CN112731090A - Method and device for testing voltage resistance of copper-clad plate on line - Google Patents
Method and device for testing voltage resistance of copper-clad plate on line Download PDFInfo
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- CN112731090A CN112731090A CN202011555282.3A CN202011555282A CN112731090A CN 112731090 A CN112731090 A CN 112731090A CN 202011555282 A CN202011555282 A CN 202011555282A CN 112731090 A CN112731090 A CN 112731090A
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- copper
- testing
- clad plate
- clad
- test
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- 238000012360 testing method Methods 0.000 title claims abstract description 112
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000012546 transfer Methods 0.000 claims description 10
- 238000005086 pumping Methods 0.000 claims description 4
- 230000015556 catabolic process Effects 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000005070 sampling Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000011076 safety test Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/16—Construction of testing vessels; Electrodes therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/18—Subjecting similar articles in turn to test, e.g. go/no-go tests in mass production
Abstract
The invention provides a method and a device for testing the pressure resistance of a copper-clad plate on line, wherein the method for testing the pressure resistance of the copper-clad plate on line comprises the following steps: (1) setting parameters of a voltage withstanding test, and starting a testing device; (2) conveying the copper-clad plate to a vacuum cavity for containing a test electrode, and vacuumizing the vacuum cavity; (3) when the testing device reaches a set value, the testing electrode is adopted to test the voltage resistance of the copper-clad plate under the vacuum condition; (4) if the copper-clad plate is not broken down under the set value, the voltage resistance is qualified, otherwise, the copper-clad plate is unqualified, and the qualified and unqualified copper-clad plates are classified. Compared with the prior art, the method for testing the pressure resistance of the copper-clad plate on line has the advantages that the test is carried out under the vacuum condition, and air does not exist, so that the condition of air breakdown at the edge of the copper-clad plate can not occur in the test process, the nondestructive test of the copper-clad plate can be realized, the misjudgment caused by the air breakdown at the edge can be reduced, and the test efficiency is high.
Description
Technical Field
The invention relates to the field of instrument testing, in particular to a performance test of a copper-clad plate, and more particularly relates to a method and a device for testing the pressure resistance of the copper-clad plate on line.
Background
The electrical safety performance is an important parameter reflecting the safety performance of electronic products and equipment, and main test indexes of the electrical safety performance of the whole machine comprise voltage resistance, insulation resistance, leakage current, grounding resistance and the like, wherein the voltage resistance test is one of the most familiar and used in product safety tests. The copper-clad plate is used as a ground cover of a circuit board and a carrier of electronic components and is applied to various electrical equipment and electrical appliances, so that the voltage resistance is one of the key properties of the copper-clad plate. At present, the method for testing the voltage resistance of the copper clad laminate by copper clad laminate manufacturers in the industry usually adopts the modes of manual sampling inspection and local testing, firstly, a whole CCL material needs to be sampled and sampled, and then, a laboratory high-voltage tester is used for carrying out a pressure test, and the existing sampling inspection local testing method cannot represent the voltage resistance of the whole large board and cannot represent the voltage resistance of all large boards in a batch of orders. In addition, with the change of science and technology and the pursuit of people for lightness, thinness, shortness and smallness of electronic equipment, the interconnection density of electronic circuits is increased by tens of thousands of times than before nowadays, and the volume is continuously reduced, so the requirement on the voltage resistance of the copper-clad plate is higher and higher, and the existing detection method of manual sampling inspection and local test cannot meet the requirement of downstream customers. Therefore, the requirement of online testing of the voltage resistance of the copper-clad plate is more and more urgent, but when the voltage resistance test is carried out on the copper-clad plate, the edge of the copper-clad plate is easy to be punctured by air to generate electric arcs, so that the edge of the copper-clad plate has a black point defect and misjudgment is brought. The current industry practice is to tear the edge copper foil and increase the distance between the two sides of the copper foil for carrying out the voltage withstanding test, but the test efficiency is very low, the operation is complex, and the automation cannot be realized. Therefore, at present, no mature method for carrying out online voltage withstanding test on the CCL exists in the CCL industry.
Disclosure of Invention
The invention aims to provide a method and a device for testing the pressure resistance of a copper-clad plate on line, which can realize on-line automatic testing, do not need to tear edge copper foils, have high testing efficiency and are simple to operate.
In order to achieve the above object, a first aspect of the present invention provides a method for online testing voltage resistance of a copper-clad plate, comprising:
(1) setting parameters of a voltage withstanding test, and starting a testing device;
(2) conveying the copper-clad plate to a vacuum cavity for containing a test electrode, and vacuumizing the vacuum cavity;
(3) when the testing device reaches a set value, the testing electrode is adopted to test the voltage resistance of the copper-clad plate under the vacuum condition;
(4) if the copper-clad plate is not broken down under the set value, the voltage resistance is qualified, otherwise, the copper-clad plate is unqualified, and the qualified and unqualified copper-clad plates are classified.
Compared with the prior art, the method for testing the pressure resistance of the copper-clad plate on line has the advantages that the test is carried out under the vacuum condition, and air does not exist, so that the condition of air breakdown at the edge of the copper-clad plate can not occur in the test process, the nondestructive test of the copper-clad plate can be realized, the misjudgment caused by the air breakdown at the edge can be reduced, and the test efficiency is high.
Preferably, in step (1), the parameters include voltage, leakage current, boosting rate and dropping rate, and the voltage endurance requirements of different models of products are different, so that the specific values can be determined according to actual conditions.
Preferably, in the step (2), before the vacuum chamber is vacuumized, a vacuumization parameter is set, wherein the vacuumization parameter mainly refers to a vacuum degree, and the vacuum degree is less than or equal to 500mbar, and the value can be determined according to actual conditions.
The invention also provides a device for testing the pressure resistance of the copper-clad plate on line, which comprises the following components:
the board placing device is provided with a sample platform for placing the copper-clad board;
the testing device is provided with a testing electrode, the testing electrode is sealed in a vacuum cavity, and the vacuum cavity is communicated with the vacuumizing device and comprises an input port and an output port;
the board collecting device comprises a qualified product board collecting platform and an unqualified product board collecting platform, and the tested copper-clad plates are classified and stored;
the conveying device is connected with the plate placing device and the plate collecting device and sequentially penetrates through the input port and the output port, the input port and the output port are both provided with automatic doors capable of presenting a closed state or an open state,
the board placing device, the testing device, the board collecting device and the conveying device are all connected with a controller.
The device for testing the pressure resistance of the copper-clad plate on line can convey and classify the copper-clad plate through the conveying device, seals the test electrode through the vacuum cavity, is communicated with the vacuumizing device and is matched with the conveying device to close or open the input port and the output port, so that the pressure resistance test under the vacuum condition can be carried out.
Preferably, the plate placing device is provided with a manipulator, and the manipulator transfers the copper-clad plate from the sample platform to the conveying device.
Preferably, the board collecting device is provided with a manipulator, and the manipulator transfers the copper-clad board from the conveying device to the qualified product board collecting platform or the unqualified product board collecting platform according to the instruction provided by the controller.
Preferably, the test electrode is connected with an output line, and the output line is seamlessly arranged on the cavity wall of the vacuum cavity in a penetrating manner and is connected with the test device.
Preferably, the vacuum pumping device is connected with a communication pipeline, and the communication pipeline penetrates through the cavity wall of the vacuum cavity in a seamless mode.
Preferably, the conveying device comprises a conveying belt, the conveying belt sequentially penetrates through the input port and the output port, and the automatic door is in seamless contact with the conveying belt in a closed state. The automatic door can also be connected with the controller and closed or closed after receiving the instruction of the controller.
Drawings
FIG. 1 is a schematic diagram of an embodiment of the device for testing the voltage resistance of the copper-clad plate on line.
FIG. 2 is a partially enlarged schematic view of the device for testing the pressure resistance of the copper-clad plate by wire of the invention.
DESCRIPTION OF SYMBOLS IN THE DRAWINGS
100-a device for testing the pressure resistance of the copper-clad plate on line; 10-a plate placing device; 11-a sample platform; 20-a test device;
21-a test electrode; 23-an output line; 30-a plate collecting device; 40-a transfer device; 41-a conveyor belt; 50-vacuum chamber;
51-an input port; 53-an output port; 60-a vacuum-pumping device; 61-a communicating conduit; 70-copper clad plate
Detailed Description
To better illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described with reference to specific embodiments. The following embodiments are further illustrative of the present invention, and should not be construed as limiting the present invention.
The invention discloses a method for testing the pressure resistance of a copper-clad plate on line, which comprises the following steps:
(1) setting parameters of a voltage withstanding test, and starting a testing device;
(2) conveying the copper-clad plate to a vacuum cavity for accommodating a test electrode, and vacuumizing the vacuum cavity;
(3) when the device to be tested reaches a set value, a test electrode is adopted to test the voltage resistance of the copper-clad plate under the vacuum condition;
(4) if the copper-clad plate is not broken down under the set value, the voltage resistance is qualified, otherwise, the copper-clad plate is unqualified, and the qualified and unqualified copper-clad plates are classified.
In the step (1), the parameters comprise voltage, leakage current, boosting rate and reducing rate, in the step (2), before the vacuum cavity is vacuumized, vacuumizing parameters are set, wherein the vacuumizing parameters mainly refer to vacuum degree, and the vacuum degree is less than or equal to 500 mbar.
In the method for testing the voltage resistance of the copper-clad plate on line, the sequence of the steps (1) and (2) is also exchanged and can be synchronously carried out, the key point is that the time required by a testing device to reach a set value and the time required by conveying the copper-clad plate to a vacuum cavity and vacuumizing to reach a set parameter value after the parameters in the step (1) are set and opened, if the time required in the step (1) is longer, the step (1) is firstly opened, if the time required in the step (2) is longer, the step (2) is firstly opened, and if the time difference between the two steps is not large, the step (1) is firstly opened so as to facilitate the preheating of equipment.
The device for testing the voltage resistance of the copper-clad plate on line is explained in detail with reference to the attached drawings.
As shown in FIGS. 1-2, the device 100 for testing the voltage resistance of the copper-clad plate on line comprises: the board placing device 10 is provided with a sample platform 11 for placing the copper-clad board 70; the testing device 20 is provided with a testing electrode 21, the testing electrode 21 is sealed in a vacuum cavity 50, and the vacuum cavity 50 is communicated with a vacuumizing device 60 and comprises an input port 51 and an output port 53; the board collecting device 30 comprises a qualified product board collecting platform (not shown in the figure) and an unqualified product board collecting platform (not shown in the figure), and the board collecting device 30 can classify and store the tested copper-clad plates 70; the conveying device 40 is connected with the plate placing device 10 and the plate collecting device 30, and sequentially penetrates through the input port 51 and the output port 53, the input port 51 and the output port 53 are provided with automatic doors (not shown) capable of presenting a closed state or an open state, and the plate placing device 10, the testing device 20, the plate collecting device 30 and the conveying device 40 are all connected with a controller (not shown).
It should be further noted that the board placing device 10 may be provided with a manipulator (not shown in the figure), the manipulator transfers the copper-clad board 70 from the sample platform 11 to the conveying device 40, and of course, the manipulator may also use other transfer modes, for example, a downward slope toward the conveying device 40 is provided on the sample platform 11, and the push rod on the board placing device 10 pushes the copper-clad board 70 to slide down to the slope and onto the conveying device 40. The purpose of the board placing device 10 is to transfer the copper-clad board 70 to the conveying device 40, which can be implemented in various ways and is not limited to the above two structures, and the detailed structure of the board placing device 10 is not the focus of the present invention, and thus will not be described in detail.
The board receiving device 30 is provided with a manipulator (not shown in the figure), the manipulator transfers the copper-clad board 70 from the conveying device 40 to a qualified product board receiving platform or an unqualified product board receiving platform according to an instruction provided by the controller, the manipulator is also connected with the controller, and after the controller sends out the instruction that the copper-clad board 70 is qualified or unqualified, the manipulator transfers the copper-clad board 70 to the corresponding board receiving platform. Certainly, the sorting and stacking can be performed by other manners, for example, the qualified product board receiving platform and the unqualified product board receiving platform are fixedly connected with the sliding device, the sliding device is connected with the controller, and after the sliding device receiving controller sends an instruction that the copper-clad board 70 is qualified or unqualified, the corresponding board receiving platform is slid to the tail end of the conveying device 40. The purpose of the board collecting device 30 is to store the tested copper-clad plates 70 in a classified manner, which can be implemented in various ways and is not limited to the above two structures, and the detailed structure of the board collecting device 30 is not the key point of the present invention, and thus is not described in detail.
In order to form a sealed vacuum environment during testing, the testing electrode 21 is connected to the output line 23, and the output line 23 is seamlessly inserted through the cavity wall of the vacuum cavity 50 and connected to the testing device 20. The vacuum extractor 60 is connected with a communication pipeline 61, and the communication pipeline 61 penetrates through the cavity wall of the vacuum cavity 50 in a seamless mode. The conveying device 40 comprises a conveying belt 41, the conveying belt 41 sequentially penetrates through an input port 51 and an output port 53, the automatic door is in seamless contact with the conveying belt 41 in a closed state, the automatic door is also connected with the controller and is closed or closed after receiving an instruction of the controller, and the conveying belt 41 is driven to operate through a driving mechanism.
When the device 100 for testing the pressure resistance of the copper-clad plate on line is actually operated, the parameter setting of the testing device 20 can be adjusted, or the copper-clad plate 70 can be conveyed to the vacuum cavity 50 and vacuumized, so as to facilitate understanding of the operation process of the device 100 for testing the pressure resistance of the copper-clad plate on line, the detailed operation process description is carried out by taking the test parameter setting as an example.
Firstly, setting test parameters of the test device 20, including voltage, leakage current, boosting rate and voltage reducing rate, starting the test device 20, transferring the copper-clad plate 70 from the sample platform 11 to the conveying device 40 by using a manipulator, and conveying the copper-clad plate 70 into the vacuum cavity 50 through the operation of the conveying belt 41. When the copper-clad plate 70 reaches the position of the test electrode 21, the conveyor belt 41 stops running, the automatic doors of the input port 51 and the output port 53 of the vacuum cavity 50 are closed, and the interior of the vacuum cavity 50 is adjusted to be in a vacuum state by the vacuum pumping device 60. When the device to be tested 20 reaches the set value, the test electrode 21 is used for testing the pressure resistance of the copper-clad plate 70 under the vacuum condition, after the test is finished, the automatic door is opened, and the conveyor belt 41 continues to operate to output the copper-clad plate 70 from the vacuum cavity 50. If the copper-clad plate 70 is not broken down under the set value, the voltage resistance is qualified, the copper-clad plate is stored to a qualified product plate collecting platform, if the copper-clad plate is broken down, the copper-clad plate is unqualified, and the unqualified copper-clad plate 70 is stored to an unqualified product plate collecting platform. The device 100 for testing the voltage resistance of the copper-clad plate on line is to test under the vacuum condition, and air does not exist, so that the situation of air breakdown at the edge of the copper-clad plate 70 can not occur in the testing process, the nondestructive testing of the copper-clad plate 70 can be realized, the misjudgment caused by the air breakdown at the edge can be reduced, and the testing efficiency is high.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting the protection scope of the present invention, and although the present invention is described in detail with reference to the preferred embodiments, it is not limited to the embodiments, and those skilled in the art should understand that the technical solutions of the present invention can be modified or substituted with equivalents without departing from the spirit and scope of the technical solutions of the present invention.
Claims (9)
1. A method for testing the pressure resistance of a copper-clad plate on line is characterized by comprising the following steps:
(1) setting parameters of a voltage withstanding test, and starting a testing device;
(2) conveying the copper-clad plate to a vacuum cavity for containing a test electrode, and vacuumizing the vacuum cavity;
(3) when the testing device reaches a set value, the testing electrode is adopted to test the voltage resistance of the copper-clad plate under the vacuum condition;
(4) if the copper-clad plate is not broken down under the set value, the voltage resistance is qualified, otherwise, the copper-clad plate is unqualified, and the qualified and unqualified copper-clad plates are classified.
2. The method for testing the voltage resistance of the copper-clad plate according to claim 1, wherein the parameters comprise voltage, leakage current, voltage boosting rate and voltage reducing rate.
3. The method for on-line testing the pressure resistance of the copper-clad plate according to claim 1, wherein the vacuum chamber is required to be set with vacuum parameters before vacuum pumping.
4. The utility model provides a device of online test copper-clad plate withstand voltage performance which characterized in that includes:
the board placing device is provided with a sample platform for placing the copper-clad board;
the testing device is provided with a testing electrode, the testing electrode is sealed in a vacuum cavity, and the vacuum cavity is communicated with the vacuumizing device and comprises an input port and an output port;
the board collecting device comprises a qualified product board collecting platform and an unqualified product board collecting platform, and the tested copper-clad plates are classified and stored;
the conveying device is connected with the plate placing device and the plate collecting device and sequentially penetrates through the input port and the output port, the input port and the output port are both provided with automatic doors capable of presenting a closed state or an open state,
the board placing device, the testing device, the board collecting device and the conveying device are all connected with a controller.
5. The apparatus for on-line testing the pressure resistance of the copper-clad plate according to claim 4, wherein the plate placing apparatus is provided with a manipulator, and the manipulator transfers the copper-clad plate from the sample platform to the conveying apparatus.
6. The apparatus for on-line testing the pressure resistance of the copper-clad plate according to claim 4, wherein the plate collecting device is provided with a manipulator, and the manipulator transfers the copper-clad plate from the conveying device to the qualified product plate collecting platform or the unqualified product plate collecting platform according to the instruction provided by the controller.
7. The apparatus for testing the pressure resistance of the copper-clad plate on line according to claim 4, wherein the testing electrode is connected to an output line, and the output line is seamlessly inserted through the cavity wall of the vacuum cavity and connected to the testing apparatus.
8. The device for testing the pressure resistance of the copper-clad plate according to claim 4, wherein the evacuating device is connected with a communicating pipe, and the communicating pipe penetrates through the wall of the vacuum cavity without a seam.
9. The apparatus for on-line testing pressure resistance of copper-clad plate according to claim 4, wherein the conveyer comprises a conveyer belt, the conveyer belt sequentially penetrates through the input port and the output port, and the automatic door is in seamless contact with the conveyer belt in a closed state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011555282.3A CN112731090A (en) | 2020-12-24 | 2020-12-24 | Method and device for testing voltage resistance of copper-clad plate on line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011555282.3A CN112731090A (en) | 2020-12-24 | 2020-12-24 | Method and device for testing voltage resistance of copper-clad plate on line |
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| CN112731090A true CN112731090A (en) | 2021-04-30 |
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| CN202011555282.3A Pending CN112731090A (en) | 2020-12-24 | 2020-12-24 | Method and device for testing voltage resistance of copper-clad plate on line |
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Application publication date: 20210430 |