CN112676923A - Mask plate hole edge burr removing process - Google Patents

Mask plate hole edge burr removing process Download PDF

Info

Publication number
CN112676923A
CN112676923A CN202011541263.5A CN202011541263A CN112676923A CN 112676923 A CN112676923 A CN 112676923A CN 202011541263 A CN202011541263 A CN 202011541263A CN 112676923 A CN112676923 A CN 112676923A
Authority
CN
China
Prior art keywords
hole
pin
mask plate
grinding
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011541263.5A
Other languages
Chinese (zh)
Inventor
钱超
杨波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Gaoguang Semiconductor Materials Co ltd
Original Assignee
Jiangsu Gaoguang Semiconductor Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Gaoguang Semiconductor Materials Co ltd filed Critical Jiangsu Gaoguang Semiconductor Materials Co ltd
Priority to CN202011541263.5A priority Critical patent/CN112676923A/en
Publication of CN112676923A publication Critical patent/CN112676923A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention discloses a mask plate hole edge burr removing process, which comprises the following steps of S1: embedding pins with the same size as the processed alignment blind holes into the holes; s2, grinding on a machine: grinding the embedded mask plate on a machine to remove raised burrs during punching; s3, removing the pin: the pin put in S1 was taken out from the hole. The invention can remove burrs to the utmost extent, ensures that the mask plate is not damaged and injured, overcomes some difficulties in the existing processing, can ensure that the burrs are not secondarily generated and secondarily injured, ensures the processing precision and also ensures that the mask plate is not injured in the processing process.

Description

Mask plate hole edge burr removing process
Technical Field
The invention relates to the technical field of masks, in particular to a mask hole edge burr removing process.
Background
Mask version need punch the operation man-hour, and common processing technology all can leave the burr arch at the top in hole, and the burr can direct influence follow-up mask version's use, can make the machine cause bigger error, consequently all need grind the burring to it and handle, make itself keep bright and clean, can not receive the influence of flaws such as burr.
And traditional grinding process can directly grind the mask plate surface, gets rid of the burr, and some burrs can be polished off, but has certain probability to make some burrs can be because of grinding and turn into downthehole inside, leads to the loaded down with trivial details error of next step's process to be difficult to carry out even.
Based on the above, the invention designs a mask plate hole edge burr removal process to solve the problems.
Disclosure of Invention
The invention aims to provide a mask plate hole edge burr removal process to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
a mask plate hole edge burr removing process comprises the following steps:
s1, pin inlaying: embedding pins with the same size as the processed alignment blind holes into the holes;
s2, grinding on a machine: grinding the embedded mask plate on a machine to remove raised burrs during punching;
s3, removing the pin: the pin put in S1 was taken out from the hole.
Preferably, in S1, a screw hole is formed in the middle of the pin, and a connecting rod is connected to the screw hole through an internal thread and used for pushing the pin into the hole and withdrawing the pin.
Preferably, in S1, a screw hole is formed in the middle of the pin, and a connecting rod is connected to the screw hole through an internal thread and used for pushing the pin into the hole and withdrawing the pin.
Preferably, in the step S2, the burr removing range is controlled within 0.5-1mm of the hole periphery.
Preferably, the number of times of grinding the edge portion of the hole is more than 2 times.
Preferably, in S3, the pin inserted into the hole is inserted into the connecting rod again and pushed out from the same direction as the insertion, and then the pin is separated from the connecting rod and the connecting rod is pushed out from the hole.
Compared with the prior art, the invention has the beneficial effects that:
compared with the traditional steps, the technology can remove burrs to the greatest extent, ensures that the mask is not damaged and injured, simultaneously removes 'reduction' in an 'adding' mode, overcomes some difficulties of the existing processing, can ensure that the burrs cannot be secondarily damaged and secondarily injured, cannot be inverted in the hole due to grinding, cannot treat symptoms and prevent the root cause, reserves certain allowance, takes the added pins out by using threaded holes, ensures the processing precision, also ensures that the mask cannot be injured in the processing process, has better quality compared with the traditional direct grinding technology, and directly avoids the defect that the burrs are inverted in the hole from the source.
Drawings
FIG. 1 is a manufacturing flow chart of a mask hole edge burr removal process according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A process for removing burrs at the edge of a mask hole,
the method comprises the following steps:
s1, pin inlaying: inserting pins with the same size as the processed alignment blind holes into the holes, placing the pins into the holes from the back side of the mask plate, arranging screw holes in the middle of the pins, and connecting rods in the screw holes for pushing the pins into the holes and withdrawing the pins;
s2, grinding on a machine: grinding the embedded mask plate on a machine, removing raised burrs during punching, controlling the burr removal range within 0.5-1mm of the periphery of the hole, polishing the edge part of the hole for more than 2 times, and controlling the contact force between the grinder piece and the mask plate to be 0.1N;
s3, removing the pin: the pin put in S1 is taken out of the hole, the pin put in the hole is put in the connecting rod again and pushed out from the same direction as when putting in, and then the pin is separated from the connecting rod and the connecting rod is pushed out of the hole.
Example 2
A process for removing burrs at the edge of a mask hole,
the method comprises the following steps:
s1, pin inlaying: inserting pins with the same size as the processed alignment blind holes into the holes, placing the pins into the holes from the back side of the mask plate, arranging screw holes in the middle of the pins, and connecting rods in the screw holes for pushing the pins into the holes and withdrawing the pins;
s2, grinding on a machine: grinding the embedded mask plate on a machine, removing raised burrs during punching, controlling the burr removal range within 0.5-1mm of the periphery of the hole, polishing the edge part of the hole for more than 2 times, and controlling the contact force between the grinder piece and the mask plate to be 0.3N;
s3, removing the pin: the pin put in S1 is taken out of the hole, the pin put in the hole is put in the connecting rod again and pushed out from the same direction as when putting in, and then the pin is separated from the connecting rod and the connecting rod is pushed out of the hole.
Example 3
A process for removing burrs at the edge of a mask hole,
the method comprises the following steps:
s1, pin inlaying: inserting pins with the same size as the processed alignment blind holes into the holes, placing the pins into the holes from the back side of the mask plate, arranging screw holes in the middle of the pins, and connecting rods in the screw holes for pushing the pins into the holes and withdrawing the pins;
s2, grinding on a machine: grinding the embedded mask plate on a machine, removing raised burrs during punching, controlling the burr removal range within 0.5-1mm of the periphery of the hole, polishing the edge part of the hole for more than 2 times, and controlling the contact force between the grinder piece and the mask plate to be 0.5N;
s3, removing the pin: the pin put in S1 is taken out of the hole, the pin put in the hole is put in the connecting rod again and pushed out from the same direction as when putting in, and then the pin is separated from the connecting rod and the connecting rod is pushed out of the hole.
Table one: statistics of contact force versus grinding effect
Figure BDA0002854933380000041
As can be seen from the table I, the effect of removing burrs at the edge of the hole of the mask plate is the best at 0.3N, and the effect of 0.3N is the most suitable for industrial production in terms of balancing the number of edge cracks, the burr removal degree and the operation time.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims (6)

1. A mask plate hole edge burr removing process is characterized by comprising the following steps:
s1, pin inlaying: embedding pins with the same size as the processed alignment blind holes into the holes;
s2, grinding on a machine: grinding the embedded mask plate on a machine to remove raised burrs during punching;
s3, removing the pin: the pin put in S1 was taken out from the hole.
2. The process of claim 1, wherein the pins are placed into the holes from the backside of the reticle in S1.
3. The process of claim 1, wherein in step S1, a screw hole is formed in the middle of the pin, and a connecting rod is screwed into the screw hole for pushing the pin into the hole and withdrawing the pin.
4. The reticle aperture edge burr removal process of claim 1, wherein in S2, the burr removal range is controlled to be within 0.5-1mm of the aperture perimeter.
5. The process of claim 4, wherein the step of removing the burr on the mask hole edge comprises: the number of times of grinding the edge part of the hole is more than 2.
6. The process of claim 1, wherein the removing the burr on the mask hole edge comprises: in S3, the pin put into the hole is put into the connecting rod again and pushed out from the same direction as the putting, and then the pin is separated from the connecting rod and the connecting rod is pushed out from the hole.
CN202011541263.5A 2020-12-23 2020-12-23 Mask plate hole edge burr removing process Pending CN112676923A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011541263.5A CN112676923A (en) 2020-12-23 2020-12-23 Mask plate hole edge burr removing process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011541263.5A CN112676923A (en) 2020-12-23 2020-12-23 Mask plate hole edge burr removing process

Publications (1)

Publication Number Publication Date
CN112676923A true CN112676923A (en) 2021-04-20

Family

ID=75451251

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011541263.5A Pending CN112676923A (en) 2020-12-23 2020-12-23 Mask plate hole edge burr removing process

Country Status (1)

Country Link
CN (1) CN112676923A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196361A (en) * 1987-02-09 1988-08-15 Nippei Toyama Corp Perforation finishing method
JP2000254846A (en) * 1999-03-08 2000-09-19 Toyoda Mach Works Ltd Method and device for removing burr of cross hole
CN102029438A (en) * 2009-09-29 2011-04-27 上海纳铁福传动轴有限公司 Method for removing burrs from through orifices in workpiece
CN102416587A (en) * 2011-09-29 2012-04-18 东莞生益电子有限公司 Board grinding method for removing orifice burrs of printed circuit board (PCB)
CN204686601U (en) * 2015-05-27 2015-10-07 芜湖永达科技有限公司 A kind of instrument for removing hole inner burr
CN105415132A (en) * 2015-12-27 2016-03-23 天津派迪科技有限公司 Deburring structure for metal product orifices
CN110576362A (en) * 2019-09-11 2019-12-17 安徽省合肥汽车锻件有限责任公司 Deburring device in drilling process of automobile front axle

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63196361A (en) * 1987-02-09 1988-08-15 Nippei Toyama Corp Perforation finishing method
JP2000254846A (en) * 1999-03-08 2000-09-19 Toyoda Mach Works Ltd Method and device for removing burr of cross hole
CN102029438A (en) * 2009-09-29 2011-04-27 上海纳铁福传动轴有限公司 Method for removing burrs from through orifices in workpiece
CN102416587A (en) * 2011-09-29 2012-04-18 东莞生益电子有限公司 Board grinding method for removing orifice burrs of printed circuit board (PCB)
CN204686601U (en) * 2015-05-27 2015-10-07 芜湖永达科技有限公司 A kind of instrument for removing hole inner burr
CN105415132A (en) * 2015-12-27 2016-03-23 天津派迪科技有限公司 Deburring structure for metal product orifices
CN110576362A (en) * 2019-09-11 2019-12-17 安徽省合肥汽车锻件有限责任公司 Deburring device in drilling process of automobile front axle

Similar Documents

Publication Publication Date Title
DE102005034120A1 (en) Semiconductor wafer and method for producing a semiconductor wafer
CN106937483A (en) Tool for removing printed circuit board (PCB) PTH copper facing hole burs
CN112676923A (en) Mask plate hole edge burr removing process
EP3181291B1 (en) Workpiece with optical lens blank, method for its preparation and method for its processing
DE10296522T5 (en) Method of manufacturing a semiconductor chip
DE102019204974A1 (en) WAFER PROCESSING PROCEDURES
DE10057066A1 (en) Device for retaining abrasive pad for fining and polishing of lenses has lap cradle with retainer positioned against lap
CN111331167B (en) Hole machining method based on virtual size of reverse side and special drill jig
DE112007002287B4 (en) Method and fixture for holding a silicon wafer
KR20060113027A (en) Clinching-nut's manufacturing method
DE102009024726A1 (en) Method for producing a semiconductor wafer
JPH09103828A (en) Press apparatus
RU2010100849A (en) METHOD FOR PRODUCING METAL PARTS AND METAL PARTS
JPH06314676A (en) Semiconductor wafer
CN111546251A (en) Polishing method for irregular sealing surface of deep hole or narrow area of high-vacuum part
CN108608166A (en) There is the stud processing method of keyway on a kind of screw thread
CN107546104B (en) Wafer thinning preparation process
TWI718721B (en) Circuit board manufacturing method
CN109402698A (en) A kind of method of aluminium workpiece surface local anodic oxidation
CN212917238U (en) Punching die for eccentric end cover
CN103862318B (en) A kind of method utilizing tool to transport electrode slice
CN221204018U (en) Nuclear remover
CN208342553U (en) It is a kind of for being ground the mold of Step Shaft
CN111098224B (en) Semiconductor substrate and surface polishing method thereof
WO2008074464A1 (en) Edge chamfering wafers

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20210420

RJ01 Rejection of invention patent application after publication