CN112666797A - Stage apparatus, method of adjusting stage apparatus, exposure apparatus, and method of manufacturing article - Google Patents
Stage apparatus, method of adjusting stage apparatus, exposure apparatus, and method of manufacturing article Download PDFInfo
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- CN112666797A CN112666797A CN202011091475.8A CN202011091475A CN112666797A CN 112666797 A CN112666797 A CN 112666797A CN 202011091475 A CN202011091475 A CN 202011091475A CN 112666797 A CN112666797 A CN 112666797A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a stage device and an adjustment method thereof, an exposure apparatus, and an article manufacturing method. Provided is a mounting table device which is advantageous in both accuracy of flatness of a substrate holding section and adjustment speed. The mounting table device for holding and moving a substrate includes: a base; a substrate holding unit configured to hold the substrate at a position above the susceptor; a plurality of adjusting portions provided between the susceptor and the substrate holding portion, the adjusting portions independently applying a force from below to each of a plurality of portions of the substrate holding surface in order to adjust a shape of the substrate holding surface of the substrate holding portion; and a plurality of fastening portions provided corresponding to each of the plurality of adjustment portions, and configured to fasten the base and the substrate holding portion in a state of sandwiching the adjustment portion therebetween using a fastening member.
Description
Technical Field
The invention relates to a stage device, a stage device adjustment method, an exposure apparatus, and an article manufacturing method.
Background
In a photolithography process which is a manufacturing process of a flat panel display or the like, an exposure apparatus of a step and scan (scanner) system is used. The scanner type exposure apparatus synchronously drives a photomask (original plate) and a glass substrate in a scanning direction while irradiating exposure light only in a slit-shaped exposure region, and optically transfers a pattern formed on the mask onto the substrate. As flat panel displays have been made higher in definition and higher in performance, the transfer pattern has been made finer, and a scanner exposure apparatus is required to achieve a higher resolution.
In order to improve the resolution, a method of increasing the aperture ratio (NA) of the projection optical system is generally employed. However, according to the rayleigh criterion, the resolution of the exposure apparatus increases in inverse proportion to the aperture ratio (NA) of the projection optical system, whereas the depth of focus (DOF) of the projection optical system decreases in inverse proportion to the square of the aperture ratio. That is, the resolution and the depth of focus are generally in a trade-off relationship. Therefore, in an exposure apparatus using a projection optical system having a high resolution, it is a very important issue to secure a depth of focus.
In order to achieve a desired resolution, it is necessary to bring the sum of various focus-inhibiting elements such as aberration of an optical system, mask flatness, substrate flatness, and the like into the depth of focus. Therefore, in order to achieve high resolution, a substrate holding portion that holds a substrate in contact with the substrate is generally required to have high flatness. Further, since the margin for the change of the components with time and the change of the apparatus environment such as the apparatus temperature is also small, it is necessary to maintain the high flatness of the substrate for a long time or to maintain the flatness by readjusting the apparatus for maintenance.
In order to achieve high flatness of the substrate holding portion, high-precision processing of the substrate holding portion and height adjustment at the time of assembly are performed. Patent document 1 describes that, during machining, machining is performed while reproducing the same stress state as that during actual use, and that, during assembly of the substrate holding portion, a height adjustment portion is provided immediately below the substrate holding portion and is driven in the height direction, thereby achieving a predetermined flatness. In addition, in patent document 1, the coupling state between the substrate holding portion and the adjustment movable portion (the adjustment portion has a movable portion driven in the height direction and a fixed portion fixed to the base (base) side) can be switched by vacuum adsorption or magnetic force. The flatness of the substrate holding portion is adjusted by a step of releasing the bonding before the height adjusting portion is driven and then bonding after the driving. This prevents stress from being generated and remaining due to distortion occurring in the substrate holding portion accompanying the height adjustment, and prevents flatness from being changed due to relaxation of the remaining stress with time.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5932305
Disclosure of Invention
Problems to be solved by the invention
However, the substrate holding portion needs to have a function of adsorbing and holding the substrate, and therefore needs to have a size of the same degree as the substrate, for example, one side of the substrate reaches 2500mm in the G8.5 generation. In many cases, a light metal such as aluminum or ceramics is used as a material for the substrate holding portion, but when the substrate holding portion is integrally formed, there are problems such as a problem of availability of the material and a limitation on a processing machine, and the manufacturing is difficult or extremely costly. Even if the substrate holder can be integrally manufactured, the rigidity of the member is required to process a large substrate holding portion capable of holding the entire surface of a substrate having such a size by suction with high flatness. This means that the substrate holding portion becomes thick and heavy. Since the substrate holding portion is formed on the substrate mounting table and is driven in a plane together with the substrate mounting table, the weight of the component increases, and the load of the actuator of the substrate mounting table increases, which results in unnecessarily enlarging the substrate mounting table.
In contrast, by dividing the substrate holding portion into a plurality of portions and reducing the size of each portion, problems such as availability of materials and limitation of processing machines can be alleviated. However, in order to improve the machining accuracy of the individual products, it is necessary to improve the component rigidity as in the case of integration. In addition, when the substrate holding portions are divided, a height difference occurs at the adjacent side between the adjacent substrate holding portions, and the flatness changes rapidly at such a portion, so that a pattern defect may occur at the time of exposure. Therefore, the adjustment near the abutting edge requires more precision.
In consideration of such a situation, the technique of patent document 1 causes the following inconvenience. Patent document 1 describes that the substrate holding portion and the adjustment movable portion are coupled to each other by vacuum suction or vacuum suction assisted by magnetic force, but there is no description about the relationship between these coupling forces and the rigidity of the substrate holding portion. Therefore, in order to partially adjust the substrate holding portion, when the substrate holding portion is deformed, it is estimated that the rigidity of the substrate holding portion overcomes the vacuum suction force according to the adjustment amount, and not only the adjustment becomes unstable but also the adjustment may become impossible. For example, in the case of adjustment in a direction in which the height of 5 μm is partially reduced, the chuck needs to be locally deformed by 5 μm by a bonding force of vacuum suction, but if only 2 μm can be deformed by the vacuum suction force, 3 μm remains as an unadjustable amount. When the adjustment amount is further increased, the vacuum leakage becomes large and the coupling force becomes further weak, and therefore, there is a case where adjustment cannot be performed at all.
Further, in patent document 1, the substrate holding portion and the adjusting movable portion are coupled, but there is no description about the relationship between the rigidity of the substrate holding portion and the rigidity of the adjusting portion itself (the rigidity between the adjusting movable portion and the adjusting fixed portion). Therefore, for the same reason, the adjustment portion is deformed, and the adjustment may become unstable and may become impossible. For example, when the adjusting portion is driven in a direction to partially reduce the height by 5 μm, the adjusting movable portion itself is pulled upward according to the stiffness ratio of the adjusting portion and the substrate holding portion. This may cause the adjusting portion to be lowered by 5 μm, but to be deformed upward by 3 μm, and the substrate holding portion to be lowered by only 2 μm. In order to lower the substrate holding portion by 5 μm, it is necessary to further lower the substrate adjusting portion and then vacuum-adsorb it, but the vacuum leakage at the start of adsorption becomes large and the bonding force becomes further weak and cannot be adjusted in some cases.
The adjustment mechanism of patent document 1 is unstable at the time of adjustment, and not only adjustment accuracy is difficult, but also adjustment itself may become impossible depending on the adjustment amount. Further, since the adjustment accuracy is low, it is necessary to repeat press-fitting adjustment a plurality of times to achieve a predetermined accuracy, and time is required for adjustment.
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a mounting table device which is advantageous in both accuracy of flatness of a substrate holding portion and adjustment speed, for example.
Means for solving the problems
According to the 1 st aspect of the present invention, there is provided a mounting table apparatus for holding a substrate and moving the substrate, comprising: a base; a substrate holding portion that holds the substrate at a position above the susceptor; a plurality of adjusting portions provided between the susceptor and the substrate holding portion, the adjusting portions independently applying a force from below to each of a plurality of portions of the substrate holding surface in order to adjust a shape of the substrate holding surface of the substrate holding portion; and a plurality of fastening portions provided corresponding to each of the plurality of adjustment portions, and configured to fasten the base and the substrate holding portion in a state of sandwiching the adjustment portion therebetween using a fastening member.
According to a second aspect of the present invention, there is provided a method of adjusting a mounting table apparatus, comprising: a base; a substrate holding portion that holds the substrate at a position above the susceptor; a plurality of adjusting portions provided between the susceptor and the substrate holding portion, the adjusting portions independently applying a force from below to each of a plurality of portions of the substrate holding surface in order to adjust a shape of the substrate holding surface of the substrate holding portion; and a plurality of fastening portions provided corresponding to each of the plurality of adjustment portions, the base and the substrate holding portion being fastened in a state in which the adjustment portion is sandwiched by fastening members, the adjustment method including: setting at least 1 of the plurality of tightening portions corresponding to the at least 1 adjusting portion to a released state in which tightening of the base and the substrate holding portion is released in order to perform adjustment in at least 1 of the plurality of adjusting portions; a step of performing adjustment by the at least 1 adjusting section after the at least 1 tightening section is set to the released state; and setting the at least 1 fastening portion to a fastened state in which the base and the substrate holding portion are fastened, after the adjustment by the at least 1 adjusting portion.
According to the 3 rd aspect of the present invention, there is provided an exposure apparatus for exposing a substrate, comprising the stage apparatus according to the 1 st aspect of the present invention for holding the substrate.
According to a 4 th aspect of the present invention, there is provided an article manufacturing method including: exposing a substrate using the exposure apparatus according to the 3 rd aspect; and a step of developing the substrate after exposure, wherein the article manufacturing method manufactures an article from the substrate after development.
According to the present invention, for example, a mounting table device advantageous in both accuracy of flatness of a substrate holding portion and adjustment speed can be provided.
Drawings
Fig. 1 is a diagram illustrating a configuration of an exposure apparatus in an embodiment.
Fig. 2 is a diagram showing a structure of a substrate mounting table in the embodiment.
Fig. 3 is a diagram showing a detailed configuration of the substrate mounting table in the embodiment.
Fig. 4 is a diagram showing a configuration of an adjusting unit in the embodiment.
Fig. 5 is a diagram showing a configuration of an adjusting portion according to a modification.
Fig. 6 is a diagram showing a configuration of an adjusting portion according to a modification.
Fig. 7 is a diagram showing a structure of a positioning mechanism of a substrate holding portion in the embodiment.
(symbol description)
220: a substrate holding portion base; 230: a substrate holding section; 240: an adjustment part; 241: a fixed part; 242: a movable part; 243: an actuator; 250: a fastening section; 251: a drive section; 252: a rod.
Detailed Description
The embodiments are described in detail below with reference to the accompanying drawings. The invention according to the claims is not limited to the following embodiments. A plurality of features are described in the embodiments, but not all of the plurality of features are essential to the invention, and a plurality of features may be arbitrarily combined. In the drawings, the same or similar components are denoted by the same reference numerals, and redundant description thereof is omitted.
First, an exposure apparatus to which the stage apparatus of the present invention is applied will be described. In the following description, specific configurations, operations, and the like are described, but the specific configurations, operations, and the like can be appropriately changed.
Fig. 1 is a schematic view of an exposure apparatus according to an embodiment. In the present specification and the drawings, directions are indicated in an XYZ coordinate system in which a horizontal plane is an XY plane. Generally, a substrate W as an exposure target substrate is placed on the substrate stage 20 so that the surface thereof is parallel to a horizontal plane (XY plane). Therefore, directions orthogonal to each other in a plane along the surface of the substrate W are hereinafter referred to as X-axis and Y-axis, and a direction perpendicular to the X-axis and the Y-axis is hereinafter referred to as Z-axis. Hereinafter, directions parallel to the X, Y, and Z axes in the XYZ coordinate system are referred to as the X, Y, and Z directions, and a rotation direction around the X axis, a rotation direction around the Y axis, and a rotation direction around the Z axis are referred to as the θ X direction, the θ Y direction, and the θ Z direction, respectively.
The exposure apparatus may include a projection optical system 10, a substrate stage 20 as a stage apparatus that holds a substrate W, a mask stage 30 that holds a mask M as an original plate, an illumination optical system 40, an interferometer 50, and a main body base 60. The projection optical system 10 projects the pattern of the mask M held by the mask stage 30 onto the substrate W held by the substrate stage 20. The projection is performed by diffracted light emitted from the mask M by light of the light source of the illumination optical system 40 irradiated toward the mask M. Further, an observation optical system 41 may be disposed between the illumination optical system 40 and the mask M. The observation optical system 41 can observe an image formed on the substrate W by the mask M and the projection optical system 10.
The mask M is sucked and held on the mask holding portion 32 in the mask stage 30. The mask holding portion 32 is disposed on the mask stage base 31. The mask M can be moved in the X direction and the Y direction by moving the mask stage 30 in the X direction and the Y direction. Here, the Y direction is a sweep (scan) direction (scanning direction) in the scanning exposure, and the X direction is a step direction (non-scanning direction). That is, the direction in which the mask stage 30 and the substrate stage 20 are synchronously scanned during projection exposure is the Y direction. The mask M is movable in a rotational direction (θ z direction) in which the mask M rotates within the X, Y plane formed by the 2-axis in the X, Y direction.
The pattern transfer from the mask M to the substrate W is performed by performing synchronous scanning with projection exposure at the same speed ratio as the magnification ratio of the mask M and the substrate W. Each region on the substrate W to which the pattern of the mask M is transferred is referred to as a shot (shot) region. Further, on the substrate W, alignment marks, not shown, used for alignment of the respective imaging regions and the mask are formed. The alignment mark can be observed by the observation optical system 41.
The interferometer 50 measures the positions of the mask stage 30 and the substrate stage 20. The interferometer 50 may include a laser head 51 which becomes a light source of the detection light, a beam splitter 52, a bending mirror 53, and strip mirrors 54 and 55 which reflect the detection light.
The substrate mounting table 20 is a mounting table device that can be driven at least in the 2-axis XY direction. The substrate stage 20 can move the substrate W to a predetermined exposure position (imaging position) with respect to the mask M, and perform position alignment based on a correction value obtained from a measurement result based on the alignment mark of the observation optical system 41. Thereafter, the substrate stage 20 can be scan-driven in synchronization with the mask stage 30 at the time of scan exposure. The substrate stage 20 may be driven in each direction of Z, θ x, θ y, and θ Z for alignment and focus correction. However, in fig. 1, the driving mechanism for the substrate mounting table 20 in each direction is not shown. The stage base 21 is disposed on the main body base 60, and the strip mirror 54 and the substrate W are disposed on the stage base 21.
The control section 70 controls each section of the exposure apparatus. The control unit 70 may be implemented by a computer including a CPU and a memory. The control unit 70 may be connected to each part of the exposure apparatus by wire or wirelessly, and may be provided separately from each part of the exposure apparatus. Thereby, the exposure apparatus can be remotely operated.
Fig. 2 is a diagram showing the structure of the substrate mounting table 20. A stage base 21 is disposed on the main body base 60, and a substrate holding portion base 220 (base) is disposed on the stage base 21. In addition, the association of the substrate holding portion base 220 and the stage base 21 is not important in the present disclosure. The substrate holding portion base 220 and the stage base 21 may be fixed to each other by separate members, or may be coupled to each other via some driving shafts. Alternatively, the substrate holding portion base 220 and the mounting table base 21 may be integrally formed. The mounting table base 21 is provided with a driving mechanism for driving in each direction of Z, θ x, θ y, and θ Z, but the illustration and description of the configuration thereof are omitted.
A substrate holding portion 230 for holding the substrate W is disposed above the substrate holding portion base 220. A plurality of adjusting parts 240 are disposed between the substrate holding part base 220 and the substrate holding part 230. The plurality of adjusting portions 240 are configured to apply force independently from below to each of a plurality of portions of the substrate holding surface in order to adjust the shape of the substrate holding surface of the substrate holding portion 230. The substrate W is fixed to the substrate holding portion 230 by vacuum suction. In the embodiment, the substrate holding surface of the substrate holding portion 230 is divided into a plurality of regions. The substrate holding portion 230 is provided with a suction groove, a pneumatic pipe, a pneumatic control device, and the like for sucking and fixing the substrate W, but the illustration and description of the configuration thereof are omitted. Further, a strip mirror 54 of the interferometer 50 is disposed on the stage base 21.
The flatness of the substrate holding surface of the substrate holding portion 230 contacting the substrate W can be measured by the height sensor 42 (measuring portion) shown in fig. 1. The height sensor 42 may be provided inside the exposure apparatus or may be provided outside the exposure apparatus. The flatness of the substrate holder 230 can be measured by measuring the Z-direction height of the substrate holder 230 with respect to the plurality of site height sensors 42 while moving the substrate holder 230 in the XY direction.
Fig. 3 is a diagram illustrating a detailed configuration of the substrate stage 20. Each of the plurality of adjusting parts 240 may include a movable part 242 that moves in contact with the substrate holding part 230, a fixed part 241 that is disposed on the substrate holding part base 220 and supports the movable part 242, and an actuator 243 that drives the movable part 242. The actuator 243 includes a motor, a speed reduction mechanism, a drive conversion mechanism, and the like, and may further include a driver board, a control board, an encoder for calculating a drive position of the motor, an origin sensor, and the like. Further, the actuator 243 may be provided with a cable, not shown, connected to a higher-level control system, a power supply circuit, and the like. The fixing portion 241 is fixed on the substrate holder base 220. The movable portion 242 is movable in the Z direction with respect to the fixed portion 241. The linear motion or rotational drive amount output from the actuator 243 is converted into a linear motion in the Z direction inside the fixed portion 241, and is output as a drive output in the Z direction of the movable portion 242. As for the specific configuration of the adjusting unit 240, various configurations can be considered depending on the type of the actuator 243, the type of the Z-conversion mechanism, and the like, and fig. 4 shows an example.
The adjusting unit 240 in fig. 4 employs a wedge mechanism as the Z-conversion mechanism, and employs the linear drive amount of the slide feed screw as the output of the actuator 243. The adjusting part 240 has a wedge member 241a that is moved in the horizontal direction (Y direction) by an actuator 243 on a bottom part 241b of the fixing part 241. The upper surface of the wedge member 241a is a sloped surface inclined with respect to the Y direction. A movable portion 242 is mounted on the wedge member 241 a. The lower surface of the movable portion 242, which abuts the upper surface of the wedge member 241a, is a sloped surface corresponding to the sloped surface of the upper surface of the wedge member 241a such that the upper surface of the movable portion 242 is horizontal. The movable portion 242 is restricted from moving in the X and Y directions by the vertical wall of the fixed portion 241, and can move only in the Z direction.
A feed screw 243a extending in the Y direction for driving the wedge member 241a in the Y direction is attached to a side surface of the wedge member 241 a. The rotation of the feed screw 243a is provided by a rotary motor 243c via a speed reducer 243 b. By the rotation of the feed screw 243a, the wedge member 241a moves in the Y direction. The movable portion 242 moves upward (Z direction) by an amount corresponding to the wedge ratio in accordance with the movement of the wedge member 241a in the Y direction.
In this case, the resolution in the Z direction of the mechanism can be improved by making the wedge ratio as large as 25 to 100. Further, by appropriately setting the reduction ratio of the speed reducer 243b, the output of the rotation motor 243c can be made small, and the mechanism as a whole can be realized by a very small motor. This suppresses the space for disposing the adjusting unit 240, and accordingly contributes to the reduction in size and weight of the entire mounting table.
As the mechanism of the speed reducer 243b, a worm gear, a gear train, a planetary gear train, or the like can be used. As the rotation motor 243c, various types of rotation motors such as a DC motor, a stepping motor, an AC motor, and an ultrasonic motor can be used. In addition, an encoder may be disposed in the rotation motor 243c, and the driving amount of the adjustment unit 240 may be estimated using the encoder. The product of the reduction ratio by the reduction gear, the reduction ratio by the screw mechanism, and the reduction ratio by the wedge mechanism is the reduction ratio of the entire mechanism. Since the present apparatus is configured as a mechanism having a very large reduction ratio, the resolution in the Z direction of the submicron order can be realized even if the resolution of the encoder is relatively coarse. Therefore, even a compact structure such as that of detecting a large number of slits circularly arranged on a circular plate by a photo interrupter can achieve sufficient resolving power. Further, since the mechanism for driving the wedge mechanism by the slide feed screw is a mechanism that self-locks by internal friction against a force in the-Z direction, the speed reducer and the motor shaft do not rotate in the reverse direction, and the rigidity in the-Z direction is very high. Further, the wedge mechanism is a mechanism having zero rigidity in the + Z direction, but as described below, the substrate holding portion 230 and the substrate holding portion base 220 are fastened by the fastening portion 250 via the adjusting portion 240, and therefore only the rigidity in the-Z direction may be considered.
The substrate stage in the embodiment has a plurality of fastening portions 250. Each of the plurality of fastening portions 250 is provided corresponding to each of the plurality of adjusting portions 240, and the substrate holding portion base 220 and the substrate holding portion 230 are fastened in a state of sandwiching the adjusting portions 240 using a fastening member. The fastening portion 250 includes a rod 252 as a fastening member extending in the Z direction between the substrate holding portion base 220 and the substrate holding portion 230 to connect them, and a driving portion 251 for driving the rod 252. A through hole is formed in the substrate holding portion 230, and the rod 252 passes through the through hole. The head 252a of the rod 252 has a larger diameter than the through hole, and the head 252a cannot penetrate the through hole. In the substrate holding portion 230, a recess for accommodating the head portion 252a is formed in an upper portion of the through hole, and the head portion 252a does not protrude above the upper surface of the substrate holding portion 230 in a normal state.
The driving unit 251 is configured inside the substrate holder base 220, and the tip end portion of the rod 252 is attached to the driving unit 251. The driving portion 251 performs pulling/releasing of the lever 252. The substrate holder 230 and the substrate holder base 220 are coupled to each other by a predetermined force F via the adjusting unit 240 by the driving unit 251 pulling the rod 252 with the predetermined force F. As examples of the method, various embodiments are conceivable, such as a method of performing push-pull driving by an air cylinder, a method of performing push-pull driving by a hydraulic cylinder, a method of generating a traction force F by a spring or the like and providing a pushing force for canceling the traction force F by a linear cylinder or the like to release fastening, and the like. Instead of the cylinder, an electric linear actuator may be used, or a pressurizing mechanism may be mounted in the cylinder to save space. Further, a screw may be formed in the rod 252, and the screw may be rotated by a motor built in the driving unit 251, and a predetermined torque may be supplied by a torque limiter to fasten the screw.
The fastening portion 250 is configured to facilitate extension of the tube to the outside of the substrate holding portion if fluid driving is performed, and to facilitate extension of the cable to the outside of the substrate holding portion if electric driving is performed, and to enable remote operation from the control portion 70 or an external control device. By configuring both the adjustment unit 240 and the tightening unit 250 to be remotely operable from the outside, flatness adjustment can be performed in a very short time.
The fastening force F required for the fastening portion 250 may be determined as follows.
First, the adjustment amount required for the substrate holding portion 230 is determined. Factors of reducing flatness, such as flatness of the upper surface of the substrate holding portion base 220, flatness of the substrate holding portions 230, and difference in thickness between adjacent substrate holding portions 230, are extracted, and the total of these factors is determined as a required maximum adjustment amount.
Next, the reaction force generated when the determined required maximum adjustment amount is supplied to the support adjustment point of each of the plurality of substrate holding portions 230 is calculated using FEM or the like. And determining a value obtained by multiplying the calculated reaction force by the safety factor as the required fastening force.
As long as the tightening part 250 generates the tightening force F, the substrate holding part 230, the adjusting part 240, and the substrate holding part base 220 can be securely attached by the sandwiching and joining by the tightening part 250. In this state, the driving amount of the adjusting unit 240 is directly reflected in the amount of change in the flatness of the substrate holding unit 230, and thus the flatness can be adjusted with high accuracy.
Next, a method of adjusting flatness and a method of calculating the driving amount of the adjusting unit 240 will be described. As described above, the flatness of the substrate holding portion 230 can be measured using the height sensor 42. The flatness is obtained by sequentially driving the substrate mounting table 20 and measuring the entire surface of the substrate holding portion 230 at predetermined intervals by the height sensor 42.
Next, the adjustment amount of each of the plurality of adjustment sections 240 is calculated. For example, the relationship between the driving amount of the plurality of adjusting portions 240 and the deformation amount of the substrate holding portion 230 is obtained in advance by FEM or actual measurement for each of the plurality of adjusting portions 240, and stored as a correction table. Based on the correction table and the measurement result of the flatness, the adjustment amounts of the respective adjustment units 240 are inverted using a least square method or the like so that the adjusted flatness becomes minimum.
By adjusting the plurality of adjusting portions 240 by the adjustment amounts of the plurality of adjusting portions 240 calculated in this way, it is possible to perform adjustment with high accuracy while covering the step differences and local irregularities between the plurality of regions of the substrate holding portion. However, in this case, stress remains inside the substrate holding portion 230 and the residual stress is relaxed with time, and thus there is a possibility that a change in flatness occurs.
Therefore, in the present embodiment, each of the plurality of fastening portions 250 is configured to be capable of switching control to a fastened state in which the substrate holding portion base 220 and the substrate holding portion 230 are fastened and a released state in which the fastening of the substrate holding portion base 220 and the substrate holding portion 230 is released. While the adjustment is performed in at least 1 of the plurality of adjustment portions 240, at least 1 of the plurality of tightening portions 250 corresponding to the at least 1 adjustment portion can be switched to the released state.
For example, the control section 70 is configured to control each of the plurality of adjusting sections 240 and each of the connecting sections of the plurality of fastening sections 250. The control section 70 controls the at least 1 adjusting section so that the step between the end portions of the adjacent ones of the plurality of regions becomes small and the substrate holding surface becomes flat after setting the at least 1 tightening section to the released state based on the measurement result of the height sensor 42 as the measuring section.
With the above configuration, the following method for adjusting the mounting table apparatus is realized. The coupling of the fastening part 250 is temporarily released. After the coupling of the tightening part 250 is released, the adjustment by at least 1 adjusting part is performed by the adjusting amount of each of the plurality of adjusting parts 240 calculated in the previous step. After the adjustment, the fastening portion is brought into a fastened state. In the adjustment by the adjustment portions, the adjustment portions may be sequentially driven, or all the adjustment portions may be simultaneously driven. In this case, the driving amount can be secured using information of the encoder of the actuator 243 built in each adjusting unit. Alternatively, the height sensor 42 may be used to measure the support adjustment position of each adjustment unit or its vicinity, and the driving amount may be secured based on the measurement result. In the former case, the driving accuracy depends on the driving accuracy of the encoder and the adjusting unit 240 as a whole. However, all the adjustment mechanisms can be driven simultaneously accordingly, so the adjustment time itself can be shortened. In the latter case, since the measurement using the height sensor 42 is required at or near the support adjustment position of each of the adjustment units 240, the table needs to be moved at regular intervals. Then, at each support adjustment position, whether or not to drive by a predetermined adjustment amount is secured by the steps of measurement, release of fastening, driving of the adjustment portion, fastening, and measurement. Therefore, the adjustment time itself becomes long although the adjustment accuracy is high. In the case where the adjusting portion 240 is elastic, the adjusting portion can be deformed by an amount corresponding to the fastening force F and the elastic constant. In this case, by calculating or actually measuring the elastic constant in advance and adding it as a correction value to the correction table, adjustment in consideration of the influence of elasticity can be performed. However, since the error component increases, there is a possibility that the adjustment accuracy is reduced accordingly. Therefore, from the viewpoint of adjustment accuracy, it is advantageous that the adjustment unit 240 is rigid.
In the same manner, a case is considered where the rigidity of the substrate holding portion base 220 is not negligible with respect to the rigidity of the substrate holding portion 230. In this case, correction can also be performed by creating a correction table by performing FEM including the rigidity of the substrate holding portion base 220. However, in this case, the error component also still increases, so that higher rigidity than the substrate holding portion 230 is desirable.
In the embodiment, the rod 252 is disposed concentrically (coaxially) with the movable portion 242. For example, a hollow portion 246 is formed to penetrate the movable portion 242 and the fixed portion 241 and to communicate the substrate holding portion base 220 and the substrate holding portion 230. The rod 252 is disposed inside the hollow portion 246, so that the rod 252 can be disposed concentrically (coaxially) with the movable portion 242. This prevents a moment from being generated due to a shift in the point of application of the tightening force F. Further, it is possible to prevent the correction table for flatness adjustment from generating a large error amount due to the complicated deformation of the substrate holding portion 230. With the above configuration, the flatness can be adjusted with high accuracy.
If the position of the substrate holding portion 230 is displaced when the substrate holding portion 230 is fastened by the fastening portion 250, the point of action of the fastening force F is displaced to generate a moment, and the flatness of the substrate holding portion 230 may be changed according to the moment. Therefore, it is desirable to perform positioning of the substrate holding portion 230 after the fastening portion 250 is set to the released state, and set it to the fastened state after the positioning is performed. Therefore, a positioning mechanism for correcting the positional deviation of the substrate holding portion 230 may be provided between the substrate holding portion 230 and the substrate holding portion base 220.
Fig. 7 shows an example of a positioning mechanism of the substrate holding portion 230. The positioning mechanism performs positioning of the substrate holder 230 in the horizontal direction (XY direction) with respect to the substrate holder base 220. Fig. 7(a) is a side view, and fig. 7(b) is a plan perspective view of the substrate W removed. In the substrate holding portion 230, 2 positioning pins 253 protruding toward the substrate holding portion base 220 are provided. Further, on the substrate holding portion base 220, a positioning member 254 and a pressing member 255 are provided so as to sandwich each positioning pin 253 along the X direction or the Y direction. Specifically, the positioning member 254 and the pressing member 255 are provided so as to sandwich one positioning pin 253 along the Y direction, and the positioning member 254 and the pressing member 255 are arranged so as to sandwich the other positioning pin 253 along the X direction. In one example, as shown in fig. 7(b), the contact portions with the positioning pins 253 of the 2 positioning members 254 are formed in a V-shape on one side and in a flat shape on the other side. Before the fastening by the fastening portion 250, the substrate holding portion 230 is moved by pressing the positioning pin 253 into the pressing member 255. By this pressing, the positioning pin 253 hits the positioning member 254, and positioning is performed.
In the positioned state, the fastening portion 250 fastens the object. If the fastening is completed, the pressing by the pressing member 255 may also be released. The pressing member may be configured by, for example, an air cylinder or an electric actuator. Further, a spring or the like may be used to always press the sheet.
In the example of fig. 7, the positioning pins 253 provided in the substrate holding portion 230 are pressed against the positioning members 254 to perform positioning, but positioning may be performed by another configuration. For example, positioning may be performed by providing a hole in the positioning member 254 and inserting the positioning pin 253 into the hole. This method can be realized simply and at low cost because no actuator is required. However, if the accuracy of the position of the hole for inserting positioning pin 253 is low, the error of positioning may increase. This mode can also be used if the amount of change in flatness of the substrate holding portion 230 due to the positional deviation of the holes is within the allowable range.
As described above, in the present embodiment, the tightening unit 250 is once released to adjust the adjustment unit 240, and then the tightening unit 250 is tightened again. This makes it possible to return the stress state and flatness to the same states as those in the adjustment.
Further, if the tightening section 250 is configured to be remotely operable from the outside, releasing and tightening can be performed in a short time by a command from the outside of the apparatus. Therefore, the device can function as a maintenance operation during operation of the device, and is suitable for maintaining flatness.
(modification example)
Fig. 5 shows a modification of the adjusting unit 240. In fig. 5, an adjustment mechanism for converting the volume movement of the incompressible fluid into the Z drive amount is used. In the example of fig. 5, the fixing portion 241 forms a container filled with a non-compressible fluid. The inside of the fixing portion 241 (container) is filled with a non-compressible fluid 245 such as oil, and the liquid surface of the non-compressible fluid 245 is sealed by the partition plate 244. Both ends of the movable portion 242 are connected to the partition 244. The incompressible fluid 245 is sent from the piston-type actuator 243 to the inside of the fixing portion 241 through a pipe. Depending on the amount of the incompressible fluid sent from the actuator 243, the volume of the internal incompressible fluid 245 changes, and the diaphragm 244 deforms accordingly. The movable portion 242 moves upward (Z direction) due to the deformation of the partition 244.
The length of the pipe connecting the piston-type actuator 243 and the fixing portion 241 is arbitrary. Therefore, the actuator 243 may be located outside the substrate holder base 220. Therefore, the substrate holding portion 230 can be remotely adjusted by externally controlling the piston portion.
A hollow portion 246 is formed in the central portion (Z-axis center) of the adjusting portion 240, and the substrate holding portion 230 and the substrate holding portion base 220 are coupled in a manner of sandwiching the adjusting portion 240 by the fastening portion 250 through the hollow portion 246. With such a configuration, even if the adjustment portion using the fluid is used, the adjustment can be performed with high accuracy. In addition, when the non-compressibility of the non-compressible fluid 245 is not complete, it is considered that the mechanism has elasticity due to the elasticity of the separator and the tube. By actually measuring such elasticity in advance and adding it to the correction table, the adjustment accuracy can be improved.
The adjustment portion using the incompressible fluid has a 2-axis tilt mechanism having a degree of freedom of tilt about the X axis and about the Y axis with respect to the movable portion 242. That is, the movable portion 242 may include a tilt mechanism for allowing displacement of the substrate holding portion in a direction different from the direction in which the force is applied to the substrate holding portion 230. The effect of the 2-axis tilting mechanism is advantageous in terms of adjustment accuracy because the structure is less susceptible to the influence of flatness of the back surface of the substrate holding portion 230, and the influence of local bending when driving is performed such that the entire substrate holding portion 230 is uniformly tilted is eliminated.
Such a 2-axis tilting mechanism can also be applied to an adjusting portion (fig. 4) using the wedge mechanism. As an example, fig. 6 shows a configuration of an adjusting portion 240 having a support member having a 2-axis tilting function on a movable portion 242. In fig. 6, a support member 256 for supporting the substrate holding portion 230 is provided on the movable portion 242. The upper surface of the support member 256 is a flat surface for receiving the substrate holder 230, and the lower end of the support member 256 is a convex spherical surface. A spherical seat 242a is formed on the upper surface of the movable portion 242 on which the support member 256 is disposed. The spherical seat 242a is formed in a concave spherical shape so as to hold the lower end portion of the support member 256 formed in a convex spherical shape. The support member 256 is supported by the spherical seat 242a of the movable portion 242 so as to be freely swingable and rotatable. The support member 256 thus supported so as to be freely swingable functions as a so-called "damper" mechanism for absorbing variations in flatness of the back surface of the substrate holding portion 230.
In addition, the damper mechanism can be realized by various structures such as a spherical +3 point support and a hinge mechanism. However, the elasticity of the damper mechanism needs to be considered. As described above, the elasticity of the damper mechanism is measured in advance, and the influence thereof is added to the correction table to enable correction.
< embodiment of method for producing article >
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as micro devices such as semiconductor devices and devices having a microstructure, for example. The method for manufacturing an article according to the present embodiment includes a step of forming a latent image pattern on a photosensitive agent applied to a substrate (a step of exposing the substrate) using the exposure apparatus, and a step of developing the substrate on which the latent image pattern has been formed in the step. The above-described manufacturing method includes other known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article according to the present embodiment is more advantageous than conventional methods in at least 1 of the performance, quality, productivity, and production cost of the article.
(other embodiments)
The present invention can also be realized by a process in which a program for realizing 1 or more functions of the above-described embodiments is supplied to a system or an apparatus via a network or a storage medium, and the program is read out and executed by 1 or more processors in a computer of the system or the apparatus. Alternatively, the function may be realized by a circuit (e.g., ASIC) that realizes 1 or more functions.
OTHER EMBODIMENTS
The embodiments of the present invention can also be realized by a method in which software (programs) that perform the functions of the above-described embodiments are supplied to a system or an apparatus through a network or various storage media, and a computer or a Central Processing Unit (CPU), a Micro Processing Unit (MPU) of the system or the apparatus reads out and executes the methods of the programs.
The present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the claims are appended to disclose the scope of the invention.
Claims (15)
1. A mounting table device for holding and moving a substrate, comprising:
a base;
a substrate holding unit configured to hold the substrate at a position above the susceptor;
a plurality of adjusting portions provided between the susceptor and the substrate holding portion, the adjusting portions independently applying a force from below to each of a plurality of portions of the substrate holding surface in order to adjust a shape of the substrate holding surface of the substrate holding portion; and
and a plurality of fastening portions provided corresponding to each of the plurality of adjustment portions, and configured to fasten the base and the substrate holding portion in a state of sandwiching the adjustment portions by using a fastening member.
2. The table apparatus of claim 1,
each of the plurality of fastening portions is configured to be switchable and controllable to a fastened state in which the base and the substrate holding portion are fastened and a released state in which the base and the substrate holding portion are released from being fastened.
3. The table apparatus of claim 2,
while the adjustment is being performed in at least 1 of the plurality of adjustment portions, at least 1 of the plurality of tightening portions corresponding to the at least 1 adjustment portion is switched to the released state.
4. The table apparatus of claim 2,
each of the plurality of fastening portions includes:
a rod as the fastening member connecting the base and the substrate holding portion; and
and a driving unit provided in the base, the driving unit driving the lever to pull the lever, and the driving unit pulling the lever with a predetermined force to obtain the fastened state.
5. The table apparatus of claim 4,
each of the plurality of adjustment sections includes:
a movable portion that moves in contact with the substrate holding portion;
a fixed portion disposed on the base and supporting the movable portion; and
and an actuator for driving the movable section.
6. The table apparatus of claim 5,
the lever is disposed concentrically with the movable portion.
7. The table apparatus of claim 6,
each of the plurality of adjustment parts has a hollow portion penetrating the movable part and the fixed part to communicate the base and the substrate holding part,
the rod is disposed inside the hollow portion.
8. The table apparatus of claim 5,
the movable portion includes a tilt mechanism for allowing displacement of the substrate holding portion in a direction different from a direction in which the substrate holding portion is applied with the force.
9. The table apparatus of claim 5,
each of the plurality of adjustment parts further has a wedge member moved in a horizontal direction by the actuator over the fixing part,
the movable portion moves in an upward direction in accordance with the movement of the wedge member.
10. The table apparatus of claim 5,
the fixed portion is formed with a container filled with a non-compressible fluid,
each of the plurality of adjustment parts further has a partition plate that seals a liquid surface of the incompressible fluid filled in the container,
the actuator is configured to deliver a non-compressible fluid into the container,
the movable portion moves upward accompanying deformation of the partition plate due to feeding of a non-compressible fluid into the container by the actuator.
11. The table apparatus of claim 2,
further comprises a positioning mechanism for positioning the substrate holding part relative to the base in the horizontal direction,
the positioning is performed by the positioning mechanism after the plurality of tightening portions are set to the released state, and the plurality of tightening portions are set to the tightened state after the positioning is performed.
12. The table apparatus according to claim 3, further comprising:
a control section that controls each of the plurality of adjustment sections and each of the plurality of fastening sections; and
a measuring section that measures a flatness of the substrate held by the substrate holding section,
the substrate holding surface is divided into a plurality of regions,
the control unit controls the at least 1 adjusting unit so that a step between end portions of adjacent ones of the plurality of regions is reduced and the substrate holding surface is flattened after the at least 1 tightening unit is set to the released state based on a measurement result of the measuring unit.
13. A method for adjusting a mounting table device is characterized in that,
the mounting table device includes: a base; a substrate holding unit configured to hold the substrate at a position above the susceptor; a plurality of adjusting portions provided between the susceptor and the substrate holding portion, the adjusting portions independently applying a force from below to each of a plurality of portions of the substrate holding surface in order to adjust a shape of the substrate holding surface of the substrate holding portion; and a plurality of fastening portions provided corresponding to each of the plurality of adjustment portions, for fastening the base and the substrate holding portion in a state of sandwiching the adjustment portion by using a fastening member,
the adjustment method comprises:
setting at least 1 of the plurality of tightening portions corresponding to the at least 1 adjusting portion to a released state in which tightening of the base and the substrate holding portion is released in order to perform adjustment in at least 1 of the plurality of adjusting portions;
a step of adjusting the at least 1 adjusting section after the at least 1 tightening section is set to the released state; and
and a step of setting the at least 1 fastening portion to a fastened state in which the base and the substrate holding portion are fastened after the adjustment by the at least 1 adjusting portion.
14. An exposure apparatus for exposing a substrate,
the mounting table apparatus according to any one of claims 1 to 12, which holds the substrate.
15. A method of manufacturing an article, comprising:
exposing a substrate using the exposure apparatus according to claim 14; and
a step of developing the substrate after exposure,
fabricating an article from the developed substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019189656A JP7406338B2 (en) | 2019-10-16 | 2019-10-16 | Stage device, stage device adjustment method, and article manufacturing method |
| JP2019-189656 | 2019-10-16 |
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| Publication Number | Publication Date |
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| CN112666797A true CN112666797A (en) | 2021-04-16 |
| CN112666797B CN112666797B (en) | 2024-04-02 |
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| CN202011091475.8A Active CN112666797B (en) | 2019-10-16 | 2020-10-13 | Stage device, method for adjusting stage device, exposure device, and method for manufacturing article |
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| Country | Link |
|---|---|
| JP (1) | JP7406338B2 (en) |
| KR (1) | KR20210045312A (en) |
| CN (1) | CN112666797B (en) |
| TW (1) | TWI833991B (en) |
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| KR20180045666A (en) * | 2016-10-26 | 2018-05-04 | 삼성전자주식회사 | Apparatus for producting substrate |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW202134794A (en) | 2021-09-16 |
| JP2021063953A (en) | 2021-04-22 |
| TWI833991B (en) | 2024-03-01 |
| CN112666797B (en) | 2024-04-02 |
| JP7406338B2 (en) | 2023-12-27 |
| KR20210045312A (en) | 2021-04-26 |
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