CN112633776A - Grinding amount correction method, system, storage medium and electronic equipment - Google Patents
Grinding amount correction method, system, storage medium and electronic equipment Download PDFInfo
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Abstract
The disclosure relates to a grinding amount correction method, a grinding amount correction system, a storage medium and electronic equipment, which solve the problem that quality defects of workpieces occur due to the fact that the grinding amount is too small in the process of workpiece production and processing procedures. The method also comprises the following steps: acquiring a size parameter of a position to be processed of a workpiece; under the condition that the size parameter has a difference value with a preset size value of the position to be processed, correcting the grinding amount of the position to be processed according to the size parameter; and controlling a servo motor to drive a grinding wheel to process the position to be processed according to the corrected grinding quantity. This openly corrects through correcting the grinding volume this openly corrects the defect position that the work piece appears at the grinding in-process, avoids work piece production course, and the work piece that the grinding volume undersize leads to is under ground, the over-grinding, has improved the quality of work piece promptly, satisfies the requirement of the high-efficient production of production line again.
Description
Technical Field
The present disclosure relates to the field of machining, and in particular, to a method and a system for correcting a polishing amount, a storage medium, and an electronic device.
Background
The grinding process is an important process in the production and processing process of workpieces and is a process for carrying out finish machining on the workpieces according to the requirements of customers. In the polishing process, the polishing amount involved is one of the important process parameters affecting the polishing quality of the workpiece. In the process of a workpiece production and processing procedure, the condition of excessively small grinding amount can cause the workpiece to be under-ground, so that the workpiece has quality defects.
Disclosure of Invention
The invention aims to provide a grinding amount correction method, a grinding amount correction system, a storage medium and electronic equipment, which solve the problem that quality defects of workpieces occur due to the fact that the grinding amount is too small in the process of workpiece production and processing.
In order to achieve the above object, according to a first aspect of embodiments of the present disclosure, there is provided a polishing amount correction method, including:
acquiring a size parameter of a position to be processed of a workpiece;
under the condition that the size parameter has a difference value with a preset size value of the position to be processed, correcting the grinding amount of the position to be processed according to the size parameter;
and controlling a servo motor to drive a grinding wheel to process the position to be processed according to the corrected grinding quantity.
Optionally, the correcting the grinding amount of the position to be processed according to the size parameter includes:
acquiring a difference value between the size parameter and a preset size value of the position to be processed;
replacing the grinding amount with the difference value to correct the grinding amount.
Optionally, when the difference is greater than the grinding amount, controlling, by the servo motor, a grinding wheel to be driven by the servo motor according to the corrected grinding amount to machine the to-be-machined position, including:
taking the difference between the obtained difference and the grinding amount as a correction amount;
and controlling the servo motor to drive the grinding wheel to advance by the correction amount to machine the position to be machined.
Optionally, when the difference is not greater than the grinding amount, controlling, by the servo motor, a grinding wheel to be driven by the servo motor according to the corrected grinding amount to machine the to-be-machined position, including:
taking the difference between the obtained difference and the grinding amount as a correction amount;
and controlling the servo motor to drive the grinding wheel to retreat by the correction amount to process the position to be processed.
Optionally, the obtaining of the size parameter of the to-be-processed position of the workpiece includes:
and detecting the size parameters of preset detection points of the workpiece through a contact sensor, wherein the preset detection points are arranged in a region to be processed on the workpiece.
Optionally, the obtaining of the size parameter of the to-be-processed position of the workpiece includes:
and detecting size parameters among a plurality of preset correction points of the workpiece through a contact sensor, wherein the preset correction points are arranged in a region to be processed of the workpiece.
According to a second aspect of embodiments of the present disclosure, there is provided a polishing amount correction system, the system including: a touch sensor and a grinder tool in communicative connection with the sensor;
the contact type sensor is used for acquiring the size parameter of the position to be machined of the workpiece and sending the size parameter to the grinding machine tool;
the polishing machine is used for executing the polishing amount correction method.
Optionally, the contact sensor is arranged before a grinding wheel machining position on the grinding machine tool.
According to a third aspect of the embodiments of the present disclosure, there is provided a computer-readable storage medium having a computer program stored thereon, the computer program, when being executed by a processor, implementing the steps of the grinding amount correction method described above.
According to a fourth aspect of embodiments of the present disclosure, there is provided an electronic apparatus comprising:
a memory having a computer program stored thereon;
and a processor for executing the computer program in the memory to realize the steps of the polishing amount correction method.
Through the technical scheme, the technical scheme provided by the embodiment of the disclosure can have the following beneficial effects: according to the method, the size parameter of the position to be machined of the workpiece is obtained, and the grinding amount is corrected according to the size parameter under the condition that the size parameter is different from a preset size value of the position to be machined; and controlling the servo motor to drive the grinding wheel to process the position to be processed according to the corrected grinding amount. The workpiece is prevented from being under ground due to the fact that the grinding amount is too small in the process of the workpiece production and processing procedure, the quality of the workpiece is improved, and the requirement of high-efficiency production of a production line is met.
Additional features and advantages of the disclosure will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure without limiting the disclosure. In the drawings:
fig. 1 is a flow chart illustrating a method of compensating a polishing amount according to an exemplary embodiment.
Fig. 2 is a schematic diagram of a correction page of a polishing amount correction method according to an exemplary embodiment.
Fig. 3 is another flow chart illustrating a method of compensating a polishing amount according to an exemplary embodiment.
Fig. 4 is a schematic diagram illustrating a polishing amount correction system according to an exemplary embodiment.
FIG. 5 is a block diagram illustrating an electronic device in accordance with an example embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the exemplary embodiments below are not intended to represent all implementations consistent with the present disclosure.
It should be noted that in the present disclosure, the terms "S101", "S102" and the like in the description and claims and the drawings are used for distinguishing the steps, and are not necessarily to be construed as performing the method steps in a specific order or sequence.
The following detailed description of specific embodiments of the present disclosure is provided in connection with the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present disclosure, are given by way of illustration and explanation only, not limitation.
Before describing the method, the system, the storage medium, and the electronic device for correcting the grinding amount provided by the embodiment of the present disclosure, an application scenario of the present disclosure is first described.
The grinding process is an important process in the work production process, and is a process of finishing a work according to a customer's request, for example, a process of grinding and chamfering the peripheral edge portion of the substrate glass according to a customer's request. In the polishing process, the polishing amount involved is one of the important process parameters affecting the polishing quality of the workpiece. In the process of a workpiece production and processing procedure, the condition of excessively small grinding amount can cause the workpiece to be under ground, so that the workpiece has quality defects, for example, the quality defects such as under grinding and the like easily occur when the substrate glass with the grinding amount less than 0.1mm is produced because zero error cannot be ensured when the substrate glass moves in the grinding process.
Taking the method as an example of application to machine tool machining, fig. 1 is a flowchart illustrating a grinding amount correction method according to an exemplary embodiment. As shown in fig. 1, the method may include the following steps.
In step S101, a dimension parameter of a to-be-processed position of the workpiece is acquired.
In step S102, in the case where there is a difference between the dimension parameter and the preset dimension value of the position to be processed, the polishing amount of the position to be processed is corrected according to the dimension parameter.
In step S103, the servo motor is controlled to drive the grinding wheel to machine the position to be machined according to the modified grinding amount.
The workpiece may be substrate glass, or may be other workpieces that need to be polished, which is not specifically limited in this disclosure.
The preset size value of the position to be machined can be preset according to the machining requirement of the workpiece, and the preset size value is not specifically limited by the disclosure.
According to the grinding amount correction method provided by the disclosure, the size parameter of the position to be processed of the workpiece is obtained, the difference value between the size parameter and the preset size value of the position to be processed is obtained under the condition that the difference value exists between the size parameter and the preset size value of the position to be processed, and the grinding amount is replaced by the difference value so as to correct the grinding amount; and acquiring the difference value between the difference value and the grinding amount and using the difference value as a correction amount, and controlling a servo motor to drive the grinding wheel to advance or retreat for correction to process the position to be processed. The grinding quantity correction is carried out on the defect position of the workpiece in the grinding process, the workpiece is prevented from being insufficiently ground due to the over-small grinding quantity or excessively ground due to the over-large grinding quantity in the process of the workpiece production and processing procedure, the quality of the workpiece is improved, the requirement of high-efficiency production of a production line is met, the defect of finished products caused by the problems of the workpiece is avoided, the rejection rate is reduced, and the processing cost is saved.
In step S101, a dimension parameter of a to-be-processed position of the workpiece may be obtained according to actual processing requirements, such as obtaining a dimension parameter of a preset monitoring point or obtaining a dimension parameter between a plurality of preset correction points.
Optionally, in step S101, acquiring a dimensional parameter of a to-be-processed position of the workpiece may include:
the method comprises the steps of detecting the size parameters of preset detection points of a workpiece through a contact sensor, wherein the preset detection points are arranged in a region to be processed on the workpiece.
Wherein the touch sensor may be GT-H10 of keyence, which is not specifically limited by the present disclosure.
For example, referring to fig. 4, the value measured by the touch sensor 30 before the polishing of the substrate glass is 650mm, which is consistent with the preset size value of 650mm, taking 1300mm × 1100mm substrate glass as an example, at this time, the size of the substrate glass meets the customer's requirements, and the processing quality is acceptable. When the substrate glass moves to the position A, the value of the position A detected by the contact sensor 30 is 649.98mm, and a difference value exists between the value and a preset size value 650mm, at the moment, the grinding amount of the position A is corrected according to the size parameter, the grinding of the position A by the private clothes motor driving grinding wheel is controlled according to the modified grinding amount, under-grinding of the substrate glass can be avoided under the condition that the grinding amount is less than 0.1mm, the rejection rate is reduced, and the processing cost is saved.
Optionally, in step S101, acquiring a dimensional parameter of a to-be-processed position of the workpiece, which may further include:
the method comprises the steps of detecting size parameters among a plurality of preset correction points of a workpiece through a contact sensor, wherein the preset correction points are arranged in a region to be processed of the workpiece.
For example, referring to fig. 2, 1300 × 1100mm substrate glass has a plurality of correction points, P1, P2, P3, P4, and P5. The sizes of P1 correction points, P2 correction points, P3 correction points and P4 correction points on 1100mm side portions are 600mm, 602mm, 900mm and 902mm respectively, namely the size parameter between the P1 correction points and the P2 correction points is 600mm-602mm, and the size parameter between the P3 correction points and the P4 correction points is 900mm-902mm, which are measured by a touch sensor, and the condition that two positions on the substrate glass have under-grinding defects and other positions are normal is determined.
Optionally, in step S102, correcting the grinding amount of the position to be processed according to the size parameter may include:
acquiring a difference value between the size parameter and a preset size value of the position to be processed;
the grinding amount is replaced with the difference value to correct the grinding amount.
For example, in the case of 1300mm 1100mm substrate glass, the preset size value of the substrate glass is 1300mm, and the polishing amount is 0.5mm, and referring to fig. 4, when the size parameter of the position of the substrate glass a detected by the touch sensor 30 is 1300.02mm, the difference between the size parameter 1300.02mm and the preset size value 1300mm is obtained as 0.02mm, and the polishing amount of 0.5mm is replaced by the difference of 0.02mm, thereby realizing the correction of the polishing amount. Alternatively, referring to fig. 5, the touch sensor 30 detects that the dimensional parameter between the P1 correction point and the P2 correction point is 1300mm to 1300.03mm, the dimensional parameter between the P3 correction point and the P4 correction point is 1300mm to 1300.03mm, the polishing amount corrected between the P1 correction point and the P2 correction point is 0.03mm, and the polishing amount corrected between the P3 correction point and the P4 correction point is 0.03 mm.
Optionally, in the case that the difference is greater than the grinding amount, in step S103, controlling the servo motor to drive the grinding wheel to machine the to-be-machined position according to the modified grinding amount, which may include:
taking the difference between the obtained difference and the grinding amount as a correction amount;
and controlling the servo motor to drive the grinding wheel to move forward and correct the amount to be processed.
For example, taking 1300mm 1100mm substrate glass as an example, the preset size value of the substrate glass is 1300mm, and the polishing amount is 0.05mm, referring to fig. 4, in the case that the touch sensor 30 detects that the size parameter of the position of the substrate glass a is 1300.07mm, the difference between the size parameter 1300.07mm and the preset size value 1300mm is 0.07mm, and the polishing amount of 0.05mm is replaced by the difference of 0.07mm, so as to correct the polishing amount; and the obtained difference value of 0.07mm and the grinding amount of 0.05mm is 0.02mm, and the difference value is used as a correction amount, a servo motor is controlled to drive the grinding wheel to advance by 0.02mm, and the grinding processing is carried out on the position A.
Alternatively, referring to fig. 5, the touch sensor 30 detects that the size parameter between the P1 correction point and the P2 correction point is 1300mm to 1300.07mm, the size parameter between the P3 correction point and the P4 correction point is 1300mm to 1300.07mm, the polishing amount corrected between the P1 correction point and the P2 correction point is 0.02mm, and the polishing amount corrected between the P3 correction point and the P4 correction point is 0.02 mm; the difference between the obtained difference value of 0.07mm and the grinding amount of 0.05mm is 0.02mm, and the grinding wheel is controlled to move forward by 0.02mm by using the servo motor as a correction amount, so that the positions between the P1 correction point and the P2 correction point and the positions between the P3 correction point and the P4 correction point are ground.
Optionally, in the case that the difference is not greater than the grinding amount, in step S103, controlling the servo motor to drive the grinding wheel to machine the to-be-machined position according to the modified grinding amount, which may include:
taking the difference between the obtained difference and the grinding amount as a correction amount;
and controlling the servo motor to drive the grinding wheel to retreat by the correction amount to process the position to be processed.
For example, taking 1300mm 1100mm substrate glass as an example, the preset size value of the substrate glass is 1300mm, the polishing amount is 0.05mm, referring to fig. 4, in the case that the touch sensor 30 detects that the size parameter of the position a of the substrate glass is 1300.02mm, the difference between the size parameter 1300.02mm and the preset size value 1300mm is obtained by 0.02mm (in this case, the difference is 0.02mm and is less than the polishing amount 0.05mm), the polishing amount 0.05mm is replaced by the difference of 0.02mm, and the polishing amount is corrected; and the difference between the obtained difference value of 0.02mm and the grinding amount of 0.05mm is 0.03mm, and the difference value is used as a correction amount, and the servo motor is controlled to drive the grinding wheel to retreat by 0.03mm, so that the grinding processing is carried out on the position A.
Alternatively, referring to fig. 2, the touch sensor 30 detects that the size parameter between the P1 correction point and the P2 correction point is 1300mm to 1300.03mm, the size parameter between the P3 correction point and the P4 correction point is 1300mm to 1300.03mm, the polishing amount corrected between the P1 correction point and the P2 correction point is 0.03mm, and the polishing amount corrected between the P3 correction point and the P4 correction point is 0.03 mm; the difference between the obtained difference 0.02mm and the grinding amount 0.05mm is 0.03mm (in this case, the difference 0.03mm is smaller than the grinding amount 0.05mm), and the grinding wheel is controlled to move backward by 0.03mm by controlling the servo motor as a correction amount, and the grinding process is performed on the positions between the P1 correction point and the P2 correction point and the positions between the P3 correction point and the P4 correction point.
Optionally, the correction amount is set by the touch screen grinding amount correction parameter setting picture.
The touch screen grinding amount correction parameter setting picture comprises an actual position of the substrate glass to be corrected and a required correction amount setting interface.
For example, referring to fig. 2, in the case of 1300mm 1100mm substrate glass, the contact sensor 30 detects that there is an under-grinding amount of 0.02mm at 600mm to 602mm at the 1100mm edge, and 0.04mm at 900mm to 902 mm. In the touch screen, the input of a P1 correction point is 600mm, the input of a P2 correction point is 602mm, the input of a P3 correction point is 900mm, the input of a P4 correction point is 902mm, the input of a P5 correction point is 0mm, the input of a P1-P2 correction amount is 0.02mm, the input of a P2-P3 correction amount is 0mm, the input of a P3-P4 correction amount is 0.04mm, the input of a P4-P5 correction amount is 0mm, and the input of a P5 tail end correction amount is 0 mm. That is, the polishing amount was increased by 0.02mm when the substrate glass position P was 600mm < P <602mm, by 0.04mm when the substrate glass position P was 900mm < P <902mm, and was not changed at other positions.
Taking the method applied to a PLC controller as an example, as shown in fig. 3, the touch sensor measures a dimensional parameter of a position to be ground of the substrate glass and sends the measured dimensional parameter to the PLC; the PLC calculates the correction amount through the size parameters sent by the contact sensor; the PLC controls the servo motor to drive the grinding wheel to grind the substrate glass according to the correction amount through the servo system; the inspector checks the size of the substrate glass, and the next substrate glass is ground under the condition that the size of the substrate glass reaches the standard;
under the condition that the size of the substrate glass does not reach the standard, supplementing the size difference value into a correction picture through a touch screen; the PLC calculates a new correction amount according to the difference value, and the servo motor is controlled by the servo system to drive the grinding wheel to grind the substrate glass according to the correction amount; and (4) checking the size of the substrate glass by an inspector until the size of the substrate glass reaches the standard, and grinding the next substrate glass.
Fig. 4 is a schematic diagram illustrating a polishing amount correction system according to an exemplary embodiment, as shown in fig. 4, the polishing amount correction system comprising: a touch sensor 30 and a grinder tool 20 that communicates with the touch sensor 30;
the contact sensor 30 is used for acquiring a dimensional parameter of a position to be machined of the workpiece and sending the dimensional parameter to the grinding machine tool 20;
the polishing machine 20 is used to execute the above-described polishing amount correction method.
According to the grinding amount correction system, the size parameter of the position to be machined of the workpiece is obtained, the difference value between the size parameter and the preset size value of the position to be machined is obtained under the condition that the difference value exists between the size parameter and the preset size value of the position to be machined, and the grinding amount is replaced by the difference value so as to correct the grinding amount; and acquiring the difference value between the difference value and the grinding amount and using the difference value as a correction amount, and controlling a servo motor to drive the grinding wheel to advance or retreat for correction to process the position to be processed. The grinding quantity correction is carried out on the defect position of the workpiece in the grinding process, the workpiece is prevented from being insufficiently ground due to the over-small grinding quantity or excessively ground due to the over-large grinding quantity in the process of the workpiece production and processing procedure, the quality of the workpiece is improved, the requirement of high-efficiency production of a production line is met, the defect of finished products caused by the problems of the workpiece is avoided, the rejection rate is reduced, and the processing cost is saved.
Alternatively, the contact sensor 30 is disposed before the grinding wheel machining position on the grinder 20.
For example, as shown in fig. 4, the processing direction of the substrate glass is a direction away from the contact sensor, and the contact sensor 30 is disposed in front of the processing position of the grinding wheel on the grinding machine 20, so that the contact sensor 30 acquires the dimensional parameter of the position to be processed of the workpiece.
As shown in fig. 4, in the case of 1300mm 1100mm substrate glass, the value measured by the touch sensor 30 before polishing of the substrate glass was always 650.00mm, and the quality of the substrate glass was acceptable. The value of the position of the substrate glass a measured at the touch sensor was 649.98mm, and it was determined that the substrate glass was not qualified. PLC is at base plate glass grinding access point and is gone to when A position with difference 0.02mm interpolation grinding volume, and servo control servo motor retreats 0.02mm and grinds this moment, guarantees that the product size is normal, avoids appearing the overgrinding. Then, the inspector checks and confirms whether an error exists, if so, the error value is supplemented through the touch screen grinding amount correction parameter setting picture.
With regard to the method in the above-described embodiment, a detailed description has been given in the embodiment related to the method, and a detailed description will not be made here.
The present disclosure also provides a computer-readable storage medium having stored thereon computer program instructions, which, when executed by a processor, implement the steps of the grinding amount correction method provided by the present disclosure.
Specifically, the computer-readable storage medium may be a flash memory, a hard disk, a multimedia card, a card type memory (e.g., SD or DX memory, etc.), a Random Access Memory (RAM), a Static Random Access Memory (SRAM), a Read Only Memory (ROM), an Electrically Erasable Programmable Read Only Memory (EEPROM), a Programmable Read Only Memory (PROM), a magnetic memory, a magnetic disk, an optical disk, a server, etc.
With respect to the computer-readable storage medium in the above embodiments, the grinding amount correction method steps when the computer program stored thereon is executed will be described in detail in the embodiments related to the method, and will not be described in detail herein.
The present disclosure also provides an electronic device, including:
a memory having a computer program stored thereon;
and a processor for executing the computer program in the memory to realize the steps of the polishing amount correction method.
According to the electronic equipment provided by the disclosure, the size parameter of the position to be processed of the workpiece is obtained, the difference value between the size parameter and the preset size value of the position to be processed is obtained under the condition that the difference value exists between the size parameter and the preset size value of the position to be processed, and the grinding amount is replaced by the difference value so as to correct the grinding amount; and acquiring the difference value between the difference value and the grinding amount and using the difference value as a correction amount, and controlling a servo motor to drive the grinding wheel to advance or retreat for correction to process the position to be processed. The grinding quantity correction is carried out on the defect position of the workpiece in the grinding process, the workpiece is prevented from being insufficiently ground due to the over-small grinding quantity or excessively ground due to the over-large grinding quantity in the process of the workpiece production and processing procedure, the quality of the workpiece is improved, the requirement of high-efficiency production of a production line is met, the defect of finished products caused by the problems of the workpiece is avoided, the rejection rate is reduced, and the processing cost is saved.
Fig. 5 is a block diagram illustrating an electronic device 700 according to an example embodiment. As shown in fig. 5, the electronic device 700 may include: a processor 701 and a memory 702. The electronic device 700 may also include one or more of a multimedia component 703, an input/output (I/O) interface 704, and a communication component 705.
The processor 701 is configured to control the overall operation of the electronic apparatus 700 to complete all or part of the steps of the polishing amount correction method. The memory 702 is used to store various types of data to support operations at the electronic device 700, such as instructions for any application or method operating on the electronic device 700 and application-related data, such as dimensional parameters of a location to be processed, preset dimensional values, amounts of grinding, and so forth.
The Memory 702 may be implemented by any type of volatile or non-volatile Memory device or combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read-Only Memory (PROM), Read-Only Memory (ROM), magnetic Memory, flash Memory, magnetic disk, or optical disk.
The multimedia components 703 may include screen and audio components. Wherein the screen may be, for example, a touch screen and the audio component is used for outputting and/or inputting audio signals. For example, the audio component may include a microphone for receiving external audio signals. The received audio signal may further be stored in the memory 702 or transmitted through the communication component 705. The audio assembly also includes at least one speaker for outputting audio signals. The I/O interface 704 provides an interface between the processor 701 and other interface modules, such as a keyboard, mouse, buttons, etc. These buttons may be virtual buttons or physical buttons. The communication component 705 is used for wired or wireless communication between the electronic device 700 and other devices. Wireless Communication, such as Wi-Fi, bluetooth, Near Field Communication (NFC), 2G, 3G, 4G, NB-IOT, eMTC, or other 5G, etc., or a combination of one or more of them, which is not limited herein. The corresponding communication component 705 may thus include: Wi-Fi module, Bluetooth module, NFC module, etc.
In an exemplary embodiment, the electronic Device 700 may be implemented by one or more Application Specific Integrated Circuits (ASICs), Digital Signal Processors (DSPs), Digital Signal Processing Devices (DSPDs), Programmable Logic Devices (PLDs), Field Programmable Gate Arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components for performing the above-described polishing amount correction method.
In another exemplary embodiment, a computer program product is also provided, which comprises a computer program executable by a programmable apparatus, the computer program having code portions for performing the above-described lapping amount correction method when executed by the programmable apparatus.
The preferred embodiments of the present disclosure are described in detail with reference to the accompanying drawings, however, the present disclosure is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present disclosure within the technical idea of the present disclosure, and these simple modifications all belong to the protection scope of the present disclosure.
It should be noted that the various features described in the above embodiments may be combined in any suitable manner without departing from the scope of the invention. In order to avoid unnecessary repetition, various possible combinations will not be separately described in this disclosure.
In addition, any combination of various embodiments of the present disclosure may be made, and the same should be considered as the disclosure of the present disclosure, as long as it does not depart from the spirit of the present disclosure.
Claims (10)
1. A method for correcting a polishing amount, comprising:
acquiring a size parameter of a position to be processed of a workpiece;
under the condition that the size parameter has a difference value with a preset size value of the position to be processed, correcting the grinding amount of the position to be processed according to the size parameter;
and controlling a servo motor to drive a grinding wheel to process the position to be processed according to the corrected grinding quantity.
2. The method according to claim 1, wherein the correcting the grinding amount of the position to be processed according to the size parameter comprises:
acquiring a difference value between the size parameter and a preset size value of the position to be processed;
replacing the grinding amount with the difference value to correct the grinding amount.
3. The method according to claim 2, wherein in the case where the difference is larger than the grinding amount, the controlling a servo motor to drive a grinding wheel to machine the position to be machined according to the corrected grinding amount includes:
taking the difference between the obtained difference and the grinding amount as a correction amount;
and controlling the servo motor to drive the grinding wheel to advance by the correction amount to machine the position to be machined.
4. The method according to claim 2, wherein in a case where the difference is not greater than the grinding amount, the controlling a servo motor to drive a grinding wheel to machine the position to be machined according to the corrected grinding amount includes:
taking the difference between the obtained difference and the grinding amount as a correction amount;
and controlling the servo motor to drive the grinding wheel to retreat by the correction amount to process the position to be processed.
5. The method of claim 1, wherein the obtaining of the dimensional parameter of the to-be-machined position of the workpiece comprises:
and detecting the size parameters of preset detection points of the workpiece through a contact sensor, wherein the preset detection points are arranged in a region to be processed on the workpiece.
6. The method of claim 1, wherein the obtaining of the dimensional parameter of the to-be-machined position of the workpiece comprises:
and detecting size parameters among a plurality of preset correction points of the workpiece through a contact sensor, wherein the preset correction points are arranged in a region to be processed of the workpiece.
7. A polishing amount correction system, comprising: a touch sensor and a grinder tool in communicative connection with the sensor;
the contact type sensor is used for acquiring the size parameter of the position to be machined of the workpiece and sending the size parameter to the grinding machine tool;
the grinding machine is used for executing the grinding amount correction method according to any one of claims 1 to 6.
8. The system of claim 7, wherein the contact sensor is positioned before a grinding wheel machining position on the grinding machine.
9. A computer-readable storage medium on which a computer program is stored, the computer program being characterized by a processor for implementing the steps of the grinding amount correction method according to any one of claims 1 to 6.
10. An electronic device, comprising:
a memory having a computer program stored thereon;
a processor for executing the computer program in the memory to realize the steps of the polishing amount correction method according to any one of claims 1 to 6.
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