CN112739014A - Manufacturing method of broken-end type crimping hole printed circuit backboard - Google Patents
Manufacturing method of broken-end type crimping hole printed circuit backboard Download PDFInfo
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- CN112739014A CN112739014A CN202011406249.4A CN202011406249A CN112739014A CN 112739014 A CN112739014 A CN 112739014A CN 202011406249 A CN202011406249 A CN 202011406249A CN 112739014 A CN112739014 A CN 112739014A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a method for manufacturing a broken-end type crimping hole printed circuit backboard, which comprises the following steps: the first step is as follows: forming a first printed circuit unit; forming a second printed circuit unit; forming a third printed circuit unit; the second step is that: cutting a weak flow glue prepreg; the third step: forming an integrated unit of the printed circuit backboard; the fourth step: drilling a through hole on the integral printed circuit back board, and carrying out chemical copper deposition; the fifth step: manufacturing a plated hole pattern on the copper deposition plate by using a photosensitive dry film; and a sixth step: plating the plate with the plated hole pattern by pattern electroplating to plate the through hole copper with the required hole copper thickness; the seventh step: stripping the plated plate, and grinding the copper protruding from the orifice of the through hole conductive hole; eighth step: and etching the outer layer circuit, namely, using acid etching to make the outer layer circuit patterns of the first printed circuit unit and the third printed circuit unit, and using the prior art to manufacture the outer layer circuit patterns.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to a method for manufacturing a broken-end type crimping hole printed circuit backboard.
Background
The backplane is a product with specialization properties in the manufacturing industry of the printed circuit board, is thicker, heavier and higher in heat capacity than the conventional printed circuit board, is a motherboard for bearing daughter boards or display cards, can realize definition functions, has the main functions of carrying power supplies and distributing the functions of the power supplies, signals and the like to each daughter board so as to obtain proper electrical connection and signal transmission, works together with the backplane, and can guide the whole system to logically run smoothly.
The printed circuit backboard comprises an insulating base material and a printed circuit pattern, a through hole or a combination of the printed circuit pattern and the through hole which are formed on the insulating base material according to a preset design to form a conductive pattern, and the printed circuit board can be divided into a single-sided printed circuit board, a double-sided printed circuit board and a multilayer printed circuit board according to different circuit configuration situations.
Referring to fig. 1, a printed circuit backplane manufactured in the prior art is shown, where the printed circuit backplane includes an inner layer circuit pattern 110, an outer layer circuit pattern 120, solder resist ink 130, and a through hole 140, where the through hole 140 is used for communicating circuits of different layers.
Along with especially server, communication base station's renewal development, the function that the printed circuit backplate needs to realize is also stronger and stronger, the integration requirement is also higher and higher, lead to the number of piles to a certain extent, thickness and plate size constantly improve, thereby to subsequent equipment, structural layout etc. bring certain adverse effect, mainly reflect in face connecting device space not enough, need to increase the plate size in order to solve the device space problem, be unfavorable for the requirement of the miniaturized high integration of product, under the condition that does not increase the size, the interval of crimping electrically conductive hole can diminish, reduce to a certain extent under, the printed circuit backplate risk of failure can increase.
Referring to fig. 2, the device 20 and the crimping pins 21 have a certain length, the crimping pins 21 of the device are crimped in the crimping conductive holes, and when the distance between the crimping conductive holes and the crimping conductive holes is small, the metal layer in the crimping conductive holes is prone to crack or crack due to the certain stress effect of the crimping device pins in the crimping conductive holes, so that the service life of the printed circuit backplane is reduced or even fails in the using process.
In the prior art, a method for manufacturing a printed circuit back plate includes the following steps:
firstly, cutting, manufacturing an inner layer circuit pattern and etching an inner layer, specifically: cutting the copper-clad plate into a production-size core plate suitable for processing; cleaning the copper clad laminate after cutting, cleaning the oxidation and the garbage on the surface of the copper clad laminate, coating the photosensitive wet film on the two sides of the copper clad laminate at proper pressure and speed, and drying the photosensitive wet film for proper time and temperature; exposing the copper-clad plate covered with the dry photosensitive wet film; selectively scanning a design pattern by using UVLED light according to a preset program in a direct laser imaging (LDI) of the photosensitive wet film, wherein the photosensitive wet film at the scanned position can generate a polymerization reaction; the photosensitive wet film of the area is reserved in the developing and etching steps and is used for blocking etching, the photosensitive wet film which is not scanned by UVLED light of direct laser imaging (LDI) is developed to expose copper, and the exposed copper is etched, so that a pattern required by design is formed; and removing the photosensitive ink, and punching a reference hole for interlayer circuit alignment on each plate with the inner layer circuit pattern at the same position.
Secondly, bonding the core board with the inner layer pattern with the outer layer copper foil by using a prepreg, namely performing browning and pressing; particularly, the core board with the inner layer pattern is subjected to brown oxidation treatment before and after the inner layer pattern is manufactured, so that the board surface is kept clean, the insulativity is increased, and the copper surface of the core board with the inner layer pattern is roughened, so that the bonding force with a prepreg is increased; when the plates are stacked, the browned inner core plates are riveted in pairs, then the gaps of the lines of the inner core plates are filled with glue on a plate curing sheet at proper temperature, pressure and time, the outer copper foil is bonded with the inner core plates through prepregs, and the printed circuit boards after being pressed are drilled with target holes to be used as datum holes for aligning the inner/outer lines.
And then, positioning the reference holes aligned by using the inner/outer layer lines, and drilling the via holes between layers and the compression joint device fixing holes by using a numerical control drilling machine.
And then depositing a layer of copper on the drilled via holes between the layers in a chemical deposition mode to achieve the function of circuit conduction between the layers.
Then, making an outer layer dry film pattern, pattern electroplating and alkaline etching to obtain a final outer layer circuit pattern; the method specifically comprises the steps of grinding and cleaning a plate with deposited copper on the plate, cleaning the copper surface of the plate and garbage, roughening the outer copper surface to achieve the effect of increasing the bonding force with a photosensitive dry film, pressing a layer of photosensitive dry film on the treated plate at a certain pressure, speed and temperature, and selectively scanning a designed pattern by using UVLED light in direct laser imaging (LDI) according to a preset program, wherein the scanned photosensitive dry film can generate polymerization reaction; the photosensitive dry film in the area can be reserved in the developing step and is used for blocking the subsequent pattern electroplating, the photosensitive dry film which is not scanned by UVLED light of direct laser imaging (LDI) can be developed to expose copper, an outer dry film pattern is formed, a layer of copper is electroplated in advance on the circuit pattern which exposes copper after being developed and the position in a hole with certain current and time, a layer of tin is electroplated, an anti-plating layer can be formed on the position where the dry film is reserved, the anti-plating dry film is removed from a plate which is electroplated with the pattern, the copper below the plate is exposed, the exposed copper can be etched through alkaline etching, the tin surface has an anti-corrosion effect, the copper below the tin surface cannot be etched, and then the tin surface is removed through chemical tin stripping to form an outer circuit pattern.
Then, solder resist is manufactured; the method specifically includes the steps that a layer of photosensitive ink is uniformly coated after an outer layer circuit graph is completed, the ink is dried at a certain temperature for a certain time, exposure is carried out after the plate surface photosensitive ink is dried, the photosensitive ink generates a polymerization reaction after being irradiated by ultraviolet rays in a film light-transmitting area, the photosensitive ink in the area can be reserved in a later developing step, the photosensitive ink which is not irradiated by the ultraviolet rays in the film light-blocking area can be developed in the developing step, and holes which are required for testing the welding electrical performance of components and parts and for printing circuit backboard pads and crimping/inserting parts are exposed.
Then, characters are made; specifically, on the surface of the board on which the solder resist is manufactured, mark characters at positions of various components, wires and the like are printed at specified positions of the board through a program, and the mark characters are solidified on the board at a certain temperature and for a certain time.
Then surface treatment is carried out; specifically, nickel and gold are deposited in a chemical mode through a bonding pad exposed from a solder resist and a hole of a compression joint/plug-in unit for a certain time and current, namely a layer of nickel and a layer of gold are deposited, and the surface treatment of the printed circuit backboard mainly takes the nickel and gold deposition as the main material.
And finally, carrying out forming, electrical testing and packaging to obtain a finished product of the multilayer printed circuit backboard.
Accordingly, the prior art is deficient and needs improvement.
Disclosure of Invention
The invention provides a manufacturing method of a broken-end type crimping hole printed circuit backboard, which solves the problems that the space of a connecting device is insufficient, the number of layers of the printed circuit backboard is increased, the flow is increased, and further the failure risk is increased.
In order to solve the above problems, the technical scheme provided by the invention is as follows: a manufacturing method of a broken-end type crimping hole printed circuit backboard comprises the following steps:
the first step is as follows: forming a first printed circuit unit; pressing the inner core board, the prepreg and the copper foil, drilling a hole for crimping, and forming a crimping conductive hole by copper deposition and copper electroplating;
forming a second printed circuit unit; the second printed circuit unit is a light plate, a single-sided board, a double-sided board or a multilayer board, and after the second printed circuit unit is manufactured, a hole for riveting is drilled;
forming a third printed circuit unit; pressing the inner core board, the prepreg and the copper foil, drilling a hole for crimping, and forming a crimping conductive hole by copper deposition and copper electroplating;
the second step is that: cutting a weak flow glue prepreg; drilling holes in the positions corresponding to the rivet holes and the crimping conductive holes in the cut weak flow prepreg; at least two weak flow glue prepregs are respectively matched with the first printed circuit unit and the third printed circuit unit;
the third step: forming an integrated unit of the printed circuit backboard; a bonding layer formed by overlapping weak flow glue prepregs among the first printed circuit unit, the second printed circuit unit and the third printed circuit unit, wherein one bonding end of the pressure welding conductive hole is blocked by the second printed circuit unit to form a broken hole;
the fourth step: drilling a through hole on the integral printed circuit back board, and carrying out chemical copper deposition;
the fifth step: manufacturing a plated hole pattern on the copper deposition plate by using a photosensitive dry film; exposing the through hole by pressing the photosensitive dry film, exposing and developing, sealing the rest positions by photosensitive dry film sealing holes, wherein the sealing area comprises a head-breaking type crimping conductive hole, and making a photosensitive dry film plated hole pattern;
and a sixth step: plating the plate with the plated hole pattern by pattern electroplating to plate the through hole copper with the required hole copper thickness;
the seventh step: stripping the plated plate, and grinding the copper protruding from the orifice of the through hole conductive hole;
eighth step: and etching the outer layer circuit, namely, using acid etching to make the outer layer circuit patterns of the first printed circuit unit and the third printed circuit unit, and using the prior art to manufacture the outer layer circuit patterns.
According to the preferable technical scheme, in the second step, holes are drilled at positions corresponding to the crimping conductive holes on the weak flow adhesive prepreg, and the diameter of each drilled hole is 0.2-0.3mm larger than the diameter of the whole crimping conductive hole.
According to the preferable technical scheme, the flowability of the weak flow glue prepreg is less than 10%, and one end of the pressed conductive hole is blocked by the second printed circuit unit after pressing to form a broken hole.
According to the preferable technical scheme, in the fifth step, a plated hole pattern is manufactured on the copper deposition plate by using a photosensitive dry film; the through hole is exposed through the pressure sensitive dry film, exposure and development, and the exposed size is 0.1mm larger than the whole hole diameter of the through hole drilling.
In a preferred embodiment, the first printed circuit unit and the third printed circuit unit are provided with at least one circuit unit having a press-fit conductive hole.
According to the preferable technical scheme, the first printed circuit unit and the third printed circuit unit are double-sided boards or multilayer boards, the multilayer boards are blind hole boards or buried hole boards, and the first printed circuit unit, the second printed circuit unit and the third printed circuit unit are communicated through the through hole in the fourth step.
According to the preferable technical scheme, the crimping hole is divided into three parts, namely a metal hole, a conical hole and a non-metal hole, the diameter of the metal hole is the same as that of an opening at the top of the conical hole, the conical hole is in a circular truncated cone structure, and the diameter of the non-metal hole is larger than or equal to that of the metal hole.
Compared with the prior art, the broken-end type printed circuit back plate produced by the manufacturing method has the beneficial effects that the broken-end type crimping conductive holes are formed in the two surfaces of the broken-end type printed circuit back plate, so that the problem that a connecting device with insufficient space can be crimped in the area of the broken-end crimping conductive holes is solved, and the problem that the space of a highly-integrated component is insufficient is solved. And compared with the prior art, the invention can effectively design the distance between the crimping conductive hole and the crimping conductive hole within a reasonable range in design, and has high integration level and reliability of the plate. In addition, the production difficulty is reduced, the production efficiency and the yield of products are improved, the precision requirement of production equipment is greatly reduced, and the overall effects of improving the product quality, reducing the product price and improving the competitiveness are realized. The control requirements of depth control drilling and copper deposition depth ratio in the production process are avoided, and the corresponding production problem is solved.
Drawings
For a clearer explanation of the embodiments or technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained from the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a conventional printed circuit backplane;
FIG. 2 is a schematic view of the assembly of the connector device to the printed circuit backplane;
FIG. 3 is a schematic view of a broken end type press-fit hole printed circuit backplane;
FIG. 4 is a flow chart of the manufacture of a break-away crimp-hole printed circuit backplane;
FIG. 5 is a block diagram of the first circuit unit and the third circuit unit;
FIG. 6 is a schematic view of a drilling structure of a weak flow prepreg;
FIG. 7 is a schematic structural view of a broken-end type press-connection hole printed circuit backboard after being pressed;
FIG. 8 is a schematic view of a break-away type crimped hole printed circuit board conductive structure;
FIG. 9 is a schematic diagram of a production process of a broken-end type crimped hole printed circuit back plate outer layer circuit negative film;
FIG. 10 is a schematic diagram of a completed structure of an outer layer circuit of a broken end type press-connection hole printed circuit backboard;
FIG. 11 is a schematic view of the whole structure of a broken-end type press-connection hole printed circuit backboard;
fig. 12 is a schematic view of an assembly structure of a broken end type press-connection hole printed circuit backboard.
Detailed Description
In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
One embodiment of the invention is: a broken-end type compression joint hole printed circuit backboard comprises a first printed circuit unit, a second printed circuit unit and a third printed circuit unit, wherein the first printed circuit unit and the third printed circuit unit are double-sided printed circuit boards or multilayer printed circuit boards; the second printed circuit unit is a light plate, a single-sided board, a double-sided board or a multilayer board. The first printed circuit unit, the second printed circuit unit and the third printed circuit unit are fixedly connected by using a weak flow glue prepreg with glue fluidity less than 10 percent in a pressing mode; preferably, the weak flow prepreg has colloid flowability of 3-6%. The broken-end type crimping hole printed circuit backboard is characterized in that a first printed circuit unit, a weak flow glue prepreg, a second printed circuit unit, a weak flow glue prepreg and a third printed circuit unit are sequentially fixedly connected, after lamination, the first printed circuit unit, the second printed circuit unit and the third printed circuit unit are electrically connected through conductive holes, and at least one of the first printed circuit unit and the third printed circuit unit is provided with a crimping conductive hole. The crimping hole is a stepped hole, the upper part of the crimping hole is a stepped sectional stepped hole, and the lower part of the crimping hole is non-metal.
Referring to fig. 3, the broken-end type crimped hole printed circuit back board includes a first printed circuit unit 210, a second printed circuit unit 220 and a third printed circuit unit 230, the first printed circuit unit 210 and the third printed circuit unit 230 have a first crimped conductive hole 213 and a second crimped conductive hole 233 respectively, the first crimped conductive hole is a crimped hole on the first printed circuit unit, the second crimped conductive hole is a crimped hole on the third printed circuit unit, the first crimped hole printed circuit back board is a first printed circuit unit 210, a weak flux prepreg 250, a second printed circuit unit 220, a weak flux prepreg 250, and a third printed circuit unit 230 are fixed in the pressed order of the broken-end type crimped hole printed circuit back board, after the fixed connection, the first crimped conductive hole 213 and the second crimped conductive hole 233 both sides of the broken-end type crimped conductive hole are formed, and the connecting device due to insufficient space can be crimped in the areas of the first crimped conductive hole 213 and the second crimped conductive hole 233 on both sides of the broken-end type crimped conductive hole respectively, the problem of highly integrated components and parts space not enough is solved, can effectually adjust the interval between the first crimping conductive hole 213 of crimping conductive hole in the design, make the interval design in reasonable scope to and avoid the adverse effect that follow-up installation, structural configuration and product reliability problem brought. Similarly, the second crimping conductive holes 233 have a plurality of groups of crimping holes having the same aperture or different pitches, and the crimping holes having various apertures or pitches are reasonably combined to form an effective utilization combination of the maximum specification and structure.
The corresponding first crimping conductive hole 213 and the second crimping conductive hole 233 on the first printed circuit unit and the third printed circuit unit are respectively and reasonably arranged according to different apertures and different aperture distances, in order to realize the maximum arrangement, crimping hole arrays of other corresponding apertures and corresponding aperture distances can be arranged between the same apertures and the aperture distances, and the arrays realize the combination and array matching of the electric performance through the circuit inside the second printed circuit unit.
In this embodiment, the first printed circuit unit 210 and the third printed circuit unit 230 are each a multilayer printed circuit board. It will be appreciated that the number and number of layers of the multilayer printed circuit board may vary depending on the different laminate structures and circuit configurations.
The first printed circuit unit 210 includes a first outer layer pattern 211, a first inner layer pattern 212, a first crimp conductive hole 213, and a solder resist ink 240, and the solder resist ink 240 is an insulating material for printing a non-land area of the circuit backplane.
The second printed circuit unit 220 is a double-sided copper-free optical board.
The third printed circuit unit 230 includes a third outer layer pattern 231, a third inner layer pattern 232, a third crimp conductive hole 233, and solder resist ink 240.
The printed circuit backboard integral unit comprises a first printed circuit unit 210, a second printed circuit unit 220, a third printed circuit unit 230, a weak flow glue prepreg 240 and solder resist ink 240, wherein the first printed circuit unit 210, the second printed circuit unit 220 and the third printed circuit unit 230 are fixedly connected by using the weak flow glue prepreg 240 in a pressing way to form broken-head type crimping conductive holes 213 and 233, the first printed circuit unit 210, the weak flow glue prepreg 240, the second printed circuit unit 220, the weak flow glue prepreg 240 and the third printed circuit unit 230 are sequentially connected in sequence, the weak flow glue prepreg 250 adopts low-fluidity, in order to prevent the resin from flowing into the end-broken crimp conductive holes 213 and 233 of the first printed circuit unit 210 and the third printed circuit unit 230 during the manufacturing process, the fluidity thereof is generally less than 10%, and preferably 3 to 6%.
The end-cut crimping conductive holes 213 and 233 are formed in both sides of the board, and the end-cut crimping conductive holes 213 and 233 on both sides thereof are separated by the second printed circuit unit 220, and the end-cut crimping conductive holes 213 and 233 thereof are used for mounting a connector.
In order to complete the interlayer circuit conduction, a through hole 260 is formed inside the non-breaking type crimp conductive holes 213 and 233, and the through hole is metallized by a chemical copper deposition process to form a channel for connecting the interlayer circuit.
Fig. 4 is a flow chart of the manufacturing process of the broken end type press-contact hole printed circuit board according to the present invention.
Referring to fig. 5, first, a first circuit unit 210 and a third circuit unit 230 are formed; and drilling holes for conductive crimping on the laminated multilayer board, metallizing the first crimping conductive hole 213 and the second crimping conductive hole 233 through copper deposition and copper electroplating, and making a circuit pattern corresponding to the smooth board surface of the second circuit on a normal positive film or a negative film.
The molding of the first circuit unit 210, the second printed circuit unit 220, and the third printed circuit unit 230 can be completed by a conventional process, which is not repeated herein, where the first outer layer pattern 211, the first inner layer pattern 212, the solder resist ink 240, the first crimping conductive hole 213, the third outer layer pattern 231, the third inner layer pattern 232, the solder resist ink 240, and the third crimping conductive hole 233 of the first circuit unit 210, and the third printed circuit unit 230 are provided.
Referring to fig. 6, the weak-flow prepreg 250 is drilled at positions corresponding to the rivet holes, the first printed circuit unit 210, the third printed circuit unit 230, the first crimping conductive hole 213 and the second crimping conductive hole 233, and the drilled diameter is 0.2-0.3mm larger than the diameter of the crimping conductive hole as a whole.
Referring to fig. 7, a first printed circuit unit 210, a second printed circuit unit 220, and a third printed circuit unit 230 are fixedly connected by using a weak flow prepreg 250 in a press-fit manner, the first printed circuit unit 210, the weak flow prepreg 250, the second printed circuit unit 220, the weak flow prepreg 250, and the third printed circuit unit 230 are sequentially connected in this order, the weak flow prepreg 250 is low-fluidity, in order to prevent resin from flowing into the first crimp conductive hole 213 and the second crimp conductive hole 233 of the first printed circuit unit 210 and the third printed circuit unit 230 during the manufacturing process, the fluidity thereof is 3 to 6%, and the break-fit crimp holes are formed after the press-fit is fixedly connected.
Referring to fig. 8, a through hole 260 is formed inside the non-broken end type crimp conductive hole in the areas of the first crimp conductive hole 213 and the second crimp conductive hole 233, and the through hole 260 is plated by electroless copper plating and pattern plating.
In this step, the printed circuit backplane unit can be drilled with the via holes 260 and the connector fixing holes between layers by using a numerical control drilling machine, the printed circuit backplane is fixed on a numerical control drilling machine bed by using positioning pins through previously drilled target holes during drilling, and the smooth lower-pad phenolic resin plate and the upper cover coating aluminum sheet are machined simultaneously to reduce the occurrence of drilling burrs.
The method comprises the steps of drilling an interlayer through hole 260, then drilling a metal copper layer on the interlayer through hole to complete conduction of an interlayer circuit, cleaning burrs and dust in the through hole in a heavy type brushing and high-pressure water washing mode, removing glue residues on the copper surface of the wall of the drilled hole by potassium permanganate liquid medicine, soaking a tin-palladium colloid layer attached to the cleaned wall of the hole, reducing the tin-palladium colloid layer into metal palladium, soaking a printed circuit backboard unit in a chemical copper deposition solution, reducing and depositing copper ions in the solution to be attached to the wall of the hole by virtue of the catalytic action of palladium metal to form a through hole circuit, and thickening the copper layer in the hole to a thickness capable of resisting subsequent processing in a copper sulfate soaking type electroplating mode.
Referring to fig. 9, a plating hole pattern is made; cleaning plate surface oxidation, oil stain and copper powder in holes by a heavy type grinding brush, ultrasonic washing and high-pressure washing, roughening an outer copper surface, pressing a layer of photosensitive dry film on a treated plate surface at a certain pressure, speed and temperature, optically positioning a positioning hole drilled by a mechanical drilling machine by direct laser imaging (LDI), and selectively scanning the positions of the plate except for a through hole by UVLED light by the direct laser imaging (LDI) according to a preset program, wherein the scanned position photosensitive dry film can generate polymerization reaction; the photosensitive dry film in the area is remained in the developing step to form a plated hole pattern.
And then pattern electroplating is carried out, the position exposed out of the through hole after development is thickened to the thickness capable of resisting subsequent processing and use environment impact in a copper sulfate immersion type electroplating mode at a certain current and for a certain time, the photosensitive dry film on the plate with the plated hole is immersed and removed by sodium hydroxide with a certain concentration, the whole copper surface is exposed, and the copper with the convex hole opening is ground and flattened by a grinding and brushing machine.
Referring to fig. 10, an outer layer negative pattern is manufactured by the plate with the exposed whole copper surface in the manner shown in fig. 8, all the broken end type crimping conductive holes, the first crimping conductive hole 213 and the second crimping conductive hole 233 of the outer layer circuit pattern, and the conductive through hole 260 are covered with a dry film, the copper surface is exposed at the rest positions, the exposed copper surface is etched by acid etching, a corrosion-resistant protective layer is formed at the position covered with the dry film, and the plate after the acid etching is soaked in sodium hydroxide with a certain concentration to remove the photosensitive dry film, so as to form the final required outer layer pattern.
Referring to fig. 11, a layer of solder resist ink 240 is printed on the surface of the outer layer pattern, and the solder resist ink 240 is printed to protect the circuit of the outer layer pattern from oxidation and solder short circuit.
Before printing, a copper surface of a printed circuit backboard is properly roughened and cleaned by methods such as rubbing and microetching, then liquid photosensitive solder mask ink is printed on a board surface in a mode of stop-point screen printing, then the board surface ink is dried at a certain temperature and time, the board surface photosensitive ink is dried by a film and then exposed, the photosensitive ink generates polymerization reaction after being irradiated by ultraviolet rays in a film light-transmitting area, the photosensitive ink in the area can be reserved in a later development step, the photosensitive ink which is not irradiated by the ultraviolet rays in the film light-blocking area can be developed in the development step, holes for testing the welding electrical performance of components and printing circuit backboard pads and crimping/inserting pieces are exposed, and then the resin in the solder mask ink 240 is completely cured by high-temperature baking.
And finally, carrying out surface treatment, molding, electrical testing and packaging to obtain a finished product of the head-breaking type press-connection hole printed circuit backboard.
The first crimping conductive hole 213 and the second crimping conductive hole 233 of the broken end type crimping conductive hole printed circuit backboard manufactured by the method are arranged on two sides of the printed circuit backboard, so that a connecting device with insufficient space can be crimped in the areas of the first crimping conductive hole 213 and the second crimping conductive hole 233 of the broken end type crimping conductive hole.
Referring to fig. 12, a schematic diagram of a double-sided connector mounted on the broken-end type press-connection hole printed circuit backplane of the present invention effectively solves the problem of insufficient space of highly integrated components.
The invention can be applied to the field of printed circuit board design and manufacture. The obtained broken-end type crimping conductive hole printed circuit back plate can be applied to the crimping process of connecting devices of any electronic assembly factory, the problem of insufficient space of highly integrated devices can be effectively solved, and secondly, as the broken-end type crimping conductive hole first crimping conductive hole 213 and second crimping conductive hole 233 on the printed circuit back plate are doubled in number on the basis of the original crimping conductive holes, more connecting devices can be installed, compared with the prior art, the distances between the first crimping conductive hole 213 and the second crimping conductive hole 233 of the crimping conductive hole and between the first crimping conductive hole 213 and the second crimping conductive hole 233 of the crimping conductive hole can be effectively designed within a reasonable range in design, and the integration degree and reliability of the plate are high.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the spirit and scope of the present invention, and various modifications and changes made to the technical solution of the present invention by those skilled in the art without departing from the design concept of the present invention shall fall within the protective scope of the present invention, and it is obvious that those skilled in the art can make modifications and changes according to the above description, and all such modifications and changes shall fall within the protective scope of the appended claims.
Claims (7)
1. A manufacturing method of a broken-end type crimping hole printed circuit backboard is characterized by comprising the following steps:
the first step is as follows: forming a first printed circuit unit; pressing the inner core board, the prepreg and the copper foil, drilling a hole for crimping, and forming a crimping conductive hole by copper deposition and copper electroplating;
forming a second printed circuit unit; the second printed circuit unit is a light plate, a single-sided board, a double-sided board or a multilayer board, and after the second printed circuit unit is manufactured, a hole for riveting is drilled;
forming a third printed circuit unit; pressing the inner core board, the prepreg and the copper foil, drilling a hole for crimping, and forming a crimping conductive hole by copper deposition and copper electroplating;
the second step is that: cutting a weak flow glue prepreg; drilling holes in the positions corresponding to the rivet holes and the crimping conductive holes in the cut weak flow prepreg; at least two weak flow glue prepregs are respectively matched with the first printed circuit unit and the third printed circuit unit;
the third step: forming an integrated unit of the printed circuit backboard; a bonding layer formed by overlapping weak flow glue prepregs among the first printed circuit unit, the second printed circuit unit and the third printed circuit unit, wherein one bonding end of the pressure welding conductive hole is blocked by the second printed circuit unit to form a broken hole;
the fourth step: drilling a through hole on the integral printed circuit back board, and carrying out chemical copper deposition;
the fifth step: manufacturing a plated hole pattern on the copper deposition plate by using a photosensitive dry film; exposing the through hole by pressing the photosensitive dry film, exposing and developing, sealing the rest positions by photosensitive dry film sealing holes, wherein the sealing area comprises a head-breaking type crimping conductive hole, and making a photosensitive dry film plated hole pattern;
and a sixth step: plating the plate with the plated hole pattern by pattern electroplating to plate the through hole copper with the required hole copper thickness;
the seventh step: stripping the plated plate, and grinding the copper protruding from the orifice of the through hole conductive hole;
eighth step: and etching the outer layer circuit, namely, using acid etching to make the outer layer circuit patterns of the first printed circuit unit and the third printed circuit unit, and using the prior art to manufacture the outer layer circuit patterns.
2. The method for manufacturing a broken-end type press-connection printed circuit backboard according to claim 1, wherein the method comprises the following steps: and in the second step, drilling holes at the positions corresponding to the crimping conductive holes on the weak flow adhesive prepreg, wherein the diameter of the drilled holes is 0.2-0.3mm larger than the diameter of the whole crimping conductive holes.
3. The method for manufacturing a broken-end type press-connection printed circuit backboard according to claim 2, wherein the method comprises the following steps: the flowability of the weak flow glue prepreg is less than 10%, and one end of the pressure welding conductive hole is blocked by the second printed circuit unit after the pressure welding, so that a broken hole is formed.
4. The method for manufacturing a broken-end type press-connection printed circuit backboard according to claim 1, wherein the method comprises the following steps: in the fifth step, a plated hole pattern is manufactured on the copper deposition plate by using a photosensitive dry film; the through hole is exposed through the pressure sensitive dry film, exposure and development, and the exposed size is 0.1mm larger than the whole hole diameter of the through hole drilling.
5. The method for manufacturing a broken-end type press-connection printed circuit backboard according to any one of claims 1 to 4, wherein: and at least one circuit unit is provided with a crimping conductive hole.
6. The method for manufacturing a broken-end type crimped hole printed circuit backboard according to claim 5, wherein the first printed circuit unit and the third printed circuit unit are double-sided boards or multilayer boards, the multilayer boards are blind hole boards or buried hole boards, and the first printed circuit unit, the second printed circuit unit and the third printed circuit unit realize the conduction of inner-layer lines through the via holes of the fourth step.
7. The method for manufacturing a broken-end type crimp hole printed circuit backboard according to claim 6, wherein the crimp hole is divided into three parts, namely a metal hole, a taper hole and a non-metal hole, the diameter of the metal hole is the same as the diameter of the top opening of the taper hole, the taper hole is in a circular truncated cone structure, and the diameter of the non-metal hole is larger than or equal to the diameter of the metal hole.
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| CN202011406249.4A CN112739014A (en) | 2020-12-05 | 2020-12-05 | Manufacturing method of broken-end type crimping hole printed circuit backboard |
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| CN202011406249.4A CN112739014A (en) | 2020-12-05 | 2020-12-05 | Manufacturing method of broken-end type crimping hole printed circuit backboard |
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