CN112720205A

CN112720205A - Be used for full-automatic equipment of polishing of industry intelligent chip

Info

Publication number: CN112720205A
Application number: CN202011540454.XA
Authority: CN
Inventors: 姚金才; 陈宇; 朱超群
Original assignee: Shenzhen Hester Technology Co ltd
Current assignee: Shenzhen Hester Technology Co ltd
Priority date: 2020-12-23
Filing date: 2020-12-23
Publication date: 2021-04-30
Anticipated expiration: 2040-12-23
Also published as: CN112720205B

Abstract

The invention discloses full-automatic polishing equipment for industrial intelligent chips, which comprises a workbench, and a feeding and discharging mechanism, a transfer table, a material moving mechanism, a polishing mechanism and a polishing support which are arranged on the workbench, wherein the transfer table is transversely arranged in the middle of the workbench through four support legs, the material moving mechanism is arranged on the left side and the right side of the transfer table, the feeding and discharging mechanism is arranged on the right side of the workbench and is adjacent to the right side of the transfer table, the polishing support is arranged on the rear side of the transfer table, the polishing mechanism is vertically arranged on the polishing mechanism, the feeding and discharging mechanism is used for transferring the intelligent chips to be polished onto the transfer table, and then discharging is carried out on the polished intelligent chips; the grinding machine has the advantages of uniform grinding force, high grinding precision, high machining efficiency, labor saving, benefit improvement and good market application value, and effectively reduces the generation of grinding defective products.

Description

Be used for full-automatic equipment of polishing of industry intelligent chip

Technical Field

The invention relates to the technical field of chip processing equipment, in particular to full-automatic grinding equipment for an industrial intelligent chip.

Background

The intelligent chip need drill the intelligent chip earlier in production and processing, then carry out car internal diameter processing through the lathe, after processing finishes, measure the size, flow into next process of polishing after measuring qualified, the work of polishing to the intelligent chip all adopts the manual work to pass through the angle mill usually, then polish the action one by one to every intelligent chip, but adopt artifical polishing because the dynamics of polishing is inhomogeneous, lead to intelligent chip internal diameter to polish inhomogeneous easily, to some intelligent chips that the machining precision requires height, very easily appear because polish the production that leads to the defective products, the artifical last unloading that need not stop of polishing in addition, lead to the manual work inefficiency. An integrated circuit is a miniature electronic device or component, and a certain process is adopted to interconnect elements such as transistors, resistors, capacitors, inductors and the like required in a circuit with wiring and manufacture the elements on a small or a plurality of small semiconductor wafers or medium substrates. With the progress of the integration technology, the improvement of the equipment and the use of the deep submicron technology, the LSI, VLSI and ULSI are appeared in succession, the integration level of a silicon single chip is continuously improved, the requirement on the integrated circuit packaging is more strict, the number of I/O pins is continuously increased, the power consumption is increased, in order to meet the development requirement, a new type, namely ball grid array packaging is added on the basis of the original packaging type, due to the particularity of the BGA packaging, the requirement on the welding process of the BGA chip is very high, the BGA chip is inevitably replaced due to BGA damage or other reasons in the production and debugging process, at this time, the dismounting of the BGA can be regarded as the reverse process of the welding of the BGA, but the current electronic equipment requires that the size of the circuit board is smaller and smaller, the components on the circuit board tend to be in the principle of small and dense, the number of layers of the circuit board is more and more, and a, once the chip is damaged, the chip cannot be replaced by a high-temperature method at all, the high temperature can deform the multilayer board, the circuit is damaged, the electrical performance is reduced, and other elements can be damaged or displaced due to overhigh temperature; still can not assist with other instruments to demolish simultaneously, still can use glue bonding because between circuit board and the BGA, can damage the pad hard, if will carry out the sol to it and handle, there is certain difficulty again, this makes the maintenance of BGA circuit board become a very big difficult point, maintain the circuit board now and generally use triaxial cnc engraving and milling machine to polish away the BGA chip that has destroyed, can guarantee like this that the circuit board does not receive the damage, need not dust-free workshop simultaneously, need not to heat and practice thrift not few costs, but the unable automatic change wearing and tearing cutter of current polisher, and the time of polishing is long, increase the technology degree of difficulty.

Accordingly, the prior art is deficient and needs improvement.

Disclosure of Invention

In order to overcome the defects in the prior art, the invention provides full-automatic polishing equipment for an industrial intelligent chip.

The invention provides technical documentation, in particular to full-automatic polishing equipment for industrial intelligent chips, which comprises a workbench, and a feeding and discharging mechanism, a transfer table, a material moving mechanism, a polishing mechanism and a polishing support which are arranged on the workbench, wherein the transfer table is transversely arranged in the middle of the workbench through four support legs, the material moving mechanism is arranged on the left side and the right side of the transfer table, the feeding and discharging mechanism is arranged on the right side of the workbench and is adjacent to the right side of the transfer table, the polishing support is arranged on the rear side of the transfer table, the polishing mechanism is vertically arranged on the polishing mechanism, the feeding and discharging mechanism is used for transferring the intelligent chips to be polished onto the transfer table and then discharging the polished intelligent chips, and the material moving mechanism is used for circularly transferring the intelligent chips on the transfer table, the polishing support is used for installing the polishing mechanism, and the polishing mechanism is used for polishing the intelligent chip on the transfer table.

Preferably, go up unloading mechanism includes lift drive assembly, transverse drive assembly, loading board and rotatory centre gripping subassembly, lift drive assembly set up in on the workstation, the loading board set up in lift drive assembly's top, transverse drive assembly set up in the upper portion right side of loading board, rotatory centre gripping subassembly set up in the upper portion left side of loading board, lift drive assembly is used for the drive the loading board up-and-down motion, transverse drive assembly is used for the drive rotatory centre gripping subassembly makes 90 degrees or 180 degrees rotations, rotatory centre gripping subassembly is used for pressing from both sides the product clamp.

Preferably, the lift drive assembly drives actuating cylinder, lift mounting panel, the flexible guide arm in left side and the flexible guide arm in right side including going up and down, the lift mounting panel set up in on the workstation, go up and down to drive actuating cylinder set up in on the lift mounting panel, the flexible guide arm in left side with the flexible guide arm in right side is equal vertical set up in on the lift mounting panel, and be located go up and down to drive actuating cylinder's the left and right sides, the flexible guide arm in left side with the upper end of the flexible guide arm in right side all is fixed in the bottom of loading board.

Preferably, the transverse driving assembly comprises a transverse sliding unit, a first transverse pushing cylinder and a transverse pushing rack, the first transverse pushing cylinder is longitudinally arranged on the right side of the bearing plate, the output end of the first transverse pushing cylinder is connected with the transverse pushing rack through a connecting rod, the transverse sliding unit is longitudinally arranged in the middle of the bearing plate, the transverse pushing rack is longitudinally arranged on a sliding block of the transverse sliding unit, and the transverse sliding unit is a transverse sliding rail and a sliding block arranged on the transverse sliding rail.

Preferably, rotatory centre gripping subassembly includes rotation axis, gear, rotatory mounting panel and finger cylinder, the rotation axis is fixed in the left side of loading board, the gear sleeve is located on the rotation axis, the stiff end cover of rotatory mounting panel is located the upper end of gear, the lower part outside of gear with horizontal propelling movement rack toothing is connected, the finger cylinder set up in the work end of optional equipment mounting panel.

Preferably, move material mechanism including set up in the left side of transfer table moves the material subassembly with set up in the right side on transfer table right side moves the material subassembly, the intermediate position of transfer table transversely is provided with one and blocks the piece, blocks that the piece will be divided into front side slide and back side slide with the transfer table, the left side moves the material subassembly and includes that left side propelling movement unit and left side move the material unit, the left side move the material unit vertically set up in the left side upper portion of transfer table, left side propelling movement unit transversely set up in the bottom rear side of transfer table, just the work end of left side propelling movement unit upwards passes the transfer table.

Preferably, the left material moving unit comprises a left material moving pushing cylinder, a guide rod mounting seat, a material moving guide rod and a material moving block, the guide rod mounting seat is arranged at the upper part of the left side of the transfer platform, the left material moving and pushing cylinder is longitudinally arranged at the left side of the guide rod mounting seat in a penetrating way, the material moving guide rod longitudinally penetrates through the right side of the guide rod mounting seat, the output end of the left material moving pushing cylinder and the working end of the material moving guide rod are both fixed on the inner side of the material moving block, the joint of the material moving guide rod and the guide rod mounting seat is connected through a guide sleeve, the left pushing unit consists of a left pushing cylinder and a pushing block, the left side propelling movement cylinder transversely set up in the bottom rear side of transfer table, the propelling movement piece set up in the output of left side propelling movement cylinder, just the propelling movement piece upwards extends to in the rear side slide of transfer table.

Preferably, the right side is moved the material subassembly and is done the horizontal reflection mirror image that the left side was moved the material subassembly, the right side is moved the material subassembly be used for with place in intelligent chip in the transfer table front side slide is transferred to left to be located after will processing the intelligent chip of the transfer table rear side slide right-hand member portion continues the propelling movement extremely the left end portion of transfer table front side slide waits for unloading mechanism to carry out the unloading action, the left side is moved the material subassembly and is used for will being located the left intelligent chip propelling movement of front side slide to the rear side slide left side to with intelligent chip from a left side to the right side of transferring to the rear side slide, when intelligent chip transfers to grinding machanism under, grinding machanism polishes the action.

Preferably, the polishing mechanism comprises an electric hydraulic cylinder, a polishing buffer component, a buffer guide seat, a polishing head, a polishing guide rod and a buffer connecting block, the electric hydraulic cylinder is vertically fixed at the top of the polishing bracket, the buffer guide seat is arranged at the middle position of the polishing bracket, the polishing guide rod is fixed at the output end of the electric hydraulic cylinder, and extends to one end of the buffering guide seat after penetrating through the polishing bracket downwards, one end of the buffering connecting block is fixed at the middle position of the polishing guide rod, the top end of the polishing buffer component is fixed on the top of the polishing bracket, the lower part of the polishing buffer component penetrates through the other end of the buffer connecting block, the polishing head is fixed at the lower end part of the polishing buffer assembly, and the middle part of the polishing buffer assembly is fixed at the other end of the buffer connecting block.

Preferably, the sanding buffer assembly is a living hinge connection.

Compared with the prior art, the beneficial effects are that: according to the automatic feeding and discharging mechanism, automatic feeding and discharging actions of products are completed through the feeding and discharging mechanism, the products are sequentially conveyed to the polishing mechanism through the material moving mechanism to complete polishing work and are transferred to the automatic feeding and discharging mechanism, the polishing force is uniform, the polishing precision is high, the production of polishing defective products is effectively reduced, the processing efficiency is high, manpower is saved, benefits are improved, and the market application value is good.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

FIG. 2 is a schematic structural view of a loading and unloading mechanism according to the present invention;

FIG. 3 is a schematic structural view of a material moving mechanism according to the present invention;

FIG. 4 is a schematic structural view of the left side material moving assembly of the present invention;

reference numerals: a work table 1; a feeding and discharging mechanism 2; a transfer table 3; a material moving mechanism 4; a polishing mechanism 5; polishing the bracket 6; a lift drive assembly 21; a transverse drive assembly 22; a carrier plate 23; a rotating clamp assembly 24; a lifting driving cylinder 211; a lifting mounting plate 212; a left telescopic guide 213; a right telescopic guide 214; a lateral sliding unit 221; a first lateral thrust cylinder 222; a lateral pushing rack 223; a rotating shaft 241; a gear 242; a rotary mounting plate 243; a finger cylinder 244; a stopper 31; a left-side pushing unit 41; a left material moving unit 42; a right transfer assembly 43; a left-side pushing cylinder 411; a push block 412; a left material moving and pushing cylinder 421; a guide rod mount 422; a transfer guide 423; a material removal block 424; an electric hydraulic cylinder 51; a sanding buffer assembly 52; a buffer guide seat 53; a sanding head 54; polishing the guide rod 55; buffer connection block 56.

Detailed Description

The technical features mentioned above are combined with each other to form various embodiments which are not listed above, and all of them are regarded as the scope of the present invention described in the specification; also, modifications and variations may be suggested to those skilled in the art in light of the above teachings, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

The present invention will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 4, a first embodiment of the present invention: a full-automatic polishing device for industrial intelligent chips comprises a workbench 1, and a feeding and discharging mechanism 2, a transfer table 3, a material moving mechanism 4, a polishing mechanism 5 and a polishing support 6 which are arranged on the workbench 1, wherein the transfer table 3 is transversely arranged in the middle of the workbench 1 through four support legs, the material moving mechanism 4 is arranged on the left side and the right side of the transfer table 3, the feeding and discharging mechanism 2 is arranged on the right side of the workbench 1 and is adjacent to the right side of the transfer table 3, the polishing support 6 is arranged on the rear side of the transfer table 3, the polishing mechanism 5 is vertically arranged on the polishing mechanism 5, the feeding and discharging mechanism 2 is used for transferring intelligent chips to be polished onto the transfer table 3 and then discharging the polished intelligent chips, the material moving mechanism 4 is used for circularly transferring the intelligent chips on the transfer table 3, the polishing support 6 is used for installing the polishing mechanism 5, and the polishing mechanism 5 is used for polishing the intelligent chip on the transfer table 3.

Preferably, the loading and unloading mechanism 2 includes a lifting driving assembly 21, a horizontal driving assembly 22, a bearing plate 23 and a rotary clamping assembly 24, the lifting driving assembly 21 is disposed on the workbench 1, the bearing plate 23 is disposed on the top of the lifting driving assembly 21, the horizontal driving assembly 22 is disposed on the right side of the upper portion of the bearing plate 23, the rotary clamping assembly 24 is disposed on the left side of the upper portion of the bearing plate 23, the lifting driving assembly 21 is configured to drive the bearing plate 23 to move up and down, the horizontal driving assembly 22 is configured to drive the rotary clamping assembly 24 to rotate 90 degrees or 180 degrees, and the rotary clamping assembly 24 is configured to clamp a product.

Preferably, lift drive assembly 21 drives actuating cylinder 211, lift mounting panel 212, the flexible guide arm 213 in left side and the flexible guide arm 214 in right side including going up and down, lift mounting panel 212 set up in on the workstation 1, go up and down to drive actuating cylinder 211 set up in on the lift mounting panel 212, the flexible guide arm 213 in left side with the flexible guide arm 214 in right side all vertically set up in on the lift mounting panel 212, and be located go up and down to drive actuating cylinder 211's the left and right sides, the flexible guide arm 213 in left side with the upper end of the flexible guide arm 214 in right side all is fixed in the bottom of loading board 23 plays through lift drive assembly 21 and carries the product of treating processing to the transfer platform 3 by the low when last unloading on, then carries to the material storage bench by transfer platform 3 when the product rethread lift drive assembly 21 that finishes processing.

Preferably, the transverse driving assembly 22 includes a transverse sliding unit 221, a first transverse pushing cylinder 222, and a transverse pushing rack 223, the first transverse pushing cylinder 222 is longitudinally disposed on the right side of the bearing plate 23, an output end of the first transverse pushing cylinder 222 is connected to the transverse pushing rack 223 through a connecting rod, the transverse sliding unit 221 is longitudinally disposed in the middle of the bearing plate 23, the transverse pushing rack 223 is longitudinally disposed on a sliding block of the transverse sliding unit 221, and the transverse sliding unit 221 is a transverse sliding rail and a sliding block disposed on the transverse sliding rail.

Preferably, the rotating clamping assembly 24 includes a rotating shaft 241, a gear 242, a rotating mounting plate 243 and a finger cylinder 244, the rotating shaft 241 is fixed to the left side of the bearing plate 23, the gear 242 is sleeved on the rotating shaft 241, the fixed end of the rotating mounting plate 243 is sleeved on the upper end of the gear 242, the outer side of the lower portion of the gear 242 is engaged with the transverse pushing rack 223, and the finger cylinder 244 is arranged at the working end of the optional mounting plate.

Preferably, move material mechanism 4 including set up in the left side of transfer table 3 moves the material subassembly with set up in the right side on transfer table 3 right side moves material subassembly 43, the intermediate position of transfer table 3 transversely is provided with one and blocks piece 31, blocks that piece 31 will be divided into front side slide and back side slide with the well platform, the left side is moved the material subassembly and is included left side propelling movement unit 41 and left side and is moved material unit 42, the left side move material unit 42 vertically set up in the left side upper portion of transfer table 3, left side propelling movement unit 41 transversely set up in the bottom rear side of transfer table 3, just the work end of left side propelling movement unit 41 upwards passes transfer table 3.

Preferably, the left material moving unit 42 includes a left material moving pushing cylinder 421, a guide rod mounting seat 422, a material moving guide rod 423 and a material moving block 424, the guide rod mounting seat 422 is disposed on the upper portion of the left side of the transfer table 3, the left material moving pushing cylinder 421 is longitudinally disposed on the left side of the guide rod mounting seat 422 in a penetrating manner, the material moving guide rod 423 is longitudinally disposed on the right side of the guide rod mounting seat 422 in a penetrating manner, the output end of the left material moving pushing cylinder 421 and the working end of the material moving guide rod 423 are both fixed on the inner side of the material moving block 424, the joint portion of the material moving guide rod 423 and the guide rod mounting seat 422 is connected through a guide sleeve, the left pushing unit 41 is composed of a left pushing cylinder 411 and a pushing block 412, the left pushing cylinder is transversely disposed on the rear side of the bottom of the transfer table 3, the pushing block 412 is disposed on the output end of the left pushing, and the pushing block 412 extends upward into the rear slide of the transfer table 3.

Preferably, the right side is moved material subassembly 43 and is done the horizontal reflection mirror image that the material subassembly was moved in the left side, the right side is moved material subassembly 43 and is used for placing in intelligent chip in the 3 front side slides of transfer table transfers left to be located after will finishing processing the intelligent chip of 3 back side slideways right-hand member portions of transfer table continues the propelling movement extremely the left end portion of 3 front side slides of transfer table waits for unloading mechanism 2 to carry out the unloading action, the left side is moved the material subassembly and is used for will being located the left intelligent chip propelling movement of preceding side slideways to the left side of back side slideways to transfer the intelligent chip to the right side of back side slideways from a left side to the right side, when intelligent chip transfers to grinding machanism 5 under, grinding machanism 5 polishes the action.

Preferably, the polishing mechanism 5 comprises an electric hydraulic cylinder 51, a polishing buffer assembly 52, a buffer guide seat 53, a polishing head 54, a polishing guide rod 55 and a buffer connecting block 56, the electric hydraulic cylinder 51 is vertically fixed on the top of the polishing bracket 6, the buffer guide seat 53 is arranged in the middle position of the polishing bracket 6, the polishing guide rod 55 is fixed on the output end of the electric hydraulic cylinder 51 and extends to one end of the buffer guide seat 53 after passing through the polishing bracket 6 downwards, one end of the buffer connecting block 56 is fixed on the middle position of the polishing guide rod 55, the top end of the polishing buffer assembly 52 is fixed on the top of the polishing bracket 6, the lower part of the polishing buffer assembly 52 passes through the other end of the buffer connecting block 56, the polishing head 54 is fixed on the lower end of the polishing buffer assembly 52, and the middle part of the polishing buffer assembly 52 is fixed on the other end of the buffer connecting block 56, when the electric hydraulic cylinder 51 works to drive the grinding guide rod 55 to move downwards, and then the buffer connecting block 56 moves along with the grinding guide rod, as the buffer connecting block 56 is fixed at the middle part of the grinding buffer assembly 52, the pressing action of the grinding head 54 is realized through the buffer connecting block 56.

Preferably, the polishing buffer component 52 is a movable hinge connection, due to the movable connection characteristic of the movable hinge connection, a buffer effect can be achieved when the polishing head 54 is pressed down, and through the buffer effect, impact deformation of the polishing head 54 on the intelligent chip in the pressing down process can be effectively avoided, so that the polishing inner diameter is uniform.

The working principle of the invention is as follows: the lifting driving component 21 is located at an initial position, the rotary clamping component 24 is located at the lowest position, the rotary clamping component 24 clamps a product to be processed placed on the material storage table, the lifting driving component 21 works to lift the rotary clamping component 24 to the horizontal position of the transfer table 3, the transverse driving component 22 works to move the clamping end of the rotary clamping component 24 to the right side of the transfer table 3 and place the product to be processed in a front side slideway of the transfer table 3, the right side material moving component 43 works to push the product on the right side of the front side slideway of the transfer table 3 to the left side, when the product is pushed to the left side of the front side slideway, the left side pushing unit 41 works to push the product to be processed to the left side of the right side slideway, then the left side material moving unit 42 works to transfer the product to be processed from the left side to the right side, when the product is transferred to the position right below the polishing mechanism 5, the electric hydraulic cylinder 51 drives the polishing guide rod 55 to move downwards, and then drive buffering connecting block 56 and make the buffering subassembly 52 of polishing move down, with the product of polishing head 54 along buffering guide seat 53 downstream to the back side on the slide, accomplish the action of polishing of treating the product of processing, the left side moves material unit 42 and makes the product that has processed move to the right side of right side slide when moving the material this moment, then the right side moves material subassembly 43 work and pushes the product propelling movement that finishes to the right side of front side slide, rotatory centre gripping subassembly 24 carries out the centre gripping with the product that finishes, lift drive subassembly 21 and transverse drive subassembly 22 cooperation are carried out unloading with the product that finishes processing to deposit the material bench, and again with the next product that treats the action more than the circulation on the revolving stage 3 of material loading.

Claims

1. A full-automatic polishing device for industrial intelligent chips is characterized by comprising a workbench, and a feeding and discharging mechanism, a transfer table, a material moving mechanism, a polishing mechanism and a polishing support which are arranged on the workbench, wherein the transfer table is transversely arranged in the middle of the workbench through four support legs, the material moving mechanism is arranged on the left side and the right side of the transfer table, the feeding and discharging mechanism is arranged on the right side of the workbench and is adjacent to the right side of the transfer table, the polishing support is arranged on the rear side of the transfer table, the polishing mechanism is vertically arranged on the polishing mechanism, the feeding and discharging mechanism is used for transferring the intelligent chips to be polished onto the transfer table and then discharging the polished intelligent chips, the material moving mechanism is used for circularly transferring the intelligent chips on the transfer table, the polishing support is used for installing the polishing mechanism, and the polishing mechanism is used for polishing the intelligent chip on the transfer table.

2. The full-automatic grinding device for the industrial intelligent chips as claimed in claim 1, wherein the feeding and discharging mechanism comprises a lifting driving assembly, a transverse driving assembly, a bearing plate and a rotary clamping assembly, the lifting driving assembly is arranged on the workbench, the bearing plate is arranged at the top of the lifting driving assembly, the transverse driving assembly is arranged on the right side of the upper portion of the bearing plate, the rotary clamping assembly is arranged on the left side of the upper portion of the bearing plate, the lifting driving assembly is used for driving the bearing plate to move up and down, the transverse driving assembly is used for driving the rotary clamping assembly to rotate 90 degrees or 180 degrees, and the rotary clamping assembly is used for clamping a product.

3. The full-automatic grinding device for the industrial intelligent chip as claimed in claim 2, wherein the lifting driving assembly comprises a lifting driving cylinder, a lifting mounting plate, a left telescopic guide rod and a right telescopic guide rod, the lifting mounting plate is arranged on the workbench, the lifting driving cylinder is arranged on the lifting mounting plate, the left telescopic guide rod and the right telescopic guide rod are vertically arranged on the lifting mounting plate and are located on the left side and the right side of the lifting driving cylinder, and the upper end portions of the left telescopic guide rod and the right telescopic guide rod are fixed at the bottom of the bearing plate.

4. The full-automatic grinding equipment for the industrial intelligent chip as claimed in claim 2, wherein the transverse driving assembly comprises a transverse sliding unit, a first transverse pushing cylinder and a transverse pushing rack, the first transverse pushing cylinder is longitudinally arranged on the right side of the bearing plate, the output end of the first transverse pushing cylinder is connected with the transverse pushing rack through a connecting rod, the transverse sliding unit is longitudinally arranged in the middle of the bearing plate, the transverse pushing rack is longitudinally arranged on a sliding block of the transverse sliding unit, and the transverse sliding unit is a transverse sliding rail and a sliding block arranged on the transverse sliding rail.

5. The full-automatic grinding device for the industrial intelligent chip is characterized in that the rotary clamping assembly comprises a rotary shaft, a gear, a rotary mounting plate and a finger cylinder, the rotary shaft is fixed on the left side of the bearing plate, the gear is sleeved on the rotary shaft, the fixed end of the rotary mounting plate is sleeved on the upper end of the gear, the outer side of the lower portion of the gear is meshed with the transverse pushing rack and is connected with the transverse pushing rack, and the finger cylinder is arranged at the working end of the optional mounting plate.

6. The full-automatic equipment of polishing that is used for industry intelligent chip of claim 1, characterized in that, move the material mechanism including set up in the left side of transfer platform move the material subassembly with set up in the right side of transfer platform right side moves the material subassembly, the intermediate position of transfer platform transversely is provided with a stopper, blocks that the piece will be divided into front side slide and back side slide with the well platform, the left side moves the material subassembly and includes left side propelling movement unit and left side and moves the material unit, the left side move the material unit vertically set up in the left side upper portion of transfer platform, the left side propelling movement unit transversely set up in the bottom rear side of transfer platform, just the working end of left side propelling movement unit upwards passes the transfer platform.

7. The full-automatic grinding device for the industrial intelligent chip according to claim 6, wherein the left material moving unit comprises a left material moving pushing cylinder, a guide rod mounting seat, a material moving guide rod and a material moving block, the guide rod mounting seat is arranged on the upper portion of the left side of the transfer platform, the left material moving pushing cylinder is longitudinally arranged on the left side of the guide rod mounting seat in a penetrating manner, the material moving guide rod is longitudinally arranged on the right side of the guide rod mounting seat in a penetrating manner, the output end of the left material moving pushing cylinder and the working end of the material moving guide rod are fixed on the inner side of the material moving block, the material moving guide rod is connected with the joint portion of the guide rod mounting seat through a guide sleeve, the left pushing unit is composed of a left material moving pushing cylinder and a pushing block, the left material moving cylinder is transversely arranged on the rear side of the bottom of the transfer platform, the pushing block is arranged on the output end of the left material moving, and the pushing block extends upwards into a rear side slideway of the transfer table.

8. The full-automatic equipment of polishing for industry intelligent chip of claim 7, characterized in that, the right side is moved the material subassembly and is the horizontal reflection mirror image that the left side moved the material subassembly, the right side is moved the material subassembly and is used for placing in the intelligent chip in the transfer table front side slide is transferred to the left to be located after will finishing processing the intelligent chip of transfer table rear side slide right-hand member portion continues the propelling movement to the left end portion of transfer table front side slide waits for unloading action of last unloading mechanism, the left side is moved the material subassembly and is used for will being located the left intelligent chip propelling movement of front side slide to the left side of rear side slide to with intelligent chip from a left side to the right side to rear side slide, when intelligent chip transfers to grinding machanism under, grinding machanism polishes and polishes the action.

9. The full-automatic grinding device for the industrial intelligent chip according to claim 1, wherein the grinding mechanism comprises an electric hydraulic cylinder, a grinding buffer component, a buffer guide seat, a grinding head, a grinding guide rod and a buffer connecting block, the electric hydraulic cylinder is vertically fixed on the top of the grinding support, the buffer guide seat is arranged at the middle position of the grinding support, the grinding guide rod is fixed on the output end of the electric hydraulic cylinder and extends to one end of the buffer guide seat after penetrating downwards the grinding support, one end of the buffer connecting block is fixed at the middle position of the grinding guide rod, the top end of the grinding buffer component is fixed at the top of the grinding support, the lower part of the grinding buffer component penetrates through the other end of the buffer connecting block, and the grinding head is fixed at the lower end part of the grinding buffer component, the middle part of the polishing buffer component is fixed at the other end of the buffer connecting block.

10. The fully automatic grinding apparatus for industrial intelligent chips of claim 9 wherein said grinding cushioning assembly is a living hinge connection.