CN101118104A - High power compact thermostatic device without liquid cooling - Google Patents
High power compact thermostatic device without liquid cooling Download PDFInfo
- Publication number
- CN101118104A CN101118104A CNA2007100530544A CN200710053054A CN101118104A CN 101118104 A CN101118104 A CN 101118104A CN A2007100530544 A CNA2007100530544 A CN A2007100530544A CN 200710053054 A CN200710053054 A CN 200710053054A CN 101118104 A CN101118104 A CN 101118104A
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- Prior art keywords
- thermal insulation
- liquid cooling
- temperature control
- high power
- temperature
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- 239000007788 liquid Substances 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 title claims abstract description 17
- 238000009413 insulation Methods 0.000 claims abstract description 25
- 239000004065 semiconductor Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 12
- 238000011534 incubation Methods 0.000 claims description 16
- 230000010354 integration Effects 0.000 claims description 4
- 229920000742 Cotton Polymers 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 3
- 239000004604 Blowing Agent Substances 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 230000009711 regulatory function Effects 0.000 claims 1
- 238000005057 refrigeration Methods 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 230000005693 optoelectronics Effects 0.000 abstract 3
- 238000010923 batch production Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to a high power non liquid cooling severe style constant temperature device, which consists of a thermal insulation unit, a semiconductor thermoelectric apparatus, a heat capacity block, a radiator, a temperature detector, a temperature control unit and a switching power. The thermal insulation unit consists of a thermal insulation box and thermal insulation filling materials, the thermal insulation filling materials is arranged in the thermal insulation box, the semiconductor thermoelectric apparatus, the heat capacity block and a temperature controlled optoelectronic device are arranged at the central part inside the thermal insulation box, and contacts with the thermal insulation filling materials; the temperature detector is directly pasted and covered on the outer surface of the optoelectronic device. The high power non liquid cooling severe style constant temperature device of the present invention has the advantages of novel concept, severe structure, large amount of refrigeration and heating, small size, convenient installation, no liquid refrigerator and compressor needed, no pollution, quick refrigeration speed, fine control performance, and easy industrialized batch production, etc; the present invention can be widely used for the temperature control of the apparatus needing constant temperature operation in the optoelectronic field, in particular to the site needing large amount of refrigeration and heating.
Description
Technical field
The present invention relates to a kind of thermostat, particularly a kind of high power compact thermostatic device without liquid cooling.
Technical background
Ordinary circumstance, many photoelectric devices all need be worked under steady temperature or in the narrower temperature range, such as diode laser, along with temperature change, laser instrument output Wavelength of Laser can drift about (being generally 0.25～0.3nm/ ℃), this drift is unallowed for some application of this type of laser instrument, as is used as the pumping source of solid state laser.Therefore, the operating temperature that needs the control diode laser, especially when environment temperature changes in-40～55 ℃ of wide regions, for laser diode configuration one cover thermostat is very important, guarantee no matter laser instrument is in to make under what temperature environment that the diode operation temperature is constant relatively, make and export wavelength stabilized laser.
The general conventional method of making thermostat is that photoelectric device 1 is positioned at incubation chamber 2, the incubation chamber wall around coil pipe 3 link to each other with refrigeration compressor 4, be connected with liquid refrigerant in the coil pipe, for solving ultralow temperature (as-40 ℃) problem of raising photoelectric device operating temperature down, generally heating resistance wire 5 is arranged at constant temperature box wall.
Said method temperature control effect is better, and efficient is higher, but the thermostat volume is bigger, and structure is comparatively complicated, and cost of manufacture is higher, and has liquid to leak hidden danger.
Summary of the invention
The objective of the invention is in order to solve the defective that prior art exists, cover the shortage, provide a kind of cooling programming rate fast, can satisfy the requirement of photoelectric device operating temperature, compact conformation, aneroid leak hidden danger, pollution-free, cost is low, well behaved high power compact thermostatic device without liquid cooling.
To achieve these goals, the technical scheme of high power compact thermostatic device without liquid cooling involved in the present invention is achieved in that this device is made up of heat-insulation unit, semi-conductor thermoelectric device, thermal capacitance piece, radiator, hygrosensor, temperature control unit and Switching Power Supply.It is characterized in that heat-insulation unit is made of incubation chamber and insulation filling materials, insulation filling materials is arranged in the incubation chamber, semi-conductor thermoelectric device, and thermal capacitance piece and be installed in central part in the incubation chamber by the photoelectric device of temperature control, and all contact with insulation filling materials; Radiator is installed in the bottom of heat-insulation unit, the lower surface of semi-conductor thermoelectric device links to each other with radiator, the thermo-electric device upper surface links to each other with the lower surface of thermal capacitance piece, the upper surface of thermal capacitance piece directly with contacted by the photoelectric device of temperature control, hygrosensor directly pastes on the outer surface of photoelectric device, the output of hygrosensor is connected with temperature control unit, the output of temperature control unit is connected with Switching Power Supply by lead, and the output of Switching Power Supply is drawn lead by lead with the electrode of semi-conductor thermoelectric device and is connected.Feed back to after the operating temperature of photoelectric device 11 is surveyed by hygrosensor 12 have ratio, integration, differential regulate the temperature control unit 13 of (PID control) function, this unit compares temperature and the actual temperature of setting, calculate automatically, output corresponding control signal, the in real time refrigeration of 14 pairs of thermo-electric devices 8 of gauge tap power supply or heat power.It is characterized in that: semi-conductor thermoelectric device 8 both can freeze, can heat again, when environment temperature is higher than the setting operating temperature of photoelectric device 11, thermo-electric device produces refrigeration, when environment temperature is lower than the setting operating temperature of photoelectric device 11, thermo-electric device produces the effect that heats, thereby the operating temperature that guarantees photoelectric device is constant.
The refrigeration that the alleged no liquid-cooled thermostat of the present invention adopts and the thermo-electric device (TEC) the 8th of heat effect, a kind of special semiconductor devices, by P type and N-type semiconductor element 16 and up and down ceramic copper-clad base plate 15 form (see figure 3), 17 draw lead for the TEC electrode.TEC moves by the orientation of carrier in the DC current, and heat is moved to the opposite side ceramic substrate from a side ceramic substrate of thermo-electric device, has realized simultaneously the absorb heat refrigeration effect of one side heat release of thermo-electric device.If change electrode 17 electric power polarities, heat absorption, the exothermic effect of its generation are just the opposite.Advantages such as this device has reliability height, good stability, refrigerating speed is fast, time response is fast, control performance is good, volume is small and exquisite.The form that can adopt monolithic during installation, also can adopt multi-disc tiling or multilayer to superpose.The refrigerating capacity of TEC or heating capacity are relevant with the temperature difference and the electric current and voltage size at cold and hot two ends, and its selection should be taken all factors into consideration factors such as the caloric value, environment temperature of photoelectric device.
The ratio that temperature control unit 13 (PID instrument) in the alleged no liquid-cooled thermostat of the present invention has, integration, differential is regulated (PID control) function and is meant when the actual work temperature of controlled device (promptly by the photoelectric device 11 of temperature control) and setting operating temperature are variant, the PID instrument will be carried out ratio automatically at this deviation size and positive negative characteristic and be regulated (promptly export controlled quentity controlled variable and deviate is in proportion), integration is regulated (direct ratio that is integrated into of promptly exporting controlled quentity controlled variable and deviate) and differential adjusting (promptly export controlled quentity controlled variable and deviate rate be directly proportional) over time, the power output and the output polarity of an appropriate control signals gauge tap power supply 14 of output are realized at last to the temperature non-overshoot in real time, pulsation-free control.
Switching Power Supply 14 in the alleged no liquid-cooled thermostat of the present invention is the controlled power supplys of a kind of power output, and can regulate output voltage polarity and size automatically according to the control signal of PID instrument 13, with the refrigeration that realizes thermo-electric device 8 or heat.
Thermal capacitance piece 9 in the alleged no liquid-cooled thermostat of the present invention plays the operating temperature of light stable electrical part 11: when little fluctuation takes place the live load of photoelectric device 11, thermal capacitance piece 9 can suppress the fluctuation of the operating temperature that photoelectric device 11 produces because of this load variations, keeps operating temperature stable.This thermal capacitance piece can adopt copper plate to make.
11 insulations of 6 pairs of photoelectric devices of incubation chamber in the alleged no liquid-cooled thermostat of the present invention heat insulating function.General surfaces externally and internally is made of aluminium sheet or steel plate, adiabatic blowing agent of interlayer filling or insulation material.
Filler 7 in the alleged no liquid-cooled thermostat of the present invention is in order further to strengthen the insulation effect, generally to adopt heat-preservation cotton to fill.
The effect of the radiator 10 in the alleged no liquid-cooled thermostat of the present invention is that the heat of photoelectric device 11 that thermo-electric device 8 is transmitted is dispersed in the environment.For make thermo-electric device 8 can high efficiency refrigeration or heat, must reduce the temperature difference of thermo-electric device 8 cold and hot ceramic substrates 15 as far as possible.Therefore, should select the less radiator of thermal resistance as far as possible.
The high power compact thermostatic device without liquid cooling that the present invention is alleged, have novel, compact conformation, the refrigerated medium heat is big, volume is small and exquisite, easy for installation, need not liquid refrigerant and compressor, pollution-free, refrigerating speed is fast, control performance good, be easy to advantages such as industrialized mass production; It can be widely used in the temperature control of the device that needs constant temperature work in the photoelectric field, is suitable for needing the occasion of big system cold finger heat especially.
Description of drawings
Fig. 1 is a conventional compression type thermostat schematic diagram;
Fig. 2 is the high-power no liquid-cooled compact thermostatic device structural representation of the present invention;
Fig. 3 is the semi-conductor thermoelectric device structural representation of high power compact thermostatic device without liquid cooling shown in Figure 2.
The specific embodiment
The specific embodiment of the high power compact thermostatic device without liquid cooling that the present invention is alleged is described below in conjunction with Fig. 2 and Fig. 3:
When the maximum laser power output of diode laser 11 is 30W, can discharge the heat of about 40W simultaneously, if this moment, environment temperature was 55 ℃, operating temperature with diode laser in 10 minutes is reduced to 25 ℃, then also need the about 20W of refrigerating capacity, the about 10W of incubation chamber 6 heat radiations needs the about 70W of total refrigeration.According to this refrigerating capacity, the semi-conductor thermoelectric device 8 that we choose 3 (tiling) maximum cooling capacities is 120W, thermal resistance (are noted: when environment temperature reaches 55 ℃ less than the radiator 10 of 0.05K/W, and heat radiator thermal resistance is during less than 0.05K/W, the actual refrigerating capacity of every chip semiconductor thermo-electric device is 25W), incubation chamber 6 thickness 12mm, surfaces externally and internally is made of aluminium sheet, the adiabatic foaming Ji of its interlayer filling, heat-preservation cotton 7 has been filled in space between incubation chamber 6 and the laser instrument 11, and thermal capacitance piece 9 is of a size of 80 * 90 * 15mm
3Thermo-electric device 8 is by 14 power supplies of maximum voltage 24VDC gate-controlled switch power supply.
If environment temperature is lower, need rising diode laser 11 operating temperatures, it is reverse that then PID instrument 13 will make the polarity of voltage of Switching Power Supply 14 output, and thermo-electric device 8 becomes the effect of heating by refrigeration, is diode laser 11 heating.
The thermostat that the present invention is alleged, its semi-conductor thermoelectric device 8, thermal capacitance piece 9 and be installed in central part in the incubation chamber 6 by the photoelectric device 11 of temperature control, and all contact with insulation filling materials 7 in the incubation chamber 6, radiator 10 is installed in the bottom of incubation chamber 6 (being heat-insulation unit), the lower surface of thermo-electric device 8 links to each other with radiator 10, its upper surface links to each other with the lower surface of thermal capacitance piece 9, the upper surface of thermal capacitance piece 9 directly contacts with photoelectric device 11, hygrosensor 12 directly pastes on the outer surface of photoelectric device 11, the output of detector 12 is connected with temperature control unit 13, the output of temperature control unit 13 is connected with gate-controlled switch power supply 14 by lead, and the output of Switching Power Supply 14 is connected with the electrode outlet line 17 of semi-conductor thermoelectric device 8 by lead.
Claims (5)
1. a high power compact thermostatic device without liquid cooling is made up of heat-insulation unit, semi-conductor thermoelectric device (8), thermal capacitance piece (9), radiator (10), hygrosensor (12), temperature control unit (13) and Switching Power Supply (14).It is characterized in that, heat-insulation unit is made of incubation chamber (6) and insulation filling materials (7), insulation filling materials (7) is arranged in the incubation chamber (6), semi-conductor thermoelectric device (8), thermal capacitance piece (9) and be installed in the interior central part of incubation chamber (6) by the photoelectric device of temperature control (11), and all contact with insulation filling materials (7); Radiator (10) is installed in the bottom of heat-insulation unit, the lower surface of semi-conductor thermoelectric device (8) links to each other with radiator (10), the upper surface of thermo-electric device (8) links to each other with the lower surface of thermal capacitance piece (9), the upper surface of thermal capacitance piece (9) directly with contacted by the photoelectric device of temperature control (11), hygrosensor (12) directly pastes on the outer surface of photoelectric device (11), the output of hygrosensor (12) is connected with temperature control unit (13), the output of temperature control unit (13) is connected with Switching Power Supply (14) by lead, and the output of Switching Power Supply (14) is drawn lead (17) by the lead and the electrode of semi-conductor thermoelectric device (8) and is connected.
2. high power compact thermostatic device without liquid cooling according to claim 1 is characterized in that, the surfaces externally and internally of incubation chamber (6) adopts aluminium sheet or steel plate to make, adiabatic blowing agent of its interlayer filling or insulation material, and insulation filling materials (7) adopts the heat-preservation cotton material.
3. high power compact thermostatic device without liquid cooling according to claim 1 is characterized in that, being provided with of semi-conductor thermoelectric device (8) can be monolithic, also can adopt the form of multi-disc tiling or multilayer stack.
4. high power compact thermostatic device without liquid cooling according to claim 1 is characterized in that, temperature control unit (13) is for having the PID instrument of ratio, integration, differential regulatory function.
5. high power compact thermostatic device without liquid cooling according to claim 1 is characterized in that, Switching Power Supply (14) is the controlled power supply of a kind of power output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100530544A CN100504244C (en) | 2007-08-28 | 2007-08-28 | High power compact thermostatic device without liquid cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100530544A CN100504244C (en) | 2007-08-28 | 2007-08-28 | High power compact thermostatic device without liquid cooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101118104A true CN101118104A (en) | 2008-02-06 |
| CN100504244C CN100504244C (en) | 2009-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100530544A Expired - Fee Related CN100504244C (en) | 2007-08-28 | 2007-08-28 | High power compact thermostatic device without liquid cooling |
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| Country | Link |
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| CN (1) | CN100504244C (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN103256708A (en) * | 2013-05-15 | 2013-08-21 | 北京杰雅利电子科技有限公司 | Energy-saving temperature controlling heating stage and constant temperature controlling method thereof |
| CN103309033A (en) * | 2012-03-14 | 2013-09-18 | 日立视听媒体股份有限公司 | Optical module and scanning image display device |
| CN104142697A (en) * | 2014-07-21 | 2014-11-12 | 北京航天控制仪器研究所 | Temperature control device and method of high power device for space |
| CN104180576A (en) * | 2014-09-03 | 2014-12-03 | 四川航天***工程研究所 | Low-temperature semiconductor refrigerator and method for providing linear voltage for chilling plates of refrigerator |
| CN104485887A (en) * | 2014-11-03 | 2015-04-01 | 南昌航空大学 | Sensitized solar cell constant low temperature test platform based on semiconductor refrigeration technology |
| CN105716341A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment and temperature control method thereof |
| CN104142697B (en) * | 2014-07-21 | 2017-01-04 | 北京航天控制仪器研究所 | One space high-power component attemperating unit and method |
| CN107491111A (en) * | 2017-08-16 | 2017-12-19 | 中国船舶工业***工程研究院 | A kind of temperature control equipment and method based on TEC |
| CN111653848A (en) * | 2020-06-15 | 2020-09-11 | 合肥阳光新能源科技有限公司 | Energy storage container temperature control method, device and system |
| CN112631352A (en) * | 2020-12-03 | 2021-04-09 | 北京自动化控制设备研究所 | Temperature control structure of analog-digital conversion circuit |
-
2007
- 2007-08-28 CN CNB2007100530544A patent/CN100504244C/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103309033A (en) * | 2012-03-14 | 2013-09-18 | 日立视听媒体股份有限公司 | Optical module and scanning image display device |
| CN103206805B (en) * | 2013-04-12 | 2015-04-15 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN103206805A (en) * | 2013-04-12 | 2013-07-17 | 苏州市莱赛电车技术有限公司 | Semiconductor refrigerating device |
| CN103256708A (en) * | 2013-05-15 | 2013-08-21 | 北京杰雅利电子科技有限公司 | Energy-saving temperature controlling heating stage and constant temperature controlling method thereof |
| CN103256708B (en) * | 2013-05-15 | 2015-08-26 | 北京杰雅利电子科技有限公司 | A kind of energy-saving temperature control thermal station and constant-temperature control method thereof |
| CN104142697B (en) * | 2014-07-21 | 2017-01-04 | 北京航天控制仪器研究所 | One space high-power component attemperating unit and method |
| CN104142697A (en) * | 2014-07-21 | 2014-11-12 | 北京航天控制仪器研究所 | Temperature control device and method of high power device for space |
| CN104180576A (en) * | 2014-09-03 | 2014-12-03 | 四川航天***工程研究所 | Low-temperature semiconductor refrigerator and method for providing linear voltage for chilling plates of refrigerator |
| CN104485887A (en) * | 2014-11-03 | 2015-04-01 | 南昌航空大学 | Sensitized solar cell constant low temperature test platform based on semiconductor refrigeration technology |
| CN104485887B (en) * | 2014-11-03 | 2016-11-16 | 南昌航空大学 | Sensitization solar cell cryogenic thermostat test platform based on semiconductor refrigerating technology |
| CN105716341A (en) * | 2014-12-01 | 2016-06-29 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment and temperature control method thereof |
| CN105716341B (en) * | 2014-12-01 | 2019-05-31 | 青岛海尔特种电冰柜有限公司 | Semiconductor refrigerating equipment and its temprature control method |
| CN107491111A (en) * | 2017-08-16 | 2017-12-19 | 中国船舶工业***工程研究院 | A kind of temperature control equipment and method based on TEC |
| CN107491111B (en) * | 2017-08-16 | 2019-10-11 | 中国船舶工业***工程研究院 | A kind of temprature control method based on TEC |
| CN111653848A (en) * | 2020-06-15 | 2020-09-11 | 合肥阳光新能源科技有限公司 | Energy storage container temperature control method, device and system |
| CN112631352A (en) * | 2020-12-03 | 2021-04-09 | 北京自动化控制设备研究所 | Temperature control structure of analog-digital conversion circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100504244C (en) | 2009-06-24 |
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