CN112673716A - 印制电路板及其制造方法、电子设备 - Google Patents

印制电路板及其制造方法、电子设备 Download PDF

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Publication number
CN112673716A
CN112673716A CN201880097221.1A CN201880097221A CN112673716A CN 112673716 A CN112673716 A CN 112673716A CN 201880097221 A CN201880097221 A CN 201880097221A CN 112673716 A CN112673716 A CN 112673716A
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CN
China
Prior art keywords
printed circuit
circuit board
layer
solder mask
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201880097221.1A
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English (en)
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CN112673716B (zh
Inventor
孙正宝
张旭
王斌
郝海
彭利军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Publication date
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Publication of CN112673716A publication Critical patent/CN112673716A/zh
Application granted granted Critical
Publication of CN112673716B publication Critical patent/CN112673716B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0761—Insulation resistance, e.g. of the surface of the PCB between the conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0588—Second resist used as pattern over first resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印制电路板及其制造方法、电子设备，涉及电子技术领域，所述印制电路板具有贯穿所述印制电路板的目标孔(A)，所述印制电路板中连通所述目标孔(A)的至少一侧中，未设置有所述目标孔(A)的区域具有用于阻挡液体流动的阻挡结构(B)。能够减弱腐蚀物在目标孔(A)外的蔓延程度，避免印制电路板无法正常使用。

Description

PCT国内申请，说明书已公开。

Claims (22)

  1. PCT国内申请，权利要求书已公开。
CN201880097221.1A 2018-12-28 2018-12-28 印制电路板及其制造方法、电子设备 Active CN112673716B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2018/124960 WO2020133238A1 (zh) 2018-12-28 2018-12-28 印制电路板及其制造方法、电子设备

Publications (2)

Publication Number Publication Date
CN112673716A true CN112673716A (zh) 2021-04-16
CN112673716B CN112673716B (zh) 2022-08-26

Family

ID=71128475

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CN201880097221.1A Active CN112673716B (zh) 2018-12-28 2018-12-28 印制电路板及其制造方法、电子设备

Country Status (4)

Country Link
US (1) US11882665B2 (zh)
EP (1) EP3893612A4 (zh)
CN (1) CN112673716B (zh)
WO (1) WO2020133238A1 (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050082682A1 (en) * 2003-10-21 2005-04-21 Advanced Semiconductor Engineering, Inc. Prevention of contamination on bonding pads of wafer during SMT
WO2005072032A1 (ja) * 2004-01-26 2005-08-04 Nec Corporation 回路基板、回路基板の実装構造および回路基板の実装方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0494591A (ja) * 1990-08-10 1992-03-26 Cmk Corp スルーホールを有するプリント配線板の製造方法
JP4328485B2 (ja) * 2002-01-18 2009-09-09 日本電気株式会社 回路基板及び電子機器
JP3951779B2 (ja) * 2002-04-10 2007-08-01 株式会社デンソー プリント回路板およびその製造方法
JP3610495B2 (ja) * 2002-07-19 2005-01-12 オリオン電機株式会社 プリント基板及び電子部品のハンダ付け構造
US20080173470A1 (en) * 2005-10-03 2008-07-24 Michael Barbetta Combined Solderable Multi-Purpose Surface Finishes on Circuit Boards and Method of Manufacture of Such Boards
US20080268267A1 (en) * 2007-04-27 2008-10-30 Michael Barbetta Combined solderable multi-purpose surface finishes on circuit boards and method of manufacture of such boards
JP2009206286A (ja) * 2008-02-27 2009-09-10 Kyocera Corp プリント基板及びこれを用いた携帯電子機器
US20090236129A1 (en) * 2008-03-19 2009-09-24 Dell Products L.P. Methods for reducing corrosion on printed circuit boards
US10593565B2 (en) * 2017-01-31 2020-03-17 Skyworks Solutions, Inc. Control of under-fill with a packaging substrate having an integrated trench for a dual-sided ball grid array package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050082682A1 (en) * 2003-10-21 2005-04-21 Advanced Semiconductor Engineering, Inc. Prevention of contamination on bonding pads of wafer during SMT
WO2005072032A1 (ja) * 2004-01-26 2005-08-04 Nec Corporation 回路基板、回路基板の実装構造および回路基板の実装方法

Also Published As

Publication number Publication date
EP3893612A1 (en) 2021-10-13
US20210329791A1 (en) 2021-10-21
WO2020133238A1 (zh) 2020-07-02
EP3893612A4 (en) 2021-12-08
CN112673716B (zh) 2022-08-26
US11882665B2 (en) 2024-01-23

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