CN112718437B - Piezoelectric micromechanical ultrasonic transducer based on multi-diaphragm coupling - Google Patents

Piezoelectric micromechanical ultrasonic transducer based on multi-diaphragm coupling Download PDF

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CN112718437B
CN112718437B CN202011485094.8A CN202011485094A CN112718437B CN 112718437 B CN112718437 B CN 112718437B CN 202011485094 A CN202011485094 A CN 202011485094A CN 112718437 B CN112718437 B CN 112718437B
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piezoelectric
diaphragm
ultrasonic transducer
transducer
piston
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CN112718437A (en
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孙成亮
王磊
吴志鹏
朱伟
胡博豪
林炳辉
占惠花
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Wuhan Memsonics Technologies Co Ltd
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Wuhan University WHU
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface

Abstract

The invention discloses a piezoelectric micro-mechanical ultrasonic transducer based on multi-diaphragm coupling. The MEMS piezoelectric micromechanical ultrasonic transducer comprises a diaphragm and a piston diaphragm which are deposited on a substrate. The piston diaphragm can replace a piezoelectric diaphragm of an MEMS piezoelectric micro-mechanical ultrasonic transducer, and a vibration mode is converted into a piston mode from a traditional Gaussian mode. When the piston type air-jet engine works in the piston mode, the energy converter can push more air, and the output power is improved. The piston diaphragm can change the rigidity and the mass of the transducer, so that the frequency can be adjusted. In addition, by introducing the piston diaphragm, the transducer can work under multiple modes simultaneously, and the bandwidth of the transducer is greatly improved through the mutual radiation effect between the piston diaphragm and the piezoelectric diaphragm of the MEMS piezoelectric micro-mechanical ultrasonic transducer.

Description

Piezoelectric micromechanical ultrasonic transducer based on multi-diaphragm coupling
Technical Field
The invention belongs to the technical field of meter sensors, and particularly relates to a piezoelectric micro-mechanical ultrasonic transducer based on multi-diaphragm coupling.
Background
A piezoelectric acoustic transducer is a transducing element that can be used to both transmit and receive acoustic waves. When the transducer works in a transmitting mode, electric energy is converted into vibration of the transducer through electrostatic force or inverse piezoelectric effect so as to radiate sound waves outwards; when the transducer works in a receiving mode, sound pressure acts on the surface of the transducer to enable the transducer to vibrate, and the transducer converts the vibration into an electric signal. At present, the most widely used acoustic wave sensor is mainly based on a piezoelectric transducer, the piezoelectric transducer mainly utilizes the thickness vibration mode of piezoelectric ceramics to generate acoustic waves, and because the resonant frequency of the thickness mode is only related to the thickness of the transducer, acoustic transducers with different resonant frequencies are difficult to manufacture on the same plane. When the high-frequency-resistant high-frequency-resistance high-frequency-resistant medium. The sound transducer (MEMS sound transducer) manufactured by the micromachining technology vibrates in a bending mode, has a vibration film with lower rigidity and lower acoustic impedance, and can be better coupled with gas and liquid. And the resonant frequency is controlled by the in-plane dimension, so that the requirement on the machining precision is low. With the gradual maturity of MEMS acoustic transducer technology, the technology of acoustic sensors tends to turn to MEMS acoustic transducers due to its advantages of high performance, low cost, and easy realization of mass production. MEMS acoustic transducers are mainly of the ultrasonic transducer, microphone, hydrophone type, etc. The ultrasonic transducer mainly comprises two capacitance type (cMUT) and piezoelectric type (pMUT), the sensitivity of the pMUT is slightly lower than that of the cMUT, but the cMUT needs to provide bias voltage and a tiny air gap is arranged between capacitance polar plates, adhesion is easily formed, and the pMUT has the advantages of simple structure and high transduction efficiency of transduction materials, but the manufacture is more complex.
At present, the improvement of the acoustic transducer mainly aims at the shape, the material thickness and the like of an electrode of the acoustic transducer, but the improvement of the energy conversion efficiency of the acoustic transducer is limited, so that the acoustic transducer is low in sensitivity and small in transmission sound pressure, and the application of the acoustic transducer is limited to a great extent. The material of the membrane of a conventional acoustic transducer is continuous and uniform, and the shape of the membrane is parabolic when vibrated, which results in less air being pushed through the center portion where the displacement is greatest. At this time, if the parabola of the central region where the acoustic transducer vibrates can be changed to a horizontal line, the air pushed by the central portion where the displacement of the acoustic transducer is the largest is greatly increased, thereby increasing the sound waves generated by the acoustic transducer, and this vibration mode is called piston-like vibration mode. When receiving sound waves, the sound transducer with piston-like vibration mode generates larger displacement compared with the common sound transducer, thereby generating larger receiving signals and improving the sensitivity of the sound transducer in receiving.
Disclosure of Invention
In order to solve the problems, the invention provides a piezoelectric micromechanical ultrasonic transducer based on multi-diaphragm coupling.
In order to achieve the above purpose, the piezoelectric micro-mechanical ultrasonic transducer based on multi-diaphragm coupling provided by the invention is a two-dimensional high-performance ultrahigh frequency resonator, comprising an MEMS piezoelectric micro-mechanical ultrasonic transducer and a piston diaphragm; the piston diaphragm is arranged on the MEMS piezoelectric micro-mechanical ultrasonic transducer and is in contact connection with the surface of the MEMS piezoelectric micro-mechanical ultrasonic transducer; the piston diaphragm is arranged on the upper surface of the MEMS piezoelectric micro-mechanical ultrasonic transducer; the MEMS piezoelectric transducer is a piezoelectric micro-mechanical ultrasonic transducer and adopts a sandwich structure or a bimorph structure; the piezoelectric acoustic transducer with the sandwich structure comprises a first substrate, a first bottom electrode, a first piezoelectric layer, a first top electrode, a first insulating layer, a first electrode and a second electrode, wherein the first bottom electrode, the first piezoelectric layer, the first top electrode, the first insulating layer and the first electrode and the second electrode are sequentially deposited on the first substrate; the piezoelectric acoustic transducer with the bimorph structure comprises a second substrate, a second bottom electrode, a second piezoelectric layer, a middle electrode, a third piezoelectric layer, a second top electrode, a second insulating layer, a third electrode and a fourth electrode, wherein the second bottom electrode, the second piezoelectric layer, the middle electrode, the third piezoelectric layer, the second top electrode, the second insulating layer, the third electrode and the fourth electrode are sequentially deposited on the second substrate, and a piston diaphragm is arranged on the upper surface of the second insulating layer.
Preferably, in the two-dimensional high-performance ultrahigh frequency resonator, the material, size, number, shape and arrangement position of the piston diaphragm are determined according to the resonance frequency of the MEMS piezoelectric micro-mechanical ultrasonic transducer.
Further, in the above-mentioned two-dimensional high performance uhf resonator, the shape of the piezoelectric micromachined ultrasonic transducer is circular, or square, or rectangular, or hexagonal, or polygonal.
The design idea of the scheme of the invention is as follows:
according to the invention, the piston diaphragm is coupled to the MEMS piezoelectric acoustic transducer, the vibration amplitude of the piston diaphragm tends to be consistent, the piston diaphragm is embodied as a vibration mode of the piston, and more air can be pushed to generate higher sound pressure in the same time; in addition, when sound waves are received, under the same sound pressure, due to the fact that the mass of the vibrating diaphragm is increased, under the same sound pressure, larger strain can be generated, and due to the fact that the piezoelectric effect is known, more polarization charges can be generated on the surface of the piezoelectric material under the condition, so that the output voltage is improved, the sensitivity of the piezoelectric acoustic transducer is further improved, and due to the large bandwidth effect of multi-mode coupling, the receiving range of the transducer can be improved. In addition, by introducing the piston diaphragm, the transducer can work under multiple modes simultaneously, and the bandwidth of the transducer is greatly improved through the mutual radiation effect between the piston diaphragm and the piezoelectric diaphragm of the MEMS piezoelectric micro-mechanical ultrasonic transducer.
Frequency modulation: the vibration of the acoustic transducer film can be equivalent to that of a concentrated mass M at the center of the circlee1In an equivalent concentration spring KeVibrating under the action of the vibration, so that the natural frequency of an equivalent system is obtained as follows:
Figure BDA0002838842710000021
the piston diaphragm is arranged to be equivalent to the center of the film and is additionally provided with a concentrated mass Me2Vibrates with the membrane, so that the equivalent total mass is Me1+Me2Then, the natural frequency of the new system can be obtained by using the natural frequency relationship of the equivalent system as follows:
Figure BDA0002838842710000031
from the above formula, it can be seen that the addition of the piston diaphragm lowers the natural frequency of the system, thereby achieving frequency modulation of the MEMS piezoelectric acoustic transducer.
Multi-modal effects: the two-degree-of-freedom model can generate two modes in air, and the vibration equation is as follows:
Figure BDA0002838842710000032
wherein
Figure BDA0002838842710000033
Figure BDA0002838842710000034
Figure BDA0002838842710000035
Figure BDA0002838842710000036
Figure BDA0002838842710000037
So that the displacement of the piston diaphragm and the circular diaphragm is:
Figure BDA0002838842710000038
Figure BDA0002838842710000039
the frequencies corresponding to both are:
Figure BDA00028388427100000310
furthermore, due to the air coupling between the piston diaphragm and the circular diaphragm, a mutual impedance effect is generated, forming a third resonance peak.
Large bandwidth effect: through the coupling effect among different modes, the energy distribution in the frequency band is more uniform, and the bandwidth far exceeding that of the traditional transducer is obtained.
The invention has the following advantages and beneficial effects:
1. the frequency modulation effect can be realized, and the piston diaphragm is coupled on the traditional diaphragm, so that the rigidity and the mass of the traditional diaphragm are changed, and the frequency is adjusted;
2. the transducer can work under multiple modes, and the multi-diaphragm coupling structure can enable the transducer to generate two resonance modes. In addition, the mutual radiation impedance effect of the piston diaphragm and the traditional diaphragm causes the transducer to generate a third resonance peak;
3. the obtained output power and receiving sensitivity are higher, the vibration amplitude of the piston diaphragm tends to be consistent, the vibration mode is embodied as the vibration mode of the piston, and more air can be pushed to generate higher sound pressure in the same time; in addition, when receiving sound waves, under the same sound pressure, the mass of the diaphragm is increased, and under the same sound pressure, larger strain can be generated, and the piezoelectric effect can show that more polarization charges can be generated on the surface of the piezoelectric material under the condition, so that the output voltage is improved;
4. a larger bandwidth is obtained, and the energy distribution in the frequency band is more uniform through the coupling effect among different modes, so that the bandwidth far exceeding that of the traditional transducer is obtained.
Drawings
Figure 1 is a cross-sectional view of an embodiment of the present invention in which a piezoelectric micromachined ultrasonic transducer with a sandwich conventional structure is added with a piston diaphragm on the upper surface,
wherein:
Figure BDA0002838842710000041
figure 2 is a cross-sectional view of an embodiment of the present invention in which a piezoelectric micromachined ultrasonic transducer of a conventional bimorph structure is provided with a piston diaphragm on the upper surface,
wherein:
Figure BDA0002838842710000042
FIG. 3 is a graph of impedance and phase curves of a coupled piston diaphragm piezoelectric micromachined ultrasonic transducer of the present invention, showing three modes;
FIG. 4 is a sectional view of three modes of vibration of the coupled piston diaphragm piezoelectric micromachined ultrasonic transducer of the present invention;
FIG. 5 is a graph comparing the transmitting power of a coupled piston diaphragm piezoelectric micromachined ultrasonic transducer of the present invention with that of a conventional piezoelectric transducer;
FIG. 6 is a graph comparing the membrane displacement curves of the coupled piston diaphragm piezoelectric micromachined ultrasonic transducer of the present invention and a conventional piezoelectric transducer;
fig. 7 is a graph comparing the bandwidth of a coupled piston diaphragm piezoelectric micromachined ultrasonic transducer of the present invention with a conventional piezoelectric transducer.
In the figure: 1.1-a first substrate, 1.2-a first bottom electrode, 1.3-a first piezoelectric layer, 1.4-a first top electrode, 1.5-a first insulating layer, 6-a piston diaphragm, 7-a support column, 8-a top diaphragm and 1.7-a sandwich structure traditional piezoelectric micro-mechanical ultrasonic transducer; 2.1-second substrate, 2.2-second bottom electrode, 2.3-second piezoelectric layer, 2.4-second top electrode, 2.5-second insulating layer, 2.7-traditional piezoelectric micromechanical ultrasonic transducer with bimorph structure, 2.8-middle electrode.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention. It is to be understood that the embodiments described herein are merely illustrative and explanatory of the invention and are not restrictive thereof.
Example 1
As shown in fig. 1, the present invention is based on a multi-diaphragm coupled piezoelectric micromechanical ultrasonic transducer, which includes a conventional MEMS piezoelectric transducer 1.7 with a sandwich structure and a piston diaphragm 6. The piston diaphragm 6 includes a support post 7 and a top diaphragm 8. The piston diaphragm 6 is arranged on the traditional sandwich structure MEMS piezoelectric acoustic transducer 1.7 and is in contact connection with the upper surface of the traditional sandwich structure MEMS piezoelectric acoustic transducer 1.7. The MEMS piezoelectric acoustic transducer 1.7 with the conventional sandwich structure comprises a first substrate 1.1, a first bottom electrode 1.2, a first piezoelectric layer 1.3, a first top electrode 1.4 and a first insulating layer 1.5. The piston diaphragm 6 changes the rigidity and the mass of the traditional sandwich structure MEMS piezoelectric acoustic transducer 1.7 diaphragm, thereby realizing the adjustment of the resonant frequency.
Example 2
As shown in fig. 2, the present invention is based on a multi-diaphragm coupled piezoelectric micromachined ultrasonic transducer, which includes a conventional bimorph MEMS piezoelectric transducer 2.7 and a piston diaphragm 6. The piston diaphragm 6 includes a support post 7 and a top diaphragm 8. The piston diaphragm 6 is arranged on the traditional bimorph structure MEMS piezoelectric acoustic transducer 2.7 and is in contact connection with the upper surface of the traditional bimorph structure MEMS piezoelectric acoustic transducer 2.7. The conventional bimorph MEMS piezoelectric acoustic transducer 2.7 comprises a second substrate 2.1, a second bottom electrode 2.2, a second piezoelectric layer 2.3, a second top electrode 2.4, a middle electrode 2.8 and a second insulating layer 2.5.
Due to the action of the piston diaphragm, the transducer can push more air per unit time, as shown in fig. 4, providing higher output power, as shown in fig. 5. In addition, the transducer operates in multiple modes, as shown in fig. 3, including two natural modes in an equivalent two-degree-of-freedom model and a third mode generated by coupling a piston diaphragm with a conventional diaphragm.
The device combines the MEMS piezoelectric acoustic transducer with the piston diaphragm, when the transducer emits ultrasonic waves, the piston diaphragm excites the piston mode, so that more air can be pushed in the same time to generate higher sound pressure, and the electro-acoustic energy conversion efficiency of the transducer is improved; when the transducer receives sound pressure, the mass of the diaphragm is increased, and larger strain can be generated under the same sound pressure.
By coupling effects between the different modes, the energy distribution within the frequency band is made more uniform, resulting in a bandwidth that far exceeds that of conventional transducers, as shown in fig. 7.
The device combines the MEMS piezoelectric acoustic transducer with the piston diaphragm, the material of the piston diaphragm has various optional schemes, and the number, the size and the arrangement position of the piston diaphragm can be selected according to the actual situation, so that the resonant frequency of the MEMS piezoelectric acoustic transducer can be adjusted.
In addition, the MEMS piezoelectric micromechanical ultrasonic transducer can adopt a traditional sandwich structure or a bimorph structure. Of course, the shape of the MEMS piezoelectric micromachined ultrasonic transducer can also be in various forms, such as a circle, square, rectangle, hexagon or other polygon.
It should be understood that parts of the specification not set forth in detail are well within the prior art.
Although specific embodiments of the present invention have been described above with reference to the accompanying drawings, it will be appreciated by those skilled in the art that these are merely illustrative of distances and that many variations or modifications may be made to these embodiments without departing from the principles and spirit of the invention. The scope of the invention is only limited by the appended claims.

Claims (2)

1. A piezoelectric micromechanical ultrasonic transducer based on multi-diaphragm coupling is characterized in that: the MEMS piezoelectric micro-mechanical ultrasonic transducer comprises an MEMS piezoelectric micro-mechanical ultrasonic transducer and a piston diaphragm (6); the piston diaphragm (6) is arranged on the MEMS piezoelectric micromechanical ultrasonic transducer and is in contact connection with the upper surface of the MEMS piezoelectric micromechanical ultrasonic transducer;
the piston diaphragm (6) comprises a supporting column (7) and a top diaphragm (8);
the MEMS piezoelectric micromechanical ultrasonic transducer adopts a sandwich structure or a bimorph structure:
the piezoelectric acoustic transducer with the sandwich structure comprises a first substrate (1.1) with a piston diaphragm (6), a first bottom electrode (1.2), a first piezoelectric layer (1.3), a first top electrode (1.4), a first insulating layer (1.5), a first electrode and a second electrode, wherein the first bottom electrode (1.2), the first piezoelectric layer (1.3), the first top electrode (1.4) and the first electrode and the second electrode are sequentially deposited on the first substrate (1.1), and the piston diaphragm (6) is arranged on the upper surface of the first insulating layer;
the piezoelectric acoustic transducer with the bimorph structure comprises a second substrate (2.1) with a piston diaphragm (6), a second bottom electrode (2.2), a second piezoelectric layer (2.3), a middle electrode (2.8), a third piezoelectric layer, a second top electrode (2.4), a second insulating layer (2.5) and a third electrode and a fourth electrode which are led out from the second top electrode (2.4) and sequentially deposited on the second substrate (2.1), wherein the piston diaphragm (6) is arranged on the upper surface of the second insulating layer (2.5);
the material, size, number, shape and arrangement position of the piston diaphragm (6) are determined according to the resonance frequency of the MEMS piezoelectric micro-mechanical ultrasonic transducer.
2. The multi-diaphragm coupling based piezoelectric micromachined ultrasonic transducer of claim 1, wherein: the shape of the MEMS piezoelectric micromechanical ultrasonic transducer is any one of a circle, a square, a rectangle, a hexagon or a polygon.
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Publication number Priority date Publication date Assignee Title
CN112871613A (en) * 2020-12-19 2021-06-01 复旦大学 Piezoelectric micromachined ultrasonic transducer with support posts
CN113746373B (en) * 2021-08-30 2023-11-10 东南大学 MEMS piezoelectric acoustics and vibration energy collector based on radial hollowed-out vibrating diaphragm
CN114007175B (en) * 2021-10-19 2022-08-23 上海交通大学 Ultrasonic transducer array and method of forming the same

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CN110523607A (en) * 2019-07-31 2019-12-03 西安交通大学 A kind of piezoelectricity transmitting capacitance sense high-performance MUT unit and preparation method thereof
CN110944274A (en) * 2019-11-20 2020-03-31 武汉大学 Tunable MEMS piezoelectric transducer with mass load based on Pitton-mode
CN111314829A (en) * 2019-11-22 2020-06-19 武汉大学 MEMS piezoelectric ultrasonic transducer with sound tube

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CN101573861A (en) * 2005-05-18 2009-11-04 科隆科技公司 Micro-electro-mechanical transducers
CN1939605A (en) * 2005-09-30 2007-04-04 中国科学院声学研究所 Piston energy exchanger
CN101898743A (en) * 2009-05-27 2010-12-01 漆斌 Micro-machined ultrasonic transducer
CN101712028A (en) * 2009-11-13 2010-05-26 中国科学院声学研究所 Thin-film ultrasonic transducer and preparation method thereof
CN102075161A (en) * 2011-01-20 2011-05-25 张�浩 Acoustic wave device and manufacturing method thereof
CN105307975A (en) * 2013-03-15 2016-02-03 蝴蝶网络有限公司 Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
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CN110944274A (en) * 2019-11-20 2020-03-31 武汉大学 Tunable MEMS piezoelectric transducer with mass load based on Pitton-mode
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