CN112666797B - Stage device, method for adjusting stage device, exposure device, and method for manufacturing article - Google Patents
Stage device, method for adjusting stage device, exposure device, and method for manufacturing article Download PDFInfo
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- CN112666797B CN112666797B CN202011091475.8A CN202011091475A CN112666797B CN 112666797 B CN112666797 B CN 112666797B CN 202011091475 A CN202011091475 A CN 202011091475A CN 112666797 B CN112666797 B CN 112666797B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
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- 238000012423 maintenance Methods 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a stage device, a method for adjusting the stage device, an exposure device, and a method for manufacturing an article. A mounting table device which is advantageous in both accuracy of flatness of a substrate holding portion and adjustment speed is provided. The stage device for holding a substrate and moving comprises: a base; a substrate holding unit configured to hold the substrate at a position above the susceptor; a plurality of adjustment sections provided between the base and the substrate holding section, the plurality of adjustment sections being configured to apply a force from below independently for each of a plurality of portions of the substrate holding surface in order to adjust a shape of a substrate holding surface of the substrate holding section; and a plurality of fastening portions provided corresponding to the plurality of adjustment portions, the plurality of fastening portions being configured to fasten the susceptor and the substrate holding portion with the fastening member interposed therebetween.
Description
Technical Field
The present invention relates to a stage device, a method of adjusting the stage device, an exposure device, and a method of manufacturing an article.
Background
In a photolithography process, which is a process for manufacturing a flat panel display or the like, an exposure apparatus of a step and scan (scanner) system is used. The scanner type exposure apparatus synchronously drives a photomask (original plate) and a glass substrate in a scanning direction while irradiating exposure light only in a slit-shaped exposure region, and optically transfers a pattern formed on the mask onto the substrate. With the development of high definition and high performance of flat panel displays, the miniaturization of transferred patterns has progressed, and a scanner-type exposure apparatus is required to achieve high resolution.
In order to improve the resolution, a method of increasing the aperture ratio (NA) of the projection optical system is generally employed. However, according to the rayleigh criterion, the resolution of the exposure apparatus increases inversely proportional to the aperture ratio (NA) of the projection optical system, whereas the depth of focus (DOF) of the projection optical system decreases inversely proportional to the square of the aperture ratio. That is, resolution and depth of focus are generally in a trade-off relationship. Therefore, in an exposure apparatus using a projection optical system having a high resolution, ensuring a focal depth is a very important issue.
In order to achieve a desired resolution, it is necessary that the sum of various focusing impeding elements such as aberration of the optical system, mask flatness, substrate flatness, and the like is included in the focal depth. Therefore, in order to achieve high resolution, a substrate holding portion for holding a substrate in contact with the substrate is generally required to have high flatness. Further, since the margin for the change of the component with time and the change of the device environment such as the device temperature is also reduced, it is necessary to maintain the high substrate flatness for a long period of time, and to maintain the flatness by readjusting as the device maintenance.
In order to achieve high flatness of the substrate holding portion, high precision machining of the substrate holding portion and height adjustment at the time of assembly are performed. Patent document 1 describes that processing is performed in a state in which the same stress state as in actual use is reproduced at the time of processing, and a height adjustment portion is provided immediately below a substrate holding portion at the time of assembling the substrate holding portion and is driven in the height direction, thereby realizing a predetermined flatness. In patent document 1, the state of coupling between the substrate holding portion and the adjustment movable portion (the adjustment portion has a movable portion driven in the height direction and a fixed portion fixed to the base (base) side) can be switched by vacuum suction or magnetic force. Then, the flatness of the substrate holding portion is adjusted by the steps of releasing the coupling before driving and coupling after driving the height adjusting portion. Thus, the occurrence and residue of stress due to the deflection occurring in the substrate holding portion with the height adjustment are prevented, and the flatness variation due to the relaxation of the residual stress with time is prevented.
Prior art literature
Patent literature
Patent document 1: japanese patent No. 5932305
Disclosure of Invention
Problems to be solved by the invention
However, the substrate holding portion needs to have a function of adsorbing and holding the substrate, and therefore needs to have a size to the same extent as the substrate, for example, one side reaches 2500mm even in G8.5 generation. In many cases, a light metal such as aluminum or ceramic is used as a material of the substrate holding portion, but when the substrate holding portion is integrally manufactured, there are problems such as a problem of availability of materials, a problem of limitation of a processing machine, and the like, and manufacturing is difficult or very costly. In addition, even if it can be integrally manufactured, in order to process a large substrate holding portion capable of sucking and holding the entire surface of the substrate of the size with high flatness, a corresponding component rigidity is required. This means that the substrate holding portion becomes thick and heavy. The substrate holding portion is formed on the substrate mounting table and is a member that is driven in a plane together with the substrate mounting table, and therefore, an increase in weight of the member increases a load of an actuator of the substrate mounting table, which causes unnecessary enlargement of the substrate mounting table.
In contrast, by dividing the substrate holding portion into a plurality of portions and reducing the size of each portion, problems such as availability of materials, limitation of processing machines, and the like can be alleviated. However, in order to improve the machining accuracy of a single product, it is necessary to improve the rigidity of the component as in the case of integration. In addition, in the case of dividing the substrate holding portions, a height difference occurs at the adjacent edges between the adjacent substrate holding portions, and the flatness changes sharply at such portions, so that there are cases where pattern defects occur at the time of exposure. Thus, accuracy is more required for adjustment near the adjoining sides.
In consideration of such a situation, the technique of patent document 1 causes the following inconvenience. In patent document 1, the substrate holding portion and the adjustment movable portion are bonded by vacuum suction or vacuum suction assisted by magnetic force, but there is no description about the correlation between these bonding forces and the rigidity of the substrate holding portion. Therefore, in order to partially adjust the substrate holding portion, in the case of deforming the substrate holding portion, it is estimated that the rigidity of the substrate holding portion overcomes the vacuum suction force according to the adjustment amount, and not only the adjustment becomes unstable, but also there is a possibility that the adjustment may not be possible. For example, when the adjustment is to be performed in a direction to partially lower the height by 5 μm, the chuck needs to be locally deformed by the bonding force of vacuum suction by 5 μm, but if only 2 μm can be deformed by the vacuum suction force, 3 μm remains as an unadjustable amount. When the adjustment amount is further increased, the vacuum leakage is increased and the bonding force is further weakened, so that there is a case where the adjustment cannot be performed at all.
In patent document 1, the substrate holding portion and the adjustment movable portion are coupled, but there is no description about the correlation between the rigidity of the substrate holding portion and the rigidity of the adjustment portion itself (the rigidity between the adjustment movable portion and the adjustment fixed portion). For this reason, the adjustment portion is deformed for the same reason, and the adjustment may not be stable but may be impossible. For example, when the adjustment unit is driven in a direction to partially reduce the height by 5 μm, the adjustment unit itself is pulled upward according to the rigidity ratio of the adjustment unit and the substrate holding unit. Thus, the adjustment portion was deformed upward by 3 μm while being lowered by 5 μm, and the substrate holding portion was lowered by only 2 μm. In order to lower the substrate holding portion by 5 μm, vacuum suction is required after the substrate adjusting portion is further lowered, but vacuum leakage at the start of suction becomes large and the bonding force becomes further weak, so that there is a case where adjustment becomes impossible.
The adjustment mechanism of patent document 1 has instability in adjustment, and there are cases where not only adjustment accuracy is difficult, but also adjustment itself becomes impossible according to the adjustment amount. In addition, since the adjustment accuracy is low, the press-in adjustment needs to be repeated a plurality of times to achieve a predetermined accuracy, and time is required for the adjustment.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a mounting table device which is advantageous in terms of accuracy of flatness of a substrate holding portion and adjustment speed.
Means for solving the problems
According to the 1 st aspect of the present invention, there is provided a stage device for holding a substrate and moving the substrate, comprising: a base; a substrate holding unit that holds the substrate at a position above the susceptor; a plurality of adjustment sections provided between the base and the substrate holding section, the plurality of adjustment sections being configured to apply a force from below independently for each of a plurality of portions of the substrate holding surface in order to adjust a shape of a substrate holding surface of the substrate holding section; and a plurality of fastening portions provided corresponding to the plurality of adjustment portions, the plurality of fastening portions being configured to fasten the susceptor and the substrate holding portion with the fastening member interposed therebetween.
According to the 2 nd aspect of the present invention, there is provided a method for adjusting a stage device, comprising: a base; a substrate holding unit that holds the substrate at a position above the susceptor; a plurality of adjustment sections provided between the base and the substrate holding section, the plurality of adjustment sections being configured to apply a force from below independently for each of a plurality of portions of the substrate holding surface in order to adjust a shape of a substrate holding surface of the substrate holding section; and a plurality of fastening portions provided corresponding to the plurality of adjustment portions, the plurality of fastening portions fastening the base and the substrate holding portion with the fastening member interposed therebetween, the adjustment method including: a step of setting at least 1 fastening portion corresponding to at least 1 adjustment portion among the plurality of fastening portions to a release state in which fastening between the base and the substrate holding portion is released, in order to perform adjustment in at least 1 adjustment portion among the plurality of adjustment portions; a step of adjusting by the at least 1 adjusting portion after setting the at least 1 fastening portion to the released state; and a step of setting the at least 1 fastening portion to a fastened state for fastening the base and the substrate holding portion after the adjustment by the at least 1 adjustment portion.
According to the 3 rd aspect of the present invention, there is provided an exposure apparatus for exposing a substrate, comprising the stage device according to the 1 st aspect for holding the substrate.
According to the 4 th aspect of the present invention, there is provided a method for manufacturing an article, comprising: a step of exposing the substrate with the exposure apparatus according to the 3 rd aspect; and developing the substrate after exposure, wherein the article manufacturing method manufactures an article from the substrate after development.
According to the present invention, for example, a stage device that is advantageous in terms of accuracy of flatness of a substrate holding portion and adjustment speed can be provided.
Drawings
Fig. 1 is a diagram showing a configuration of an exposure apparatus in the embodiment.
Fig. 2 is a diagram showing a structure of the substrate stage according to the embodiment.
Fig. 3 is a diagram showing a detailed configuration of the substrate stage in the embodiment.
Fig. 4 is a diagram showing the structure of the adjustment unit in the embodiment.
Fig. 5 is a diagram showing a structure of an adjusting portion according to a modification.
Fig. 6 is a diagram showing a structure of an adjusting portion according to a modification.
Fig. 7 is a diagram showing a structure of a positioning mechanism of a substrate holding portion in the embodiment.
(symbol description)
220: a substrate holding portion base; 230: a substrate holding section; 240: an adjusting part; 241: a fixing part; 242: a movable part; 243: an actuator; 250: a fastening part; 251: a driving section; 252: a rod.
Detailed Description
The embodiments are described in detail below with reference to the drawings. The invention according to the claims is not limited to the following embodiments. In the embodiments, a plurality of features are described, but not all of the plurality of features are necessary for the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar structures are denoted by the same reference numerals, and redundant description thereof is omitted.
First, an exposure apparatus to which the stage apparatus of the present invention is applied will be described. In the following description, specific structures, operations, and the like are shown for explanation, but these specific structures, operations, and the like can be appropriately changed.
Fig. 1 is a schematic view of an exposure apparatus according to an embodiment. In the present specification and the drawings, directions are indicated in XYZ coordinate systems in which a horizontal plane is an XY plane. Generally, a substrate W, which is an exposed substrate, is placed on the substrate stage 20 such that its surface is parallel to a horizontal plane (XY plane). Accordingly, directions orthogonal to each other in a plane along the surface of the substrate W are hereinafter referred to as X-axis and Y-axis, and directions perpendicular to the X-axis and the Y-axis are hereinafter referred to as Z-axis. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are hereinafter referred to as an X-direction, a Y-direction, and a Z-direction, and the directions around the X-axis, the Y-axis, and the Z-axis are hereinafter referred to as a θx-direction, a θy-direction, and a θz-direction, respectively.
The exposure apparatus may include a projection optical system 10, a substrate stage 20 as a stage device for holding a substrate W, a mask stage 30 for holding a mask M as a master, an illumination optical system 40, an interferometer 50, and a main body base 60. The projection optical system 10 projects a pattern of the mask M held by the mask stage 30 onto the substrate W held by the substrate stage 20. The projection is performed by diffracted light emitted from the mask M by the light of the light source of the illumination optical system 40 that irradiates toward the mask M. In addition, an observation optical system 41 may be disposed between the illumination optical system 40 and the mask M. The observation optical system 41 can observe an image formed on the substrate W through the mask M and the projection optical system 10.
The mask M is sucked and held on the mask holding portion 32 in the mask stage 30. The mask holding portion 32 is disposed on the mask stage base 31. The mask M can be moved in the X direction and the Y direction by moving the mask stage 30 in the X direction and the Y direction. The Y direction is referred to herein as a scan direction (scanning direction) in scanning exposure, and the X direction is referred to herein as a step direction (non-scanning direction). That is, the direction in which the mask stage 30 and the substrate stage 20 are synchronously scanned during projection exposure is the Y direction. The mask M is movable in a rotation direction (θz direction) of X, Y in-plane rotation formed by the 2-axis of the X, Y direction.
The pattern transfer from the mask M to the substrate W is performed by performing synchronous scanning at the same speed ratio as that of the mask M and the substrate W by projection exposure. Each region on the substrate W on which the pattern of the mask M is transferred is referred to as a shot region. Further, on the substrate W, an alignment mark, not shown, is formed for use in alignment between each imaging region and the mask. The alignment mark can be observed by the observation optical system 41.
Interferometer 50 measures the positions of mask stage 30 and substrate stage 20. Interferometer 50 may include laser head 51, beam splitter 52, bending mirror 53, and strip mirrors 54 and 55 that reflect the detection light.
The substrate stage 20 is a stage device that can be driven at least in the XY 2-axis direction. The substrate stage 20 may move the substrate W to a predetermined exposure position (imaging position) with respect to the mask M, and perform alignment based on a correction value obtained from a measurement result based on the alignment mark of the observation optical system 41. Thereafter, the substrate stage 20 may be scan-driven in synchronization with the mask stage 30 during the scanning exposure. The substrate stage 20 may be driven in each direction of Z, θx, θy, and θz for alignment and focus correction. However, in fig. 1, the driving mechanisms of the substrate stage 20 in all directions are not shown. The stage base 21 is disposed above the main body base 60, and the bar mirror 54 and the substrate W are disposed above the stage base 21.
The control section 70 controls each part of the exposure apparatus. The control unit 70 may be realized by a computer including a CPU and a memory. The control unit 70 is connected to each part of the exposure apparatus by wire or wirelessly, and may be provided at a place separated from each part of the exposure apparatus. Thereby, the exposure apparatus can be remotely operated.
Fig. 2 is a diagram showing a structure of the substrate stage 20. A stage base 21 is disposed above the main body base 60, and a substrate holding portion base 220 (base) is disposed above the stage base 21. In addition, the association of the substrate holding portion base 220 and the stage base 21 is not important in the present disclosure. The substrate holding unit base 220 and the stage base 21 may be fixed to each other by different members, or may be coupled to each other via some kind of drive shaft. Alternatively, the substrate holding unit base 220 and the stage base 21 may be integrally formed. The stage base 21 is provided with driving mechanisms for driving in the directions Z, θx, θy, and θz, but illustration and explanation of the structures thereof are omitted.
A substrate holding portion 230 for holding the substrate W is disposed above the substrate holding portion base 220. A plurality of adjustment portions 240 are disposed between the substrate holding portion base 220 and the substrate holding portion 230. The plurality of adjustment portions 240 are configured to apply a force from below independently for each of a plurality of portions of the substrate holding surface in order to adjust the shape of the substrate holding surface of the substrate holding portion 230. The substrate W is fixed to the substrate holding portion 230 by vacuum suction. In the embodiment, the substrate holding surface of the substrate holding portion 230 is divided into a plurality of areas. The substrate holding portion 230 is provided with an adsorption tank, a pneumatic pipe, a pneumatic control device, and the like for adsorbing and fixing the substrate W, and illustration and description of the structure thereof are omitted. A bar mirror 54 of the interferometer 50 is also disposed on the stage base 21.
The flatness of the substrate holding surface of the substrate holding portion 230 that is in contact with the substrate W can be measured by the height sensor 42 (measuring portion) shown in fig. 1. The height sensor 42 may be provided inside the exposure apparatus or outside the exposure apparatus. The flatness of the substrate holding portion 230 can be measured by measuring the Z-directional height of the substrate holding portion 230 with respect to the plurality of position height sensors 42 while moving the substrate holding portion 230 in the XY directions.
Fig. 3 is a diagram illustrating a detailed configuration of the substrate stage 20. Each of the plurality of adjustment portions 240 may include a movable portion 242 that moves in contact with the substrate holding portion 230, a fixed portion 241 that is disposed on the substrate holding portion base 220 and supports the movable portion 242, and an actuator 243 that drives the movable portion 242. The actuator 243 includes a motor, a speed reducing mechanism, a drive conversion mechanism, and the like, and may further include a driver board, a control board, an encoder for calculating a drive position of the motor, a home sensor, and the like. The actuator 243 may be provided with a cable, not shown, connected to a host control system, a power supply circuit, or the like. The fixing portion 241 is fixed to the substrate holding portion base 220. The movable portion 242 is movable in the Z direction with respect to the fixed portion 241. The linear motion or rotational drive amount output from the actuator 243 is converted into a linear motion in the Z direction in the fixed portion 241, and is output as a drive of the movable portion 242 in the Z direction. As for the specific configuration of the adjustment unit 240, various configurations can be considered depending on the type of the actuator 243, the type of the Z-shift mechanism, and the like, and an example is shown in fig. 4.
The adjustment unit 240 in fig. 4 uses a wedge mechanism as the Z-shift mechanism, and uses the linear drive amount of the slide feed screw as the output of the actuator 243. The adjustment portion 240 has a wedge member 241a that moves in the horizontal direction (Y direction) above the bottom portion 241b of the fixing portion 241 by an actuator 243. The upper surface of the wedge member 241a is inclined with respect to the Y direction. A movable portion 242 is mounted on the wedge member 241a. The lower surface of the movable portion 242 that abuts against the upper surface of the wedge member 241a is a slope corresponding to the slope of the upper surface of the wedge member 241a so that the upper surface of the movable portion 242 is horizontal. The movable portion 242 is restricted from moving in the X direction and the Y direction by the vertical wall of the fixed portion 241, and can move only in the Z direction.
A feed screw 243a extending in the Y direction for driving the wedge member 241a in the Y direction is attached to a side surface of the wedge member 241a. Rotation of the feed screw 243a is provided by a rotation motor 243c via a speed reducer 243 b. By the rotation of the feed screw 243a, the wedge part 241a moves in the Y direction. Along with the movement of the wedge member 241a in the Y direction, the movable portion 242 moves upward (Z direction) by an amount corresponding to the wedge ratio.
In this case, the resolution in the Z direction of the mechanism can be improved by setting the wedge ratio to be as large as 25 to 100. Further, by appropriately setting the reduction ratio of the speed reducer 243b, the output of the rotation motor 243c can be made small, and the mechanism as a whole can be realized by a very small motor. This suppresses the space for disposing the adjustment unit 240, and thus contributes to the reduction in size and weight of the entire mounting table.
The mechanism of the speed reducer 243b may be a worm wheel, a gear train, a planetary gear train, or the like. As the rotary motor 243c, various rotary motors such as a DC motor, a stepping motor, an AC motor, and an ultrasonic motor can be used. Further, an encoder may be disposed in the rotation motor 243c, and the driving amount of the adjusting unit 240 may be estimated using the encoder. The product of the reduction ratio by the speed reducer, the reduction ratio by the screw mechanism, and the reduction ratio by the wedge mechanism is the reduction ratio of the whole mechanism. The present mechanism is a mechanism having a very large reduction ratio, and therefore can realize a submicron-order Z-direction resolution even if the encoder resolution is relatively large. Therefore, even a simplified structure such as detecting a large number of slits circularly arranged on a circular plate by a photointerrupter can achieve a sufficient resolution. Further, since the mechanism for driving the wedge mechanism by the slide feed screw is self-locking by internal friction against force in the-Z direction, the speed reducer and the motor shaft do not rotate in reverse, and the mechanism has extremely high rigidity in the-Z direction. The wedge mechanism is a mechanism having zero rigidity in the +z direction, but as will be described below, the substrate holding portion 230 and the substrate holding portion base 220 are fastened by the fastening portion 250 via the adjustment portion 240, so that only the rigidity in the-Z direction may be considered.
The substrate stage in the embodiment has a plurality of fastening portions 250. Each of the plurality of fastening portions 250 is provided corresponding to each of the plurality of adjustment portions 240, and the substrate holding portion base 220 and the substrate holding portion 230 are fastened with the fastening member so as to sandwich the adjustment portions 240. The fastening portion 250 includes a rod 252 as a fastening member extending in the Z direction between the substrate holding portion base 220 and the substrate holding portion 230 to connect the two, and a driving portion 251 that drives the rod 252. A through hole is formed in the substrate holding portion 230, and the rod 252 penetrates the through hole. The head 252a of the rod 252 has a larger diameter than the through hole, and the head 252a cannot pass through the through hole. In the substrate holding portion 230, a recess for accommodating the head 252a is formed in an upper portion of the through hole, and the head 252a does not protrude above the upper surface of the substrate holding portion 230 in normal operation.
The driving unit 251 is formed inside the substrate holding unit base 220, and the tip end portion of the lever 252 is attached to the driving unit 251. The driving part 251 performs pulling/releasing of the lever 252. The lever 252 is pulled by the driving unit 251 with a predetermined force F, and the substrate holding unit 230 and the substrate holding unit base 220 are coupled by the force F via the adjusting unit 240. As examples, various examples of the method of releasing the fastening by generating the traction force F by a cylinder, by a hydraulic cylinder, by a spring or the like, and by providing a pushing force for eliminating the traction force F by a direct-acting cylinder or the like can be considered. Instead of the cylinder, an electric linear actuator may be used, or a pressurizing mechanism may be mounted in the cylinder for space saving. Further, a screw may be formed in the rod 252, and the screw may be rotated by a motor incorporated in the driving unit 251, and the screw may be fastened by supplying a predetermined torque by a torque limiter.
The fastening portion 250 is easy to extend the tube to the outside of the substrate holding portion if it is fluid-driven, and easy to extend the cable to the outside of the substrate holding portion if it is electric, and can be remotely operated from the control portion 70 or an external control device. By configuring both the adjustment portion 240 and the fastening portion 250 to be remotely operable from the outside, it is possible to perform flatness adjustment in a very short time.
The fastening force F required for the fastening portion 250 can be determined as follows.
First, an adjustment amount required for the substrate holding section 230 is determined. The total of the factors that reduce the flatness, such as the flatness of the upper surface of the substrate holding portion base 220, the flatness of the substrate holding portion 230, and the thickness difference between the adjacent substrate holding portions 230, is determined as the required maximum adjustment amount.
Next, a reaction force generated when the determined required maximum adjustment amount is supplied to the support adjustment point of each of the plurality of substrate holders 230 is calculated using FEM or the like. The value obtained by multiplying the calculated reaction force by the safety factor is determined as the required tightening force.
If the fastening force F is generated by the fastening portion 250, the substrate holding portion 230, the adjusting portion 240, and the substrate holding portion base 220 can be securely attached by the sandwiching and bonding by the fastening portion 250. In this state, the driving amount of the adjustment unit 240 is directly reflected on the amount of change in the flatness of the substrate holding unit 230, and thus the flatness can be adjusted with high accuracy.
Next, a method of adjusting the flatness and a method of calculating the driving amount of the adjusting unit 240 will be described. As described above, the flatness of the substrate holding portion 230 may be measured using the height sensor 42. The flatness is obtained by sequentially driving the substrate stage 20 and measuring the entire surface of the substrate holding portion 230 at predetermined intervals by the height sensor 42.
Next, an adjustment amount of each of the plurality of adjustment portions 240 is calculated. For example, for each of the plurality of adjustment units 240, the relationship between the driving amounts of the plurality of adjustment units 240 and the deformation amount of the substrate holding unit 230 is obtained in advance by FEM or actual measurement, and stored as a correction table. Based on the correction table and the measurement result of the flatness, the adjustment amounts of the plurality of adjustment units 240 are calculated by the least square method or the like in a reciprocal manner so that the adjusted flatness becomes minimum.
By adjusting the plurality of adjustment portions 240 by the adjustment amounts of the plurality of adjustment portions 240 calculated in this way, the steps and the local irregularities between the plurality of regions of the substrate holding portion can be adjusted with high accuracy. However, in this case, since stress remains in the substrate holding portion 230 and the residual stress is relaxed with time, there is a possibility that a change in flatness occurs.
Therefore, in the present embodiment, each of the plurality of fastening portions 250 is configured to be switchable between a fastening state in which the substrate holding portion base 220 and the substrate holding portion 230 are fastened and a release state in which the fastening of the substrate holding portion base 220 and the substrate holding portion 230 is released. At least 1 fastening portion corresponding to at least 1 adjustment portion among the plurality of fastening portions 250 can be switched to the released state while the adjustment is performed in at least 1 adjustment portion among the plurality of adjustment portions 240.
For example, the control section 70 is configured to control each of the plurality of adjustment sections 240 and each of the connection sections of the plurality of fastening sections 250. The control unit 70 controls the at least 1 adjustment unit so that the step between the end portions of adjacent ones of the plurality of regions becomes small and the substrate holding surface becomes flat after setting the at least 1 fastening units to the released state based on the measurement result of the height sensor 42 as the measurement unit.
With the above configuration, the following method for adjusting the mounting table device is realized. The engagement of the fastening portion 250 is temporarily released. After the fastening portion 250 is released, the adjustment by at least 1 adjustment portion is performed using the adjustment amounts of the plurality of adjustment portions 240 calculated in the previous step. After the adjustment, the fastening portion is brought into a fastened state. In the adjustment by the adjustment sections, each adjustment section may be driven sequentially or all adjustment sections may be driven simultaneously. At this time, the driving amount may be ensured using information of the encoder of the actuator 243 built in each adjustment section. Alternatively, the height sensor 42 may be used to measure the support adjustment position of each adjustment unit or the vicinity thereof, and the driving amount may be ensured based on the measurement result. In the former case, the driving accuracy depends on the driving accuracy of the encoder and the adjusting section 240 as a whole. However, all the adjustment mechanisms can be driven accordingly at the same time, so the adjustment time itself can be shortened. In the latter case, the measurement by the height sensor 42 is required at or near each support adjustment position of the adjustment unit 240, and therefore, the stage needs to be moved at regular intervals. In addition, in each support adjustment position, whether the drive is performed by a predetermined adjustment amount is ensured by the steps of measurement, fastening release, driving of the adjustment portion, fastening, and measurement. Therefore, the adjustment time itself becomes long although the adjustment accuracy is high. When the adjustment portion 240 is elastic, the adjustment portion may be deformed by an amount corresponding to the fastening force F and the elastic constant. In this case, by calculating or actually measuring the elastic constant in advance and adding it as a correction value to the correction table, adjustment in consideration of the influence of elasticity can be performed. However, since the error component increases, there is a possibility that the adjustment accuracy decreases accordingly. Therefore, the rigidity of the adjustment portion 240 is advantageous from the viewpoint of adjustment accuracy.
In the same way, the case where the rigidity of the substrate holding portion base 220 is not negligible with respect to the rigidity of the substrate holding portion 230 is considered. In this case, too, correction can be performed by creating a correction table by implementing FEM including the rigidity of the substrate holding portion base 220. However, in this case, the error component still increases, so that higher rigidity than the substrate holding portion 230 is desired.
In the embodiment, the lever 252 is disposed concentrically (coaxially) with the movable portion 242. For example, a hollow portion 246 is formed to communicate the substrate holding portion base 220 and the substrate holding portion 230 through the movable portion 242 and the fixed portion 241. The rod 252 is disposed inside the hollow portion 246, and thus the rod 252 can be disposed concentrically (coaxially) with the movable portion 242. This can prevent moment due to the displacement of the point of application of the tightening force F. In addition, the deformation of the substrate holding portion 230 can be prevented from being complicated, and a large error component can be generated in the correction table for flatness adjustment. With the above configuration, the flatness can be adjusted with high accuracy.
If the position of the substrate holding portion 230 is shifted when the substrate holding portion 230 is fastened by the fastening portion 250, a moment is generated by shifting the point of application of the fastening force F, and there is a possibility that the flatness of the substrate holding portion 230 may be changed in accordance with the moment. Therefore, it is desirable to position the substrate holding portion 230 after the fastening portion 250 is set to the released state, and to set it to the fastened state after the positioning is performed. Therefore, a positioning mechanism for correcting the positional deviation of the substrate holding portion 230 may be provided between the substrate holding portion 230 and the substrate holding portion base 220.
Fig. 7 shows an example of a positioning mechanism of the substrate holding portion 230. The positioning mechanism performs positioning of the substrate holding portion 230 with respect to the horizontal direction (XY direction) of the substrate holding portion base 220. Fig. 7 (a) is a side view, and fig. 7 (b) is a plan perspective view of the substrate W in a state of being removed. In the substrate holding portion 230, 2 positioning pins 253 protruding toward the substrate holding portion base 220 are provided. Further, the positioning member 254 and the pressing member 255 are provided on the substrate holding portion base 220 so as to sandwich the positioning pins 253 in the X direction or the Y direction. Specifically, the positioning member 254 and the pressing member 255 are provided so as to sandwich one positioning pin 253 in the Y direction, and the positioning member 254 and the pressing member 255 are arranged so as to sandwich the other positioning pin 253 in the X direction. In one example, as shown in fig. 7 (b), the contact portions of the 2 positioning members 254 with the positioning pins 253 are V-shaped and flat. Before fastening by the fastening portion 250, the positioning pins 253 are pressed by the pressing member 255 to move the substrate holding portion 230. By this pressing, the positioning pin 253 collides with the positioning member 254, thereby performing positioning.
In the positioned state, the fastening portion 250 performs fastening. If the fastening is completed, the pressing by the pressing member 255 may be released. The pressing member may be constituted by, for example, an air cylinder, an electric actuator, or the like. Further, the pressing may be performed at all times using a spring or the like.
In the example of fig. 7, the positioning is performed by pressing the positioning pins 253 provided in the substrate holding portion 230 against the positioning members 254, but the positioning may be performed by other structures. For example, positioning may be performed by providing a hole in the positioning member 254 and inserting the positioning pin 253 into the hole. This embodiment can be realized simply and at low cost because an actuator is not required. However, if the accuracy of the position of the hole for inserting the positioning pin 253 is low, there is a possibility that an error in positioning becomes large. This method can also be used if the amount of flatness variation of the substrate holding portion 230 due to the positional deviation of the holes is within an allowable range.
As described above, in the present embodiment, the fastening portion 250 is temporarily released to adjust the adjustment portion 240, and then the fastening portion 250 is fastened again. This can return the stress state and the flatness to the same state as in the adjustment.
Further, if the fastening portion 250 is configured to be remotely operable from the outside, the release and fastening can be performed in a short time by an instruction from the outside of the apparatus. Therefore, the device can also function as a maintenance operation during operation of the device, and is suitable for maintaining flatness.
(modification)
Fig. 5 shows a modification of the adjustment unit 240. In fig. 5, an adjustment mechanism for converting the volume movement of the incompressible fluid into the Z drive amount is used. In the example of fig. 5, the fixing portion 241 forms a container filled with a non-compressive fluid. The inside of the fixing portion 241 (container) is filled with an incompressible fluid 245 such as oil, and the liquid surface of the incompressible fluid 245 is sealed by a partition 244. Both end portions of the movable portion 242 are connected to a spacer 244. The incompressible fluid 245 is sent from the piston-type actuator 243 to the inside of the fixing portion 241 via a tube. The volume of the incompressible fluid 245 inside changes according to the amount of incompressible fluid sent from the actuator 243, and the diaphragm 244 deforms accordingly. The movable portion 242 moves upward (Z direction) by deformation of the diaphragm 244.
The length of the tube connecting the piston actuator 243 and the fixing portion 241 is arbitrary. Accordingly, the actuator 243 may be located outside the substrate holder base 220. Therefore, by controlling the piston portion from the outside, the substrate holding portion 230 can be remotely adjusted.
A hollow portion 246 is formed in a central portion (Z-axis center) of the adjustment portion 240, and the substrate holding portion 230 and the substrate holding portion base 220 are coupled to each other by a fastening portion 250 through the hollow portion 246 so as to sandwich the adjustment portion 240. With this structure, even if the fluid adjusting portion is used, the adjustment can be performed with high accuracy. In addition, when the incompressibility of the incompressibility fluid 245 is not complete, the mechanism is considered to have elasticity due to the elasticity of the separator and the tube. By actually measuring such elasticity in advance and adding it to the correction table, the adjustment accuracy can be improved.
The adjustment section using the incompressible fluid has a 2-axis tilting mechanism having a degree of freedom of tilting about the X-axis and about the Y-axis with respect to the movable section 242. That is, the movable portion 242 may include an inclination mechanism for allowing displacement of the substrate holding portion in a direction different from a direction in which the substrate holding portion 230 is applied. The effect of the 2-axis tilting mechanism is that the structure is less susceptible to the influence of the flatness of the back surface of the substrate holding portion 230, and the influence of local bending when driving to tilt the substrate holding portion 230 uniformly as a whole is eliminated, which is advantageous in terms of adjustment accuracy.
Such a 2-axis tilting mechanism can also be applied to an adjustment section (fig. 4) using the wedge mechanism described above. As an example, fig. 6 shows a structure of an adjustment portion 240 having a support member having a 2-axis tilting function on a movable portion 242. In fig. 6, a support member 256 that supports the substrate holding portion 230 is provided above the movable portion 242. The upper surface of the support member 256 is flat to receive the substrate holding portion 230, while the lower end of the support member 256 is a convex spherical surface. A spherical seat 242a is formed on the upper surface of the movable portion 242 on which the support member 256 is disposed. The spherical seat 242a is formed in a concave spherical shape so as to hold the lower end portion of the support member 256, which is formed in a convex spherical shape. The support member 256 is swingably supported by the spherical seat 242a of the movable portion 242. The support member 256 rotatably supported by the rocking motion in this way functions as a so-called "damper" mechanism that absorbs the variation in flatness of the back surface of the substrate holding section 230.
In addition, the damper mechanism can be realized by various structures such as a spherical +3 point support and a hinge mechanism. However, the elasticity of the damper mechanism needs to be considered. As described above, the elasticity of the damper mechanism is measured in advance, and correction can be performed by adding the influence thereof to the correction table.
< embodiment of article manufacturing method >
The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing an article such as a micro-device such as a semiconductor device or an element having a microstructure. The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate (a step of exposing the substrate) using the exposure apparatus, and a step of developing the substrate on which the latent image pattern is formed in the step. The above-mentioned production method includes other known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is more advantageous than conventional methods in at least 1 of performance, quality, productivity, and production cost of the article.
(other embodiments)
The present invention can also be realized by supplying a program that realizes 1 or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and reading out and executing the program by 1 or more processors in a computer of the system or apparatus. Further, the present invention can be realized by a circuit (for example, ASIC) that realizes 1 or more functions.
OTHER EMBODIMENTS
The embodiments of the present invention can also be realized by a method in which software (program) that performs the functions of the above embodiments is supplied to a system or apparatus, a computer of the system or apparatus or a method in which a Central Processing Unit (CPU), a Micro Processing Unit (MPU), or the like reads out and executes the program, through a network or various storage mediums.
The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.
Claims (13)
1. A stage device for holding a substrate and moving the substrate, comprising:
a base;
a substrate holding unit configured to hold the substrate at a position above the susceptor;
a plurality of adjustment sections provided between the base and the substrate holding section, the plurality of adjustment sections being configured to apply a force from below independently for each of a plurality of portions of the substrate holding surface in order to adjust a shape of a substrate holding surface of the substrate holding section; and
a plurality of fastening portions provided corresponding to the plurality of adjustment portions, the base and the substrate holding portion being fastened with a fastening member so as to sandwich the adjustment portions,
each of the plurality of adjustment portions has:
a movable portion that moves in contact with the substrate holding portion;
a fixed part arranged on the base and supporting the movable part; and
a hollow portion penetrating the movable portion and the fixed portion and communicating the base and the substrate holding portion,
each of the plurality of fastening parts including a lever as the fastening member, connecting the base and the substrate holding part,
the lever is disposed inside the hollow portion and concentrically with the movable portion.
2. The stage device according to claim 1, wherein,
each of the plurality of fastening portions is configured to be switchable between a fastening state in which the base and the substrate holding portion are fastened, and a release state in which the fastening of the base and the substrate holding portion is released.
3. The stage device according to claim 2, wherein,
at least 1 fastening portion corresponding to at least 1 adjusting portion of the plurality of fastening portions is switched to the released state while the adjustment is performed in at least 1 adjusting portion of the plurality of adjusting portions.
4. The stage device according to claim 2, wherein,
each of the plurality of fastening parts further includes:
and a driving unit provided on the base and configured to drive the lever by pulling the lever, wherein the fastening state is obtained by pulling the lever with a predetermined force by the driving unit.
5. The stage device according to claim 4, wherein,
each of the plurality of adjustment portions further includes:
an actuator drives the movable portion.
6. The stage device according to claim 1, wherein,
the movable portion includes a tilting mechanism for allowing displacement of the substrate holding portion in a direction different from a direction in which the force is applied to the substrate holding portion.
7. The stage device according to claim 5, wherein,
each of the plurality of adjustment portions further has a wedge component that is moved in a horizontal direction above the fixed portion by the actuator,
the movable portion moves upward in response to movement of the wedge member.
8. The stage device according to claim 5, wherein,
the fixing portion is formed with a container filled with a non-compressive fluid,
each of the plurality of adjustment portions further has a partition plate that seals a liquid surface of the incompressible fluid filled in the container,
the actuator is configured to deliver a non-compressible fluid to the container,
the movable portion moves upward in association with deformation of the diaphragm caused by feeding non-compressible fluid into the container through the actuator.
9. The stage device according to claim 2, wherein,
further comprises a positioning mechanism for positioning the substrate holding portion in the horizontal direction relative to the base,
the positioning is performed by the positioning mechanism after the plurality of fastening portions are set to the released state, and the plurality of fastening portions are set to the fastened state after the positioning is performed.
10. The mounting table device according to claim 3, further comprising:
a control section that controls each of the plurality of adjustment sections and each of the plurality of fastening sections; and
a measuring section that measures flatness of the substrate held by the substrate holding section,
the substrate holding surface is divided into a plurality of regions,
the control section controls the at least 1 adjustment section so that a step difference between ends of adjacent ones of the plurality of regions becomes small and the substrate holding surface becomes flat after setting the at least 1 fastening section to the released state, based on a measurement result of the measurement section.
11. A method for adjusting a mounting table device is characterized in that,
the stage device includes: a base; a substrate holding unit configured to hold the substrate at a position above the susceptor; a plurality of adjustment sections provided between the base and the substrate holding section, the plurality of adjustment sections being configured to apply a force from below independently for each of a plurality of portions of the substrate holding surface in order to adjust a shape of a substrate holding surface of the substrate holding section; and a plurality of fastening portions provided corresponding to the plurality of adjustment portions, the plurality of fastening portions being configured to fasten the susceptor and the substrate holding portion with the adjustment portion interposed therebetween by using a fastening member,
each of the plurality of adjustment portions has:
a movable portion that moves in contact with the substrate holding portion;
a fixed part arranged on the base and supporting the movable part; and
a hollow portion penetrating the movable portion and the fixed portion and communicating the base and the substrate holding portion,
each of the plurality of fastening parts including a lever as the fastening member, connecting the base and the substrate holding part,
the lever is disposed inside the hollow portion and concentrically with the movable portion, and the adjustment method includes:
a step of setting at least 1 fastening portion corresponding to at least 1 adjustment portion among the plurality of fastening portions to a release state in which fastening between the base and the substrate holding portion is released, in order to perform adjustment in at least 1 adjustment portion among the plurality of adjustment portions;
a step of adjusting by the at least 1 adjusting portion after setting the at least 1 fastening portion to the released state; and
and a step of setting the at least 1 fastening portion to a fastened state for fastening the base and the substrate holding portion after the adjustment by the at least 1 adjustment portion.
12. An exposure apparatus for exposing a substrate, characterized in that,
a mounting table device according to any one of claims 1 to 10 having the substrate held thereon.
13. A method of manufacturing an article, comprising:
a step of exposing a substrate using the exposure apparatus according to claim 12; and
a step of developing the substrate after exposure,
an article is manufactured from the developed substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019189656A JP7406338B2 (en) | 2019-10-16 | 2019-10-16 | Stage device, stage device adjustment method, and article manufacturing method |
| JP2019-189656 | 2019-10-16 |
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| Publication Number | Publication Date |
|---|---|
| CN112666797A CN112666797A (en) | 2021-04-16 |
| CN112666797B true CN112666797B (en) | 2024-04-02 |
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| CN202011091475.8A Active CN112666797B (en) | 2019-10-16 | 2020-10-13 | Stage device, method for adjusting stage device, exposure device, and method for manufacturing article |
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| Country | Link |
|---|---|
| JP (1) | JP7406338B2 (en) |
| KR (1) | KR20210045312A (en) |
| CN (1) | CN112666797B (en) |
| TW (1) | TWI833991B (en) |
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| KR20180045666A (en) * | 2016-10-26 | 2018-05-04 | 삼성전자주식회사 | Apparatus for producting substrate |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202134794A (en) | 2021-09-16 |
| JP2021063953A (en) | 2021-04-22 |
| TWI833991B (en) | 2024-03-01 |
| JP7406338B2 (en) | 2023-12-27 |
| CN112666797A (en) | 2021-04-16 |
| KR20210045312A (en) | 2021-04-26 |
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