CN108311361A - Micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape - Google Patents
Micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape Download PDFInfo
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- CN108311361A CN108311361A CN201810253797.4A CN201810253797A CN108311361A CN 108311361 A CN108311361 A CN 108311361A CN 201810253797 A CN201810253797 A CN 201810253797A CN 108311361 A CN108311361 A CN 108311361A
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- supersonic wave
- wave transducer
- micro electronmechanical
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- 239000000758 substrate Substances 0.000 claims abstract description 25
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 229910017083 AlN Inorganic materials 0.000 claims description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 239000002210 silicon-based material Substances 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 claims description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 2
- 229920005591 polysilicon Polymers 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 12
- 230000005540 biological transmission Effects 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 230000005684 electric field Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses a kind of micro electronmechanical piezoelectric supersonic wave transducers with the modality-specific vibration shape.Energy converter is equipped with substrate, structure sheaf, hearth electrode, piezoelectric layer, top electrode.Energy converter operation principle is to utilize forward and inverse piezoelectric effect realization mechanical energy to electric energy or electric energy to the conversion of mechanical energy.For the present invention by realizing that certain vibration structure reaches the modality-specific vibration shape on structure sheaf, which has the acoustic pressure in transmission of bigger and higher space efficiency utilization.
Description
Technical field
The invention belongs to the field of transducer in MEMS (MEMS) technical field, more particularly to a kind of specific mould
The high efficiency piezoelectric supersonic wave transducer of the state vibration shape.
Background technology
Piezoelectric supersonic wave transducer be it is a kind of can not only convert electrical energy into mechanical energy, but also mechanical energy can be converted to electricity
The device for integrating transmitting-receiving ultrasonic wave of energy.Traditional ultrasonic transducer by the way of mechanical processing, volume is big,
Power consumption is high, it is integrated to be unfavorable for, and since its acoustic impedance and traditional sound transmission medium (empty gas and water) mismatch, sound emission effect
Rate is relatively low.The microelectromechanical ultrasound wave transducer processed in conjunction with the micro manufacturing technique that micro electro mechanical system (MEMS) technology uses is then effective
Overcome disadvantages mentioned above.Microelectromechanical ultrasound wave transducer can be broadly divided into micro electronmechanical capacitive ultrasonic by its operation principle and change
It can device and micro electronmechanical piezoelectric-type ultrasonic wave transducer：The sensitivity of capacitive ultrasonic transducer and bandwidth are super compared with piezoelectric type
Acoustic wave transducer has some superiority, but it needs very high DC offset voltage and extremely narrow capacitance gap to realize, the same to time limit
It is also very limited [1] in the acoustic pressure of limited amplitude, transmitting；It is micro electronmechanical with the modality-specific vibration shape designed by the present invention
Piezoelectric supersonic wave transducer can effectively improve acoustic pressure in transmission and space efficiency utilization, daily application scenario such as：Fingerprint
Identify that [2], distance detection [3] and energy acquisition [4] etc. have the advantage of bigger.
Citation：
[1]Jung J,Kim S,Lee W and Choi H 2013 Fabrication of a two-
dimensional piezoelectric micromachined ultrasonic transducer array using a
top-crossover-to-bottom structure and metal bridge connections,
J.Micromechanics Microengineering 23 125037.
[2]Przybyla R J,Tang H Y,Shelton S E,Horsley D A and Boser B E 2014
12.1 3D ultrasonic gesture recognition Dig.Tech.Pap.-IEEE Int.Solid-State
Circuits Conf.57 210–1.
[3]Przybyla R J,Tang H,Member S,Guedes A,Shelton S E,Horsley D A and
Boser B E 2015 3D Ultrasonic Range finder on a Chip IEEE J.Solid-State
Circuits 50 320–34
[4]He Q,Liu J,Yang B,Wang X,Chen X and Yang C 2014 MEMS-based
ultrasonic transducer as the receiver for wireless power supply of the
implantable microdevices Sensors Actuators,A Phys.219 65–72
Invention content
It is an object of the invention to solve the problem of the not high low space utilization of acoustic pressure existing in the prior art, and carry
For a kind of micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape.
The technical solution adopted by the present invention to solve the technical problems is：
Micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape comprising substrate, hearth electrode, piezoelectric layer and on
Electrode, backside of substrate middle section open up slotted cavities, and substrate front surface is made to form resilient structural layer, the base on slotted cavities periphery
Fixing end of the bottom as resilient structural layer；The slotted cavities by 4 identical tangent formation of cylindrical cavity unit, and
The cylindrical substrate being clamped between four cylindrical cavity units also while being emptied；Elastic construction above each cavity unit
The front of layer stacks gradually hearth electrode, piezoelectric layer and top electrode, and four vibration film units are collectively formed with resilient structural layer；
Wherein hearth electrode continuously covers the front of substrate, piezoelectric layer and top electrode is rounded and the center of circle and the cavity unit are same
Axis；The piezoelectric layer area is more than top electrode area.
The energy converter overall effect is that four identical energy converter junior units are tangent, and top electrode is arranged in each small list
The centre of member.When energy converter is as transmitting terminal, shaken using inverse piezoelectric effect driving by applying alternating voltage in upper, hearth electrode
Film does flat out-of-plane vibration, to generate ultrasonic wave；It, will be in external ultrasonic exciting using direct piezoelectric effect when as receiving terminal
Diaphragm oscillations are converted into electric signal output caused by lower.
Preferably, the thickness of the vibration film unit is 5~20 μm, cavity unit radius is 25 μm~1mm.
Preferably, the thickness of the substrate is 100 μm~1mm.
Preferably, the polar radius that powers on is 0.55R~0.7R, R is the radius of cavity unit.
Preferably, the vibration film unit and cylindrical cavity unit is concentric.
Preferably, the substrate and resilient structural layer are Semiconducting Silicon Materials, including monocrystalline silicon or polysilicon.
Preferably, the slotted cavities in backside of substrate selective etch by forming.
Preferably, the piezoelectric material in the piezoelectric layer is aluminium nitride, zinc oxide or lead titanate piezoelectric ceramics.
Preferably, the hearth electrode is boron doped silicon or metal material gold, platinum, aluminium or tin.
Preferably, described powers on extremely metal material gold, platinum, aluminium or tin.
The energy converter operation principle of the present invention is to realize mechanical energy to electric energy or electric energy to mechanical using forward and inverse piezoelectric effect
The conversion of energy.By connecting 4 small transducer units on structure sheaf, reaches the modality-specific vibration shape and improve acoustic pressure in transmission.Together
When, which is equivalent to 4 small transducer units and is connected, and eliminates the bearing area between unit, is changed to improve
The area utilization of energy device.
Description of the drawings
Present invention will be further explained below with reference to the attached drawings and examples
Fig. 1 is the structural schematic diagram of the micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape in the present invention；
Fig. 2 is the partial 3 d diagrammatic cross-section of Fig. 1；
Fig. 3 is Figure 1A-A diagrammatic cross-sections；
Fig. 4 be emulate the micro electronmechanical piezoelectric supersonic wave transducer as transmitting terminal when Mode Shape figure；
In figure：Top electrode 1, piezoelectric layer 2, hearth electrode 3, substrate 4, resilient structural layer 41, vibration film unit 00, cavity
Unit 01.
Specific implementation mode
The present invention is further elaborated and is illustrated with reference to the accompanying drawings and detailed description.Each implementation in the present invention
The technical characteristic of mode can carry out the corresponding combination under the premise of not conflicting with each other.
As shown in Figures 1 to 3, the micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape, including substrate 4, bottom electricity
Pole 3, piezoelectric layer 2 and top electrode 1,4 back side middle section of substrate open up slotted cavities, and the front of substrate 4 is made to form resilient structural layer
41.The slotted cavities are by 4 same sizes, the tangent formation two-by-two of cylindrical cavity unit 01 of height, the center of four cylinders
Line is located on four angle points of square, and clamping forms a section and is between four cylindrical cavity units 01
The cylindrical base 4 of arc side diamond shape, the cylinder are also required to be emptied simultaneously, therefore resilient structural layer 41 is practical petal in four leaves
Shape.Fixing end of the substrate 4 on slotted cavities periphery as resilient structural layer 41.The elastic construction of 01 top of each cavity unit
The front of layer 41 stacks gradually hearth electrode 3, piezoelectric layer 2 and top electrode 1, and it is thin to collectively form four vibrations with resilient structural layer 41
Film unit 00, each vibration film unit 00 are rounded.The wherein front of the continuous covering substrate 4 of hearth electrode 3, piezoelectric layer 2 and upper
The rounded sheet of electrode 1, and the center of circle of the two and cavity unit 01 are coaxial.Energy converter overall effect is four identical
Energy converter junior unit is tangent.Top electrode 1 is arranged in the centre of each junior unit.2 area of piezoelectric layer is slightly larger than top electrode 1
Area.When energy converter is as transmitting terminal, vibrating diaphragm is driven to do using inverse piezoelectric effect by applying alternating voltage in upper, hearth electrode
Flat out-of-plane vibration, to generate ultrasonic wave；When as receiving terminal, it will be drawn under external ultrasonic exciting using direct piezoelectric effect
The diaphragm oscillations risen are converted into electric signal output.
In addition, in the present embodiment, the structural parameters of each component are as follows：1 material of top electrode is aluminium electrode, and thickness is 1 μm；Pressure
2 material of electric layer is aluminium nitride, and thickness is 0.5 μm.Piezoelectric layer 2 and the radius of top electrode 1 are respectively 0.65R and 0.6R, and R is to shake
The radius (i.e. the radius of cavity unit 01) of dynamic film unit 00, takes 300 μm.Vibration film unit 00 and cylindrical cavity unit
01 is coaxial.3 material of hearth electrode is boron doped silicon, and thickness is 1 μm.4 material of substrate is semiconductor silicon, and thickness is 400 μm, is led to
It crosses and discharges vibration film unit 00, the thickness of the resilient structural layer 41 formed after etching from back selective etch part silicon
It is 5 μm.The profile for etching the cavity formed is the tangent outer profile of 4 cylindrical cavities, and interior three-dimensional structure is as shown in Figure 2.
The resilient structural layer 41 formed after etching generates resonance under excitation of 4 nonsymmetrical piezo layers by voltage, reaches particular job mould
State, as shown in Figure 4.
As shown in figure 3, should micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape as transmitting terminal, by
Top electrode 1 and hearth electrode 3 apply the alternating voltage of certain frequency to piezoelectric layer 2, according to inverse piezoelectric effect, will produce and electric field
Hang down the stress of perpendicular and parallel both direction in direction, due to the d of aluminium nitride material in this example31Piezoelectric constant is more notable,
Therefore mainly consider the effect of the stress vertical with direction of an electric field.The direction of stress changes with the direction of an electric field of alternating voltage
And constantly change, under the driving of alternate stress, 4 vibration film units 00 are forced to do motion outside plane, about due to its edge
Beam is 3/4 circumferential confinement, is easy to reach Fig. 4 vibration shapes by external drive, the synthesis vibration shape is roughly equivalent to 4 individually
00 vibration shape of vibration film unit is connected.It is opposite that its dark colored portion with bright colored portion represents direction of vibration.
A kind of micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape proposed by the invention, by using specific
Mode Shape can be effectively integrated four small transducer units, so that bottom cavity is connected, it is made to be operated in the modality-specific vibration shape
On, the interval between transducer unit is eliminated, energy converter fixed constraint is reduced, to reach the effect for improving acoustic pressure in transmission
Fruit.To sum up, the micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape is with big bandwidth, highly sensitive advantage.
Claims (10)
1. a kind of micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape, it is characterised in that：Including substrate (4), bottom
Electrode (3), piezoelectric layer (2) and top electrode (1), substrate (4) back side middle section open up slotted cavities, make the positive shape of substrate (4)
At resilient structural layer (41), the fixing end of the substrate (4) on slotted cavities periphery as resilient structural layer (41)；The flute profile is empty
Chamber is by 4 tangent formation of identical cylindrical cavity unit (01), and the column being clamped between four cylindrical cavity units (01)
The substrate (4) of shape is also emptied simultaneously；The front of resilient structural layer (41) above each cavity unit (01) stacks gradually bottom electricity
Pole (3), piezoelectric layer (2) and top electrode (1) collectively form four vibration film units (00) with resilient structural layer (41)；Wherein
Hearth electrode (3) continuously covers the front of substrate (4), piezoelectric layer (2) and top electrode (1) is rounded and the center of circle and the cavity
Unit (01) is coaxial；Piezoelectric layer (2) area is more than top electrode (1) area.
2. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
The thickness of the vibration film unit (00) is 5~20 μm, and cavity unit (01) radius is 25 μm~1mm.
3. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
The thickness of the substrate (4) is 100 μm~1mm.
4. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
Described top electrode (1) radius is 0.55R~0.7R, and R is the radius of cavity unit (01).
5. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
The vibration film unit (00) and cylindrical cavity unit (01) is concentric.
6. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
The substrate (4) and resilient structural layer (41) is Semiconducting Silicon Materials, including monocrystalline silicon or polysilicon.
7. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
The slotted cavities in substrate (4) back side selective etch by forming.
8. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
Piezoelectric material in the piezoelectric layer (2) is aluminium nitride, zinc oxide or lead titanate piezoelectric ceramics.
9. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, it is characterised in that：
The hearth electrode (3) is boron doped silicon or metal material gold, platinum, aluminium or tin.
10. the micro electronmechanical piezoelectric supersonic wave transducer according to claim 1 with the modality-specific vibration shape, feature exist
In：The top electrode (1) is metal material gold, platinum, aluminium or tin.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810253797.4A CN108311361B (en) | 2018-03-26 | 2018-03-26 | Micro-electromechanical piezoelectric ultrasonic transducer with specific mode vibration mode |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810253797.4A CN108311361B (en) | 2018-03-26 | 2018-03-26 | Micro-electromechanical piezoelectric ultrasonic transducer with specific mode vibration mode |
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| Publication Number | Publication Date |
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| CN108311361A true CN108311361A (en) | 2018-07-24 |
| CN108311361B CN108311361B (en) | 2022-12-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109270540A (en) * | 2018-11-05 | 2019-01-25 | 浙江大学 | Continuous ultrasound Wave ranging device and method based on micro electronmechanical piezoelectric ultrasonic transducer array |
| CN109798944A (en) * | 2018-12-25 | 2019-05-24 | 浙江大学 | Flowmeter and transition time measuring device based on micromechanics piezoelectric supersonic wave transducer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1060798A1 (en) * | 1999-06-18 | 2000-12-20 | Prokic Miodrag | Unidirectional single piston ultrasonic transducer |
| CN101352710A (en) * | 2007-07-25 | 2009-01-28 | 中国科学院声学研究所 | Thin film piezoelectric ultrasonic transducer |
| CN102172575A (en) * | 2011-03-11 | 2011-09-07 | 深圳大学 | Piezoelectric micro machining energy transducer |
| CN104860258A (en) * | 2013-09-19 | 2015-08-26 | 因文森斯公司 | Aluminum Nitride (ain) Devices With Infrared Absorption Structural Layer |
| DE102014111661A1 (en) * | 2014-08-14 | 2016-02-18 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Vibration element with decoupled component |
| CN208116117U (en) * | 2018-03-26 | 2018-11-20 | 浙江大学 | A kind of micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape |
-
2018
- 2018-03-26 CN CN201810253797.4A patent/CN108311361B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1060798A1 (en) * | 1999-06-18 | 2000-12-20 | Prokic Miodrag | Unidirectional single piston ultrasonic transducer |
| CN101352710A (en) * | 2007-07-25 | 2009-01-28 | 中国科学院声学研究所 | Thin film piezoelectric ultrasonic transducer |
| CN102172575A (en) * | 2011-03-11 | 2011-09-07 | 深圳大学 | Piezoelectric micro machining energy transducer |
| CN104860258A (en) * | 2013-09-19 | 2015-08-26 | 因文森斯公司 | Aluminum Nitride (ain) Devices With Infrared Absorption Structural Layer |
| DE102014111661A1 (en) * | 2014-08-14 | 2016-02-18 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Vibration element with decoupled component |
| CN208116117U (en) * | 2018-03-26 | 2018-11-20 | 浙江大学 | A kind of micro electronmechanical piezoelectric supersonic wave transducer with the modality-specific vibration shape |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109270540A (en) * | 2018-11-05 | 2019-01-25 | 浙江大学 | Continuous ultrasound Wave ranging device and method based on micro electronmechanical piezoelectric ultrasonic transducer array |
| CN109270540B (en) * | 2018-11-05 | 2023-11-28 | 浙江大学 | Continuous ultrasonic ranging device and method based on micro-electromechanical voltage ultrasonic transducer array |
| CN109798944A (en) * | 2018-12-25 | 2019-05-24 | 浙江大学 | Flowmeter and transition time measuring device based on micromechanics piezoelectric supersonic wave transducer |
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| CN108311361B (en) | 2022-12-16 |
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