CN112740436A - 掩模的制造方法、掩模支撑模板的制造方法及框架一体型掩模的制造方法 - Google Patents

掩模的制造方法、掩模支撑模板的制造方法及框架一体型掩模的制造方法 Download PDF

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Publication number
CN112740436A
CN112740436A CN201980062036.3A CN201980062036A CN112740436A CN 112740436 A CN112740436 A CN 112740436A CN 201980062036 A CN201980062036 A CN 201980062036A CN 112740436 A CN112740436 A CN 112740436A
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CN
China
Prior art keywords
mask
frame
metal film
manufacturing
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980062036.3A
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English (en)
Chinese (zh)
Inventor
李炳一
张泽龙
李裕进
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuluomao Materials Co ltd
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Wuluomao Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuluomao Materials Co ltd filed Critical Wuluomao Materials Co ltd
Priority claimed from PCT/KR2019/013468 external-priority patent/WO2020085701A1/ko
Publication of CN112740436A publication Critical patent/CN112740436A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
    • G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
    • G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
CN201980062036.3A 2018-10-22 2019-10-15 掩模的制造方法、掩模支撑模板的制造方法及框架一体型掩模的制造方法 Pending CN112740436A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2018-0126080 2018-10-22
KR20180126080 2018-10-22
KR10-2019-0009437 2019-01-24
KR1020190009437A KR102236541B1 (ko) 2018-10-22 2019-01-24 마스크의 제조 방법, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법
PCT/KR2019/013468 WO2020085701A1 (ko) 2018-10-22 2019-10-15 마스크의 제조 방법, 마스크 지지 템플릿의 제조 방법 및 프레임 일체형 마스크의 제조 방법

Publications (1)

Publication Number Publication Date
CN112740436A true CN112740436A (zh) 2021-04-30

Family

ID=70732615

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980062036.3A Pending CN112740436A (zh) 2018-10-22 2019-10-15 掩模的制造方法、掩模支撑模板的制造方法及框架一体型掩模的制造方法

Country Status (3)

Country Link
KR (2) KR102236541B1 (ko)
CN (1) CN112740436A (ko)
TW (1) TW202032833A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111224019A (zh) * 2018-11-23 2020-06-02 Tgo科技株式会社 掩模支撑模板和其制造方法及框架一体型掩模的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202147666A (zh) * 2020-05-27 2021-12-16 南韓商奧魯姆材料股份有限公司 掩模的製造方法、掩模支撐模板的製造方法及框架一體型掩模的製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05229091A (ja) * 1992-02-25 1993-09-07 Dainippon Printing Co Ltd スクリーン印刷用のスクリーンマスク及びその製造方法
KR102082784B1 (ko) * 2014-12-11 2020-03-02 삼성디스플레이 주식회사 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법
KR20180087824A (ko) * 2017-01-25 2018-08-02 주식회사 티지오테크 프레임 일체형 마스크 및 그 제조방법

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111224019A (zh) * 2018-11-23 2020-06-02 Tgo科技株式会社 掩模支撑模板和其制造方法及框架一体型掩模的制造方法
CN111224019B (zh) * 2018-11-23 2023-05-02 Tgo科技株式会社 掩模支撑模板和其制造方法及掩模与框架连接体的制造方法

Also Published As

Publication number Publication date
KR102236541B1 (ko) 2021-04-07
TW202032833A (zh) 2020-09-01
KR20200045386A (ko) 2020-05-04
KR102138801B1 (ko) 2020-07-28
KR20200045451A (ko) 2020-05-04

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