CN112698523A - Method of manufacturing display module - Google Patents

Method of manufacturing display module Download PDF

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Publication number
CN112698523A
CN112698523A CN202010545977.7A CN202010545977A CN112698523A CN 112698523 A CN112698523 A CN 112698523A CN 202010545977 A CN202010545977 A CN 202010545977A CN 112698523 A CN112698523 A CN 112698523A
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CN
China
Prior art keywords
conductive particles
display panel
magnet
display module
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010545977.7A
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Chinese (zh)
Inventor
郑喆豪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Display Co Ltd
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Samsung Display Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Display Co Ltd filed Critical Samsung Display Co Ltd
Publication of CN112698523A publication Critical patent/CN112698523A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13458—Terminal pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136227—Through-hole connection of the pixel electrode to the active element through an insulation layer
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136286—Wiring, e.g. gate line, drain line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Abstract

A method of manufacturing a display module according to an embodiment of the present invention may include: a step of disposing a display panel on a stage including a first magnet having a first pole; a step of disposing an adhesive member including a plurality of conductive particles on the display panel; disposing a circuit portion on the adhesive member; a step of disposing a head portion including a second magnet having a second pole different from the first pole on the circuit portion; aligning the plurality of conductive particles using the first magnet and the second magnet; and electrically connecting the display panel and the circuit unit.

Description

Method of manufacturing display module
Technical Field
The present invention relates to an apparatus for manufacturing a display module and a method of manufacturing a display module with improved reliability.
Background
The display module includes a display panel that displays an image and a circuit portion. The display panel may include a plurality of gate lines, a plurality of data lines, and a plurality of pixels connected to the plurality of gate lines and the plurality of data lines. The display panel may be connected with a circuit part that supplies an electric signal necessary for displaying an image to the gate line or the data line. The circuit section and the display panel may be electrically connected to each other through an Anisotropic conductive film (Anisotropic conductive film). In addition, the circuit portion and the display panel may be electrically connected by an ultrasonic (ultrasonic) bonding method without using an anisotropic conductive film.
Disclosure of Invention
Solves the technical problem
An object of the present invention is to provide an apparatus for manufacturing a display module and a method of manufacturing a display module with improved reliability.
Solution to the problem
A method of manufacturing a display module according to an embodiment of the present invention may include: a step of disposing a display panel on a stage including a first magnet having a first pole; a step of disposing an adhesive member including a plurality of conductive particles on the display panel; disposing a circuit portion on the adhesive member; a step of disposing a head portion on the circuit portion, the head portion including a second magnet having a second pole different from the first pole; aligning the plurality of conductive particles by using the first magnet and the second magnet; and electrically connecting the display panel and the circuit unit.
The step of aligning the plurality of conductive particles may include: and forming a magnetic field in a thickness direction of the display panel by using the first magnet and the second magnet.
The step of aligning the plurality of conductive particles may include: and a step of forming a first region having the first pole and a second region having the second pole on each of the plurality of conductive particles.
The step of aligning the plurality of conductive particles may further include: aligning the first region adjacent to the head and aligning the second region adjacent to the table.
The step of aligning the plurality of conductive particles may further include: and a step of applying a repulsive force between the plurality of conductive particles.
The plurality of conductive particles may be spaced apart from each other at a predetermined interval on a plane.
Each of the plurality of conductive particles may include a core portion and a coating portion covering the core portion and including a ferromagnetic material, and the aligning the plurality of conductive particles may include: and magnetizing the coating portion by the first magnet and the second magnet.
The step of electrically connecting the display panel and the circuit portion may include: and heating and pressurizing the adhesive member by the head.
The step of aligning the plurality of conductive particles and the step of electrically connecting the display panel and the circuit portion may be performed simultaneously.
The step of arranging the circuit section includes: and a step of bringing a bottom surface of the circuit part into contact with the adhesive member, wherein the bottom surface is flat, the circuit part includes an insulating layer and a pad electrically connected to the display panel, and a part of the bottom surface may be the pad and another part of the bottom surface may be the insulating layer.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the apparatus for manufacturing a display module and the method for manufacturing a display module of the present invention, a plurality of conductive particles in an adhesive member can be aligned in a process of attaching a display panel and a circuit part. By aligning the conductive particles, the reliability of the electrical connection state between the display panel and the circuit portion can be improved. Accordingly, an apparatus for manufacturing a display module and a method of manufacturing a display module with improved reliability can be provided.
Drawings
Fig. 1 is a perspective view of a display panel according to an embodiment of the present invention.
Fig. 2 is a plan view of a display module according to an embodiment of the present invention.
Fig. 3 is a flowchart illustrating a method of manufacturing a display module according to an embodiment of the present invention.
Fig. 4 is a perspective view of an apparatus for manufacturing a display module according to an embodiment of the present invention.
Fig. 5 is a sectional view taken along a plane corresponding to I-I' of fig. 4 according to an embodiment of the present invention.
Fig. 6 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention.
Fig. 7 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention.
Fig. 8 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention.
Fig. 9 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention.
Detailed Description
In the present specification, in the case where a certain constituent element (or a region, a layer, a portion, or the like) is referred to as being "on", "connected to" or "coupled to" another constituent element, it means that it may be directly arranged/connected/coupled to the another constituent element, or a third constituent element may be arranged therebetween.
Like reference numerals refer to like elements. In addition, in the drawings, the thickness, proportion, and size of the constituent elements are exaggerated for effective description of technical contents.
"and/or" includes all of one or more combinations that can be defined by the relevant composition.
Although the terms "first", "second", and the like may be used to describe various constituent elements, the above-described constituent elements should not be limited by the above-described terms. The above terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component, without departing from the scope of the invention. Unless the context clearly dictates otherwise, expressions in the singular also include expressions in the plural.
In addition, terms of "lower", "upper", and the like are used to describe the associative relations of the configurations shown in the drawings. The above terms are relative concepts and are described with reference to directions indicated in the drawings.
Unless otherwise defined, all terms (including technical and scientific terms) used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In addition, terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It will be understood that the terms "comprises" or "comprising," or the like, specify the presence of stated features, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, or combinations thereof.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
Fig. 1 is a perspective view of a display panel according to an embodiment of the present invention.
Referring to fig. 1, the display panel DP may display an image IM through the display surface IS. The display surface IS may be parallel to a surface defined by the first direction DR1 and the second direction DR 2. The normal direction of the display surface IS (i.e., the thickness direction of the display panel DP) may be the third direction DR 3. The third direction DR3 may be a direction intersecting the first direction DR1 and the second direction DR 2. The first direction DR1, the second direction DR2 and the third direction DR3 may be orthogonal to each other.
In addition, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts, and may be converted into other directions. In addition, in the present specification, the surface defined by the first direction DR1 and the second direction DR2 is defined as a plane, and "viewing on the plane" may be defined as viewing in the third direction DR 3.
In an embodiment of the present invention, the display panel DP having the flat display surface IS shown, but IS not limited thereto. The display panel DP according to an embodiment of the present invention may include a curved display surface.
The display panel DP may be a rigid display panel. However, it is not limited thereto, and the display panel DP according to an embodiment of the present invention may include a flexible display panel DP. In the present embodiment, the display panel DP that can be applied to the mobile phone terminal is exemplarily shown, but is not limited thereto. The display panel DP according to an embodiment of the present invention can be applied to large display panels such as televisions, monitors, and the like, and small and medium display panels such as tablet computers, car navigators, game machines, and smart watches.
The display surface IS may include a display area DA displaying the image IM and a non-display area NDA adjacent to the display area DA. The non-display area NDA may be an area where the image IM is not displayed. In fig. 1, an icon and a clock window are shown as one example of the image IM.
The non-display area NDA may surround the display area DA. However, it is not limited thereto, and the shape of the display area DA and the shape of the non-display area NDA may be relatively designed.
Fig. 2 is a plan view of a display module according to an embodiment of the present invention.
Referring to fig. 2, the display module DM may include a display panel DP and a circuit part CP.
The display panel DP according to an embodiment of the present invention may include a light receiving type display panel or a light emitting type display panel. For example, the light receiving type display panel may be a liquid crystal display panel. The light-emitting display panel can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light emitting layer of the organic light emitting display panel may include an organic light emitting substance. The light emitting layer of the quantum dot light emitting display panel may include quantum dots, quantum rods, and the like. Hereinafter, the display panel DP will be described as an organic light emitting display panel.
The display panel DP may include a scan driving circuit DCV, a signal line SGL, and pixels PX. The area where the pixels PX are arranged may be defined as a display area DA.
The scan driving circuit DCV may be disposed in the non-display area NDA. The scan driving circuit DCV may generate a control signal. The scan driving circuit DCV may sequentially output the control signals to the gate lines GL. The scan driving circuit DCV may also output another control signal to the driving circuit of the pixel PX.
The scan driving circuit DCV may include a thin film transistor formed through the same process as the driving circuit of the pixel PX. For example, the above process may include an LTPS (low temperature polysilicon) process or an LTPO (low temperature poly oxide) process.
The signal line SGL may include a conductive material. For example, each of the signal lines SGL may be formed of a conductive material such as gold (Au), silver (Ag), aluminum (Al), or copper (Cu). However, this is exemplary, and the signal line SGL according to an embodiment of the present invention is not limited thereto, and may be formed of one of various conductive materials used when the display module DM is manufactured.
The signal line SGL may include a data line DL, a power line PL, a control signal line CSL, a gate line GL, and a light emission control line LCL.
The data lines DL may be respectively connected to corresponding pixels PX among the pixels PX. Each of the pixels PX may be connected to a corresponding one of the data lines DL.
The power supply line PL may be connected to the pixel PX. The control signal line CSL may supply the above-described control signal to the scan driving circuit DCV.
The gate line GL may extend in the second direction DR 2. The gate lines GL may be respectively connected to corresponding ones of the pixels PX. The gate line GL may be connected to the scan driving circuit DCV.
The emission control line LCL may extend in the second direction DR 2. The emission control lines LCL may be respectively connected to corresponding pixels PX among the pixels PX. The emission control line LCL may be connected to the scan driving circuit DCV.
Some of the data lines DL, the power supply lines PL, the control signal lines CSL, the gate lines GL, and the light emission control lines LCL may be disposed on the same layer, and others may be disposed on other layers.
The circuit section CP may include a circuit film FP and a driving element IC. The circuit part CP may be referred to as a flexible circuit film or a chip on film. However, this is exemplary, and the circuit part CP according to an embodiment of the present invention may be configured in the form of an integrated circuit chip to be directly mounted on the display panel DP.
The circuit film FP may be electrically connected to the display panel DP. For example, the circuit film FP may be electrically connected to the display circuit layer DP-CL (refer to fig. 5) including the signal line SGL.
The driving element IC may be arranged on the circuit film FP. The driving element IC may output an image signal and a driving signal required to display an image. The driving element IC may be electrically connected to the conductive pattern to be arranged in a region of the circuit film FP. The image signal and the driving signal output from the driving element IC may be transferred to the display panel DP through the circuit film FP. Meanwhile, one driving element IC is disclosed on the circuit film FP shown in fig. 2, but is not limited thereto. A plurality of driving elements required for displaying an image may be arranged on the circuit film FP.
Fig. 3 is a flowchart illustrating a method of manufacturing a display module according to an embodiment of the present invention, fig. 4 is a perspective view of an apparatus of manufacturing a display module according to an embodiment of the present invention, and fig. 5 is a sectional view taken along a plane corresponding to I-I' of fig. 4 according to an embodiment of the present invention.
Referring to fig. 3 to 5, the device DMA that manufactures the display module may include a stage ST and a head HD.
The display panel DP may be disposed on the stage ST (S100). The display panel DP according to an embodiment of the present invention may be vacuum-adsorbed to the stage ST.
The display panel DP may include a base layer SUB, a display circuit layer DP-CL, an image realization layer DP-OLED, and a thin film encapsulation layer TFE.
The base layer SUB may be disposed on the stage ST. The base layer SUB may be a plastic substrate, a glass substrate, an insulating film, or a laminated structure including a plurality of insulating layers.
The display circuit layer DP-CL may be disposed on the base layer SUB. The display circuit layer DP-CL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the display circuit layers DP to CL may constitute the signal line SGL (refer to fig. 2) or a control circuit of the pixel.
The image realization layer DP-OLED may be disposed on the display circuit layer DP-CL. The image realization layer DP-OLED may include an organic light emitting diode. The image realization layer DP-OLED may define a display area DA.
The thin film encapsulation layer TFE may cover the image realization layer DP-OLED. The thin film encapsulation layer TFE may include at least one insulating layer. For example, the thin film encapsulation layer TFE may include at least one encapsulating inorganic film. For example, the thin film encapsulation layer TFE may include at least one encapsulating organic film and at least one encapsulating inorganic film. The thin film encapsulation layer TFE may be provided as a single encapsulation layer, or may be provided as a plurality of thin films.
In an embodiment of the present invention, the thin film encapsulation layer TFE may be omitted, and a thin film encapsulation substrate may be disposed on the image realization layer DP-OLED. The thin film encapsulation substrate and the display circuit layer DP-CL may be coupled by a coupling member. The above-mentioned coupling member may include an organic substance such as a photocurable resin or a thermoplastic resin, or may include an inorganic substance such as a frit seal (frit seal).
The adhesive member ACF may be disposed on the display panel DP (S200). The circuit part CP may be arranged on the adhesive member ACF (S300). The adhesive member ACF may be disposed between the display panel DP and the circuit section CP.
The adhesive member ACF may be disposed in the non-display area NDA. The adhesive member ACF may be disposed on the display circuit layer DP-CL. The adhesive member ACF may electrically connect the display circuit layers DP to CL and the circuit portion CP.
The head portion HD may be disposed on the circuit portion CP. The head portion HD according to an embodiment of the present invention may vacuum-adsorb the circuit portion CP. The head portion HD may pressurize the circuit portion CP in the third direction DR 3.
The step of electrically connecting the display panel DP and the circuit section CP (S600) may include the step of heating and pressing the adhesive member ACF with the head HD. For example, the head portion HD may be heated to 220 ℃ while pressurizing the circuit portion CP for 5 seconds, thereby electrically connecting the display panel DP and the circuit portion CP. However, this is exemplary, and the temperature and time are not limited to the above example. For example, the head part HD according to an embodiment of the present invention may be heated to 150 ℃ while pressurizing the circuit part CP for 7 seconds, thereby electrically connecting the display panel DP and the circuit part CP.
The step (S500) of aligning the plurality of conductive particles CB (refer to fig. 6) and the step (S600) of electrically connecting the display panel DP and the circuit portion CP may be simultaneously performed.
According to the present invention, the resin layer AF-BS (refer to fig. 6) of the adhesive member ACF heated by the head HD may have fluidity, and the position of the conductive particles CB (refer to fig. 6) within the resin layer AF-BS (refer to fig. 6) may be changed. That is, the device DMA that manufactures the display module may control the positions of the plurality of conductive particles CB (refer to fig. 6) within the resin layer AF-BS (refer to fig. 6). The display panel DP and the circuit portion CP may be electrically connected through the aligned conductive particles CB (refer to fig. 6). Accordingly, an apparatus DMA for manufacturing a display module and a method of manufacturing a display module with improved reliability may be provided.
Fig. 6 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention.
Referring to fig. 3 and 6, the display circuit layer DP-CL may further include a display pad DP-PD (refer to fig. 6). The display pads DP-PD (refer to fig. 6) may be electrically connected to some of the signal lines SGL (refer to fig. 2), respectively.
The circuit film FP may include a base film FP-BS, an insulating layer FP-IL, and a pad FP-PD. In the case where the circuit section CP (refer to fig. 2) is provided in a chip form, the pad FP-PD may be a protrusion disposed below the driving element IC (refer to fig. 2).
Insulating layer FP-IL may be disposed under base film FP-BS. The insulating layer FP-IL may be an inorganic layer and/or an organic layer, and may have a single-layer structure or a multi-layer structure. The insulating layer FP-IL according to an embodiment of the present invention may be a single silicon oxide layer.
The pads FP-PD may be disposed in contact holes defined in the insulating layer FP-IL, respectively. The thickness TK-PD of each of the pads FP-PD may be greater than the thickness of the insulating layer FP-IL.
The stage ST may include a first magnet MG1 having a first pole. The head HD may include a second magnet MG2, the second magnet MG2 having a second pole different from the first pole described above. In a plane, the first magnet MG1 and the second magnet MG2 may overlap.
The step (S500) of aligning the plurality of conductive particles CB may include: a step of applying a current to each of the first magnet MG1 and the second magnet MG 2; a step of forming a magnetic field MF in a thickness direction of the display panel DP; a step of forming a first region AR1 having the first pole and a second region AR2 having the second pole on each of the plurality of conductive particles CB; a step of aligning the first area AR1 adjacent to the head HD and the second area AR2 adjacent to the stage ST; and a step of causing repulsive force to act between the conductive particles CB.
Each of the first magnet MG1 and the second magnet MG2 may include an electromagnet. The strength of the magnetic force of each of the first magnet MG1 and the second magnet MG2 may be determined according to the applied current. However, this is exemplary, and each of the first and second magnets MG1 and MG2 according to an embodiment of the invention may be a permanent magnet.
Each of the first and second magnets MG1 and MG2 to which the current is applied may have a magnetic force. For example, the above-described first pole of the first magnet MG1 may be an S pole, and the above-described second pole of the second magnet MG2 may be an N pole. However, this is exemplary, and the above-described first pole according to an embodiment of the present invention may be an N pole, and the above-described second pole may be an S pole.
The first and second magnets MG1 and MG2 may form a magnetic field MF in a thickness direction of the display panel DP. The direction of the magnetic field MF may be parallel to the third direction DR 3. The magnetic field MF according to an embodiment of the invention may be formed in a direction from the second magnet MG2 to the first magnet MG 1. However, this is exemplary, and the direction of the magnetic field MF according to an embodiment of the invention may be changed according to the above-described first pole of the first magnet MG1 and the above-described second pole of the second magnet MG 2.
The adhesive member ACF may include a resin layer AF-BS and a plurality of conductive particles CB. The adhesive member ACF may include an anisotropic conductive film. The adhesive member ACF may electrically connect the display panel DP and the circuit film FP. The resin layer AF-BS may include an adhesive resin.
Each of the plurality of conductive particles CB may include a core portion CR and a coating portion CT. The core portion CR may include a polymer in a spherical shape. The coating portion CT may cover the core portion CR. The coating portion CT may include a ferromagnetic material. For example, the coating portion CT may be nickel. However, this is exemplary, and the coating portion CT according to an embodiment of the present invention may be one of various ferromagnetic materials.
The step of aligning the plurality of conductive particles CB (S500) may further include the step of magnetizing the coating part CT. The coating portion CT can be magnetized into the first pole and the second pole by a magnetic field MF.
Each of the magnetized plurality of conductive particles CB may include a first area AR1 and a second area AR 2. The first area AR1 may have the first pole described above by a magnetic field MF. The second area AR2 may have the second polarity described above by the magnetic field MF.
The first area AR1 may be aligned adjacent to the head HD. The first area AR1 may have a different polarity than the head HD. For example, the first area AR1 may have an S-pole. An attractive force may be formed between the first area AR1 and the first magnet MG 1.
The second area AR2 may be aligned adjacent to the stage ST. The second area AR2 may have a different polarity from the station ST. For example, the second area AR2 may have an N-pole. An attractive force may be formed between the second area AR2 and the second magnet MG 2.
The first region AR1 of one conductive particle CB may have the same polarity as the first region AR1 of the adjacent conductive particle CB. The repulsive force may act between the first areas AR1 of the conductive particles CB.
The second region AR2 of one conductive particle CB may have the same polarity as the second region AR2 of the adjacent conductive particle CB. A repulsive force may act between the second areas AR2 of the conductive particles CB.
The repulsive force may act between the plurality of conductive particles CB. The conductive particles CB may be spaced apart from each other at a prescribed interval CBD.
According to the present invention, the repulsive force may act between the plurality of conductive particles CB by the first magnet MG1 and the second magnet MG 2. By the repulsive force, the plurality of conductive particles CB can be uniformly distributed at a predetermined interval CBD. The probability of arranging at least one conductive particle CB between the display pad DP-PD and the pad FP-PD may increase. It is shown that the probability of some of the pads DP-PD and corresponding some of the pads FP-PD failing to electrically connect to each other may be reduced. Accordingly, an apparatus DMA (refer to fig. 4) of manufacturing a display module and a method of manufacturing a display module with improved reliability may be provided.
Further, according to the present invention, by the first magnet MG1 and the second magnet MG2, a repulsive force can be generated between the plurality of conductive particles CB. By the repulsive force described above, the plurality of conductive particles CB may be arranged at intervals at a prescribed interval CBD. The phenomenon that the conductive particles CB are aggregated can be prevented. It is possible to prevent the phenomenon of electrical connection between one pad FP-PD and an adjacent pad. Accordingly, an apparatus DMA (refer to fig. 4) of manufacturing a display module and a method of manufacturing a display module with improved reliability may be provided.
Even if the arrangement of the plurality of conductive particles CB included in the adhesive member ACF before being disposed between the display panel DP and the circuit section CP (refer to fig. 5) is irregular, the device DMA (refer to fig. 4) manufacturing the display module according to an embodiment of the present invention may align the plurality of conductive particles CB by the step (S500) of aligning the plurality of conductive particles CB and the step (S600) of electrically connecting the display panel DP and the circuit section CP (refer to fig. 5).
According to the apparatus DMA (refer to fig. 4) for manufacturing a display module and the method for manufacturing a display module of the present invention, it is possible to align the plurality of conductive particles CB in the adhesive member ACF in the process of attaching the display panel DP and the circuit part CP (refer to fig. 5). By aligning the conductive particles CB, the reliability of the electrical connection state of the display panel DP and the circuit portion CP (refer to fig. 5) may be improved. Accordingly, an apparatus DMA (refer to fig. 4) of manufacturing a display module and a method of manufacturing a display module with improved reliability may be provided.
Fig. 7 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention. In describing fig. 7, the constituent elements described with reference to fig. 6 are collectively denoted by the same reference numerals, and the description thereof is omitted.
Referring to fig. 3 and 7, the stage ST may include first magnets MG1-1, MG1-2, MG1-3, and MG 1-4. The first magnets MG1-1, MG1-2, MG1-3, and MG1-4 may be spaced apart from one another in the second direction DR 2.
Head HD may include second magnets MG2-1, MG2-2, MG2-3, and MG 2-4. The second magnets MG2-1, MG2-2, MG2-3, and MG2-4 may be spaced apart from one another in the second direction DR 2.
In plan, the first magnets MG1-1, MG1-2, MG1-3, and MG1-4 may overlap with the second magnets MG2-1, MG2-2, MG2-3, and MG2-4, respectively.
The step (S100) of arranging the display panel DP may include: the step of aligning the display pad DP-PD such that the pad DP-PD overlaps the first magnets MG1-1, MG1-2, MG1-3, and MG1-4, respectively, is displayed on a plane. The step (S400) of arranging the head HD may include: a step of aligning the pads FP-PD such that the pads FP-PD overlap the second magnets MG2-1, MG2-2, MG2-3, and MG2-4, respectively, on a plane.
In a plane, each of the first magnets MG1-1, MG1-2, MG1-3, and MG1-4, the display pad DP-PD, the pad FP-PD, and the second magnets MG2-1, MG2-2, MG2-3, and MG2-4 may overlap in one-to-one correspondence.
The first magnets MG1-1, MG1-2, MG1-3, and MG1-4 and the second magnets MG2-1, MG2-2, MG2-3, and MG2-4 may form a magnetic field MF-1.
The first area AR1 may have a first pole through a magnetic field MF-1. The second area AR2 may have a second pole different from the first pole described above by the magnetic field MF-1.
Attractive force may be formed between the first area AR1 and the first magnets MG1-1, MG1-2, MG1-3, and MG 1-4. An attractive force may be formed between the second area AR2 and the second magnets MG2-1, MG2-2, MG2-3, and MG 2-4. In a plane, a plurality of conductive particles CB may be disposed adjacent to the first magnets MG1-1, MG1-2, MG1-3, and MG1-4 and the second magnets MG2-1, MG2-2, MG2-3, and MG 2-4.
The adhesive part ACF may include a first film area FA1 and a second film area FA2, wherein the first film area FA1 overlaps each of the first magnets MG1-1, MG1-2, MG1-3, and MG1-4, and the second film area FA2 is adjacent to the first film area FA 1.
The first number of the conductive particles CB overlapping each of the first film areas FA1 may be larger than the second number of the conductive particles CB overlapping each of the second film areas FA 2.
The repulsive force may act between the first areas AR1 of the conductive particles CB. A repulsive force may act between the second areas AR2 of the conductive particles CB.
The conductive particles CB overlapping the first film area FA1 on a plane may be spaced apart from each other at a first interval CBD-1 by a repulsive force between the conductive particles CB. The conductive particles CB overlapping the second film region FA2 on the plane may be spaced apart from each other at a second interval CBD-2 by an attractive force between the conductive particles CB and the first magnets MG1-1, MG1-2, MG1-3, and MG1-4 and the second magnets MG2-1, MG2-2, MG2-3, and MG 2-4. The first interval CBD-1 may be narrower than the second interval CBD-2.
According to the present invention, by the attractive force between the conductive particles CB and the first magnets MG1-1, MG1-2, MG1-3 and MG1-4 and the second magnets MG2-1, MG2-2, MG2-3 and MG2-4 and the repulsive force between the conductive particles CB, it is shown that the probability of the electrical connection failure between the pad DP-PD and the pad FP-PD can be reduced, and the phenomenon that one pad FP-PD is electrically connected to the adjacent pad can be prevented. Accordingly, an apparatus DMA (refer to fig. 4) of manufacturing a display module and a method of manufacturing a display module with improved reliability may be provided.
Fig. 8 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention. In describing fig. 8, the constituent elements described with reference to fig. 6 are collectively denoted by the same reference numerals, and the description thereof is omitted.
Referring to fig. 3 and 8, the step (S300) of disposing the circuit section CP (refer to fig. 5) may include a step of contacting the bottom surface BT-S of the circuit section CP (refer to fig. 5) with the adhesive member ACF.
The bottom surface BT-S may be flat. A portion of the bottom surface BT-S may be the pad FP-PD and another portion of the bottom surface BT-S may be the insulating layer FP-IL 1.
The thickness TK-PD1 of each of the pads FP-PD may be the same as the thickness TK-IL1 of the insulating layer FP-IL 1.
Fig. 9 is a sectional view taken along a plane corresponding to II-II' of fig. 4 according to an embodiment of the present invention. In describing fig. 9, the constituent elements described with reference to fig. 7 are collectively denoted by the same reference numerals, and the description thereof is omitted.
Referring to fig. 3 and 9, the step (S300) of disposing the circuit section CP (refer to fig. 5) may include a step of contacting the bottom surface BT-S1 of the circuit section CP (refer to fig. 5) with the adhesive member ACF.
The bottom surface BT-S1 may be flat. A portion of bottom surface BT-S1 may be pad FP-PD and another portion of bottom surface BT-S1 may be insulating layer FP-IL 2.
The thickness TK-PD2 of each of the pads FP-PD may be the same as the thickness TK-IL2 of the insulating layer FP-IL 2.
It is to be understood that the foregoing has been described with reference to the preferred embodiments of the present invention, but various modifications and changes can be made by those skilled in the art or those skilled in the art without departing from the spirit and scope of the present invention as set forth in the claims to be described later. Therefore, the technical scope of the present invention is not limited to the contents described in the detailed description of the specification, but is defined by the claims.

Claims (10)

1. A method of manufacturing a display module, comprising:
a step of disposing a display panel on a stage including a first magnet having a first pole;
a step of disposing an adhesive member including a plurality of conductive particles on the display panel;
a step of arranging a circuit portion on the adhesive member;
a step of arranging a head portion on the circuit portion, the head portion including a second magnet having a second pole different from the first pole;
a step of aligning the plurality of conductive particles with the first magnet and the second magnet; and
and electrically connecting the display panel and the circuit portion.
2. The method of manufacturing a display module of claim 1, wherein the step of aligning the plurality of conductive particles comprises: a step of forming a magnetic field in a thickness direction of the display panel by using the first magnet and the second magnet.
3. The method of manufacturing a display module of claim 1, wherein the step of aligning the plurality of conductive particles comprises: a step of forming a first region having the first pole and a second region having the second pole on each of the plurality of conductive particles.
4. The method of manufacturing a display module of claim 3, wherein the step of aligning the plurality of conductive particles further comprises: a step of aligning the first region adjacent to the head and the second region adjacent to the table.
5. The method of manufacturing a display module of claim 3, wherein the step of aligning the plurality of conductive particles further comprises: a step of causing repulsive force to act between the plurality of conductive particles.
6. The method of manufacturing a display module according to claim 5, wherein the plurality of conductive particles are spaced apart from each other at a prescribed interval on a plane.
7. The method of manufacturing a display module according to claim 1, wherein each of the plurality of conductive particles includes a core portion and a coating portion that covers the core portion and includes a ferromagnetic material, and
the step of aligning the plurality of conductive particles comprises: a step of magnetizing the coating portion with the first magnet and the second magnet.
8. The method of manufacturing a display module according to claim 1, wherein the step of electrically connecting the display panel and the circuit portion includes: a step of heating and pressing the adhesive member with the head.
9. The method of manufacturing a display module according to claim 1, wherein the step of aligning the plurality of conductive particles is performed simultaneously with the step of electrically connecting the display panel and the circuit portion.
10. The method of manufacturing a display module according to claim 1, wherein the step of arranging the circuit portion includes: a step of bringing a bottom surface of the circuit part into contact with the adhesive member, and
the bottom surface is flat, and the circuit section includes an insulating layer and a pad electrically connected to the display panel, a portion of the bottom surface being the pad, and another portion of the bottom surface being the insulating layer.
CN202010545977.7A 2019-10-07 2020-06-16 Method of manufacturing display module Pending CN112698523A (en)

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KR1020190123802A KR20210041661A (en) 2019-10-07 2019-10-07 Display module manufacturing apparatus and display module manufacturing method

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