CN112631352A - Temperature control structure of analog-digital conversion circuit - Google Patents
Temperature control structure of analog-digital conversion circuit Download PDFInfo
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- CN112631352A CN112631352A CN202011393983.1A CN202011393983A CN112631352A CN 112631352 A CN112631352 A CN 112631352A CN 202011393983 A CN202011393983 A CN 202011393983A CN 112631352 A CN112631352 A CN 112631352A
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- analog
- temperature control
- conversion circuit
- digital conversion
- temperature
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/30—Automatic controllers with an auxiliary heating device affecting the sensing element, e.g. for anticipating change of temperature
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a temperature control structure of an analog-digital conversion circuit, which comprises a temperature field, a temperature control device and a heat preservation device; the temperature field is composed of red copper (5) and heat conducting glue (4), the red copper (5) is of a copper plate structure and is in contact with a circuit board of the analog-to-digital conversion circuit (3) through the heat conducting glue (4); the temperature control device comprises a temperature sensor and a heating heat dissipation piece, a hole is formed in a position, corresponding to red copper, of a device, needing accurate temperature control, of the analog-to-digital conversion circuit, the temperature sensor is placed in the hole, a gap is filled with heat conduction glue, and the heating heat dissipation piece is tightly attached to the red copper; and a heat preservation device is arranged on the periphery of the temperature field and the temperature control device. The invention is suitable for the analog-digital conversion circuit with limited space, provides a large isothermal area for the analog-digital conversion circuit and has high temperature control precision.
Description
Technical Field
The invention belongs to the technical field of temperature control, and particularly relates to a temperature control structure of an analog-digital conversion circuit.
Background
In a high-precision analog-to-digital conversion circuit, the performance and stability of analog devices such as an operational amplifier and an ADC (analog-to-digital converter) have certain temperature drift characteristics, and when the temperature fluctuation is large, the performance of the conversion circuit is influenced inevitably. In order to solve the problem that the temperature drift adversely affects the accuracy of the conversion circuit, it is necessary to provide a sufficiently stable temperature field environment for the conversion circuit.
If the temperature field environment is air, the stability of the temperature field is poor because the lower heat conduction rate of the air can cause larger temperature gradient; if the liquid is used, the requirement on the sealing property of the structure is high, and the short circuit of a circuit can be caused; in the case of copper, aluminum and other metals, it is not only the one hand that the short circuit is caused, but also the other hand that the circuit has no way of being in sufficient contact with these solids, and the presence of voids can cause non-uniformity of the temperature field. In addition, when the temperature control system has a small structure and a limited space, the selection of the heat insulation material needs to be considered in many aspects.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a temperature control structure suitable for an analog-digital conversion circuit.
In order to solve the technical problems, the invention adopts the following technical scheme:
the temperature control structure comprises a temperature field, a temperature control device and a heat preservation device,
the temperature field is composed of red copper and heat conducting glue, the red copper is of a copper plate structure and is in contact with a circuit board of the analog-to-digital conversion circuit through the heat conducting glue;
the temperature control device comprises a temperature sensor and a heating heat dissipation piece, a hole is punched at a position, corresponding to red copper, of a device, needing accurate temperature control, of an analog-to-digital conversion circuit, the temperature sensor is placed in the hole, a gap is filled with heat conducting glue, and the heating heat dissipation piece is tightly attached to the red copper;
and a heat preservation device is arranged on the periphery of the temperature field and the temperature control device.
Further, the heat preservation device is formed by filling polyurethane into a shape structural member.
Further, the distance between the red copper and the analog-to-digital conversion circuit is 1.8-3 mm.
Furthermore, the shape structural part is made of aluminum materials, the thickness of the shape structural part is 1.5-2.5 mm, and the space filled with the heat insulation materials is 2.5-3.5 mm in thickness.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, the red copper and the heat-conducting glue are skillfully combined, a large (30mm by 30mm) isothermal area is provided for the analog-to-digital conversion circuit, the temperature gradient is small and is only 0.231 ℃, and the temperature field is uniform. Through reasonable placement and treatment of temperature measuring points and reasonable selection and design of heat insulation materials and devices, a high-precision temperature control system is obtained, and the precision reaches 0.05 ℃.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. It is obvious that the drawings in the following description are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
FIG. 1 is a schematic diagram of a temperature-controlled structure for an analog-to-digital conversion circuit according to an embodiment of the present invention;
wherein the figures include the following reference numerals:
1. a shape structural member; 2. a polyurethane; 3. an analog-to-digital conversion circuit; 4. heat conducting glue; 5. red copper; 6. the heat sink is heated.
Detailed Description
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, in an embodiment of the present invention, a temperature control structure for an analog-to-digital conversion circuit is provided, which includes a temperature field, a temperature control device, and a temperature holding device.
The temperature field is composed of red copper 5 and heat conducting glue 4, wherein the red copper 5 is of a copper plate structure and is in contact with a circuit board of the analog-to-digital conversion circuit 3 through the heat conducting glue 4.
The temperature control device comprises a temperature sensor, a heating and radiating piece and a temperature controller.
Punching holes at the position of the analog-digital conversion circuit where the device needing accurate temperature control corresponds to the red copper, wherein the diameter of each hole is slightly larger than that of a temperature sensor of the temperature control device, and the temperature sensor is a thermistor. And placing the temperature sensor in the hole, and filling the gap with heat-conducting glue, so that the temperature sensor can fully sense the temperature of the red copper. The heating heat dissipation piece in the temperature control device is tightly attached to the red copper, and the temperature controller controls the heating heat dissipation piece to heat or dissipate the red copper, so that the temperature of the red copper is controlled in a closed loop mode. When the temperature of the red copper is controlled to a certain precision, the red copper and the heat conducting glue can provide a stable temperature field environment with small temperature gradient for the analog-to-digital conversion circuit.
The heat preservation device is composed of a shape structural member 1 and polyurethane 2 filled in the shape structural member.
In a preferred embodiment, the distance between the red copper 5 and the analog-to-digital conversion circuit 3 is 1.8-3 mm, the distance is not suitable to be too large, otherwise, the temperature transmission is slow, and the temperature control effect is not good.
In a preferred embodiment, a heat conducting glue SC320LVH is added between the red copper 5 and the circuit board, the glue has good fluidity, is easy to form and fast in heat conduction, has a heat conductivity coefficient of 2.1W/(m.K), and forms a heat sink together with the red copper. The heat conducting glue can be fully contacted with components on the circuit board, and heat on the red copper can be quickly and uniformly transferred to the whole circuit board.
In a preferred embodiment, the shape structural member 1 is made of aluminum material, the thickness is 1.5-2.5 mm, and the space filled with the heat insulation material is 2.5-3.5 mm thick. Polyurethane with a foaming function is selected as a heat insulation material, and the heat conductivity coefficient of the polyurethane is 0.021W/(m.K). A hole M3 is formed in a proper position on the shape structural member, and after the shape structural member is installed, a foaming agent is injected through the hole, so that compact polyurethane can be formed in the heat insulation space, and a good enough heat insulation effect is provided.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. A temperature control structure of an analog-digital conversion circuit is characterized by comprising a temperature field, a temperature control device and a heat preservation device,
the temperature field is composed of red copper (5) and heat conducting glue (4), the red copper (5) is of a copper plate structure and is in contact with a circuit board of the analog-to-digital conversion circuit (3) through the heat conducting glue (4);
the temperature control device comprises a temperature sensor and a heating heat dissipation piece, a hole is punched at a position, corresponding to red copper, of a device, needing accurate temperature control, of an analog-to-digital conversion circuit, the temperature sensor is placed in the hole, a gap is filled with heat conducting glue, and the heating heat dissipation piece is tightly attached to the red copper;
and a heat preservation device is arranged on the periphery of the temperature field and the temperature control device.
2. The temperature control structure of an analog-to-digital conversion circuit according to claim 1, wherein the heat insulating means is formed by filling a profile structural member (1) with polyurethane (2).
3. The temperature control structure of an analog-to-digital conversion circuit according to claim 1, wherein the distance between the red copper (5) and the analog-to-digital conversion circuit (3) is 1.8-3 mm.
4. The temperature control structure of an analog-to-digital conversion circuit according to claim 2, wherein the outline structural member (1) is made of aluminum and has a thickness of 1.5 to 2.5mm, and the space filled with the thermal insulation material has a thickness of 2.5 to 3.5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011393983.1A CN112631352A (en) | 2020-12-03 | 2020-12-03 | Temperature control structure of analog-digital conversion circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011393983.1A CN112631352A (en) | 2020-12-03 | 2020-12-03 | Temperature control structure of analog-digital conversion circuit |
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| Publication Number | Publication Date |
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| CN112631352A true CN112631352A (en) | 2021-04-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011393983.1A Pending CN112631352A (en) | 2020-12-03 | 2020-12-03 | Temperature control structure of analog-digital conversion circuit |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118104A (en) * | 2007-08-28 | 2008-02-06 | 武汉凌云光电科技有限责任公司 | High power compact thermostatic device without liquid cooling |
| CN101625318A (en) * | 2009-08-12 | 2010-01-13 | 南京信息工程大学 | Intelligent indoor gas formaldehyde concentration measuring apparatus |
| CN209282599U (en) * | 2018-12-06 | 2019-08-20 | 聚源光电(无锡)有限公司 | A kind of temperature control device of solid state laser |
-
2020
- 2020-12-03 CN CN202011393983.1A patent/CN112631352A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118104A (en) * | 2007-08-28 | 2008-02-06 | 武汉凌云光电科技有限责任公司 | High power compact thermostatic device without liquid cooling |
| CN101625318A (en) * | 2009-08-12 | 2010-01-13 | 南京信息工程大学 | Intelligent indoor gas formaldehyde concentration measuring apparatus |
| CN209282599U (en) * | 2018-12-06 | 2019-08-20 | 聚源光电(无锡)有限公司 | A kind of temperature control device of solid state laser |
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Application publication date: 20210409 |