TWM511699U - Electrical connector and ball grid array package assembly - Google Patents
Electrical connector and ball grid array package assembly Download PDFInfo
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- TWM511699U TWM511699U TW103218372U TW103218372U TWM511699U TW M511699 U TWM511699 U TW M511699U TW 103218372 U TW103218372 U TW 103218372U TW 103218372 U TW103218372 U TW 103218372U TW M511699 U TWM511699 U TW M511699U
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Description
本新型係關於電連接器。具體而言，本新型係關於用在球狀柵格陣列(BGA)封裝中之電連接器。This new type relates to electrical connectors. In particular, the present invention relates to electrical connectors for use in ball grid array (BGA) packages.
BGA插座連接器用於將BGA封裝形式之晶片模組電連接至電路板，如母板或PCB板。圖1(A)至圖1(E)展示典型BGA插座連接器1，其中圖1(A)與圖1(D)係分別自晶片模組側與對置之電路板側觀看到之連接器，圖1(B)與圖1(E)分別為圖1(A)與圖1(D)中展示的連接器之一部分之局部放大視圖，圖1(C)說明該連接器中之一個端子。The BGA socket connector is used to electrically connect a chip module in a BGA package form to a circuit board, such as a motherboard or a PCB board. 1(A) to 1(E) show a typical BGA socket connector 1, wherein FIG. 1(A) and FIG. 1(D) are connectors viewed from the chip module side and the opposite circuit board side, respectively. Figure 1 (B) and Figure 1 (E) are partial enlarged views of a portion of the connector shown in Figure 1 (A) and Figure 1 (D), respectively, Figure 1 (C) illustrates one of the terminals of the connector .
如圖所示，BGA插座連接器1包括一個絕緣體2與固定在絕緣體2之中央區域中之一個端子模組3，端子模組3中之每個端子具有第一端或焊腳31與第二端或彈性端32，第一端31在面向電路板之一側上設置有焊球5，焊接陣列適於焊接至電路板(未展示)上之焊墊，彈性端32適於電接觸晶片模組(未展示)之接觸件，如錫球。在絕緣體2之周邊區域中通常亦設置有用於連接該連接器之殼體(未展示)之結構，如螺母4，該螺母與螺釘配合以將殼體固定至絕緣體。As shown, the BGA socket connector 1 includes an insulator 2 and a terminal module 3 fixed in a central region of the insulator 2. Each terminal of the terminal module 3 has a first end or solder tail 31 and a second The end or resilient end 32, the first end 31 is provided with a solder ball 5 on one side facing the circuit board, the soldering array is adapted to be soldered to a solder pad on a circuit board (not shown), and the elastic end 32 is adapted to electrically contact the wafer die Group (not shown) contacts, such as solder balls. Also provided in the peripheral region of the insulator 2 is a structure for connecting a housing (not shown) of the connector, such as a nut 4, which cooperates with the screw to secure the housing to the insulator.
當前，插座連接器及與之配合之模組基本上藉由鎖扣或螺絲進行連接，而鎖扣或螺絲之結構件一般均需要在電路板上鑽孔固定。Currently, the socket connector and the mating module are basically connected by a buckle or a screw, and the structural member of the buckle or the screw generally needs to be drilled and fixed on the circuit board.
考慮到上述情況，本新型提出一種改良之電連接器，其能夠焊接在電路板上，無需在電路板上鑽孔。In view of the above, the present invention proposes an improved electrical connector that can be soldered to a circuit board without drilling holes in the circuit board.
進一步，本新型亦提出一種電連接器，其能夠以BGA封裝之方式焊接在電路板上，實現與該電連接器之BGA封裝端子模組一致之封裝形式，從而能夠降低產品之複雜程度，簡化製造過程。Further, the present invention also proposes an electrical connector that can be soldered on a circuit board in a BGA package to achieve a package form conforming to the BGA package terminal module of the electrical connector, thereby reducing product complexity and simplifying Manufacturing process.
根據本新型之一個態樣，提供一種電連接器，被構造為將球狀柵格陣列(BGA)封裝形式之晶片模組電連接至一個電路板，該電連接器包括：一個絕緣體；一個端子模組，其固定在絕緣體之中央區域中且包括多個端子，每個端子具有一個第一端與適於電接觸晶片模組之一個第二端；及多個連接結構，其定位在絕緣體之周邊區域中且被構造成焊接至電路板。According to one aspect of the present invention, an electrical connector is provided that is configured to electrically connect a wafer module in a ball grid array (BGA) package form to a circuit board, the electrical connector comprising: an insulator; a terminal a module fixed in a central region of the insulator and including a plurality of terminals, each terminal having a first end and a second end adapted to electrically contact the wafer module; and a plurality of connection structures positioned in the insulator In the peripheral region and configured to be soldered to the circuit board.
較佳地，該電連接器亦可包括一個殼體，該殼體固定在絕緣體上並露出該第二端，從而第二端能夠電接觸晶片模組上對應之觸點或焊墊。Preferably, the electrical connector can also include a housing that is secured to the insulator and exposes the second end such that the second end can electrically contact a corresponding contact or pad on the wafer module.
較佳地，該電連接器亦可包括多個連接螺母，該等連接螺母定位在絕緣體之周邊區域中以將殼體固定至絕緣體。Preferably, the electrical connector may also include a plurality of coupling nuts positioned in a peripheral region of the insulator to secure the housing to the insulator.
較佳地，在該電連接器中，絕緣體具有面向殼體之一個第一面及與該第一面對置之面向電路板之一個第二面，且每個連接結構具有在該第二面上露出之一或多個焊接端及嵌入並固定在絕緣體中之一個基部。Preferably, in the electrical connector, the insulator has a first side facing the housing and a second side facing the first facing surface of the circuit board, and each connecting structure has the second side One or more solder ends are exposed and a base embedded and fixed in the insulator.
較佳地，在該電連接器中，每個焊接端上可設置有構造成焊接至電路板之一個焊球。Preferably, in the electrical connector, one solder ball configured to be soldered to the circuit board may be disposed on each soldering end.
較佳地，在該電連接器中，該多個連接結構可成對地設置在絕 緣體之至少一個拐角中。Preferably, in the electrical connector, the plurality of connection structures are arranged in pairs At least one corner of the body.
較佳地，在該電連接器中，每個連接結構可包括定位在絕緣體之至少一個拐角處之至少一個螺紋結構，每個螺紋結構被構造成將殼體固定在絕緣體上，且每個螺紋結構在面向電路板之一端具有被構造成焊接至電路板之一個焊接部。Preferably, in the electrical connector, each of the connection structures may include at least one threaded structure positioned at at least one corner of the insulator, each threaded structure being configured to secure the housing to the insulator, and each thread The structure has a solder portion configured to be soldered to the circuit board at one end facing the circuit board.
較佳地，在該電連接器中，該等連接螺母中之一者及該等連接結構中之至少兩者可形成定位在絕緣體之拐角中之一個L形之一體結構，其中該兩個連接結構分別構成該一體結構之第一臂及第二臂。Preferably, in the electrical connector, one of the connecting nuts and at least two of the connecting structures may form an L-shaped body structure positioned in a corner of the insulator, wherein the two connections The structures respectively form the first arm and the second arm of the unitary structure.
較佳地，在該電連接器中，絕緣體具有面向殼體之一個第一面及與第一面對置之面向電路板之一個第二面，且第一臂與第二臂中之每一者具有在該第二面上露出之一或多個焊接端。Preferably, in the electrical connector, the insulator has a first face facing the housing and a second face facing the first facing surface of the circuit board, and each of the first arm and the second arm One or more solder ends are exposed on the second side.
較佳地，在該電連接器中，每個焊接端上可設置有構造成焊接至電路板之一個焊球。Preferably, in the electrical connector, one solder ball configured to be soldered to the circuit board may be disposed on each soldering end.
較佳地，在該電連接器中，每個端子之第一端上設置有適於焊接至電路板之一個焊球。Preferably, in the electrical connector, a solder ball adapted to be soldered to the circuit board is disposed on the first end of each of the terminals.
根據本新型之另一個態樣，提供一種球狀柵格陣列(BGA)封裝組件，其包括一個電路板；一個晶片模組，被以球狀柵格陣列(BGA)封裝形式構造而成；及前述電連接器，該電連接器之該多個端子用於將晶片模組電連接至電路板。According to another aspect of the present invention, a ball grid array (BGA) package assembly includes a circuit board; a wafer module constructed in a ball grid array (BGA) package; In the foregoing electrical connector, the plurality of terminals of the electrical connector are used to electrically connect the chip module to the circuit board.
在參閱以下詳細之實施例及相關之圖式與申請專利範圍後，閱者將能更好地瞭解本新型之其他目的、特徵及優點。The reader will be able to better understand the other objects, features and advantages of the present invention after the following detailed description of the embodiments and the accompanying drawings and claims.
1‧‧‧BGA插座連接器1‧‧‧BGA socket connector
2‧‧‧絕緣體2‧‧‧Insulator
3‧‧‧端子模組3‧‧‧Terminal module
4‧‧‧螺母4‧‧‧ nuts
5‧‧‧焊球5‧‧‧ solder balls
31‧‧‧第一端或焊腳31‧‧‧First end or solder fillet
32‧‧‧第二端或彈性端32‧‧‧Second or elastic end
100‧‧‧電連接器100‧‧‧Electrical connector
110‧‧‧絕緣體110‧‧‧Insulator
111‧‧‧第一面111‧‧‧ first side
112‧‧‧第二面112‧‧‧ second side
120‧‧‧端子模組120‧‧‧Terminal module
130‧‧‧連接螺母或螺紋結構130‧‧‧Connecting nut or threaded structure
131‧‧‧焊接部131‧‧‧Welding Department
140‧‧‧連接結構140‧‧‧ Connection structure
140'‧‧‧連接結構140'‧‧‧ Connection structure
140"‧‧‧連接結構140"‧‧‧ connection structure
141‧‧‧焊接端141‧‧‧welding end
142‧‧‧基部142‧‧‧ base
143‧‧‧焊球143‧‧‧ solder balls
145‧‧‧第一臂145‧‧‧First arm
146‧‧‧第二臂146‧‧‧second arm
150‧‧‧焊球150‧‧‧ solder balls
參閱後續之圖式與描述將可更好地瞭解本新型之原理。文中未詳列之非限制性實施例請參考後續圖式之描述。圖式中之組成元件並不 一定符合比例，而是以強調之方式描繪出本新型之原理。在圖式中，相同之元件於不同圖式中標出相同之對應部分。The principles and concepts of the present invention will be better understood by reference to the following drawings and description. For a non-limiting example that is not detailed herein, please refer to the description of the subsequent figures. The components in the diagram are not It must be proportionate, but the principle of the new model is drawn in an emphasis. In the drawings, the same elements are labeled with the same corresponding parts in the different drawings.
圖1(A)為展示典型BGA插座連接器自殼體側觀看得到之立體示意圖；圖1(B)為展示圖1(A)所示之A部分之放大示意圖；圖1(C)為展示圖1(A)所示之連接器中之一個端子之立體示意圖；圖1(D)為展示圖1(A)所示之連接器自電路板側觀看得到之立體示意圖；圖1(E)為展示圖1(D)所示之B部分之放大示意圖；；圖2(A)為展示根據本新型之第一例示性實施例之BGA插座連接器自殼體側觀看得到之立體示意圖；圖2(B)為展示圖2(A)所示之連接器自電路板側觀看得到之立體示意圖；圖2(C)為展示2(A)所示之連接器之端子、連接結構及連接螺母之立體示意圖；圖3(A)為展示根據本新型之第二例示性實施例之BGA插座電連接器自殼體側觀看得到之立體示意圖；3(B)為展示3(A)所示之連接器之端子、連接結構及連接螺母之立體示意圖；圖4為展示根據本新型之第三例示性實施例之BGA插座電連接器自殼體側觀看得到之立體示意圖；圖5(A)為展示根據本新型之第四例示性實施例之BGA插座電連接器自殼體側觀看得到之立體示意圖；圖5(B)為展示5(A)所示之連接器之連接結構之一種立體示意圖；圖5(C)為展示5(B)所示之連接結構之另一種立體示意圖；及圖6為展示根據本新型之第五例示性實施例之BGA插座電連接器 之端子及連接結構之立體示意圖。1(A) is a perspective view showing a typical BGA socket connector viewed from the housing side; FIG. 1(B) is an enlarged schematic view showing a portion A shown in FIG. 1(A); FIG. 1(C) is a view Figure 1 (A) is a perspective view showing one of the terminals shown in Figure 1 (A); Figure 1 (D) is a perspective view showing the connector shown in Figure 1 (A) viewed from the side of the circuit board; Figure 1 (E) 1(A) is a perspective view showing the BGA socket connector according to the first exemplary embodiment of the present invention as seen from the side of the casing; 2(B) is a perspective view showing the connector shown in FIG. 2(A) viewed from the circuit board side; FIG. 2(C) is a terminal, connection structure and connecting nut of the connector shown in FIG. 2(A). FIG. 3(A) is a perspective view showing the BGA socket electrical connector according to the second exemplary embodiment of the present invention as seen from the side of the housing; 3(B) is shown in FIG. 3(A) FIG. 4 is a perspective view showing a terminal of a connector, a connection structure, and a connection nut; FIG. 4 is a view showing a BGA socket electrical connector self-housing according to a third exemplary embodiment of the present invention; FIG. 5(A) is a perspective view showing the BGA socket electrical connector according to the fourth exemplary embodiment of the present invention viewed from the housing side; FIG. 5(B) is a view showing 5(A) A perspective view of the connection structure of the connector shown; FIG. 5(C) is another perspective view showing the connection structure shown in FIG. 5(B); and FIG. 6 is a view showing a fifth exemplary embodiment according to the present invention. BGA socket electrical connector A schematic view of the terminal and the connection structure.
下文將藉由具體實施例並結合附圖對本新型之技術方案作進一步之說明。在本說明書中，相同或相似之部件由相同或類似之附圖標號指示。下述參照附圖對本新型之各實施例之說明旨在闡述本新型之總體構思，而不應當理解為對本新型之限制。The technical solution of the present invention will be further described below by way of specific embodiments and with reference to the accompanying drawings. In this specification, the same or similar components are denoted by the same or similar reference numerals. The description of the various embodiments of the present invention is intended to be illustrative of the present invention, and is not to be construed as limiting.
圖2(A)至圖2(C)展示根據本新型之電連接器100之一實施例之立體示意圖。例如，此種電連接器100為用於將BGA封裝形式之晶片模組電連接至電路板(如母板或PCB板)之BGA插座連接器。其中，圖2(A)為自晶片模組側觀看到之電連接器之立體示意圖，而圖2(B)為自與晶片模組側對置之電路板側觀看到之連接器，且2(C)為圖2(A)中展示之電連接器100之一部分之局部放大視圖。2(A) through 2(C) are perspective views showing an embodiment of an electrical connector 100 in accordance with the present invention. For example, such an electrical connector 100 is a BGA receptacle connector for electrically connecting a wafer module in the form of a BGA package to a circuit board such as a motherboard or PCB. 2(A) is a perspective view of the electrical connector viewed from the side of the chip module, and FIG. 2(B) is a connector viewed from the side of the circuit board opposite to the chip module side, and 2 (C) is a partial enlarged view of a portion of the electrical connector 100 shown in Fig. 2(A).
如圖2(A)及圖2(B)所示，根據本新型之第一例示性實施例之電連接器100包括一絕緣體110、一端子模組120、一殼體(未展示)及多個連接結構140。絕緣體110可由絕緣材料，例如由塑膠或塑膠件製成，且可為如藉由注塑成型形成之整體模製件。絕緣體110通常係大致矩形的，具有面向晶片模組之一第一面111及與第一面對置之面向電路板之一第二面112。As shown in FIG. 2(A) and FIG. 2(B), the electrical connector 100 according to the first exemplary embodiment of the present invention includes an insulator 110, a terminal module 120, a housing (not shown), and a plurality of Connection structure 140. The insulator 110 may be made of an insulating material such as a plastic or plastic member, and may be an integrally molded member such as formed by injection molding. The insulator 110 is generally generally rectangular having a first side 111 facing the wafer module and a second side 112 facing the first facing surface of the circuit board.
端子模組120固定在絕緣體110之中央區域中且包括多個端子，每個端子具有一第一端及適於電接觸晶片模組之一第二端，第一端上設置有適於焊接至電路板之一焊球150。如圖所示，焊球150在第二面112上形成一焊球陣列，其適於焊接至電路板上之焊墊或導電跡線，從而與電路板上之電路電連接。電連接器100之殼體可為絕緣結構，其固定在絕緣體110上並露出端子模組之第二端，以便第二端與***之晶片模組之接觸件或錫球彈性地電接觸，從而實現電路板與晶片模組之可靠電連通。The terminal module 120 is fixed in a central region of the insulator 110 and includes a plurality of terminals, each terminal having a first end and a second end adapted to electrically contact the wafer module, the first end being provided with a soldering to One of the board's solder balls 150. As shown, the solder balls 150 form an array of solder balls on the second side 112 that are adapted to be soldered to pads or conductive traces on the circuit board for electrical connection to circuitry on the circuit board. The housing of the electrical connector 100 can be an insulating structure that is fixed on the insulator 110 and exposes the second end of the terminal module such that the second end is in elastic electrical contact with the contact or solder ball of the inserted wafer module, thereby Realize reliable electrical communication between the board and the chip module.
根據本新型，電連接器100亦包括多個連接結構140，其定位在絕緣體110之周邊區域中且被構造成焊接至電路板，例如，在電連接器100安裝在電路板上時與焊球150一起焊接在電路板上。此等連接結構140與端子模組120係電絕緣的，但由於能夠焊接在電路板上，從而避免了對用於固定電連接器之鎖扣或螺絲及在電路板上鑽孔之需求。According to the present invention, the electrical connector 100 also includes a plurality of connection structures 140 that are positioned in the peripheral region of the insulator 110 and that are configured to be soldered to the circuit board, for example, when the electrical connector 100 is mounted on the circuit board. 150 is soldered together on the board. These connection structures 140 are electrically insulated from the terminal module 120, but are capable of soldering to the circuit board, thereby obviating the need for a lock or screw for securing the electrical connector and drilling holes in the circuit board.
在一項實例中，電連接器100亦可包括多個連接螺母或螺紋結構130，連接螺母130同樣定位在絕緣體110之周邊區域中，例如設置在絕緣體之四個拐角上，用於將電連接器100之殼體固定至其絕緣體110上。顯然，連接螺母130之位置不限於此種位置，而是可根據絕緣體110及殼體之結構以及具體固定需求而設置在任何合適之位置處。In one example, the electrical connector 100 can also include a plurality of connection nuts or threaded structures 130 that are also positioned in a peripheral region of the insulator 110, such as on four corners of the insulator for electrical connection. The housing of the device 100 is secured to its insulator 110. Obviously, the position of the coupling nut 130 is not limited to such a position, but may be set at any suitable position depending on the structure of the insulator 110 and the housing and the specific fixing requirements.
如圖3(A)至圖3(C)所示，每個連接結構140可具有在第二面112上露出之一或多個焊接端141及嵌入並固定在絕緣體110中之一基部142。多個焊接端141連接至基部142或與基部142形成為一體。焊接端141與焊球150一樣面向電路板，從而能夠與焊球同時焊接至電路板。 在所說明之實例中，連接結構140係大致T形扁平構件形式，其可成對地設置在絕緣體110之周邊區域中，例如在絕緣體110之每個拐角處設置有兩對連接結構。例如，在絕緣體110之周邊區域中形成有與連接結構140之形狀配合之凹槽或開槽，連接結構140可定位並固定在此種凹槽或開槽中。在絕緣體110之拐角設置有連接螺母130之情況下，此兩對連接結構140可以L形形式設置在連接螺母130之兩側。As shown in FIGS. 3(A) to 3(C), each of the connection structures 140 may have one or more solder ends 141 exposed on the second surface 112 and one base portion 142 embedded and fixed in the insulator 110. A plurality of weld ends 141 are coupled to or integral with the base 142. The solder end 141 faces the circuit board like the solder ball 150 so that it can be soldered to the board simultaneously with the solder ball. In the illustrated example, the connection structure 140 is in the form of a generally T-shaped flat member that can be disposed in pairs in a peripheral region of the insulator 110, such as two pairs of connection structures disposed at each corner of the insulator 110. For example, a groove or slot is formed in the peripheral region of the insulator 110 that conforms to the shape of the connecting structure 140, and the connecting structure 140 can be positioned and fixed in such a groove or slot. In the case where the connecting nut 130 is provided at the corner of the insulator 110, the two pairs of connecting structures 140 may be disposed on both sides of the connecting nut 130 in an L-shape.
圖3(A)及圖3(B)展示根據本新型之連接結構之另一實施例，其中圖3(B)為圖3(A)中展示之電連接器之一部分之局部放大視圖。如圖所示，每個焊接端141上可設置有構造成焊接至電路板之一焊球143，可採用與焊球150相同之焊接製程將焊球143同時焊接在電路板上，由此能夠保持封裝之一致性。焊球143在與端子模組120之焊球150相同之第二面112上露出，較佳地，與焊球150具有相同之高度，甚至與焊球 150具有相同之材料及尺寸，從而進一步簡化製造製程。3(A) and 3(B) show another embodiment of the connection structure according to the present invention, wherein FIG. 3(B) is a partial enlarged view of a portion of the electrical connector shown in FIG. 3(A). As shown, each soldering end 141 can be provided with a solder ball 143 configured to be soldered to the circuit board. The soldering process can be simultaneously soldered to the circuit board by the same soldering process as the solder ball 150. Keep the package consistent. The solder balls 143 are exposed on the same second surface 112 as the solder balls 150 of the terminal module 120, preferably at the same height as the solder balls 150, even with solder balls 150 has the same materials and dimensions to further simplify the manufacturing process.
圖4展示連接結構之另一實例。在該實例中，用作將電連接器100固定至電路板之連接結構可包括螺紋結構或該連接螺母本身。每個螺紋結構在面向電路板之一端具有被構造成焊接至電路板之一焊接部131，焊接部131在與端子模組120之焊球150相同之第二面112上露出。同時，此種螺紋結構或連接螺母亦被構造成能夠將電連接器100之殼體固定在其絕緣體110上，例如在與該一端對置之另一端具有螺紋，從而能夠利用此種形式之連接結構同時實現絕緣體至電路板及至電連接器100之殼體之固定。Figure 4 shows another example of a connection structure. In this example, the connection structure used to secure the electrical connector 100 to the circuit board can include a threaded structure or the coupling nut itself. Each of the threaded structures has a solder portion 131 that is configured to be soldered to one of the circuit boards at one end of the circuit board, and the solder portion 131 is exposed on the same second surface 112 as the solder balls 150 of the terminal module 120. At the same time, such a threaded structure or coupling nut is also configured to secure the housing of the electrical connector 100 to its insulator 110, for example, at the other end opposite the end, thereby enabling the use of such a form of connection The structure simultaneously secures the insulator to the circuit board and to the housing of the electrical connector 100.
圖5(A)至圖5(C)展示根據本新型之電連接器之另一項實施例，其中圖5(B)及圖5(C)說明用在此種電連接器之連接結構140'之立體示意圖。如圖所示，連接結構140'固定在電連接器之絕緣體中，例如定位在絕緣體之拐角中之L形之一體結構，每個一體結構包括一第一臂145、一第二臂146及一連接螺母或螺紋結構144，此種螺紋結構144可為一體地形成在連接結構140'中之前述連接螺母，以將電連接器之殼體固定在其絕緣體110。如圖所示，第一臂145與第二臂146中之每一者具有在絕緣體110之第二面上露出之一或多個焊接端141，由此能夠將電連接器焊接至電路板。在一項實例中，第一臂145與第二臂146中之每一者可具有兩排焊接端141，例如由兩個前述連接結構140一體地形成。或者，第一臂145與第二臂146中之每一者可僅具有一排焊接端141，例如由一前述連接結構140形成。顯而易見，焊接端141之數目及排數不受限制。5(A) to 5(C) show another embodiment of an electrical connector according to the present invention, wherein FIGS. 5(B) and 5(C) illustrate a connection structure 140 for use in such an electrical connector. 'Three-dimensional diagram. As shown, the connection structure 140' is fixed in an insulator of the electrical connector, such as an L-shaped body structure positioned in a corner of the insulator, each integral structure including a first arm 145, a second arm 146, and a A coupling nut or threaded structure 144 is provided. The threaded structure 144 can be the aforementioned coupling nut integrally formed in the connecting structure 140' to secure the housing of the electrical connector to its insulator 110. As shown, each of the first arm 145 and the second arm 146 has one or more solder ends 141 exposed on the second side of the insulator 110, thereby enabling the electrical connector to be soldered to the circuit board. In one example, each of the first arm 145 and the second arm 146 can have two rows of weld ends 141 that are integrally formed, for example, by two of the foregoing connection structures 140. Alternatively, each of the first arm 145 and the second arm 146 may have only one row of solder ends 141, such as formed by a previously described connection structure 140. It is obvious that the number of the welded ends 141 and the number of rows are not limited.
圖6說明根據本新型之另一形式之連接結構140"。如之前參照3(A)至3(C)所描述，連接結構140"與前述連接結構140'之不同之處僅在於，每個焊接端141上設置有構造成焊接至電路板之一焊球143。Figure 6 illustrates a connection structure 140" according to another form of the present invention. As previously described with reference to 3(A) through 3(C), the connection structure 140" differs from the aforementioned connection structure 140' only in that each The soldering end 141 is provided with a solder ball 143 configured to be soldered to one of the circuit boards.
本新型亦提供一種球狀柵格陣列(BGA)封裝組件，其包括一電路 板、以球狀柵格陣列(BGA)封裝形式構造而成之一晶片模組，及根據本新型之用於將晶片模組電連接至電路板之前述電連接器。The present invention also provides a ball grid array (BGA) package assembly including a circuit A board, a wafer module constructed in a ball grid array (BGA) package, and the aforementioned electrical connector for electrically connecting a wafer module to a circuit board according to the present invention.
應當理解，上述實施例與附圖僅供熟習此項技術者對於本新型之各個不同實施例具有概括性的瞭解。該些圖式與說明並非想要對利用此處所述之結構或方法之裝置與系統中之所有元件及特徵作完整性之描述。藉由閱讀本新型之說明書，熟習此項技術者將更能明白本新型之許多其他實施例、將源自本新型之揭示內容之內容。在不悖離本新型保護範圍之情況下，本新型可進行結構與邏輯之置換與改變。此外，本新型之附圖僅用於說明而非按比例進行繪製。附圖中之某些部分可能會被放大以進行強調，而其他部分可能被簡略。因此，本新型之說明書與附圖應當視為描述而非限制性的，並將由下文中之申請專利範圍之保護範圍來限制。應注意，詞「包括」不排除其他元件或步驟，詞「一」或「一個」不排除多個。另外，申請專利範圍之任何元件標號不應理解為限制本新型之範疇。It should be understood that the above-described embodiments and drawings are only for a general understanding of the various embodiments of the present invention. The illustrations and illustrations are not intended to describe the integrity of all of the elements and features in the devices and systems that utilize the structures or methods described herein. Many other embodiments of the present invention, which will be apparent from the disclosure of the present invention, will be apparent to those skilled in the art. The present invention can be replaced and changed in structure and logic without departing from the scope of the novel protection. In addition, the drawings of the present invention are intended to be illustrative only and not to scale. Some parts of the drawings may be enlarged for emphasis, while others may be simplified. The specification and drawings of the present invention are to be regarded as the description It should be noted that the word "comprising" does not exclude other elements or steps. The word "a" or "an" does not exclude a plurality. In addition, any component numbering of the patent application scope should not be construed as limiting the scope of the invention.
100‧‧‧電連接器100‧‧‧Electrical connector
112‧‧‧第二面112‧‧‧ second side
130‧‧‧連接螺母或螺紋結構130‧‧‧Connecting nut or threaded structure
140‧‧‧連接結構140‧‧‧ Connection structure
141‧‧‧焊接端141‧‧‧welding end
150‧‧‧焊球150‧‧‧ solder balls
Claims (12)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320638699.5U CN203491477U (en) | 2013-10-16 | 2013-10-16 | Electrical connector and ball grid array encapsulation assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM511699U true TWM511699U (en) | 2015-11-01 |
Family
ID=50262281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103218372U TWM511699U (en) | 2013-10-16 | 2014-10-16 | Electrical connector and ball grid array package assembly |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN203491477U (en) |
| MX (1) | MX2014012539A (en) |
| TW (1) | TWM511699U (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105514643B (en) * | 2014-09-24 | 2018-06-19 | 泰科电子(上海)有限公司 | Electric connector and its manufacturing method, electric coupler component |
| CN113473785A (en) | 2014-11-14 | 2021-10-01 | 安费诺富加宜（亚洲）私人有限公司 | On-board transceiver assembly with retention features |
| CN112768974A (en) * | 2019-10-21 | 2021-05-07 | 北京小米移动软件有限公司 | Laminated plate structure and electronic equipment |
-
2013
- 2013-10-16 CN CN201320638699.5U patent/CN203491477U/en not_active Expired - Lifetime
-
2014
- 2014-10-16 MX MX2014012539A patent/MX2014012539A/en unknown
- 2014-10-16 TW TW103218372U patent/TWM511699U/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| MX2014012539A (en) | 2015-11-06 |
| CN203491477U (en) | 2014-03-19 |
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