CN112706046A

CN112706046A - Silicon rod grinding machine and silicon rod grinding method

Info

Publication number: CN112706046A
Application number: CN201911015504.XA
Authority: CN
Inventors: 卢建伟; 潘雪明; 苏静洪; 李鑫; 曹奇峰; 钱春军; 李彬
Original assignee: Tiantong Rijin Precision Technology Co ltd
Current assignee: Tiantong Rijin Precision Technology Co ltd
Priority date: 2019-10-24
Filing date: 2019-10-24
Publication date: 2021-04-27

Abstract

The application provides a silicon rod grinds machine and silicon rod grinding method, the corase grind device and the correct grinding device of silicon rod grinding machine set up respectively in the first processing position district and the second processing position district of silicon rod processing platform, and be provided with first transfer device and the second transfer device that runs through first processing position district and second processing position district simultaneously, and for first, the second transfer device disposes silicon rod anchor clamps and actuating mechanism respectively, through first, the second transfer device of coordinated control and corase grind device, correct grinding device, make at the same moment silicon rod grinds quick grind device and correct grinding device and all is in operating condition, promote grinding machining efficiency to the twice on the basis of keeping silicon rod to grind the size specification and the cost of machine, it consumes time to have reduced the grinding operation, has promoted economic benefits.

Description

Silicon rod grinding machine and silicon rod grinding method

Technical Field

The application relates to the technical field of silicon workpiece processing, in particular to a silicon rod grinding machine and a silicon rod grinding method.

Background

At present, with the importance and the openness of the society on the utilization of green renewable energy sources, the field of photovoltaic solar power generation is more and more valued and developed. In the field of photovoltaic power generation, conventional crystalline silicon solar cells are fabricated on high quality silicon wafers that are cut and subsequently processed by multi-wire saw from a pulled or cast silicon ingot.

In the conventional silicon wafer manufacturing process, taking a single crystal silicon product as an example, the general working procedures may include: firstly, a silicon rod cutting machine is used for cutting the original long silicon rod to form a plurality of sections of short silicon rods; after the truncation is finished, performing the operation of squaring the truncated short silicon rod by using a silicon rod squaring machine to form a single crystal silicon rod; then, processing operations such as surface grinding, chamfering and the like are carried out on each silicon rod, so that the surface of each silicon rod is shaped to meet the corresponding requirements on flatness and dimensional tolerance; and subsequently, slicing the silicon rod to obtain a silicon wafer.

Generally, in the process of grinding and chamfering silicon rods, a single silicon rod is loaded through two processes of rough grinding and fine grinding, then the silicon rod is conveyed and unloaded after the rough grinding and the fine grinding are carried out in sequence, then the other silicon rod is loaded, ground and unloaded, and in the common large-batch processing, the silicon rod grinding machine repeats the processing process, so that the grinding tool of the silicon rod grinding machine has a large amount of time in an idle state, the grinding efficiency is low, and the economic benefit of silicon rod processing is influenced.

Disclosure of Invention

In view of the above disadvantages of the related art, an object of the present invention is to provide a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method, which are used to solve the problems of low efficiency between each process operation and poor silicon rod processing operation effect in the related art.

To achieve the above and other related objects, the present application discloses a silicon rod grinding machine, including: the base is provided with a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area; the first transfer device comprises a first liftable silicon rod clamp, a first transfer guide rail arranged along a first direction and a first driving mechanism used for driving the first silicon rod clamp and a silicon rod clamped by the first silicon rod clamp to move along a first transfer path and transfer between a first processing area and a second processing area; the second transfer device comprises a second silicon rod clamp capable of lifting, a second transfer guide rail arranged along the first direction and a second driving mechanism used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along a second transfer path and transfer between the first processing position and the second processing position; wherein, when the second transfer device and the first transfer device are in a transfer working state, the silicon rod clamped by the first silicon rod clamp and the silicon rod clamped by the second silicon rod clamp are positioned at different height positions; the rough grinding device is arranged at the first processing position of the silicon rod processing platform and is used for performing rough grinding operation on the silicon rod positioned at the first processing position; and the fine grinding device is arranged at the second processing position of the silicon rod processing platform and is used for performing fine grinding operation on the silicon rod positioned at the second processing position.

In certain embodiments of the first aspect of the present application, the first transfer path comprises a first transfer segment of the elevation direction, a second transfer segment of the first direction, and a third transfer segment of the elevation direction; the second transfer path comprises a unidirectional transfer section in a first direction; and the unidirectional transfer section and the second transfer section in the first direction are located at different height positions.

In certain embodiments of the first aspect of the present application, the first transfer device and the second transfer device are mounted above the silicon rod processing platform by a mounting frame, and the first transfer device and the second transfer device are respectively mounted on two opposite sides of the mounting frame.

In certain embodiments of the first aspect of the present application, the first silicon rod clamp comprises: the clamping arm mounting seat is arranged on the first transfer guide rail; the clamping arms are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod; and the clamping arm driving mechanism is used for driving at least one clamping arm in the at least two clamping arms to move along the first direction.

In certain embodiments of the first aspect of the present application, the clamp arm is a rotary structure; the first silicon rod clamp further comprises a clamping arm rotating mechanism used for driving the clamping arm to rotate.

In certain embodiments of the first aspect of the present application, the second silicon rod clamp comprises: the clamping arm mounting seat is arranged on the second transfer guide rail; the clamping arms are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod; and the clamping arm driving mechanism is used for driving at least one clamping arm in the at least two clamping arms to move along the first direction.

In certain embodiments of the first aspect of the present application, the first silicon rod clamp arm is a rotary-type structure; the second silicon rod clamp further comprises a clamping arm rotating mechanism used for driving the clamping arm to rotate.

In certain embodiments of the first aspect of the present application, the first drive mechanism comprises: the first moving rack is arranged along a first direction; a first driving gear which is arranged on the first silicon rod clamp and meshed with the first moving rack; and a first driving power source for driving the first driving gear.

In certain embodiments of the first aspect of the present application, the second drive mechanism comprises: the second moving rack is arranged along the first direction; the second driving gear is arranged on the second silicon rod clamp and meshed with the second moving rack; and a first driving power source for driving the second driving gear.

In certain embodiments of the first aspect of the present application, the rough grinding apparatus comprises: at least one pair of rough grinding tools, which are oppositely arranged at the first processing position of the silicon rod processing platform; and the rough grinding tool advancing and retreating mechanism is used for driving at least one rough grinding tool in the at least one pair of rough grinding tools to transversely move along a second direction, wherein the second direction is perpendicular to the first direction.

In certain embodiments of the first aspect of the present application, the refining apparatus comprises: at least one pair of finish grinding tools, which are oppositely arranged at the first processing position of the silicon rod processing platform; a finish grinder advancing and retracting mechanism for driving at least one of the pair of finish grinders to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

In certain embodiments of the first aspect of the present application, the silicon rod mill further comprises: and the silicon rod transferring device is adjacently arranged at the first processing position of the silicon rod processing platform and is used for transferring the silicon rod to be processed to the first processing position of the silicon rod processing platform or transferring the processed silicon rod on the silicon rod processing platform out of the first processing position.

In certain embodiments of the first aspect of the present application, the silicon rod processing platform is further provided with a waiting location, and the silicon rod grinding machine further comprises a silicon rod transfer device adjacently disposed to the waiting location of the silicon rod processing platform, for transferring a silicon rod to be processed to the waiting location of the silicon rod processing platform or transferring a processed silicon rod in the waiting location out of the silicon rod processing platform.

The second aspect of the present application further provides a silicon rod grinding method applied to a silicon rod grinding machine, the silicon rod grinding machine includes a base having a silicon rod processing platform, the silicon rod processing platform is provided with a first processing location and a second processing location, the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device includes a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, the second transfer device includes a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism, and the silicon rod grinding method is characterized by including the following steps:

loading a first silicon rod on a first processing station, enabling a first silicon rod clamp in a first transfer device to clamp the first silicon rod, and enabling a coarse grinding device to perform coarse grinding operation on the first silicon rod positioned at a first processing position;

enabling a first driving mechanism in a first transfer device to drive a first silicon rod clamp and a first silicon rod clamped by the first silicon rod clamp to move along a first transfer path and enabling a second driving mechanism in a second transfer device to drive a second silicon rod clamp to move along a second transfer path, wherein the first transfer path and the second transfer path are on the same straight line parallel to the first direction but staggered up and down and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod clamped by the first silicon rod clamp are transferred from a first processing position to a second processing position and the second silicon rod clamp is transferred from the second processing position to the first processing position;

enabling the fine grinding device to carry out fine grinding operation on the first silicon rod located at the second machining position; at this stage, a second silicon rod is loaded in the first processing station, a second silicon rod clamp in the second transfer device clamps the second silicon rod, and the coarse grinding device performs coarse grinding operation on the second silicon rod positioned at the first processing position;

enabling a first driving mechanism in a first transfer device to drive a first silicon rod clamp and a first silicon rod clamped by the first silicon rod clamp to move along a first transfer path and enabling a second driving mechanism in a second transfer device to drive a second silicon rod clamp and a second silicon rod clamped by the second silicon rod clamp to move along a second transfer path, wherein the first transfer path and the second transfer path are on the same straight line parallel to the first direction but staggered up and down and not on the same horizontal plane, so that the first silicon rod clamp and the first silicon rod clamped by the first silicon rod clamp are transferred from a second processing region to a first processing region and the second silicon rod clamp and the second silicon rod clamped by the second silicon rod clamp are transferred from the first processing region to a second processing region;

unloading the first silicon rod from the first processing position, loading a third silicon rod, enabling a first silicon rod clamp in the first transfer device to clamp the third silicon rod, and enabling the coarse grinding device to perform coarse grinding operation on the third silicon rod positioned at the first processing position; at this stage, the second silicon rod located at the second processing location is subjected to a fine grinding operation by the fine grinding device.

The third aspect of the present application further provides a silicon rod grinding method applied to a silicon rod grinding machine, the silicon rod grinding machine includes a base having a silicon rod processing platform, the silicon rod processing platform is provided with a waiting zone, a first processing zone and a second processing zone, the silicon rod grinding machine further includes a first transfer device, a second transfer device, a rough grinding device and a fine grinding device, wherein the first transfer device includes a first silicon rod clamp, a first transfer guide rail and a first driving mechanism, and the second transfer device includes a second silicon rod clamp, a second transfer guide rail and a second driving mechanism, and the silicon rod grinding method includes the following steps:

loading a first silicon rod in a waiting position, enabling a first silicon rod clamp in a first transfer device to clamp the first silicon rod, enabling a first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod clamped by the first silicon rod clamp to move along a first transfer guide rail so as to be transferred from the waiting position to a first processing position, and enabling a coarse grinding device to perform coarse grinding operation on the first silicon rod positioned at the first processing position;

enabling the fine grinding device to carry out fine grinding operation on the first silicon rod located at the second machining position; at this stage, a second silicon rod is loaded in the waiting location, the second silicon rod clamp in the second transfer device clamps the second silicon rod, the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail so as to be transferred from the waiting location to the first processing location, and the rough grinding device performs rough grinding operation on the second silicon rod located at the first processing location;

unloading the first silicon rod from the waiting position and loading a third silicon rod, enabling the first silicon rod clamp in the first transfer device to clamp the third silicon rod, enabling a first driving mechanism in the first transfer device to drive the first silicon rod clamp and the third silicon rod clamped by the first silicon rod clamp to move along a first transfer guide rail so as to be transferred from the waiting position to a first processing position, and enabling the rough grinding device to carry out rough grinding operation on the third silicon rod positioned at the first processing position; at this stage, the second silicon rod located at the second processing location is subjected to a fine grinding operation by the fine grinding device.

As described above, the silicon rod grinding machine and the silicon rod grinding method according to the present application have the following advantageous effects: the silicon rod grinding machine has the advantages that the rough grinding device and the fine grinding device of the silicon rod grinding machine are respectively arranged at the first processing position and the second processing position of the silicon rod processing platform, the first transfer device and the second transfer device which simultaneously penetrate through the first processing position and the second processing position are arranged, the silicon rod clamps and the driving mechanism are respectively arranged for the first transfer device and the second transfer device, the positions of the first silicon rod clamp and the second silicon rod clamp on the first transfer device and the second transfer device are coordinately controlled, the transfer path during transfer is realized, the rough grinding device and the fine grinding device of the silicon rod grinding machine are both in a working state at the same moment, the grinding efficiency is doubled on the basis of keeping the size specification and the cost of the silicon rod grinding machine, the time consumption of grinding operation is reduced, and the economic benefit is improved.

Drawings

Fig. 1 is a schematic perspective view of a silicon rod grinding machine according to an embodiment of the present invention.

Fig. 2 is a simplified schematic diagram of the silicon rod grinding machine according to an embodiment of the present application.

Fig. 3 is a schematic view showing the configuration of a first silicon rod clamp in the silicon rod grinding machine according to the present application in one embodiment.

Fig. 4 is an enlarged schematic view of a structure shown at a in fig. 2.

Fig. 5 is a schematic view showing the structure of a second silicon rod clamp in the silicon rod grinding machine according to the present application in one embodiment.

Fig. 6 is a simplified schematic diagram of the silicon rod grinding machine according to an embodiment of the present application.

Fig. 7 is a simplified schematic diagram of a transfer path for transferring a silicon rod in one embodiment of the silicon rod grinding machine of the present application.

Fig. 8 is a simplified schematic diagram of a transfer path for transferring a silicon rod in one embodiment of the silicon rod grinding machine of the present application.

Fig. 9 is a simplified schematic diagram of the silicon rod grinding machine according to the present application in one embodiment.

Fig. 10 is a simplified structural diagram of the silicon rod grinding machine according to the present application in one embodiment.

Fig. 11 is a schematic view showing the operation of the silicon rod polishing method according to an embodiment of the present invention.

Fig. 12 is a schematic view showing the operation of the silicon rod polishing method according to an embodiment of the present disclosure.

Fig. 13 is a schematic view showing the operation of the silicon rod polishing method according to an embodiment of the present disclosure.

Detailed Description

The following description of the embodiments of the present application is provided for illustrative purposes, and other advantages and capabilities of the present application will become apparent to those skilled in the art from the present disclosure.

In the following description, reference is made to the accompanying drawings that describe several embodiments of the application. It is to be understood that other embodiments may be utilized and that mechanical, structural, electrical, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description is not to be taken in a limiting sense, and the scope of embodiments of the present application is defined only by the claims of the issued patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Spatially relative terms, such as "upper," "lower," "left," "right," "lower," "below," "lower," "above," "over," "upper," and the like, may be used herein to facilitate describing one element or feature's relationship to another element or feature as illustrated in the figures.

Although the terms first, second, etc. may be used herein to describe various elements or parameters in some instances, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another element or parameter. For example, a first direction may be referred to as a second direction, and similarly, a second direction may be referred to as a first direction, without departing from the scope of the various described embodiments.

Also, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used in this specification, specify the presence of stated features, steps, operations, elements, components, items, species, and/or groups, but do not preclude the presence, or addition of one or more other features, steps, operations, elements, components, species, and/or groups thereof. The terms "or" and/or "as used herein are to be construed as inclusive or meaning any one or any combination. Thus, "A, B or C" or "A, B and/or C" means "any of the following: a; b; c; a and B; a and C; b and C; A. b and C ". An exception to this definition will occur only when a combination of elements, functions, steps or operations are inherently mutually exclusive in some way.

In the related art for processing a silicon rod, several steps such as cutting, grinding, chamfering, and the like are involved.

In the processing of silicon materials, silicon wafers put into industrial production are generally obtained through a plurality of processes, and there are involved a plurality of processes such as cutting, grinding, and chamfering. The original silicon material is usually a long silicon rod and is in a cylindrical structure, and the long silicon rod is cut by a silicon rod cutting machine to obtain a plurality of sections of short silicon rods; cutting the cut silicon rod sections by a silicon rod cutting machine to form a single crystal silicon rod, wherein the cross section of the obtained single crystal silicon rod is similar to a rectangle (including a similar square); the surface damage of the obtained silicon single crystal rod needs to be removed, chamfering is carried out on the edge angle to eliminate the internal stress, then, the surface grinding and chamfering are carried out on the silicon single crystal rod, so that the surface shaping of the silicon single crystal rod can meet the requirements of corresponding flatness and dimensional tolerance, and the final slicing can be carried out subsequently.

In the process of grinding the silicon single crystal rod, coarse grinding and then fine grinding are needed, grinding is realized by a corresponding coarse grinding tool and a corresponding fine grinding tool respectively, a single silicon single crystal rod is subjected to coarse grinding in a traditional working mode and then transferred to a fine grinding working area for fine grinding, the processed silicon rod is conveyed out of the working area after the fine grinding is completed, the process is repeatedly operated in a large amount of grinding work, the grinding sequence of the fine grinding and the coarse grinding ensures that the silicon rod grinding machine inevitably has the grinding tool in a waiting state in the operation, for example, the fine grinding tool is in the waiting state when the coarse grinding tool is subjected to coarse grinding, the coarse grinding tool is in the waiting state when the fine grinding tool is subjected to fine grinding, and the time consumption of the grinding.

In the embodiments provided herein, a three-dimensional space defined by a first direction, a second direction, and a third direction is defined for defining the direction and the operation mode between different structures, and the first direction, the second direction, and the third direction are all linear directions and are perpendicular to each other two by two. The direction in which the length of the silicon rod mill extends, i.e., the length direction when the single crystal silicon rod to be milled is placed thereon, is defined as a first direction, i.e., the front-rear direction, the direction in which the width of the silicon rod mill extends, i.e., the left-right direction, is defined as a second direction, and the vertical direction, i.e., the up-down or up-and-down direction, is defined as a third direction.

Fig. 1 is a schematic structural view of a silicon rod grinding machine according to an embodiment of the present invention. As shown in fig. 1, the silicon rod grinding machine includes a base 1, a first transfer device 2, a second transfer device 3, a rough grinding device 4, and a finish grinding device 5.

The silicon rod grinding machine is used for grinding single crystal silicon rods, wherein the single crystal silicon rods are obtained by cutting original silicon rods through silicon rods and then cutting the silicon rods through a silicon rod cutting device. The starting silicon rod is typically a rod-shaped single crystal silicon grown from a melt by the czochralski method or the suspension float zone method.

The base 1 is provided with a silicon rod processing platform 11, and the silicon rod processing platform 11 is provided with a first processing area and a second processing area. The silicon rod processing platform 11 is disposed on the upper surface of the base 1, in an implementation manner of this embodiment, the processing platform is designed to be rectangular in shape following the shape of the base 1, and a first processing location and a second processing location thereof correspond to a rough grinding processing area and a finish grinding processing area during grinding, respectively, as shown in fig. 1, the first processing location and the second processing location are disposed at the front and rear ends of the silicon rod processing platform 11 in a collinear manner, and can process the corresponding supported single crystal silicon rods on the first processing location and the second processing location independently.

The supporting structure of the mounting frame 12 is disposed on the upper surface of the machine base 1, in the illustrated embodiment, the upper surface of the machine base 1 is rectangular, the supporting structure of the mounting frame 12 is on the outer edge of the rectangle, and the shape and size of the upper surface of the mounting frame 12 are approximately the same as those of the upper surface of the machine base 1.

The mounting frame 12 is erected on the base 1 and is of a vertical frame structure, and the upper surface of the frame is higher than the silicon rod processing platform 11 and bears the first transfer device 2 and the second transfer device 3. As shown in fig. 1, the first transfer device 2 and the second transfer device 3 are respectively disposed above the first processing location and the second processing location through a mounting frame, the first transfer device 2 and the second transfer device 3 are disposed in parallel in a first direction, in a reverse or mirror-image manner in a second direction, and the projections of the loaded silicon rods on a horizontal plane are kept collinear. The first transfer device 2 and the second transfer device 3 are arranged above the second processing area of the first processing area through the mounting frame 12, and can move between the two processing areas to be interchanged to different processing areas.

Fig. 2 is a simplified schematic diagram of a silicon rod grinding machine according to an embodiment of the present invention. Referring to fig. 1 and 2 in combination, as shown in fig. 1 and 2, the first transfer device 2 includes a first silicon rod clamp 21, a first transfer guide 22 and a first driving mechanism (not shown). The first silicon rod clamp 21 is carried on the first transfer rail 22; the first transfer guide rail 22 is arranged on the upper surface of the mounting frame 12 and arranged along a first direction, and the first silicon rod clamp 21 on the first transfer guide rail is limited to move along the first direction; the first driving mechanism is used for driving the first silicon rod clamp 21 and the silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail 22, and the first silicon rod clamp 21 is transferred between the first processing position and the second processing position. The first silicon rod clamp 21 comprises a clamp arm mounting seat 211, at least two clamp arms 212 and a clamp arm driving mechanism 213.

With reference to fig. 1, the first silicon rod clamp 21 is integrally formed as a clamp arm mounting seat disposed at the upper part, the clamp arm mounting seat includes a clamp arm at an outer part thereof and is in a downward hanging state, the silicon rod clamp mounting seat is supported on the upper surface of the mounting frame 12, and the clamp arm extends downward from the hollow part of the clamp arm mounting seat in the mounting frame 12, so as to enable the silicon rod clamped by the clamp arm to be located on the processing surface of the silicon rod processing platform 11.

The clamping arm mounting seat is disposed on the first transfer guide rail 22, in an implementation manner of this embodiment, a guide groove structure matched with the first transfer guide rail 22 is disposed at the bottom of the clamping arm mounting seat, the first transfer guide rail 22 is disposed along the first direction, and a length range of the first transfer guide rail 22 in the first direction at least covers positions of the first working area and the second working area in the first direction, so as to ensure that the silicon rod clamped by the first silicon rod clamp 21 is transferred between the two working areas. In one implementation of this embodiment, the first transfer rail 22 is disposed across the full length of the mounting frame in the first direction.

Referring to fig. 3, which is a schematic structural view of the first silicon rod clamp 21 of the present application in one embodiment, as shown in fig. 3, the clamping arm mounting seat 211 further has a guide 2111 in a first direction, and the clamping arm 212 is disposed on the clamping arm mounting seat 211 through the guide 2111 and can move in the first direction.

The at least one pair of clamping arms 212 are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod. The silicon rod is a slender structure which is cut, the length direction of the silicon rod is placed along the first direction, and the end faces are sections of two ends in the length direction. The clamping arm 212 is hung down from the clamping arm mounting seat 211, and the clamping end of the clamping arm is positioned below the clamping arm 212 and used for directly contacting and clamping the silicon rod.

The gripper arm driving mechanism 213 may drive at least one gripper arm of the at least one pair of gripper arms 212 to move along the first direction to adjust a distance between the pair of oppositely disposed gripper arms. Two arm lock clamping ends along the relative setting of first direction are close to in opposite directions and press from both sides tight silicon rod to keep the tight state of clamp and transfer and grind the silicon rod between different workspace, keep away from each other after the grinding is finished transporting the silicon rod to the load-bearing position with release post-processing silicon rod.

In certain implementations of this embodiment, the clamp arm driving mechanism 213 may be configured as a travel motor that drives the clamp arm 212 to move along the guide rails of the clamp arm mounting seat 211.

In one embodiment of the present application, the clamp arm drive mechanism includes a drive motor, a drive gear, and a pair of racks. The driving motor drives the gears to rotate, the pair of racks are meshed with two opposite sides of the circumference of the gear of the driving gear, namely a connecting line of two meshing positions, corresponding to the two racks, meshed with the driving gear passes through the rotating center of the driving gear. When the driving gear rotates, each rack moves under the driving of the gear, the moving direction of each rack is the rotating direction of the driving gear at the corresponding meshing position, and as the two racks are respectively meshed with two opposite sides on the circumference of the driving gear, the linear speeds have the same size under the driving of the driving gear, but the moving directions are opposite. In an implementation manner of this embodiment, each rack of the pair of racks is a long and thin structure, and the teeth meshed with the driving gear are arranged in the length direction, one end of each rack of the pair of racks is meshed with the driving gear, and the other end of each rack is connected with a clamping arm.

In an embodiment of the present application, the clamping arms are of a rotary type structure, as shown in fig. 3, the first silicon rod clamp further comprises a clamping arm rotating mechanism 214 for driving the clamping arms to rotate. In an implementation manner of this embodiment, a rotatable structure is disposed at any one of the clamping ends of the pair of clamping arms 212, and the clamping end of the clamping arm is driven by the clamping arm rotating mechanism 214 to rotate around the longitudinal direction of the silicon rod, i.e. the first direction, as an axis, so that the clamped silicon rod correspondingly rotates around the first direction as an axis. In the actual grinding, the grinding face that the silicon rod needs to go on and the edge of chamfer at juncture between four faces and four faces of length direction, by the arm lock that this application provided, can realize the selection and the control to the different grinding faces of silicon rod and different edges.

In certain embodiments of this embodiment, the clamping ends of the at least one pair of clamping arms have contact surfaces for clamping a silicon rod. When the clamping ends of the silicon rod are at two end faces at two ends of the elongated structure, the contact surfaces of the clamping ends of the clamping arms may be contact surfaces in a vertical direction or contact surfaces including a plane in the vertical direction. The contact surface is arranged on a rotatable platform, and the platform can be arranged into a self-defined regular geometric figure or an irregular geometric figure.

In an embodiment of the present application, the rotatable platform may be provided as a whole hinged with a hinge device having a locking function, and may be rotatable along an axis in the first direction. The axis of the rotating shaft is connected with the clamping arm rotating mechanism.

In an embodiment of the application, the clamping end of the clamping arm may be configured as a rotatable circular table, and a circular plane of the circular table is in contact with the end surface of the silicon rod and is kept relatively stationary with the end surface of the silicon rod after being tightly attached to the end surface of the silicon rod. The silicon rod clamping end further comprises a locking structure, and the clamping arm clamping end is in a locking state when a selected plane is ground. In the switching of different grinding surfaces, the silicon rod clamping end is driven by the clamping arm rotating mechanism to rotate along the circle center of the circular truncated cone.

Referring to fig. 4, an enlarged view of a portion a of the silicon rod grinding machine of fig. 2 is shown. As shown in fig. 4, the clamping end of the clamping arm includes a rotatable circular table and a series of protruding contacts disposed on the circular table, each of the contacts having a contact plane. The round platform is driven by the clamping arm rotating mechanism to rotate, in an implementation mode of the embodiment, the protruding length of the contact is adjustable in the position in the first direction, so that in the process of clamping the silicon rod, the protruding length of the contact can be adjusted according to the end face of the silicon rod for enabling each contact face and the end face of the silicon rod to be in a tight state. The protruding length is a length in a first direction from a circular plane of the circular truncated cone to a contact plane of the contact.

In an embodiment of the present application, the clamping end of the first silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping a silicon rod, a pair of clamping arms of the first silicon rod clamp are driven by a clamping arm driving mechanism to approach each other along a first direction until a contact surface of the clamping end contacts with an end surface of the silicon rod to be clamped, and when the clamping end is provided with a plurality of contacts and a pressure value of partial contact with the end surface of the contacted silicon rod is detected to be smaller than a set value or a set area, the clamping degree can be changed by adjusting the protruding length of the contacts (generally towards the approaching direction of the end surface of the silicon rod); or each clamping end of the pair of clamping arms of the first silicon rod clamp is provided with a contact surface, in the process of clamping the silicon rod, the clamping arm driving mechanism drives the end surfaces of the pair of clamping arms, which face the two ends of the silicon rod, to approach each other, after the clamping ends contact with the end surfaces of the silicon rod, the pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm driving mechanism controls to stop the opposite movement of the pair of clamping arms.

The clamping arm rotating mechanism can be arranged on one of the pair of clamping arms so as to drive the clamping ends of the pair of clamping arms and the clamped silicon rod to rotate; or the clamping arm rotating mechanism is arranged on each clamping arm of the pair of clamping arms and controls the two clamping ends of the pair of clamping arms to rotate in the same angle and direction in a coordinated motion mode. In some implementations, the clamp arm rotation mechanism can be configured as a drive motor.

When the silicon rod grinding machine grinds different side surfaces of a silicon rod or chamfers edges of the silicon rod, the clamping arm rotating mechanism drives the clamping arm clamping end to rotate so as to achieve the purpose. Generally, when different sides of a silicon single crystal rod which passes through the cutting are ground, the clamping arm rotating mechanism controls the clamping arm clamping end to rotate by a certain angle, such as 90 degrees, and when different edges are chamfered, the clamping arm rotating mechanism can control the clamping arm clamping end to rotate by a certain angle, such as 45 degrees, 135 degrees and the like. Under the condition that the grinding surface that the grinding device provided is the plane, when carrying out the chamfer to the silicon rod, the steerable arm lock clamping end of arm lock slewing mechanism carries out many times chamfer rather than the rotatory different angle of the silicon rod of centre gripping and realizes, for example, to the silicon rod after accomplishing the grinding of a side, to an edge that this edge is relative with this edge of adjacent edge of this side, accessible rotation certain angle for example 40 °, 45 °, 50 the equal angle of chamfer many times, obtain the silicon rod that passes through more slick and sly at different side junctures. The angles are all rotational angles from the initial position of grinding. For the chamfering method, refer to patent publications such as CN108942570A, etc., and the grinding tool is used to grind the edge angle by driving the silicon rod to rotate a certain angle and performing the transverse feeding in the second direction.

The first silicon rod clamp may, for example, be an elevating silicon rod clamp. In one implementation manner, a lifting guide rail is disposed on the clamp arm mounting seat of the first silicon rod clamp, the clamp arm of the silicon rod clamp and the guide rail carrying the clamp arm on the clamp arm mounting seat can move in a third direction along the lifting guide rail, and can be used to control the relative position of the outer surface of the silicon rod and the grinding surface of the grinding tool in the vertical direction, so as to select a grinding area for grinding the ground surface of the silicon rod and the grinding tool. In an implementation manner of this embodiment, the lifting guide rail is disposed on an upright surface of the clamping arm mounting seat, and the clamping arm is correspondingly provided with a guide groove matched with the lifting guide rail and a driving mechanism for driving the clamping arm to perform a lifting motion; the driving mechanism comprises a traveling lead screw and a traveling motor, the traveling lead screw is arranged along the lifting guide rail and connected with the traveling motor, and the clamping arm is driven by the traveling motor to move in a third direction.

In an embodiment of the application, when the lifting device of the first silicon rod clamp controls the clamp arm to move between different working locations by the first transfer device, for example, from the first working location to the second working location or when the first transfer device moves from the second working location to the first working location, the clamp arm of the first silicon rod clamp and the silicon rod clamped by the clamp arm move along the lifting guide under the driving of the lifting motion driving mechanism, for example, the clamp arm rises to a certain height along the lifting guide, so that the overall height of the clamp arm of the first silicon rod clamp and the silicon rod clamped by the clamp arm is above the clamp arm of the second silicon rod clamp and the silicon rod clamped by the clamp arm. Then, when the first silicon rod clamp is driven by the first driving mechanism to move along the first direction and the second silicon rod clamp is driven by the second driving mechanism to move along the first direction, the clamping arms of the first silicon rod clamp and the transfer paths corresponding to the silicon rods clamped by the clamping arms of the first silicon rod clamp and the transfer paths corresponding to the clamping arms of the second silicon rod clamp and the silicon rods clamped by the clamping arms of the second silicon rod clamp are spatially represented as two parallel lines along the first direction, the two parallel lines are respectively positioned at different heights, and the projections on the horizontal plane are collinear in the top view.

With reference to fig. 1, the first driving mechanism includes a first moving rack, a first driving gear, and a first driving power source. The first moving rack is arranged in a first direction parallel to the first transfer rail 22. The first moving rack is fixed on the upper surface of the mounting frame, and the length dimension in the first direction is set to be approximately the same as that of the first transfer guide rail 22, and is parallel to and adjacent to the first transfer guide rail 22.

The first driving gear is disposed on the first silicon rod clamp 21, and is engaged with the first moving rack for driving the first silicon rod clamp 21 to move along the first transfer guide 22. The first driving power source is used for driving the first driving gear. In an implementation manner of the present application, the first driving gear is disposed on the clamping arm mounting seat of the first silicon rod clamp 21, the first driving gear is driven by a first driving power source to rotate, the gear teeth of the first driving gear are meshed with the first moving rack to conform to the first moving rack, and the first silicon rod clamp 21 connected with the first driving gear generates corresponding movement on the first transferring guide rail 22.

In one implementation manner of this embodiment, the first driving power source may be configured as a driving motor, a power output shaft of the driving motor is coupled to the first driving gear, and controls a motion state of the first driving gear, and then the first driving power source controls the first silicon rod clamp to move in a first direction with respect to the silicon rod clamped by the first silicon rod clamp.

In an embodiment of the application, the first driving mechanism may be disposed on the first silicon rod clamp, and include a traveling motor and a traveling lead screw, where the traveling lead screw is disposed along the first transfer rail and connected to the traveling motor, and the first silicon rod clamp is driven by the traveling motor to move along the first transfer rail.

With continued reference to fig. 1, the second transfer device 3 comprises a second silicon rod clamp 31, a second transfer rail 32 and a second drive mechanism. The second silicon rod clamp 31 is carried on the second transfer rail 32; the second transfer guide rail 32 is arranged on the upper surface of the mounting frame 12 and arranged along a first direction, and the second silicon rod clamp 31 on the second transfer guide rail is limited to move along the first direction; the second driving mechanism is used for driving the second silicon rod clamp 31 and the silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail 32, and the second silicon rod clamp 31 is transferred between the first processing position and the second processing position.

Referring to fig. 5, a second silicon rod clamp 31 of the silicon rod grinding machine of the present application is schematically shown in one embodiment. As shown in fig. 5, the second silicon rod clamp 31 includes a clamp arm mounting seat 311, at least two clamp arms 312, and a clamp arm driving mechanism 313.

Referring to fig. 1 and 5, the second silicon rod clamp 31 is integrally formed such that the clamping arm mounting seat 311 is disposed above, the clamping arm mounting seat 311 includes a clamping arm 312 at an outer portion thereof, and is in a downward-hanging state, the clamping arm mounting seat 311 is supported on the upper surface of the mounting frame 12, and the clamping arm 312 extends downward from the hollow portion of the clamping arm mounting seat 311 in the mounting frame 12, so as to enable the silicon rod clamped by the clamping arm 312 to be located on the processing surface of the silicon rod processing platform 11.

The clamping arm mounting seat 311 is disposed on the second transfer guide rail 32, in an implementation manner of this embodiment, a guide groove structure matched with the second transfer guide rail 32 is disposed at the bottom of the clamping arm mounting seat 311, the second transfer guide rail 32 is disposed along the first direction, and a length range of the second transfer guide rail 32 in the first direction at least covers positions of the first working area and the second working area in the first direction, so as to ensure that the silicon rod clamped by the second silicon rod clamp 31 is transferred between the two working areas. In one implementation of this embodiment, the second transfer rail 32 is disposed across the full length of the mounting frame 12 in the first direction.

Referring to fig. 1, 3 and 5, as shown in the drawings, the second transfer guide rail 32 and the first transfer guide rail 22 are disposed in parallel and symmetrically, and the clamp arm mounting seat 211 of the first silicon rod clamp 21 and the clamp arm mounting seat 311 of the second silicon rod clamp 31 respectively move on the mutually parallel paths defined by the first transfer guide rail 22 and the second transfer guide rail 32. When the first silicon rod clamp 21 and the silicon rod clamped by the first silicon rod clamp are transferred from different processing regions, the second silicon rod clamp 31 and the silicon rod clamped by the second silicon rod clamp can also be transferred from different processing regions, the movement of the clamping arm mounting seat 211 of the first silicon rod clamp 21 and the movement of the clamping arm mounting seat 311 of the second silicon rod clamp 31 are mutually independent, and the first transfer guide rail 22 and the second transfer guide rail 32 which limit the movement range of the clamping arm mounting seats on the two transfer devices are respectively arranged at different spatial positions and are not interfered with each other.

In an embodiment of the present application, the clamping arm mounting seat further has a guide rail in a first direction. Referring to fig. 5, the clamping arm 312 is disposed on the clamping arm mounting seat 311 via a horizontal guide 3111 in a first direction and can move in the first direction.

The at least one pair of clamping arms 312 are oppositely arranged along the first direction and used for clamping two end surfaces of the silicon rod. The silicon rod is a slender structure which is cut, the length direction of the silicon rod is placed along the first direction, and the end faces are sections of two ends in the length direction. The clamping arm is hung down from the clamping arm mounting seat, and the clamping end of the clamping arm is positioned below the clamping arm and used for directly contacting and clamping the silicon rod.

The clamping arm driving mechanism 313 can drive at least one clamping arm of the at least one pair of clamping arms 312 to move along the first direction so as to adjust the distance between the pair of oppositely arranged clamping arms. Two arm lock clamping ends along the relative setting of first direction are close to in opposite directions and press from both sides tight silicon rod to keep the tight state of clamp and transfer and grind the silicon rod between different workspace, keep away from each other after the grinding is finished transporting the silicon rod to the load-bearing position with release post-processing silicon rod. In certain implementations of this embodiment, the clamp arm driving mechanism 314 may be configured as a travel motor that drives the clamp arm 312 to move along the guide rail 3111 of the clamp arm mount 311.

In one embodiment of the present application, the clamp arm drive mechanism includes a drive motor, a drive gear, and a pair of racks. The driving motor drives the driving gear to rotate, the pair of racks are meshed with two opposite sides of the circumference of the gear of the driving gear, namely, a connecting line of two meshed parts, corresponding to the two racks, meshed with the driving gear passes through the rotating center of the driving gear. When the driving gear rotates, each rack moves under the driving of the gear, the moving direction of each rack is the rotating direction of the driving gear at the corresponding meshing position, and as the two racks are respectively meshed with two opposite sides on the circumference of the driving gear, the linear speeds have the same size under the driving of the driving gear, but the moving directions are opposite. In an implementation manner of this embodiment, each rack of the pair of racks is a long and thin structure, and the teeth meshed with the driving gear are arranged in the length direction, one end of each rack of the pair of racks is meshed with the driving gear, and the other end of each rack is connected with a clamping arm.

In an embodiment of the present application, the clamping arms are of a rotary type, as shown in fig. 5, the second silicon rod clamp 31 further comprises a clamping arm rotating mechanism 314 for driving the clamping arms to rotate. In an implementation manner of this embodiment, a rotatable structure is disposed at the clamping end of any one of the pair of clamping arms 312, and the clamping end of the clamping arm is driven by the clamping arm rotating mechanism 314 to rotate around the longitudinal direction of the silicon rod, i.e. the first direction, as an axis, so that the clamped silicon rod correspondingly rotates around the first direction as an axis. In the actual grinding, the grinding face that the silicon rod needs to go on and the edge of chamfer at juncture between four faces and four faces of length direction, by the arm lock that this application provided, can realize the selection and the control to the different grinding faces of silicon rod and different edges.

In some embodiments of this embodiment, the contact surface of the clamping end of the clamping arm may be a contact surface in the vertical direction or a contact surface including a plane in the vertical direction. The contact surface is arranged on a rotatable platform, and the platform can be arranged into a self-defined regular geometric figure or an irregular geometric figure.

With continued reference to fig. 4, in an embodiment of the present application, the clamping end of the clamping arm includes a rotatable circular table and a series of protruding contacts disposed on the circular table, each of the contacts having a contact plane. The round platform is driven by the clamping arm rotating mechanism to rotate, in an implementation mode of the embodiment, the protruding length of the contact is adjustable in the position in the first direction, so that in the process of clamping the silicon rod, the protruding length of the contact can be adjusted according to the end face of the silicon rod for enabling each contact face and the end face of the silicon rod to be in a tight state. The protruding length is a length in a first direction from a circular plane of the circular truncated cone to a contact plane of the contact.

In an embodiment of the present application, the clamping end of the silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping a silicon rod, a pair of clamping arms of the first silicon rod clamp are driven by a clamping arm driving mechanism to approach each other along a first direction until a contact surface of the clamping end contacts with an end surface of the silicon rod to be clamped, and when the clamping end is provided with a plurality of contacts and a pressure value of partial contact with the end surface of the contacted silicon rod is detected to be smaller than a set value or a set area, the clamping degree can be changed by adjusting the protruding length (generally, the approaching direction towards the end surface of the silicon rod) of the contacts; or each clamping end of the pair of clamping arms of the first silicon rod clamp is provided with a contact surface, in the process of clamping the silicon rod, the clamping arm driving mechanism drives the end surfaces of the pair of clamping arms, which face the two ends of the silicon rod, to approach each other, after the clamping ends contact with the end surfaces of the silicon rod, the pressure sensor detects the clamping degree of the silicon rod, and when the set pressure range is reached, the clamping arm driving mechanism controls to stop the opposite movement of the pair of clamping arms.

Referring to fig. 5, the clamping arm rotating mechanism 314 may be disposed on one of the pair of clamping arms 312 to drive the clamping end of the pair of clamping arms and the silicon rod to be clamped to rotate.

In another embodiment, the clamping arm rotating mechanism is arranged on each clamping arm of the pair of clamping arms and cooperatively controls the two clamping ends of the pair of clamping arms to rotate by the same angle and direction in a coordinated manner. In some implementations, the clamp arm rotation mechanism can be configured as a drive motor.

When the silicon rod grinding machine grinds different side surfaces of a silicon rod or chamfers edges of the silicon rod, the clamping arm rotating mechanism drives the clamping arm clamping end to rotate so as to achieve the purpose. Generally, when different sides of a silicon single crystal rod which passes through the cutting are ground, the clamping arm rotating mechanism controls the clamping arm clamping end to rotate by a certain angle, such as 90 degrees, and when different edges are chamfered, the clamping arm rotating mechanism can control the clamping arm clamping end to rotate by a certain angle, such as 45 degrees, 135 degrees and the like. Under the condition that the grinding surface that the grinding device provided is the plane, when carrying out the chamfer to the silicon rod, the steerable arm lock clamping end of arm lock slewing mechanism carries out many times chamfer rather than the rotatory different angle of the silicon rod of centre gripping and realizes, for example, accomplish the back of grinding of a side to the silicon rod, to an edge that this side is adjacent and the edge relative with this edge, accessible rotation certain angle for example 40 °, 45 °, 50 the equal angle of angle carry out many times chamfer, obtain the silicon rod that passes through more slick and sly at different side junctures. The angles are all rotational angles from the initial position of grinding. For the chamfering method, refer to patent publications such as CN108942570A, etc., and the grinding tool is used to grind the edge angle by driving the silicon rod to rotate a certain angle and performing the transverse feeding in the second direction.

In an embodiment of the present application, as shown in fig. 5, the second silicon rod clamp 31 is an elevating silicon rod clamp. In one implementation, a lifting guide 315 in a third direction is disposed on the clamping arm mounting seat 311 of the second silicon rod clamp 31, and the clamping arm 312 of the second silicon rod clamp 31 and the guide 3111 carrying the clamping arm 312 on the clamping arm mounting seat 311 are movable in the third direction along the lifting guide 315, and can be used to control the relative positions of the outer surface of the silicon rod and the grinding surface of the grinding tool in the vertical direction, so as to select a grinding area for grinding the ground surface of the silicon rod and the grinding tool. In an implementation manner of this embodiment, the lifting guide 315 is disposed on an upright surface of the clamping arm mounting seat 311, and the clamping arm 312 is correspondingly provided with a guide slot matched with the lifting guide 315 and a driving mechanism for driving the clamping arm 312 to perform a lifting motion; the driving mechanism comprises a traveling lead screw and a traveling motor, the traveling lead screw is arranged along the lifting guide rail and connected with the traveling motor, and the clamping arm is driven by the traveling motor to move in a third direction.

With reference to fig. 1, the second driving mechanism (not shown) includes a second moving rack, a second driving gear and a second driving power source. The second moving rack is arranged along the first direction and is parallel to the second transfer guide rail. The second moving rack is fixed on the upper surface of the mounting frame 12, and the length dimension of the second moving rack in the first direction is set to be approximately the same as that of the second transfer guide rail 32, and the second moving rack is parallel to and adjacent to the second transfer guide rail 32.

The second driving gear is disposed on the second silicon rod clamp 31, and is engaged with the second moving rack for driving the second silicon rod clamp 31 to move along the second transfer guide 32. The second driving power source is used for driving the second driving gear. In an implementation manner of the present application, the second driving gear is disposed on the clamping arm mounting seat of the second silicon rod clamp 31, the second driving gear is driven by a second driving power source to rotate, the gear teeth of the second driving gear are meshed with the second moving rack to conform to the second moving rack, and the second silicon rod clamp 31 connected with the second driving gear moves correspondingly on the second transfer rail 32.

In one implementation manner of this embodiment, the second driving power source may be configured as a driving motor, a power output shaft of the driving motor is coupled to the second driving gear to control a motion state of the second driving gear, and then the second driving power source controls the first silicon rod clamp to move in the first direction with respect to the silicon rod clamped by the first silicon rod clamp.

In an embodiment of the application, the second driving mechanism may be disposed on the second silicon rod clamp, and include a traveling motor and a traveling lead screw, where the traveling lead screw is disposed along the second transfer rail and connected to the traveling motor, and the second silicon rod clamp is driven by the traveling motor to move along the second transfer rail.

In practical settings, in order to reduce the size of the silicon rod grinding machine while maintaining the designed processing efficiency, the clamping arms of the first and second silicon rod clamps and the silicon rods clamped by the clamping arms are collinear on a top projection view, and the collinear direction is the first direction. The first silicon rod clamp lifting device controls the clamping arms of the first silicon rod clamp and the silicon rods clamped by the first silicon rod clamp to ascend to a certain height position, so that the clamping arms of the first silicon rod clamping arms, the silicon rods clamped by the clamping arms of the first silicon rod clamping arms, the clamping arms of the second silicon rod clamp and the silicon rods clamped by the second silicon rod clamp are in different height positions in the overlooking projection, no collision occurs between the first silicon rod clamp and the clamped silicon rods in the transferring process, and the safe transfer of the two silicon rod clamps between different processing areas is realized.

Fig. 6 is a simplified schematic diagram of a silicon rod grinding machine according to an embodiment of the present disclosure. Referring to fig. 1 and 6 in combination, as shown in fig. 1 and 6, the first transfer device 2 and the second transfer device 3 are respectively erected at the left end and the right end of the mounting frame 12, the second transfer device 3 includes a second transfer guide rail 32, and the second transfer guide rail 32 and the first transfer guide rail 31 are arranged in parallel. The first silicon rod clamp 21 and the second silicon rod clamp 31 respectively carried on the first transfer guide 22 and the second transfer guide 32 have the same structure and respectively and independently work under the control of the corresponding driving device. When the second transfer device and the first transfer device are in a transfer working state, the silicon rod clamped by the first silicon rod clamp and the silicon rod clamped by the second silicon rod clamp are located at different height positions.

The first silicon rod clamp 21 and the second silicon rod clamp 31 are asymmetric in the second direction, the first silicon rod clamp 21 and the second silicon rod clamp 31 are arranged in the second reverse direction, namely in a mirror image manner, the silicon rods clamped by the first silicon rod clamp 21 and the second silicon rod clamp 31 are on the same straight line in the space in the clamping state or when the rough grinding tool 41 and the finish grinding tool 51 are simultaneously in the grinding state, and the same straight line is a straight line along the first direction. The first and second silicon rod clamps 21 and 31 may be moved along the first and second transfer rails 22 and 32, respectively, with a degree of freedom of movement in the first direction, and are each configured with a lifting rail such that the clamped silicon rods may be moved in an alternating state in different levels through the movement exchange positions in the third and first directions.

The moving ranges of the lifting guide rail of the first silicon rod clamp 21 and the lifting guide rail of the second silicon rod clamp 31 in the third direction can meet the condition that the clamping ends of the two silicon rod clamps and the clamped silicon rods are located in different height intervals.

The first transfer path is a transfer path through which the first silicon rod clamp 21 transfers the clamped silicon rod from the first processing location to the second processing location or transfers the silicon rod from the second processing location to the first processing location in the clamped state, and the clamped silicon rod passes.

The second transfer path is a transfer path through which the second silicon rod clamp 31 transfers the clamped silicon rod from the first processing location to the second processing location in the clamped state, or transfers the silicon rod from the second processing location to the first processing location, and the clamped silicon rod passes.

Referring to fig. 7 and 8, a simplified schematic diagram of a first transfer path corresponding to a silicon rod held by the first silicon rod clamp and a simplified schematic diagram of a second transfer path corresponding to a silicon rod held by the second silicon rod clamp are shown in an embodiment. As shown in fig. 7, the first transfer path includes a first transfer segment S1 of the ascending and descending direction, i.e., the third direction, a second transfer segment S2 of the first direction, and a third transfer segment S3 of the ascending and descending direction; the second transfer path includes a unidirectional transfer section S4 of the first direction.

Specifically, when the positions of the first silicon rod clamp and the silicon rod a clamped by the first silicon rod clamp, the second silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are switched between the first processing location and the second processing location, the transfer path of the silicon rod a clamped by the first silicon rod clamp may be:

starting from the initial position shown in fig. 7, the silicon rod a held by the first silicon rod clamp and the silicon rod b held by the second silicon rod clamp are respectively located on the same horizontal plane or a horizontal plane with a similar height of the two processing positions, and the clamping arm holding end of the first silicon rod clamp and the silicon rod a held by the first silicon rod clamp move to a certain height along the lifting guide rail, i.e. a first transfer section S1 in the lifting direction is formed;

then the first silicon rod clamp and the silicon rod a clamped by the first silicon rod clamp move in a first direction along a first transfer guide rail under the driving of a first driving device, so that a second transfer section S2 in the first direction is formed, and end points at two ends of the second transfer section are respectively located at a first processing position and a second processing position;

when the silicon rod a clamped by the first silicon rod clamp is transferred to the second transfer section S2 along a first direction, the second silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are wholly driven by a second driving device to move along the first direction, so that a unidirectional transfer section S4 in the first direction is formed, the end points of the two ends of the unidirectional transfer section are respectively located at a first processing position and a second processing position, for example, when the first silicon rod clamp is transferred from the first processing position to the second processing position, the second silicon rod clamp is transferred from the second processing position to the first processing position;

after the second silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp leave the second processing position, the clamping arm clamping end of the first silicon rod clamp and the clamped silicon rod descend under the control of the lifting device, and a third transfer section S3 in the lifting direction is formed.

Referring to fig. 7 and 8 in combination, in the state shown in fig. 8, the silicon rod a held by the first silicon rod holder and the silicon rod b held by the second silicon rod holder are respectively transferred from the initial processing area to another processing area, i.e., one transfer is completed.

As shown in fig. 8, according to the processing requirements, when the first silicon rod clamp and the silicon rod a held thereby and the second silicon rod clamp and the silicon rod b held thereby need to be transferred from one processing location to another processing location again, it can be implemented in a similar manner, for example, the silicon rod a held by the first silicon rod clamp is at a first transfer section S1 which is raised to a certain height along the lifting guide rail to form a lifting direction; then the first silicon rod clamp and the silicon rod a clamped by the first silicon rod clamp integrally move along the first transfer guide rail to form a second transfer section S2 in the first direction, the direction of the second transfer section S2 is controlled by a first driving device, and the second transfer section S2 can be controlled from a first processing area to a second processing area or from the second processing area to the first processing area; at this stage, the second silicon rod clamp and the second silicon rod b clamped by the second silicon rod clamp are driven by the second driving device to move along the first direction, namely, a unidirectional transfer section S4 of the first direction is formed; then, the silicon rod a held by the first silicon rod holder descends along the elevation guide rail thereof, and forms a third transfer section S3 in the elevation direction.

After the transfer is completed, the first silicon rod clamp and the second silicon rod clamp exchange processing areas with the silicon rods clamped by the first silicon rod clamp and the second silicon rod clamp again, in the process of processing a plurality of silicon rods, the grinding devices in the first processing area and the second processing area can be simultaneously processed, a new silicon rod to be ground is installed after the processed silicon rods are unloaded, and the process of transferring the silicon rods is circulated.

The heights of the first transfer section S1 and the third transfer section S3 in the lifting direction in the first transfer path are adjusted by the lifting device of the first silicon rod clamp, and in actual operation, the lifting heights corresponding to the first transfer section S1 and the third transfer section S3 can be controlled within the lifting range allowed by the lifting guide rail according to the requirement of realizing transfer; the unidirectional transfer section S4 in the first direction in the second transfer path and the second transfer section in the first direction in the first transfer path are located at different height positions, that is, the silicon rod a clamped by the first silicon rod clamp and the silicon rod b clamped by the second silicon rod clamp are located at different height positions in the transfer process, and the two silicon rods are vertically staggered to realize safe transfer.

In another embodiment of the present application, the clamping arms of the first silicon rod clamp and the clamping arms of the second silicon rod clamp are both movable in space in a first direction and in a third direction. Namely, the second transfer path corresponding to the silicon rod held by the second silicon rod clamp also includes a transfer section in the lifting direction, and the lifting height of the second transfer path is controlled by the lifting device of the second silicon rod clamp. In the actual transfer, it should be understood that the first transfer path and the second transfer path are not the only fixed paths, and collision between the silicon rod grinding machine and the silicon rod or the like can be avoided during the transfer, and the first transfer path and the second transfer path are at different height positions in the first direction, which satisfies the safety transfer.

Fig. 9 is a simplified schematic diagram of the silicon rod grinding machine according to an embodiment. As shown in fig. 9, the first transfer device 2 or/and the second transfer device 3 is in a silicon rod transfer state. The first silicon rod clamp 21 and the second silicon rod clamp 31 are both provided with lifting guide rails, the height of the silicon rod clamped by the first silicon rod clamp 21 and the height of the silicon rod clamped by the second silicon rod clamp 31 can be adjusted within a movable range limited by the lifting guide rails, the formed first transfer path and the formed second transfer path are not unique, and in actual adjustment, the two silicon rods and the clamps thereof can be enabled not to be overlapped within the occupied height range according to the requirement of safe transfer. The silicon rod and the clamp occupy a height range from the lower surface of the clamped silicon rod or the lower surface of the clamping end of the clamping arm to the upper surface of the horizontal guide rail bearing the clamping arm.

Referring to fig. 2, the rough grinding apparatus 4 includes at least one pair of rough grinding tool 41 and rough grinding tool advancing and retreating mechanism 42.

The at least one pair of rough grinding tools 41 is disposed at the first processing location, and the pair of rough grinding tools 41 are presented to be disposed oppositely in the second direction. In certain implementations, the rough grinding tool 41 includes a grinding wheel with a certain granularity and roughness and a rotating shaft, the two grinding wheels are oppositely arranged and respectively provide two symmetrical grinding surfaces for the clamped silicon rod, and in certain implementations, the grinding wheel is circular and is provided with a through hole in the middle. The grinding wheel is formed by consolidating abrasive particles and a binding agent, and the surface with the abrasive particle part is formed to be in contact rotation with the surface of the silicon rod to be ground. The rough grinding wheel has certain abrasive particle size and abrasive particle density, and meanwhile, the grinding wheel is provided with air holes. The abrasive of the grinding wheel can be set into abrasive grains with hardness higher than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding the silicon rod.

The rough grinding tool advancing and retreating mechanism 42 is used for driving at least one rough grinding tool 41 of the at least one pair of rough grinding tools 41 to move transversely along a second direction, namely the width direction of the silicon rod grinding machine defined perpendicular to the first direction. The rough grinding tool advancing and retreating mechanism 42 controls the displacement of at least one of the pair of rough grinding tools 41 in the second direction to adjust the relative distance between the two rough grinding tools in the pair of rough grinding tools 42 in the second direction, so as to control the feeding amount during the grinding process, i.e. determine the grinding amount.

In certain implementations, a rough grinding stone advancing and retreating mechanism is provided for each pair of rough grinding stones. In the embodiment shown in fig. 2, the rough grinding tool advancing and retreating mechanism includes a slide rail 422, a driving motor 421, and a ball screw (not shown). The sliding guide rail 422 is arranged along the second direction and is arranged on the first processing area of the base, the bottom of the rough grinding tool 41 is provided with a guide groove matched with the sliding guide rail 422 along the second direction, and the ball screw is arranged along the sliding guide rail 422 and is in shaft connection with the driving motor 421.

In an embodiment of the application, one of the at least one pair of rough grinding tools is provided with the driving motor and the ball screw, and the relative distance between the rough grinding tools is changed by moving one of the pair of opposite grinding tools.

In an embodiment of the application, each grinding tool of the at least one pair of rough grinding tools is configured with the driving motor and the ball screw, and the driving motors can respectively and independently control the positions of the corresponding grinding tools in the second direction, or based on a certain cooperative relationship, the two grinding tools are far away from or close to each other at the same linear speed, for example, during the grinding process, the pair of rough grinding tools are fed towards each other at the same speed in the second direction, and the pair of rough grinding tool grinding wheels rotate at the same linear speed for grinding.

In one embodiment of the present application, a pair of rough grinding tools are driven by the same driving motor to move in the second direction at equal and opposite speeds. In one implementation manner of this embodiment, the rough grinding tool advancing and retreating mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail sets up along the second direction, locates on the first processing position of frame, the bottom of corase grind grinding apparatus be provided with the guide rail complex is along the guide slot of second direction. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear. In one implementation of this embodiment, one end of each of the pair of racks is engaged with the driving gear, and the other end of each of the pair of racks is connected to a rough grinding tool, so that the pair of rough grinding tools move away from or approach each other along the guide rail in the first direction.

In an embodiment of the application, the rough grinding device further comprises a cooling device to cool the at least one pair of rough grinding tools, so that damage to a surface layer of a silicon rod in a grinding process is reduced, and grinding efficiency and service life of the grinding wheel are improved. In one implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion trench, and a diversion hole. In some embodiments, the grinding wheel is provided with a shield around its circumference for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected with a cooling water source, the other end of the cooling water pipe is connected to the surface of the protective cover of the grinding wheel, the diversion groove is arranged on the protective cover and serves as a contact point of the protective cover and the cooling water pipe, and the diversion hole is formed in the cooling groove. The cooling water pumped by the cooling water pipe reaches the diversion groove and the diversion hole on the surface of the grinding wheel and is guided to the contact surface of the grinding wheel and the ground silicon rod for cooling, and the cooling water in the diversion hole rotated by the grinding wheel enters the grinding wheel for sufficient cooling under the centrifugal action during grinding of the grinding wheel.

The silicon rod grinding device comprises a pair of clamping arms, a pair of rough grinding tools and a pair of rough grinding tools, wherein the pair of rough grinding tools correspond to the pair of clamping arms, the silicon rod is clamped by the pair of clamping arms in the grinding process to move in a first direction so as to control the sequence of grinding and chamfering the side surface and the corner angle of the silicon rod, the silicon rod can be fully ground in the length direction through reciprocating motion, and the pair of rough grinding tools which are oppositely arranged move in a second direction so as to determine the grinding feed amount of the contact surface of the grinding tools and the silicon rod.

With continued reference to fig. 2, the lapping device 5 includes at least one pair of a lapping tool 51 and a lapping tool advancing and retreating mechanism 52.

The at least one pair of finish grinder tools 51 is disposed at the first processing location, and the pair of finish grinder tools 51 are presented to be disposed oppositely in the second direction. In certain implementations, the finish grinding tool 51 includes a grinding wheel having a granularity and a roughness, and two grinding wheels are provided to two grinding surfaces symmetrically opposite to each other, and in certain embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is formed by consolidating abrasive particles and a binding agent, and the surface with the abrasive particle part is formed to be in contact rotation with the surface of the silicon rod to be ground. The fine grinding wheel has certain abrasive particle size and abrasive particle density, and meanwhile, the grinding wheel is provided with air holes. Particularly, the abrasive grain size of the grinding wheel of the finish grinding tool is smaller than that of the grinding wheel of the rough grinding tool, so that the ground surface of the silicon rod can form a surface with higher surface finish degree in grinding; or the abrasive grain density of the grinding wheel of the finish grinding tool is greater than that of the grinding wheel of the rough grinding tool, so that the finish degree is higher.

The abrasive of the grinding wheel can be set into abrasive grains with hardness higher than that of silicon materials, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride and the like according to the requirement of grinding the silicon rod.

The finish grinding tool advancing and retreating mechanism 52 is configured to drive at least one finish grinding tool of the at least one pair of finish grinding tools 51 to move laterally in a second direction, which is a width direction of the silicon rod grinder defined perpendicular to the first direction. The finish grinder advancing and retreating mechanism 52 controls the movement of at least one of the pair of finish grinders 51 in the second direction to control the relative distance between the two grinders of the pair of finish grinders 51 in the second direction, thereby controlling the feed amount during grinding, that is, determining the grinding amount.

In certain implementations, a rough grinding stone advancing and retreating mechanism is provided for each pair of rough grinding stones. In the embodiment shown in fig. 2, the grindstone advancing and retreating mechanism includes a slide rail 522, a driving motor 521, and a ball screw. The sliding guide rail 522 is arranged along the second direction and is arranged on the first processing area of the base, the bottom of the finish grinding tool 51 is provided with a guide groove which is matched with the sliding guide rail 522 and is arranged along the second direction, and the ball screw is arranged along the sliding guide rail 522 and is in shaft connection with the driving motor 521.

In one embodiment of the present application, one of the at least one pair of lapping abrasive tools is provided with the drive motor and the ball screw, and the relative distance between the lapping abrasive tools is changed by moving one of the pair of oppositely disposed abrasive tools.

In an embodiment of the present application, each of the at least one pair of lapping tools is configured with the driving motor and the ball screw, and the driving motor can individually control the position of the corresponding grinding tool in the second direction, or based on a certain cooperative relationship, the two grinding tools are moved away from or closer to each other at the same linear velocity, for example, during grinding, the pair of lapping tools are fed toward each other at the same linear velocity in the second direction, and the pair of lapping tool wheels rotate at the same linear velocity for grinding.

In one embodiment of the present application, a pair of lapping abrasive tools are moved in a second direction at equal and opposite speeds by the same drive motor. In one implementation mode of the embodiment, the finish grinding tool advancing and retreating mechanism comprises a driving motor, a driving gear, a pair of racks and a guide rail. The guide rail is arranged along the second direction and is arranged on the first processing area of the base, and the bottom of the fine grinding tool is provided with a guide groove matched with the guide rail along the second direction. The driving motor drives the gear to rotate, the pair of racks is meshed with two opposite ends of the driving gear, and when the driving gear rotates, the pair of racks are driven to be close to or far away from each other under the driving of linear speeds in opposite directions of two ends of the gear. In one implementation of this embodiment, each of the pair of racks has one end engaged with the driving gear and the other end connected with a respective one of the pair of grinders, such that the pair of grinders are moved away from or closer to each other along the guide rail in the first direction.

In an embodiment of the application, the finish grinding device further comprises a cooling device for cooling the at least one pair of finish grinding tools, so that damage to a surface layer of the silicon rod in the grinding process is reduced, and the grinding efficiency and the service life of the grinding wheel are improved. In one implementation manner of this embodiment, the cooling device includes a cooling water pipe, a diversion trench, and a diversion hole. In some embodiments, the grinding wheel is provided with a shield around its circumference for placing cooling water into the rotary drive motor of the grinding wheel. One end of the cooling water pipe is connected with a cooling water source, the other end of the cooling water pipe is connected to the surface of the protective cover of the grinding wheel, the diversion groove is arranged on the protective cover and serves as a contact point of the protective cover and the cooling water pipe, and the diversion hole is formed in the cooling groove. The cooling water pumped by the cooling water pipe reaches the diversion groove and the diversion hole on the surface of the grinding wheel and is guided to the contact surface of the grinding wheel and the ground silicon rod for cooling, and the cooling water in the diversion hole rotated by the grinding wheel enters the grinding wheel for sufficient cooling under the centrifugal action during grinding of the grinding wheel.

The pair of finish grinding tools correspond to the pair of clamping arms, the silicon rod is clamped by the pair of clamping arms which are oppositely arranged to move in a first direction in the grinding process so as to control the sequence of grinding and chamfering the side surface and the corner angle of the silicon rod, the silicon rod can be fully ground in the length direction through reciprocating motion, and the pair of finish grinding tools which are oppositely arranged move in a second direction so as to determine the grinding feed amount of the contact surface of the grinding tools and the silicon rod.

By the silicon rod grinding machine that this application provided, in the actual grinding, first processing position district can be in operating condition with the second processing position district simultaneously, can carry out corase grind and accurate grinding respectively to different silicon rods. In one embodiment, a silicon rod to be ground is transferred to a first processing location, the silicon rod is ground by the rough grinding device under the clamping of the first silicon rod clamp, after the rough grinding is finished, the clamp of the first silicon rod clamp is driven by the lifting device to enable the clamping arms and the clamped silicon rod to ascend to a certain height, then the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp are driven by the first driving device to move along the first transfer guide rail, and the first silicon rod clamp and the clamped silicon rod are transferred from the first processing location to the second processing location. The clamping arm of the first silicon rod clamp descends along the lifting guide rail of the first silicon rod clamp at the second machining position so as to grind the silicon rod clamped by the fine grinding device; when the silicon rod clamped by the first silicon rod clamp is accurately ground, a second silicon rod clamp clamps a silicon rod to perform rough grinding on the silicon rod in the first processing position, and when the rough grinding is completed, the silicon rod accurate grinding in the second processing position is completed; the silicon rod after coarse grinding is transferred to a second processing position by a second transfer device for accurate grinding, the silicon rod clamped by the first transfer device is accurately ground and transferred out of the silicon rod processing platform, and in the transfer process, the lifting devices of the first silicon rod clamp and the second silicon rod clamp respectively adjust the heights of the clamping arms and the clamped silicon rod, so that the first transfer path and the second transfer path and the silicon rod and the clamping structure on the transfer path are mutually staggered in the transfer process; and then the first transfer device continues to clamp the unground silicon rod, namely the process is repeated.

In certain embodiments of the present disclosure, the first and second silicon rod clamps include a plurality of pairs of clamp arms disposed opposite to each other in the first direction, and a plurality of pairs of rough grinding tools and finish grinding tools disposed opposite to each other are disposed at the rough grinding device and the finish grinding device, respectively. In certain implementations, the number of pairs of arms on the first silicon rod clamp, the second silicon rod clamp, the rough grinding device and the finish grinding device is the same as the number of pairs of grinding tools, and the driving mechanism of each pair of arms and each pair of grinding tools is relatively independent, so that the transfer and grinding of the plurality of silicon rods between the first processing area and the second processing area can be performed relatively independently at the same time.

In some embodiments of the present application, the silicon rod grinding mill further comprises a silicon rod transfer device. The silicon rod transfer device is used for transferring a silicon rod to be processed to a first processing area or transferring the ground silicon rod out of the silicon rod processing platform.

Fig. 10 is a simplified schematic diagram of a silicon rod grinding machine according to an embodiment of the present application. As shown in fig. 10, the silicon rod transfer device 6 is disposed adjacent to the first processing position of the silicon rod processing platform 11, and penetrates the first transfer device 2 and the second transfer device 3. In one embodiment of the present application, the silicon rod transfer device 6 may be configured as a conveyor belt mechanism, the conveying direction of which is along the second direction, and which conveys the silicon rod located on the transfer device to the first processing location. The end points of the two ends of the conveying belt can be arranged on the left side and the right side of the base, the conveying distance covers the width of the silicon rod grinding machine, and the silicon rods can be transferred to a first transfer guide rail or a second transfer guide rail at a first processing position from a feeding position according to processing requirements, or the silicon rods at the first processing position or the second processing position are transferred out of the silicon rod processing platform to a blanking position. The feeding position and the discharging position can be the same position and are arranged at the same end of the silicon rod transfer device; or may be provided at both ends, i.e., left and right ends, of the silicon rod transfer device in the second direction, respectively.

In certain implementations of the present application, the silicon rod transfer device 6 may also be configured as a chain conveying mechanism, a speed-doubling chain mechanism, to enable the silicon rods to be transferred between different processing locations and the loading or unloading position in the second direction.

In certain embodiments of the present application, the silicon rod processing platform 11 is further provided with a waiting location (not shown), and the silicon rod grinding machine further comprises a silicon rod transfer device 6. The waiting area is arranged beside the base in the second direction and can be used as a feeding position of the silicon rod to be processed and a discharging position of the processed silicon rod.

The silicon rod transfer device 6 is disposed adjacent to the waiting location of the silicon rod processing platform 11, and is configured to transfer a silicon rod to be processed to the waiting location of the silicon rod processing platform 11 or transfer a processed silicon rod in the waiting location out of the silicon rod processing platform 11. In one embodiment, the silicon rod transfer device 6 may be configured as a conveyor belt mechanism, the conveying direction of which is along the second direction, and which conveys the silicon rod located on the transfer device to the first processing location. The end points of the two ends of the conveying belt can be arranged on the left side and the right side of the base, the conveying distance covers the width of the silicon rod grinding machine, and the silicon rods can be transferred to a first transfer guide rail or a second transfer guide rail at a first processing position from a feeding position according to processing requirements, or the silicon rods at the first processing position or the second processing position are transferred out of the silicon rod processing platform 11 to a blanking position. The feeding position and the discharging position can be the same position and are arranged at the same end of the silicon rod transfer device; or may be provided at both ends, i.e., left and right ends, of the silicon rod transfer device in the second direction, respectively.

In certain implementations of the present disclosure, the silicon rod transfer device may be further configured as a chain conveying mechanism, a speed-doubling chain mechanism, to transfer the silicon rod between different processing locations and a loading position or a unloading position in the second direction.

Through the silicon rod grinding machine that this application provided, in grinding the processing to the silicon rod, the corase grind device and the accurate grinding device of first work position and second work position can grind the silicon rod that is in different grinding stages respectively, will grind machining efficiency and promote to the twice on the basis of the size and specification that keeps silicon rod grinding machine and cost, have reduced consuming time of silicon rod processing, have promoted economic benefits.

In order to realize the use of the silicon rod grinding machine provided by the application, the application also provides a silicon rod grinding method in a second aspect, and the silicon rod grinding method can be used in a silicon rod grinding machine. The silicon rod grinding machine comprises a machine base with a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area; the silicon rod grinding machine further comprises a first transfer device, a second transfer device, a coarse grinding device and a fine grinding device, wherein the first transfer device comprises a first liftable silicon rod clamp, a first transfer guide rail and a first driving mechanism, and the second transfer device comprises a second liftable silicon rod clamp, a second transfer guide rail and a second driving mechanism.

The fine grinding device and the coarse grinding device are respectively positioned at different processing positions; in the embodiments provided in the present application, the rough grinding device and the finish grinding device are respectively disposed in the first processing area and the second processing area. The fine grinding device comprises at least one pair of fine grinding tools, and can simultaneously grind two opposite sides of the silicon rod; the rough grinding device comprises at least one pair of rough grinding tools, and can simultaneously grind two opposite sides of the silicon rod. In certain implementations, at least one of the pair of grinding tools of the rough grinding apparatus has a degree of freedom of movement in the second direction, and the amount of grinding of the silicon rod can be controlled during grinding in the rough grinding operation and the finish grinding operation.

The first driving mechanism drives the first silicon rod clamp to move along the first transfer guide rail; and the second driving mechanism drives the second silicon rod clamp to move along the second transfer guide rail. The first transfer guide rail and the first transfer guide rail are arranged on the base in parallel and are arranged along a first direction.

The first direction and the second direction are perpendicular to each other, in the embodiment provided in the present application, the first direction is along the length direction of the base, and the second direction is the width direction of the base.

In certain embodiments, the silicon rod grinding machine to which the silicon rod grinding method may be applied comprises a silicon rod grinding machine as in any one of the embodiments shown in fig. 1 to 10.

The silicon rod grinding method comprises the following steps:

referring to fig. 11, a simplified configuration of a silicon rod grinding machine for performing the silicon rod grinding method of the present application is shown in an embodiment. In the state shown in fig. 11, the first silicon rod 71 is loaded in the first processing station, the first silicon rod clamp 21 in the first transfer device clamps the first silicon rod 71, and the rough grinding device 4 performs rough grinding operation on the first silicon rod 71 located at the first processing location. In certain implementations, the first silicon rod 71 is clamped by the first silicon rod clamp 21 and moves in a first direction, and during the rough grinding process and the subsequent finish grinding process, the first silicon rod 71 is driven by the first silicon rod clamp 21 to move, so that the contact surface of the first silicon rod 71 and the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of the two opposite side surfaces is completed; alternatively, the first silicon rod clamp 21 drives the first silicon rod 71 to move in a meandering manner in the first direction, so that the contact surface of the first silicon rod 71 and the rough grinding tool is moved to sufficiently cover the side surface of the first silicon rod 71. The first silicon rod clamp 21 comprises at least one pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can rotate along the axis in the first direction under the clamping of the clamping arms, so that the switching and chamfering of grinding of different sides of the first silicon rod 71 are realized.

Referring to fig. 12, a simplified configuration of a silicon rod grinding machine for performing the silicon rod grinding method of the present application is shown in an embodiment. After the rough grinding of the first silicon rod 71 in the first processing location is completed in the state shown in fig. 12, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped by the first silicon rod clamp to move along the first transfer guide rail, so as to transfer the first silicon rod 71 from the first processing location to the second processing location, and the fine grinding device 5 performs the fine grinding operation on the first silicon rod 71; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp to move along the second transfer path, so that the second silicon rod clamp is transferred from the second processing area to the first processing area; and loading the second silicon rod 72 in the first processing location, enabling the second silicon rod clamp 31 in the second transfer device to clamp the second silicon rod 72, and enabling the rough grinding device 4 to perform rough grinding operation on the second silicon rod 72 positioned in the first processing location. In the transferring process, the lifting device of the first silicon rod clamp 21 controls the clamping arms thereof and the clamped first silicon rod 71 to ascend to a certain height, so that the clamping arms of the first silicon rod 71 and the first silicon rod clamp 21, the clamping arms of the second silicon rod clamp 31 and the second silicon rod clamped thereby are located on different horizontal planes, and the first driving device drives the first silicon rod clamp 21 to move in a first direction so as to move from a first processing area to a second processing area.

In certain implementations, the second silicon rod 72 is clamped by the second silicon rod clamp 31 and moves in a first direction, and during the rough grinding process and the subsequent finish grinding process, the second silicon rod clamp 31 drives the second silicon rod 72 to move, so that the contact surface of the second silicon rod 72 and the grinding tool moves from one end of the silicon rod to the other end, i.e., the grinding of the two opposite side surfaces is completed; alternatively, the second silicon rod clamp 31 drives the second silicon rod 72 to move in a meandering manner in the first direction, so that the contact surface of the second silicon rod 72 with the grinding tool is moved to sufficiently cover the side surface of the first silicon rod 71. The second silicon rod clamp 31 includes at least one pair of rotatable clamp arms, and the second silicon rod 72 can rotate along the axial lead in the first direction under the clamping of the clamp arms, so that the grinding, switching and chamfering of different sides of the clamped second silicon rod 72 are realized.

Referring to fig. 13, a simplified configuration of a silicon rod grinding machine for performing the silicon rod grinding method of the present application is shown in an embodiment. When the finish grinding operation of the first silicon rod 71 located in the second processing location is completed, the rough grinding operation of the second silicon rod 72 located in the first processing location is completed. As shown in fig. 13, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped by the first silicon rod clamp to move along the first transfer guide rail, so as to transfer the first silicon rod 71 from the second processing position to the first processing position, then unload the first silicon rod 71 from the first processing position and load a third silicon rod, make the first silicon rod clamp 21 in the first transfer device clamp the third silicon rod, and make the rough grinding device 4 perform rough grinding operation on the third silicon rod located at the first processing position; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to move along the second transfer guide rail, so as to transfer the second silicon rod 72 from the first processing position to the second processing position, and the fine grinding device 5 carries out fine grinding operation on the second silicon rod 72 positioned at the second processing position. In the process of transferring the first silicon rod 71 from the second processing location to the first processing location while transferring the second silicon rod 72 from the first processing location to the second processing location, the first and second silicon rod clamps 21 and 31 and the displacement of the first and second silicon rods respectively clamped by the first and second silicon rod clamps are moved along the first direction, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped by the first silicon rod clamp to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to move along the second transfer path. The height of the horizontal plane where the clamping arms of the first silicon rod clamp 21 and the first silicon rod 71 are located is controlled by the lifting device of the first silicon rod clamp 21, the height of the horizontal plane where the clamping arms of the second silicon rod clamp 31 and the second silicon rod 72 are located is controlled by the lifting device of the second silicon rod clamp, the first transfer path and the second transfer path are located on the horizontal planes with different heights in the moving process, namely, the first transfer path and the second transfer path are in a staggered state in the third direction in space, and therefore the situation that the paths of the two silicon rod clamps are overlapped and collide in the moving process along the first direction can be avoided.

When the finish grinding operation of the second silicon rod 72 located in the second processing location is completed, the rough grinding operation of the third silicon rod located in the first processing location is completed. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to be transferred from the second processing position to the first processing position along the second transfer guide rail, and the lifting device adjusts the height of the corresponding second transfer path, so that the ground second silicon rod 72 can be unloaded and a new silicon rod to be ground can be loaded.

According to the silicon rod grinding method, different silicon rods are ground and ground respectively on the same silicon rod grinding device at the same time, the grinding waiting time is shortened, the grinding steps are repeated, and grinding and circulation of a large number of silicon rods are achieved.

The third aspect of the present application also provides a silicon rod grinding method, which can be used in a silicon rod grinding machine.

The silicon rod grinding machine comprises a machine base with a silicon rod processing platform, wherein the silicon rod processing platform is provided with a first processing location, a second processing location and a waiting location; the silicon rod grinding machine further comprises a first transfer device, a second transfer device, a rough grinding device and a fine grinding device; the first transfer device comprises a first silicon rod clamp, a first transfer guide rail and a first driving mechanism, and the second transfer device comprises a second silicon rod clamp, a second transfer guide rail and a second driving mechanism.

The waiting area is adjacent to the first processing area and used for loading the silicon rod to be ground which needs to be transferred into the processing area or unloading the silicon rod after grinding.

The fine grinding device and the coarse grinding device are respectively positioned at different processing positions; in the embodiments provided in the present application, the rough grinding device and the finish grinding device correspond to the first processing area and the second processing area, respectively.

The fine grinding device comprises at least one pair of fine grinding tools, and can grind two opposite sides of the silicon rod at the same time; the rough grinding device comprises at least one pair of rough grinding tools, and can simultaneously grind two opposite sides of the silicon rod. In certain implementations, the grinding tools of the rough grinding device and the finish grinding device each have a degree of freedom of movement in the second direction, and at least one rough grinding tool of the pair of rough grinding tools of the rough grinding device can move in the second direction for the clamped silicon rod at the first processing position to control the grinding amount of the ground silicon rod during the rough grinding operation; at least one of the pair of lapping dies of the lapping apparatus is movable in a second direction for the clamped silicon rod in the second machining zone to control the amount of grinding of the ground silicon rod during lapping operation.

The silicon rod grinding method comprises the following steps:

and loading a first silicon rod in the waiting position, enabling a first silicon rod clamp in the first transfer device to clamp the first silicon rod, and enabling a first driving mechanism in the first transfer device to drive the first silicon rod clamp and the first silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail so as to transfer the first silicon rod from the waiting position to the first processing position. In the state shown in fig. 11, the first silicon rod 71 is transferred to the first processing location, and the rough grinding device 4 performs rough grinding operation on the first silicon rod 71 located at the first processing location; at this stage, the second silicon rod 72 is loaded in the waiting position, so that the second silicon rod holder 31 in the second transfer device holds the second silicon rod 72.

In certain implementations, the first silicon rod 71 is moved in a first direction under the clamping of the first silicon rod clamp 21, and during the rough grinding process and the subsequent fine grinding process, the first silicon rod 71 is moved by the first silicon rod clamp 21 from one end to the other end to complete the grinding of the two opposite side surfaces; alternatively, the first silicon rod clamp 21 drives the first silicon rod 71 to move in a meandering manner in the first direction, so that the contact surface of the first silicon rod 71 and the rough grinding tool is moved to sufficiently cover the side surface of the first silicon rod 71. The first silicon rod clamp 21 comprises at least one pair of clamping arms, the clamping arms are rotatable, and the first silicon rod 71 can rotate along the axis in the first direction under the clamping of the clamping arms, so that the switching and chamfering of grinding of different sides of the first silicon rod 71 are realized.

After the rough grinding of the first silicon rod 71 in the first processing location is completed, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped by the first silicon rod clamp to move along the first transfer guide rail, so that the first silicon rod 71 is transferred from the first processing location to the second processing location along the first transfer path, and the fine grinding device 5 performs fine grinding operation on the first silicon rod 71; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 to move along the second transfer path, so that the second silicon rod clamp 31 is transferred from the second processing area to the waiting area; and then, the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to move along the second transfer guide rail, so that the second silicon rod 72 is transferred from the waiting area to the first processing area, and the rough grinding device 4 performs rough grinding operation on the second silicon rod 72 located at the first processing area. In the state shown in fig. 12, the first silicon rod 71 is transferred to a second processing station, and is ground by a finish grinder; the second silicon rod 72 is transferred to the first processing station where it is ground by a rough grinding tool. The elevation device of the first silicon rod clamp 21 controls the height of the horizontal plane on which the clamping arms thereof and the first silicon rod 71 are located, and the elevation device of the second silicon rod clamp 31 controls the height of the horizontal plane on which the clamping arms thereof are located, so that the first transfer path and the second transfer path are located on different levels in movement, that is, in a state of being staggered in a third direction in space.

In the process of transferring the first silicon rod 71 from the second processing location to the first processing location and simultaneously transferring the second silicon rod 72 from the first processing location to the second processing location, the first and second silicon rod clamps 21 and 31 and the first and

second silicon rods

71 and 72 respectively clamped by the first and second silicon rod clamps are moved in the first direction, the first driving mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped by the first silicon rod clamp to move along the first transfer path, and the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to move along the second transfer path. The height of the horizontal plane where the clamping arms of the first silicon rod clamp 21 and the first silicon rod 71 are located is controlled by the lifting device of the first silicon rod clamp 21, the height of the horizontal plane where the clamping arms of the second silicon rod clamp 31 and the second silicon rod 72 are located is controlled by the lifting device of the second silicon rod clamp, the first transfer path and the second transfer path are located on the horizontal planes with different heights in the moving process, namely, the first transfer path and the second transfer path are in a staggered state in the third direction in space, and therefore the situation that the paths of the two silicon rod clamps are overlapped and collide in the moving process along the first direction can be avoided.

When the finish grinding operation of the first silicon rod 71 located in the second processing location is completed, the rough grinding operation of the second silicon rod 72 located in the first processing location is completed. In the state as shown in fig. 13, the first drive mechanism in the first transfer device drives the first silicon rod clamp 21 and the first silicon rod 71 clamped thereby to move along the first transfer rail, so as to transfer said first silicon rod 71 from the second processing station to the waiting station and then to unload the first silicon rod 71 from the waiting station and load a third silicon rod; enabling a first silicon rod clamp 21 in the first transfer device to clamp a third silicon rod, driving the first silicon rod clamp 21 and the clamped third silicon rod to move along a first transfer guide rail by a first driving device, enabling the third silicon rod to be transferred from a waiting zone to a first processing zone, and enabling a coarse grinding device 4 to perform coarse grinding operation on the third silicon rod located at the first processing zone; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to move along the second transfer guide rail, so as to transfer the second silicon rod 72 from the first processing position to the second processing position, and the fine grinding device 5 carries out fine grinding operation on the second silicon rod 72 positioned at the second processing position. In the process of transferring the first silicon rod clamp 21 and the clamped first silicon rod 71 from the second processing location to the first processing location along the first transfer path, and simultaneously transferring the second silicon rod clamp 31 located in the second processing location and the clamped second silicon rod 72 from the first processing location to the first processing location along the second transfer path, the height of the horizontal plane where the clamping arms of the first silicon rod clamp 21 and the first silicon rod 71 are located is controlled by the lifting device of the first silicon rod clamp 21, the height of the horizontal plane where the clamping arms of the second silicon rod clamp 31 and the clamped second silicon rod 72 are located is controlled by the lifting device of the second silicon rod clamp 31, and the first transfer path and the second transfer path are located on horizontal planes with different heights in the moving process, namely, the first silicon rod clamp and the second silicon rod clamp are in a state of being staggered in the third direction in the space, so that the two silicon rod clamps can be prevented from being overlapped in the paths and colliding in the moving process along the first.

After being transferred to the first processing location, the first silicon rod clamp 21 and the first silicon rod 71 continue to move in the first direction under the driving of the first driving device to be transferred to the waiting location for subsequent unloading and loading of a third silicon rod.

When the finish grinding operation of the second silicon rod 72 located in the second processing location is completed, the rough grinding operation of the third silicon rod 73 located in the first processing location is completed. The second driving mechanism of the second transfer device drives the second silicon rod clamp 31 and the second silicon rod 72 clamped by the second silicon rod clamp to be transferred from the second processing location to the waiting location along the second transfer guide rail, so that the ground second silicon rod 72 can be unloaded and a new silicon rod to be ground can be loaded.

The above embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art can modify or change the above-described embodiments without departing from the spirit and scope of the present application. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical concepts disclosed in the present application shall be covered by the claims of the present application.

Claims

1. A silicon rod grinding machine characterized by comprising:

the base is provided with a silicon rod processing platform; the silicon rod processing platform is provided with a first processing area and a second processing area;

the first transfer device comprises a first liftable silicon rod clamp, a first transfer guide rail arranged along a first direction and a first driving mechanism used for driving the first silicon rod clamp and a silicon rod clamped by the first silicon rod clamp to move along a first transfer path and transfer between a first processing area and a second processing area;

the second transfer device comprises a second silicon rod clamp capable of lifting, a second transfer guide rail arranged along the first direction and a second driving mechanism used for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along a second transfer path and transfer between the first processing position and the second processing position; wherein, when the second transfer device and the first transfer device are in a transfer working state, the silicon rod clamped by the first silicon rod clamp and the silicon rod clamped by the second silicon rod clamp are positioned at different height positions;

the rough grinding device is arranged at the first processing position of the silicon rod processing platform and is used for performing rough grinding operation on the silicon rod positioned at the first processing position; and

and the fine grinding device is arranged at the second processing position of the silicon rod processing platform and is used for performing fine grinding operation on the silicon rod positioned at the second processing position.

2. The silicon rod grinder as set forth in claim 1, the first transfer path comprising a first transfer section in a lifting direction, a second transfer section in a first direction, and a third transfer section in a lifting direction; the second transfer path comprises a unidirectional transfer section in a first direction; and the unidirectional transfer section and the second transfer section in the first direction are located at different height positions.

3. The silicon rod grinding machine as claimed in claim 1, wherein the first transfer device and the second transfer device are mounted above the silicon rod processing platform by means of a mounting frame, and the first transfer device and the second transfer device are respectively mounted on opposite sides of the mounting frame.

4. The silicon rod grinder as set forth in claim 1, wherein the first silicon rod clamp comprises:

the clamping arm mounting seat is arranged on the first transfer guide rail;

the clamping arms are oppositely arranged along the first direction and used for clamping two end faces of the silicon rod; and

and the clamping arm driving mechanism is used for driving at least one clamping arm in the at least two clamping arms to move along the first direction.

5. The silicon rod grinder as set forth in claim 4, wherein the clamping arms are of a rotary configuration; the first silicon rod clamp further comprises a clamping arm rotating mechanism used for driving the clamping arm to rotate.

6. The silicon rod grinder as set forth in claim 1, wherein the second silicon rod clamp comprises:

the clamping arm mounting seat is arranged on the second transfer guide rail;

7. The silicon rod grinder as set forth in claim 6, wherein the clamping arms are of a rotary configuration; the second silicon rod clamp further comprises a clamping arm rotating mechanism used for driving the clamping arm to rotate.

8. The silicon rod grinding machine as claimed in claim 1, characterized in that the first drive mechanism comprises:

the first moving rack is arranged along a first direction;

a first driving gear which is arranged on the first silicon rod clamp and meshed with the first moving rack; and

and the first driving power source is used for driving the first driving gear.

9. The silicon rod grinding machine as claimed in claim 1, characterized in that the second drive mechanism comprises:

the second moving rack is arranged along the first direction;

the second driving gear is arranged on the second silicon rod clamp and meshed with the second moving rack; and

and the first driving power source is used for driving the second driving gear.

10. The silicon rod grinding machine as claimed in claim 1, characterized in that the rough grinding device comprises:

at least one pair of rough grinding tools, which are oppositely arranged at the first processing position of the silicon rod processing platform;

and the rough grinding tool advancing and retreating mechanism is used for driving at least one rough grinding tool in the at least one pair of rough grinding tools to transversely move along a second direction, wherein the second direction is perpendicular to the first direction.

11. The silicon rod grinding mill as claimed in claim 1, characterized in that the fine grinding device comprises:

at least one pair of finish grinding tools, which are oppositely arranged at the first processing position of the silicon rod processing platform;

a finish grinder advancing and retracting mechanism for driving at least one of the pair of finish grinders to move laterally in a second direction, wherein the second direction is perpendicular to the first direction.

12. The silicon rod mill as set forth in claim 1, further comprising: and the silicon rod transferring device is adjacently arranged at the first processing position of the silicon rod processing platform and is used for transferring the silicon rod to be processed to the first processing position of the silicon rod processing platform or transferring the processed silicon rod on the silicon rod processing platform out of the first processing position.

13. The silicon rod grinding machine as recited in claim 1, wherein the silicon rod processing platform is further provided with a waiting location, and the silicon rod grinding machine further comprises a silicon rod transfer device disposed adjacent to the waiting location of the silicon rod processing platform for transferring a silicon rod to be processed to the waiting location of the silicon rod processing platform or transferring a processed silicon rod on the waiting location out of the silicon rod processing platform.

14. A silicon rod grinding method is applied to a silicon rod grinding machine, the silicon rod grinding machine comprises a base with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing area and a second processing area, the silicon rod grinding machine further comprises a first transfer device, a second transfer device, a coarse grinding device and a fine grinding device, wherein the first transfer device comprises a first silicon rod clamp, a first transfer guide rail and a first driving mechanism, the second transfer device comprises a second silicon rod clamp, a second transfer guide rail and a second driving mechanism, and the silicon rod grinding method is characterized by comprising the following steps:

enabling the fine grinding device to carry out fine grinding operation on the first silicon rod located at the second machining position; at this stage, a second silicon rod is loaded in the first processing station, a second silicon rod clamp in the second transfer device clamps the second silicon rod, and the rough grinding device performs rough grinding operation on the second silicon rod positioned at the first processing position;

15. A silicon rod grinding method is applied to a silicon rod grinding machine, the silicon rod grinding machine comprises a base with a silicon rod processing platform, the silicon rod processing platform is provided with a waiting zone, a first processing zone and a second processing zone, the silicon rod grinding machine further comprises a first transfer device, a second transfer device, a coarse grinding device and a fine grinding device, wherein the first transfer device comprises a first silicon rod clamp, a first transfer guide rail and a first driving mechanism, and the second transfer device comprises a second silicon rod clamp, a second transfer guide rail and a second driving mechanism, and the silicon rod grinding method is characterized by comprising the following steps: