing nitrogen gas when the CrN layer is deposited, wherein the nitrogen gas flow is set to be 30-40 sccm, the high pulse target sputtering power is 10kW, and the substrate bias is-70 to-90V. The multilayer structure coating is deposited in a mode that a layer of Cr and a layer of CrN are mutually overlapped, and the deposition time of each layer is controlled to be 8-10 min.
Example 1
FIG. 1 shows the multi-layer coating morphology of the coating observed under a microscope after rubbing the coating with a ball and crater instrument. It can be seen that the layers are distinct, the ring-shaped structure is basically a concentric ring, and compared with the coating preparation method shown in fig. 2, the process can prepare a coating with more layers, uniform layer thickness and better transition layer combination.
Fig. 3 shows ARC CrN, (H + B) CrN, and curves in which the base line fluctuates up and down in the figure are acoustic emission signal curves, and the trend line above the base line is a friction coefficient curve, respectively. The abrupt transition of the coefficient of friction curve indicates that the diamond indenter has scratched from the coating to the substrate. The ARC CrN critical load 33.5N, (H + B) CrN critical load 72.2N is plotted on the graph, and the coating deposited by this method has better film-based adhesion. And the scratch edge in fig. 3 is smooth and flat, and the coating is more tightly combined with the substrate. The other process comparison of fig. 4 shows that the scratch edge shows a fine coating peeling block, the coating is not well combined, and the coating is brittle and hard.
FIG. 5 shows the surface micro-topography observed under a scanning electron microscope. In comparison with the graph in FIG. 6, the arc ion plating deposited coating has large liquid drops on the surface and pinhole defects, and the coating has smooth surface and very compact tissue arrangement under the process condition, and although a small amount of pinholes appear, the whole coating is uniform. The cross-sectional view shows that the pattern of the multi-layer coating is very obvious in layer by layer distribution.
FIG. 7 is a cross section of the coating (process) showing that the fine columnar grains are pressed tightly together and the texture is finer.
The above embodiments are all preferred embodiments of the present invention, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention fall within the scope of the present invention.
Claims (5)
1. A preparation method of a CrN coating for the surface of a gravure printing plate based on GIS and HIPIMS technology is characterized by comprising the following specific steps: the method comprises the steps of cleaning and drying the surface of a nickel plate by taking the nickel plate as a substrate, fixing the nickel plate on a coating machine rotating frame, setting a certain temperature and bias voltage after the coating machine is vacuumized, introducing a certain amount of argon and hydrogen, ionizing Ar atoms and H atoms into Ar ions and H ions under high voltage through a Gas Ion Source Etching cleaning technology (GISETCH), bombarding and activating the nickel plate by the Ar ions and the H ions under the action of the bias voltage to finish Etching and cleaning the surface of the nickel plate, and then finishing the preparation of the Cr + CrN composite coating under a coating process.
2. The preparation method of a CrN coating for the surface of intaglio printing plates based on GIS and HIPIMS technology as claimed in claim 1, characterized in that: the substrate is a nickel plate, the nickel plate is ultrasonically cleaned for 15-20 min by using an acetone solution and an industrial absolute ethyl alcohol reagent before being installed and clamped, and the nickel plate is dried in a drying oven. The Cr + CrN coating is prepared by adopting high-purity Cr with the purity of more than 99.9 percent
A target.
3. The preparation method of a CrN coating for the surface of intaglio printing plates based on GIS and HIPIMS technology as claimed in claim 1, characterized in that: the effective coating space of the coating machine is phi 1100mm multiplied by 1100mm, and an HIPIMS high-energy pulse magnetron power supply is arranged in the vacuum chamber.
4. The preparation method of a CrN coating for the surface of intaglio printing plates based on GIS and HIPIMS technology as claimed in claim 1, characterized in that: the gas ion source etching and cleaning technology comprises setting the rotating speed of a rotating frame to be 1-2r/min, and vacuumizing to 3.0 x 10 before deposition-3The deposition temperature is below Pa and is 150-180 ℃; introducing pure Ar into the vacuum chamber until the air pressure of the cavity reaches 0.5pa, adjusting the bias voltage to-400V, and bombarding the nickel plate by utilizing Ar ions for 60-90min under the bias voltage condition to finish the surface cleaning of the nickel plate.
5. The preparation method of a CrN coating for the surface of intaglio printing plates based on GIS and HIPIMS technology as claimed in claim 1, characterized in that: the coating process specifically comprises the following steps: plating a Cr layer as a bottom layer, and then plating a CrN layer. Controlling the deposition time of the bottom layer to be 30-40 min; and introducing nitrogen gas when the CrN layer is deposited, wherein the nitrogen gas flow is set to be 30-40 sccm, the high pulse target sputtering power is 10kW, and the substrate bias is-70 to-90V. The multilayer structure coating is deposited in a mode that a layer of Cr and a layer of CrN are mutually overlapped, and the deposition time of each layer is controlled to be 8-10 min.
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| CN202010847279.2A CN112779493A (en) | 2020-08-21 | 2020-08-21 | Preparation method of CrN coating for surface of gravure printing plate based on GIS and HIPIMS technology |
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| CN202010847279.2A CN112779493A (en) | 2020-08-21 | 2020-08-21 | Preparation method of CrN coating for surface of gravure printing plate based on GIS and HIPIMS technology |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116240512A (en) * | 2023-03-01 | 2023-06-09 | 纳狮新材料有限公司杭州分公司 | Spray cleaning of coating die head and preparation of CrxN lamination on surface of coating die head |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5561326A (en) * | 1992-01-08 | 1996-10-01 | Mitsubishi Denki Kabushiki Kaisha | Large scale integrated circuit device |
| CN101181848A (en) * | 2007-12-27 | 2008-05-21 | 中国印钞造币总公司 | Gravure edition as well as making method and vacuum deposition film-plating apparatus thereof |
| DE102009015478A1 (en) * | 2009-03-26 | 2010-09-30 | Roth & Rau Ag | Producing hard material layers by magnetron sputtering, comprises carrying out a substrate cleaning and then a substrate pre-treatment, in which a coating material is deposited on a substrate with a magnetron in pure inert gas atmosphere |
| CN103741105A (en) * | 2013-12-24 | 2014-04-23 | 中国印钞造币总公司 | Chrome-based coating film and preparation method thereof |
| CN103741108A (en) * | 2013-12-27 | 2014-04-23 | 晨光真空技术（深圳）有限公司 | Preparation method of decorating protective coating for CrNx-based component gradient transition |
| CN107206825A (en) * | 2015-04-14 | 2017-09-26 | 株式会社新克 | Gravure cylinder and its manufacture method |
| CN109504947A (en) * | 2018-12-28 | 2019-03-22 | 北京大学深圳研究生院 | A kind of CrN coating, preparation method and application |
-
2020
- 2020-08-21 CN CN202010847279.2A patent/CN112779493A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5561326A (en) * | 1992-01-08 | 1996-10-01 | Mitsubishi Denki Kabushiki Kaisha | Large scale integrated circuit device |
| CN101181848A (en) * | 2007-12-27 | 2008-05-21 | 中国印钞造币总公司 | Gravure edition as well as making method and vacuum deposition film-plating apparatus thereof |
| DE102009015478A1 (en) * | 2009-03-26 | 2010-09-30 | Roth & Rau Ag | Producing hard material layers by magnetron sputtering, comprises carrying out a substrate cleaning and then a substrate pre-treatment, in which a coating material is deposited on a substrate with a magnetron in pure inert gas atmosphere |
| CN103741105A (en) * | 2013-12-24 | 2014-04-23 | 中国印钞造币总公司 | Chrome-based coating film and preparation method thereof |
| CN103741108A (en) * | 2013-12-27 | 2014-04-23 | 晨光真空技术（深圳）有限公司 | Preparation method of decorating protective coating for CrNx-based component gradient transition |
| CN107206825A (en) * | 2015-04-14 | 2017-09-26 | 株式会社新克 | Gravure cylinder and its manufacture method |
| CN109504947A (en) * | 2018-12-28 | 2019-03-22 | 北京大学深圳研究生院 | A kind of CrN coating, preparation method and application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116240512A (en) * | 2023-03-01 | 2023-06-09 | 纳狮新材料有限公司杭州分公司 | Spray cleaning of coating die head and preparation of CrxN lamination on surface of coating die head |
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Effective date of registration: 20221014 Address after: 102200 b807, building 8, No. 97, Changping Road, Shahe Town, Changping District, Beijing (Changping Demonstration Park) Applicant after: Beijing Danpu Surface Technology Co.,Ltd. Address before: 100000 Room 504, Block C, Building 6, No. 97, Changping Road, Shahe Town, Changping District, Beijing Applicant before: BEIJING DNP SURFACE TECHNOLOGY INSTITUTE |