CN112736517A - Electric connector and integrated device comprising same - Google Patents

Abstract

The invention discloses an electric connector which comprises an insulator, wherein a first conductor and a second conductor are respectively arranged on the surfaces of two sides of the insulator, and a solder layer is arranged on the surface of the first conductor and/or the surface of the second conductor. The electric connector is clamped between the chip module and the circuit board, and the electric conductors are welded with the pins and the bonding pads, so that the chip module and the circuit board can be electrically conducted and fixedly connected. The conductive body is provided with the solder layer, so that the pins are not required to be brushed with solder paste, the packaging procedures of the integrated device are reduced, and the packaging difficulty of the integrated device is reduced; and because the electric connector participates in the packaging as a whole, the electric connector is only required to be placed between the chip module and the circuit board during the packaging, and the electric conductors, the pins and the bonding pads can realize accurate alignment, thereby reducing the requirements on equipment and personnel. In addition, the invention also provides two integrated devices, and both the two integrated devices have the advantages of high precision, low cost, easy manufacture and the like.

Description

Electric connector and integrated device comprising same

Technical Field

The invention relates to the technical field of electric connectors, in particular to an electric connector and an integrated device comprising the same.

Background

As the number and density of signal input/output pins (I/O pin counts) of chips within integrated devices continues to increase, the process of attaching chip modules to circuit boards becomes very challenging.

In the past, BGA (Ball Grid Array) was typically used to make electrical connections between the chip module and the circuit board. Specifically, the solder paste is brushed on the signal input/output pins of the chip module or the bonding pads of the circuit board, then the two are pasted together, and finally, the stable connection is realized through the reflow soldering process. However, in order to prevent short circuit, the solder paste can only be brushed on the pins, but not between the pins, and since the number and density of the signal input/output pins of the chip module are high, the electrical connection form is not only complex in structure, difficult to operate, high in precision requirement, but also can be completed by more precise equipment, and high in cost.

Disclosure of Invention

The invention aims to provide an electric connector which is simple in manufacturing process, low in consumption cost, convenient to use and low in operation difficulty and an integrated device comprising the electric connector.

In order to achieve the above object, the present invention provides an electrical connector, comprising an insulator, wherein a plurality of first conductors are disposed on one surface of the insulator, a plurality of second conductors are disposed on the other surface of the insulator, a conductive medium for connecting the first conductors and the second conductors is further disposed on the insulator, and a solder layer is disposed on a surface of the first conductor and/or the second conductor.

Preferably, a surface of the first conductor and/or the second conductor is a flat surface.

Preferably, a surface of the first conductor and/or the second conductor is provided with a protrusion.

Preferably, the protrusion is formed by protruding the first conductor and/or the second conductor to a side away from the insulator.

Preferably, the shape of the projection is a column, a block, a cusp, an inverted cone, a dendrite, a sphere, or an arc.

Preferably, two or more of the protrusions are provided on the surface of the first conductor and/or the second conductor, the shape of each of the protrusions is the same or different, the size of each of the protrusions is the same or different, and the two or more of the protrusions are continuously or discontinuously distributed on the surface of the first conductor and/or the second conductor.

Preferably, the insulator is provided with a connection hole for connecting the first conductor and the second conductor, and the conductive medium is provided in the connection hole.

Preferably, the conductive medium fills the connection hole, or the conductive medium is attached to a hole wall of the connection hole to form a conductive hole.

Preferably, the first conductors are two or more and each of the first conductors is independent of each other, and the second conductors are two or more and each of the second conductors is independent of each other.

Preferably, the number of the second conductors is equal to that of the first conductors, and each of the first conductors is connected to each of the second conductors in a one-to-one correspondence via the conductive medium in the different connecting holes.

Preferably, the number of the first conductors is greater than that of the second conductors, at least two of the first conductors are connected to the same second conductor through the conductive media in different connecting holes, and the rest of the first conductors are connected to the rest of the second conductors in a one-to-one correspondence manner through the conductive media in different connecting holes.

Preferably, the number of the first conductors is less than that of the second conductors, at least two of the second conductors are connected to the same first conductor through the conductive media in different connecting holes, and the rest of the second conductors are connected to the rest of the first conductors in a one-to-one correspondence manner through the conductive media in different connecting holes.

Preferably, at least two of the first conductors are connected to the same second conductor through the conductive media in different connecting holes, and at least two of the second conductors are connected to the same first conductor through the conductive media in different connecting holes.

Preferably, at least two of the first conductors are connected to the same second conductor through the conductive media in different connecting holes, at least two of the second conductors are connected to the same first conductor through the conductive media in different connecting holes, and the rest of the first conductors are connected to the rest of the second conductors in a one-to-one correspondence manner through the conductive media in different connecting holes.

Preferably, the insulator is one or a combination of more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer and polyoxamide.

Preferably, the solder layer is tin or a tin alloy.

Preferably, the insulator is provided with a first accommodation hole or a first accommodation groove.

Another objective of the present invention is to provide an integrated device, which includes a first circuit board, a second circuit board and the electrical connector, wherein the electrical connector is disposed between the first circuit board and the second circuit board, a first pad is disposed on a surface of the first circuit board facing the electrical connector, the first pad is connected to the first electrical conductor, a second pad is disposed on a surface of the second circuit board facing the electrical connector, and the second pad is connected to the second electrical conductor;

wherein the first pad and the first conductor are soldered by the solder layer; and/or

The second pad and the second conductor are soldered by the solder layer.

Preferably, the number of the first pads is equal to that of the first conductors, and the first pads and the first conductors are connected in a one-to-one correspondence manner; and/or

The second bonding pads and the second conductors are equal in number and are connected in a one-to-one correspondence mode.

Another objective of the present invention is to provide another integrated device, which includes a first circuit board, a second circuit board and an interposer disposed therebetween, wherein the electrical connectors are disposed between the first circuit board and the interposer, and between the second circuit board and the interposer;

the two electrical connectors are respectively marked as a first electrical connector and a second electrical connector, a first bonding pad is arranged on the surface of the first circuit board facing the first electrical connector and connected with a first conductor of the first electrical connector, and a second bonding pad is arranged on the surface of the second circuit board facing the second electrical connector and connected with a first conductor of the second electrical connector;

a third bonding pad is arranged on the surface of the adapter plate facing the first electric connector and connected with a second conductor of the first electric connector, and a fourth bonding pad connected with the third bonding pad is arranged on the surface of the adapter plate facing the second electric connector and connected with a second conductor of the second electric connector;

wherein the first pad is soldered to the first conductor of the first electrical connector via the solder layer; and/or

The second pad is welded with the first conductor of the second electrical connector through the solder layer; and/or

The third pad is welded with the second conductor of the first electrical connector through the solder layer; and/or

The fourth pad is soldered to the second conductor of the second electrical connector through the solder layer.

Preferably, the number of the first pads is equal to that of the first conductors of the first electrical connector, and the first pads and the first conductors of the first electrical connector are connected in a one-to-one correspondence manner; and/or

The second bonding pads are connected with the first conductors of the second electric connector in a one-to-one correspondence manner, and the number of the second bonding pads is equal to that of the first conductors of the second electric connector; and/or

The third bonding pads are connected with the second conductors of the first electric connector in a one-to-one correspondence manner, and the number of the third bonding pads is equal to that of the second conductors of the first electric connector; and/or

The number of the fourth bonding pads is equal to that of the second electric conductors of the second electric connector, and the fourth bonding pads are connected with the second electric conductors of the second electric connector in a one-to-one correspondence mode.

Preferably, the adapter plate is provided with a second accommodating hole or a second accommodating groove.

The embodiment of the invention provides an electric connector, which has the following beneficial effects compared with the prior art:

the electric connector provided by the embodiment of the invention is clamped between the chip module and the circuit board, and the first conductor is welded with the signal input/output pin of the chip module and the second conductor is welded with the bonding pad of the circuit board, so that the chip module and the circuit board can be electrically conducted and fixedly connected. The first conductor and the second conductor are provided with solder layers, so that solder paste does not need to be brushed on the signal input/output pins of the chip module, the packaging process of the integrated device is reduced, and the packaging difficulty of the integrated device is greatly reduced; and because the first conductor, the second conductor and the insulator take part in the packaging as a whole, the electric connector is only required to be placed between the chip module and the circuit board during the packaging, and the first conductor, the pins and the second conductor and the bonding pads can realize accurate alignment, so that the requirements on equipment and personnel are reduced, and the packaging precision of the integrated device is improved.

In addition, the invention also provides two integrated devices, and the two integrated devices adopt the electric connector, so that the integrated device has the advantages of high precision, low cost, easiness in manufacturing and the like.

Drawings

Fig. 1 is a schematic cross-sectional view of an electrical connector (the surfaces of the first and second electrical conductors are flat surfaces) according to a first embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of an electrical connector (the surfaces of the first and second electrical conductors are uneven) according to a first embodiment of the present invention;

fig. 3 is a schematic cross-sectional view illustrating a connection hole filled with a conductive medium according to a first embodiment of the present invention;

FIG. 4 is a schematic cross-sectional view of an electrical connector in a second form of electrical connection between a first electrical conductor and a second electrical conductor in accordance with a first embodiment of the invention;

FIG. 5 is a schematic cross-sectional view of an electrical connector according to a first embodiment of the present invention, wherein a third electrical connection is provided between the first and second electrical conductors;

FIG. 6 is a cross-sectional view of an electrical connector according to a fourth embodiment of the present invention, wherein the first electrical conductor is electrically coupled to the second electrical conductor;

FIG. 7 is a schematic cross-sectional view of an electrical connector according to a fifth embodiment of the present invention, wherein the electrical connector is configured to provide a first electrical connection between a first electrical conductor and a second electrical conductor;

fig. 8 is a schematic view of a split structure of an integrated device according to a second embodiment of the present invention;

FIG. 9 is a schematic cross-sectional view of an integrated device according to a second embodiment of the present invention;

fig. 10 is a schematic view of a split structure of an integrated device according to a third embodiment of the present invention;

fig. 11 is a schematic cross-sectional structure diagram of an integrated device according to a third embodiment of the present invention.

In the figure: 1. an electrical connector; 1a, a first electrical connector; 1b, a second electrical connector; 11. an insulator; 12. a first electrical conductor; 13. a second electrical conductor; 14. a conductive medium; 15. a solder layer; 16. a boss portion; 17. a conductive via; 18. a first accommodation hole; 2. a first circuit board; 21. a first pad; 3. a second circuit board; 31. a second pad; 4. an adapter plate; 41. a third pad; 42. a fourth pad; 43. the second accommodation hole.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be understood that the terms "first", "second", etc. are used herein to describe various information, but the information should not be limited to these terms, which are only used to distinguish one type of information from another. For example, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information, without departing from the scope of the present invention.

Example one

As shown in fig. 1, an electrical connector 1 according to an embodiment of the present invention includes an insulator 11, a plurality of first conductors 12 are disposed on one side surface of the insulator 11, a plurality of second conductors 13 are disposed on the other side surface of the insulator 11, a conductive medium 14 for connecting the first conductors 12 and the second conductors 13 is further disposed on the insulator 11, and solder layers 15 are disposed on the surfaces of the first conductors 12 and the second conductors 13. Based on the above structure, the electrical connector 1 is clamped between the chip module and the circuit board, and the first electrical conductor 12 is soldered to the signal input/output pin of the chip module, and the second electrical conductor 13 is soldered to the pad of the circuit board, so that the chip module and the circuit board can be electrically connected and fixed.

Compared with the prior art, the first conductor 12 and the second conductor 13 are provided with the solder layers 15, so that the signal input/output pins of the chip module do not need to be brushed with solder paste, the packaging procedures of the integrated device are reduced, and the packaging difficulty of the integrated device is greatly reduced; and because the first conductor 12, the second conductor 13 and the insulator 11 participate in the packaging as a whole, when packaging, the electric connector 1 is only needed to be placed between the chip module and the circuit board, and the first conductor 12 and the pins, and the second conductor 13 and the bonding pads can realize accurate alignment, thereby reducing the requirements on equipment and personnel and simultaneously improving the packaging precision of the integrated device.

Alternatively, as shown in fig. 1 and fig. 2, as an embodiment of the electrical connector 1 provided by the present invention, the surfaces of the first electrical conductor 12 and the second electrical conductor 13 may be flat surfaces or uneven surfaces provided with the protrusions 16, and the surfaces of the first electrical conductor 12 and the second electrical conductor 13 may be different, for example, the surface of the first electrical conductor 12 is a flat surface and the surface of the second electrical conductor 13 is an uneven surface.

Specifically, as shown in fig. 2, the protrusion 16 provided on the surface of the first conductor 12 is formed by the first conductor 12 protruding to the side away from the insulator 11, and similarly, the protrusion 16 provided on the surface of the second conductor 13 is formed by the second conductor 13 protruding to the side away from the insulator 11. The protrusions 16 have a regular or irregular solid geometry, such as a cylindrical, block, cusp, inverted cone, dendritic, spherical, or arc shape. Based on this, as shown in fig. 2, two or more protrusions 16 are provided on the surfaces of the first conductor 12 and the second conductor 13, the shape of each protrusion 16 may be the same or different, the size of each protrusion 16 may be the same or different, and the two or more protrusions 16 are continuously or discontinuously distributed on the surfaces of the first conductor 12 and the second conductor 13, for example, when the two or more protrusions 16 are in a sharp-angled and continuously distributed shape, a regular and periodic three-dimensional pattern with insection or an irregular and disordered three-dimensional pattern with insection may be formed. It should be noted that, according to different practical applications, only the surface of the first conductor 12 or the second conductor 13 may be provided with the protruding portion 16, and the technical effect generated at this time can be reasonably inferred, so that the details are not repeated herein.

Further, as shown in fig. 1, the insulator 11 is provided with a connection hole for connecting the first conductor 12 and the second conductor 13, the conductive medium 14 is attached to the wall of the connection hole and forms a conductive hole 17, and the conductive hole 17 may be a through hole, a buried hole, or a blind hole. Of course, as shown in fig. 3, during the formation of the conductive medium 14, an operator may also choose to fill the entire connection hole with the conductive medium 14, i.e., not form the conductive hole 17, so as to prevent the etching solution from entering the conductive hole 17 and protect the conductive medium 14 from being etched.

In the embodiment of the present invention, two or more first conductors 12 are provided, and the first conductors 12 are independent of each other, and similarly, two or more second conductors 13 are provided, and the second conductors 13 are independent of each other. Furthermore, the following connection forms exist between the first conductor 12 and the second conductor 13:

first, as shown in fig. 1, the number of the second electric conductors 13 is equal to that of the first electric conductors 12, and each first electric conductor 12 is connected with each second electric conductor 13 in a one-to-one correspondence manner through the conductive medium 14 in different connecting holes;

secondly, as shown in fig. 4, the number of the first electric conductors 12 is greater than that of the second electric conductors 13, at least two first electric conductors 12 are respectively connected with the same second electric conductor 13 through the electric conduction mediums 14 in different connecting holes, and the rest first electric conductors 12 are respectively connected with the rest second electric conductors 13 in a one-to-one correspondence manner through the electric conduction mediums 14 in different connecting holes;

thirdly, as shown in fig. 5, the number of the first electric conductors 12 is less than that of the second electric conductors 13, at least two second electric conductors 13 are respectively connected with the same first electric conductor 12 through the electric conduction mediums 14 in different connecting holes, and the rest second electric conductors 13 are respectively connected with the rest first electric conductors 12 in a one-to-one correspondence manner through the electric conduction mediums 14 in different connecting holes;

fourthly, as shown in fig. 6, at least two first conductors 12 are connected with the same second conductor 13 through the conducting mediums 14 in different connecting holes, and at least two second conductors 13 are connected with the same first conductor 12 through the conducting mediums 14 in different connecting holes;

fifth, as shown in fig. 7, at least two first conductors 12 are connected to the same second conductor 13 through conductive media 14 in different connecting holes, at least two second conductors 13 are connected to the same first conductor 12 through conductive media 14 in different connecting holes, and the rest first conductors 12 are connected to the rest second conductors 13 through conductive media 14 in different connecting holes in a one-to-one correspondence manner.

Optionally, no matter which form of the electrical connection is adopted between the first electrical conductor 12 and the second electrical conductor 13, two or more connection holes may be provided between the first electrical conductor 12 and the second electrical conductor 13 connected thereto, and a conductive medium 14 is provided in each connection hole to further improve the conductivity of the electrical connector 1.

Alternatively, as shown in fig. 8 and 10, as an embodiment of the electrical connector 1 provided by the present invention, in order to avoid damaging components on the circuit board, the insulator 11 is provided with a first receiving hole 18 or a first receiving groove for receiving components.

Alternatively, as a specific embodiment of the electrical connector 1 provided by the present invention, the material of the insulator 11 is one or a combination of more of polyimide, thermoplastic polyimide, modified epoxy resin, modified acrylic resin, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, and polyoxamide. Specifically, the insulator 11 may be a single component, i.e., one of the above-described various insulating materials, or may be a composite of any of the above-described plural insulating materials. Based on this, the insulator 11 has a certain deformation amount, which can ensure the reliable electrical connection between the conductor and the pin and the pad.

Alternatively, as an embodiment of the electrical connector 1 provided by the present invention, the first electrical conductor 12 and the second electrical conductor 13 are preferably made of copper, but other materials with good electrical conductivity may be selected, such as nickel, lead, chromium, molybdenum, zinc, tin, gold, silver, etc., and the first electrical conductor 12 and the second electrical conductor 13 may be made of different materials.

Optionally, as an embodiment of the electrical connector 1 provided in the present invention, the conductive medium 14 is preferably copper, but other materials with good conductive performance, such as tin, silver, gold, graphite, copper paste, silver paste, tin paste, carbon nanotube, etc., may also be selected.

Alternatively, as a specific embodiment of the electrical connector 1 provided by the present invention, the solder layer 15 is preferably tin or tin alloy, which has the advantages of low melting point, stable connection, and the like.

It should be noted that, in the embodiment of the present invention, only the surface of the first conductor 12 or the second conductor 13 may be provided with the solder layer 15 according to different practical applications, and the technical effect generated at this time can be reasonably inferred, so that the details are not repeated herein.

Example two

As shown in fig. 8 to 9, an integrated device according to an embodiment of the present invention includes a first circuit board 2, a second circuit board 3, and an electrical connector 1 provided in the first embodiment, wherein the electrical connector 1 is disposed between the first circuit board 2 and the second circuit board 3; the surface of the first circuit board 2 facing the electric connector 1 is provided with a first pad 21, and the first pad 21 and the first conductor 12 are welded through a solder layer 15; the surface of the second circuit board 3 facing the electrical connector 1 is provided with a second land 31, and the second land 31 and the second conductor 13 are soldered by the solder layer 15. Note that, if only the surface of the first conductor 12 or the second conductor 13 is provided with the solder layer 15, the first conductor 12 and the first land 21 are soldered by the solder layer 15, the second conductor 13 and the second land 31 are attached and connected, or the first conductor 12 and the first land 21 are attached and connected, and the second conductor 13 and the second land 31 are soldered by the solder layer 15.

Further, as shown in fig. 8 to 9, the first pads 21 are connected to the first conductors 12 in the same number and in one-to-one correspondence, and similarly, the second pads 31 are connected to the second conductors 13 in the same number and in one-to-one correspondence. Of course, in other embodiments, the first pads 21 and the first conductors 12, and the second pads 31 and the second conductors 13 may be unequal in number and not correspondingly connected, for example, two first pads 21 are connected to the same first conductor 12, one second pad 31 is simultaneously connected to three second conductors 13, and so on.

Still further, a surface of the first circuit board 2 facing the electrical connector 1 and/or a surface of the second circuit board 3 facing the electrical connector 1 are provided with components (not shown), and the components extend into the first accommodation hole 18 or the first accommodation groove of the electrical connector 1.

Furthermore, the first circuit board 2 and the second circuit board 3 are detachably connected by a fastener, such as a bolt connection, a snap connection, etc., so as to improve the firmness of the integrated device.

EXAMPLE III

As shown in fig. 10 to fig. 11, an integrated device according to an embodiment of the present invention includes a first circuit board 2, a second circuit board 3, and an interposer 4 disposed therebetween, wherein the electrical connector 1 provided in the first embodiment is disposed between the first circuit board 2 and the interposer 4, and between the second circuit board 3 and the interposer 4; the two electrical connectors 1 are respectively referred to as a first electrical connector 1a and a second electrical connector 1b, a first pad 21 is arranged on the surface of the first circuit board 2 facing the first electrical connector 1a, the first pad 21 is welded with the first conductor 12 of the first electrical connector 1a through a solder layer 15, a second pad 31 is arranged on the surface of the second circuit board 3 facing the second electrical connector 1b, and the second pad 31 is welded with the first conductor 12 of the second electrical connector 1b through the solder layer 15; the surface of the interposer 4 facing the first electrical connector 1a is provided with a third land 41, the third land 41 is soldered to the second conductor 13 of the first electrical connector 1a via a solder layer 15, the surface of the interposer 4 facing the second electrical connector 1b is provided with a fourth land 42 connected to the third land 41, and the fourth land 42 is soldered to the second conductor 13 of the second electrical connector 1b via the solder layer 15.

It should be noted that the first electrical connector 1a and the second electrical connector 1b are not related to each other in terms of structural consistency, that is, the structures of the two electrical connectors may be identical or different, for example: in the first electrical connector 1a, only the surface of the first conductor 12 is provided with the solder layer 15, and only the surface of the second conductor 13 of the second electrical connector 1b is provided with the solder layer 15, at this time, the first conductor 12 of the first electrical connector 1a is welded with the first pad 21 through the solder layer 15, the second conductor 13 of the first electrical connector 1a is attached and connected with the third pad 41, the first conductor 12 of the second electrical connector 1b is attached and connected with the second pad 31, and the second conductor 13 of the second electrical connector 1b is welded with the fourth pad 42 through the solder layer 15; the surface of the first conductor 12 of the first electrical connector 1a is a flat surface, the surface of the second conductor 13 is an uneven surface, and the surface of the first conductor 12 and the surface of the second conductor 13 of the second electrical connector 1b are both uneven surfaces; the insulator 11 of the first electrical connector 1a is made of polyimide, and the insulator 11 of the second electrical connector 1b is made of thermoplastic polyimide or the like.

Further, as shown in fig. 10 to 11, the first pads 21 are connected to the first conductors 12 of the first electrical connector 1a in an equal number and in a one-to-one correspondence, and the second pads 31 are connected to the first conductors 12 of the second electrical connector 1b in an equal number and in a one-to-one correspondence; similarly, the third pads 41 are connected to the second conductors 13 of the first electrical connector 1a in the same number and in a one-to-one correspondence, and the fourth pads 42 are connected to the second conductors 13 of the second electrical connector 1b in the same number and in a one-to-one correspondence. Of course, in other embodiments, the first pad 21 and the first conductor 12 of the first electrical connector 1a, the second pad 31 and the first conductor 12 of the second electrical connector 1b, the third pad 41 and the second conductor 13 of the first electrical connector 1a, and the fourth pad 42 and the second conductor 13 of the second electrical connector 1b may be unequal in number and not correspondingly connected, for example, two first pads 21 are connected to the same first conductor 12 of the first electrical connector 1a, one fourth pad 42 is simultaneously connected to three second conductors 13 of the second electrical connector 1b, and so on.

Still further, a surface of the first circuit board 2 facing the first electrical connector 1a and/or a surface of the second circuit board 3 facing the second electrical connector 1b are provided with components (not shown), and the components extend into the first receiving hole 18 or the first receiving groove of the first electrical connector 1a and/or the first receiving hole 18 or the first receiving groove of the second electrical connector 1 b. If the size of the component is too large, the insulator 11 of the first electrical connector 1a and/or the second electrical connector 1b is provided with a first receiving hole 18, and correspondingly, the adapter plate 4 is provided with a second receiving hole 43 or a second receiving groove, so as to ensure that the component with larger size can be received.

Furthermore, the first circuit board 2 and the second circuit board 3 are detachably connected by a fastener, such as a bolt connection, a snap connection, etc., so as to improve the firmness of the integrated device.

In summary, the present invention provides an electrical connector 1, which includes an insulator 11, a plurality of first conductors 12 disposed on one side surface of the insulator 11, a plurality of second conductors 13 disposed on the other side surface of the insulator 11, a conductive medium 14 disposed on the insulator 11 for connecting the first conductors 12 and the second conductors 13, and a solder layer 15 disposed on the surface of the first conductors 12 and/or the second conductors 13. Compared with the prior art, the electric connector 1 is simple in manufacturing process, low in cost, convenient to use and low in operation difficulty.

In addition, the invention also provides two integrated devices, and the two integrated devices adopt the electric connector 1, so that the integrated device has the advantages of high precision, low cost, easiness in manufacturing and the like.

The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.

Claims (22)

1. The electric connector is characterized by comprising an insulator, wherein a plurality of first electric conductors are arranged on one side surface of the insulator, a plurality of second electric conductors are arranged on the other side surface of the insulator, a conductive medium for connecting the first electric conductors and the second electric conductors is further arranged on the insulator, and a solder layer is arranged on the surface of each of the first electric conductors and/or the second electric conductors.

2. The electrical connector of claim 1, wherein a surface of the first electrical conductor and/or the second electrical conductor is a planar surface.

3. The electrical connector of claim 1, wherein a surface of the first electrical conductor and/or the second electrical conductor is provided with a raised portion.

4. The electrical connector according to claim 3, wherein the protrusion is formed by protruding the first conductor and/or the second conductor to a side away from the insulator.

5. The electrical connector of claim 3, wherein the protrusion is shaped as a column, a block, a horn, an inverted cone, a tree, a sphere, or an arc.

6. The electrical connector of claim 3, wherein the surface of the first electrical conductor and/or the second electrical conductor is provided with two or more protrusions, the protrusions are the same or different in shape, the protrusions are the same or different in size, and the two or more protrusions are continuously or discontinuously distributed on the surface of the first electrical conductor and/or the second electrical conductor.

7. The electrical connector of claim 1, wherein the insulator is provided with a connection hole for connecting the first conductor and the second conductor, and the conductive medium is provided in the connection hole.

8. The electrical connector of claim 7, wherein the conductive medium fills the connection hole, or adheres to a wall of the connection hole and forms a conductive hole.

9. The electrical connector of claim 7, wherein the first electrical conductors are provided in two or more numbers and each of the first electrical conductors is independent of each other, and the second electrical conductors are provided in two or more numbers and each of the second electrical conductors is independent of each other.

10. The electrical connector of claim 9, wherein the number of the second conductors is equal to the number of the first conductors, and each of the first conductors is connected to each of the second conductors in a one-to-one correspondence via the conductive medium in a different one of the connecting holes.

11. The electrical connector of claim 9, wherein the number of the first electrical conductors is greater than the number of the second electrical conductors, at least two of the first electrical conductors are connected to the same second electrical conductor through the conductive media in different ones of the connecting holes, and the remaining first electrical conductors are connected to the remaining second electrical conductors in a one-to-one correspondence via the conductive media in different ones of the connecting holes.

12. The electrical connector of claim 9, wherein the number of the first electrical conductors is less than the number of the second electrical conductors, at least two of the second electrical conductors are connected to the same first electrical conductor through the conductive media in different ones of the connecting holes, and the remaining second electrical conductors are connected to the remaining first electrical conductors in a one-to-one correspondence through the conductive media in different ones of the connecting holes.

13. The electrical connector of claim 9, wherein at least two of said first conductors are connected to the same second conductor through said conductive media in different ones of said connecting holes, and wherein at least two of said second conductors are connected to the same first conductor through said conductive media in different ones of said connecting holes.

14. The electrical connector of claim 9, wherein at least two of the first conductors are connected to the same second conductor through the conductive media in different ones of the connecting holes, at least two of the second conductors are connected to the same first conductor through the conductive media in different ones of the connecting holes, and the remaining first conductors are connected to the remaining second conductors in a one-to-one correspondence through the conductive media in different ones of the connecting holes.

15. The electrical connector of claim 1, wherein the insulator is a combination of one or more of polyimide, thermoplastic polyimide, modified epoxy, modified acrylic, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polytetrafluoroethylene, liquid crystal polymer, polyoxamide.

16. The electrical connector of claim 1, wherein the solder layer is tin or a tin alloy.

17. The electrical connector of claim 1, wherein the insulator is provided with a first receiving hole or a first receiving groove.

18. An integrated device comprising a first circuit board, a second circuit board, and an electrical connector according to any one of claims 1-17, the electrical connector being disposed between the first circuit board and the second circuit board, a surface of the first circuit board facing the electrical connector being provided with a first land, the first land being connected to the first electrical conductor, a surface of the second circuit board facing the electrical connector being provided with a second land, the second land being connected to the second electrical conductor;

wherein the first pad and the first conductor are soldered by the solder layer; and/or

The second pad and the second conductor are soldered by the solder layer.

19. The integrated device of claim 18, wherein the first pads are connected in equal number and one-to-one correspondence with the first conductors; and/or

The second bonding pads and the second conductors are equal in number and are connected in a one-to-one correspondence mode.

20. An integrated device, comprising a first circuit board, a second circuit board and an interposer disposed therebetween, wherein the electrical connector according to any one of claims 1-17 is disposed between the first circuit board and the interposer, and between the second circuit board and the interposer;

the two electrical connectors are respectively marked as a first electrical connector and a second electrical connector, a first bonding pad is arranged on the surface of the first circuit board facing the first electrical connector and connected with a first conductor of the first electrical connector, and a second bonding pad is arranged on the surface of the second circuit board facing the second electrical connector and connected with a first conductor of the second electrical connector;

a third bonding pad is arranged on the surface of the adapter plate facing the first electric connector and connected with a second conductor of the first electric connector, and a fourth bonding pad connected with the third bonding pad is arranged on the surface of the adapter plate facing the second electric connector and connected with a second conductor of the second electric connector;

wherein the first pad is soldered to the first conductor of the first electrical connector via the solder layer; and/or

The second pad is welded with the first conductor of the second electrical connector through the solder layer; and/or

The third pad is welded with the second conductor of the first electrical connector through the solder layer; and/or

The fourth pad is soldered to the second conductor of the second electrical connector through the solder layer.

21. The integrated device of claim 20, wherein the first pads are connected in equal number and one-to-one correspondence with the first conductors of the first electrical connector; and/or

The second bonding pads are connected with the first conductors of the second electric connector in a one-to-one correspondence manner, and the number of the second bonding pads is equal to that of the first conductors of the second electric connector; and/or

The third bonding pads are connected with the second conductors of the first electric connector in a one-to-one correspondence manner, and the number of the third bonding pads is equal to that of the second conductors of the first electric connector; and/or

The number of the fourth bonding pads is equal to that of the second electric conductors of the second electric connector, and the fourth bonding pads are connected with the second electric conductors of the second electric connector in a one-to-one correspondence mode.

22. The integrated device according to claim 20, wherein the interposer is provided with a second receiving hole or a second receiving groove.

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