CN112631042A - Electronic device and method of assembling electronic device - Google Patents
Electronic device and method of assembling electronic device Download PDFInfo
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- CN112631042A CN112631042A CN202110075690.7A CN202110075690A CN112631042A CN 112631042 A CN112631042 A CN 112631042A CN 202110075690 A CN202110075690 A CN 202110075690A CN 112631042 A CN112631042 A CN 112631042A
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- circuit board
- board assembly
- shielding
- circuit
- electronic device
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
- G03B15/06—Special arrangements of screening, diffusing, or reflecting devices, e.g. in studio
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/56—Cameras or camera modules comprising electronic image sensors; Control thereof provided with illuminating means
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The application provides an electronic device and an assembling method of the electronic device, wherein the electronic device comprises: a circuit main board; the circuit board assembly is provided with a welding part which is welded on the circuit main board so as to electrically connect the circuit board assembly and the circuit main board; the light supplement lamp is arranged on the circuit board assembly; the shielding piece is installed on the circuit board assembly and provided with a shielding portion, the shielding portion is located on the first side of the circuit board assembly and located between the light supplementing lamp and the welding portion, the shielding portion is made of shape memory alloy, and the shielding portion can be bent between the first shape and the second shape to deform to be far away from or close to the circuit board assembly. The shielding part blocks heat generated at the welding part and high-energy particles generated in the welding process, and the light supplement lamp is not easy to damage.
Description
Technical Field
The application belongs to the technical field of intelligent equipment, and particularly relates to electronic equipment and an assembling method of the electronic equipment.
Background
The light filling lamp on the electronic equipment can play the role of light filling, and the shooting effect of the camera can be improved.
The light filling lamp is usually installed on the light filling lamp circuit board, and in order to avoid the light filling lamp circuit board to produce the influence to other devices in the electronic equipment, need carry out ground connection to light filling lamp circuit board and mainboard connection, the ground connection operation to the light filling lamp circuit board is realized with the mainboard spot welding to the light filling lamp circuit board at present.
However, in the spot welding process of the circuit board and the main board of the light supplement lamp, the welding point temperature is high, so that high temperature is easily transmitted to the light supplement lamp, high-energy particles are sputtered out of the welding point, and once the high-energy particles are directly sputtered onto the light supplement lamp, the light supplement lamp is easily damaged.
Content of application
This application aims at providing an electronic equipment, and electronic equipment can the separation high temperature to the conduction of light filling lamp, can prevent moreover that welding particle from sputtering to the light filling lamp, provides the protection for the light filling lamp.
In order to solve the above problems, the present application is implemented as follows:
an embodiment of a first aspect of the present application provides an electronic device, including: a circuit main board;
the circuit board assembly is provided with a welding part which is welded on the circuit main board so as to electrically connect the circuit board assembly and the circuit main board;
the light supplement lamp is arranged on the circuit board assembly;
the shielding part is arranged on the first side of the circuit board assembly and is positioned between the light supplementing lamp and the welding part, the shielding part is made of shape memory alloy, and the shielding part can be bent and deformed between a first shape and a second shape to be far away from or close to the circuit board assembly;
in the first form, the shielding part is bent to be away from the circuit board assembly and is used for isolating the light supplement lamp from the welding part; in the second state, the shielding part is flattened to be adjacent to the circuit board assembly.
The circuit board assembly is provided with the welding part, the circuit board assembly and the circuit main board can be welded at the position of the welding part, the electric connection of the circuit board assembly and the circuit main board can be realized in a welding mode, the circuit main board is generally grounded, and after the circuit board assembly and the circuit main board are electrically connected, the circuit board assembly is not easily influenced by other devices in the electronic equipment due to the fact that the circuit main board is grounded, and the performance of the electronic equipment is improved.
In to circuit mainboard and circuit board assembly welding process, the heat that the welding produced and high energy particle can lead to the fact the damage to the light filling lamp, sets up the shielding piece on circuit board assembly in this embodiment, and the shielding part of shielding piece is located between light filling lamp and the welding part, and the shielding part blocks the heat that is located the production of welding part department and the high energy particle that produces in the welding process, and the light filling lamp is difficult for taking place the damage. In addition, the shielding part can be bent relative to the circuit board assembly, for example, when the circuit main board and the circuit board assembly need to be welded, the shielding part is in the state of the first shape, specifically, the shielding part is bent towards the direction far away from the circuit board assembly, the shielding part can isolate the light supplement lamp from the welding part, so that the shielding part can effectively block heat and high-energy particles generated by welding, after the welding is completed, the shielding part is in the second shape, specifically, the second end of the shielding part is close to the circuit board assembly, the shielding part is flattened so that the shielding part can be attached to the circuit board assembly, and the shielding part is prevented from interfering with the installation of other parts, the thickness of the electronic equipment is reduced, and the use experience of a user on the electronic equipment is improved.
The shielding part is a shape memory alloy part, the shape memory alloy part can deform under the action of external force, the original shape can be automatically recovered under the condition of recovering to a certain temperature, the shielding part is required to be unfolded normally, and the shielding part is only required to be placed at the certain temperature, so that the shielding part can be automatically unfolded, the operation of workers is simplified, and the assembly convenience of the electronic equipment is improved.
An embodiment of a second aspect of the present application provides an assembling method of an electronic device.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 shows one of the schematic structural diagrams of an electronic device of an embodiment of the present application;
fig. 2 shows a second schematic structural diagram of an electronic device of an embodiment of the present application;
FIG. 3 shows a cross-sectional view in the direction A-A in FIG. 2;
FIG. 4 illustrates one of the schematic structural views of the circuit board assembly and the shield of one embodiment of the present application;
FIG. 5 illustrates a second schematic structural view of the circuit board assembly and the shield of one embodiment of the present application;
fig. 6 shows a third schematic structural diagram of an electronic device according to an embodiment of the present application;
FIG. 7 shows a fourth schematic structural diagram of an electronic device of an embodiment of the present application;
fig. 8 shows a flow chart of an assembly method of an electronic device of an embodiment of the present application.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 7 is:
10. the circuit comprises a circuit main board, 20, a circuit board assembly, 21, a circuit soft board, 211, a through hole, 22, a reinforcing plate, 221, a welding part, 30, a light supplement lamp, 40, a shielding piece, 41, a shielding part, 42, a connecting part, 50 and a lampshade.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Electronic devices and methods of assembling electronic devices provided according to some embodiments of the present application are described with reference to fig. 1-8.
With reference to fig. 1, fig. 2, fig. 4, and fig. 5, an embodiment of a first aspect of the present application provides an electronic device, including: a circuit main board 10; the circuit board assembly 20, the circuit board assembly 20 has welding parts 221, the welding parts 221 are welded on the circuit main board 10, so that the circuit board assembly 20 and the circuit main board 10 are electrically connected; a light supplement lamp 30, the light supplement lamp 30 being mounted on the circuit board assembly 20; the shielding piece 40 is mounted on the circuit board assembly 20, the shielding piece 40 has a shielding portion 41, the shielding portion 41 is located on the first side of the circuit board assembly 20, the shielding portion 41 is located between the fill-in light lamp 30 and the soldering portion 221, the shielding portion 41 is made of shape memory alloy, and the shielding portion 41 can be bent and deformed between the first shape and the second shape to be far away from or close to the circuit board assembly 20; in the first mode, the shielding portion 41 is bent away from the circuit board assembly 20 and is used for isolating the fill-in light 30 from the soldering portion 221; in the second state, the shielding portion 41 is flattened to be adjacent to the circuit board assembly 20.
This implementation provides electronic equipment includes: circuit mainboard 10, circuit board assembly 20, light filling lamp 30 and shielding piece 40, circuit mainboard 10 installs on electronic equipment's body, light filling lamp 30 is installed on circuit board assembly 20, circuit board assembly 20 can with electronic equipment's power electric connection, thereby make circuit board assembly 20 can the power supply of light filling lamp 30, and can control the circular telegram or the outage of light filling lamp 30, light filling lamp 30 is responsible for providing the light quantity, play the light filling effect when shooing, thereby realize the soft light auto heterodyne. This light filling lamp 30 can provide stronger light volume through the heavy current to it is better to autodyne the effect at night. The light filling lamp 30 is fixed on the circuit board assembly 20 through the patch, and if the light filling lamp 30 receives the temperature about 220 ℃, the soldering tin of the light filling lamp 30 is easily melted, so that the light filling lamp 30 falls off. The circuit board assembly 20 is provided with the welding part 221, the circuit board assembly 20 and the circuit main board 10 can be welded at the position of the welding part 221, the circuit board assembly 20 can be electrically connected with the circuit main board 10 in a welding mode, the circuit main board 10 is generally grounded, and after the circuit board assembly 20 is electrically connected with the circuit main board 10, the circuit board assembly 20 is not easily influenced by other parts in the electronic equipment due to the fact that the circuit main board 10 is grounded generally, and the performance of the electronic equipment is improved.
In the process of welding the circuit board 10 and the circuit board assembly 20, the heat generated by welding and high-energy particles can damage the light supplement lamp 30, in this embodiment, the shielding part 40 is arranged on the circuit board assembly 20, the shielding part 41 of the shielding part 40 is located between the light supplement lamp 30 and the welding part 221, the shielding part 41 blocks the heat generated at the welding part 221 and the high-energy particles generated in the welding process, and the light supplement lamp 30 is not easily damaged. In addition, the shielding portion 41 can be bent relative to the circuit board assembly 20, for example, when the circuit board 10 and the circuit board assembly 20 need to be soldered, the shielding portion 41 is in the state of the first shape, specifically, the shielding member 40 is bent in a direction away from the circuit board assembly 20, the shielding portion 41 can isolate the fill-in light lamp 30 from the soldering portion 221, so that the shielding member 40 can effectively block heat and high-energy particles generated by soldering, after the soldering is completed, the shielding portion is in the second shape, specifically, the second end of the shielding member 40 is close to the circuit board assembly 20, the shielding portion 41 is flattened so that the shielding member 40 can be attached to the circuit board assembly 20, thereby preventing the shielding member 40 from interfering with the installation of other components, reducing the thickness of the electronic device, and facilitating the improvement of the use experience of a user on the electronic device.
Specifically, it is the shape memory alloy spare to have injectd shielding portion 41, and shape memory alloy can take place to warp under the exogenic action, and under the circumstances of recovering the uniform temperature, can return original shape automatically, when needing to open up shielding portion 41, only need place shielding portion 41 in the uniform temperature under, just can realize shielding portion 41 automatic exhibition flat, simplifies staff's operation, is favorable to improving the assembly convenience to electronic equipment.
The influence and the damage of spot welding to the light filling lamp 30 are effectively solved, and the effect of space stacking of the light filling lamp 30 through the spot welding process is achieved.
Before the shape memory alloy part is assembled on the circuit board assembly 20, the shape memory alloy part is firstly punched and bent under the environment of normal temperature or high temperature, the shape memory alloy part is punched and flattened under the environment of low temperature, when the shape memory alloy part needs to be assembled, the shape memory alloy part is bent and installed and fixed on the circuit board assembly 20 under the environment of normal temperature, after the welding of the circuit mainboard 10 and the circuit board assembly 20 is completed, the electronic equipment is placed under the environment of low temperature, the shape memory alloy part can automatically return to the flat state, the shape memory alloy part is attached to the circuit board assembly 20, and the interference of the shape memory alloy part on the installation of other parts in the electronic equipment is avoided. Because the shape memory alloy spare can resume original shape automatically under low temperature environment, so need not carry out the punching press operation to shape memory alloy spare, reduce the operation degree of difficulty of laminating shape memory alloy spare to circuit board components 20, moreover, when the less condition of operating space in the electronic equipment, carry out the punching press to shape memory alloy spare and cause other parts to damage easily, can effectively reduce the assembly degree of difficulty to electronic equipment through setting up shape memory alloy spare automatic recovery original shape.
The one-way shape memory alloy member may be formed into an assembly after being mounted to the circuit board assembly 20, and then the one-way shape memory alloy member may be press-bent in a non-stop temperature environment, or the one-way shape memory alloy member may be press-bent before being mounted to the circuit board assembly 20.
Specifically, the shape memory alloy member in this embodiment is a one-way shape memory alloy member, and the one-way shape memory alloy member can only restore its original shape once, so that, after the one-way shape memory alloy member is attached to the circuit board assembly 20, the one-way shape memory alloy member is not bent again even if the ambient temperature is restored to normal temperature, thereby improving the structural stability of each component in the electronic device.
The temperature of the whole machine is generally required to be-30-80 ℃, the functional and appearance problems can not occur, so the phase-change temperature of the shape memory alloy must be controlled to be-30-80 ℃, and the nickel-titanium memory alloy can be selected in order to realize the ultra-narrow pitch spot welding effect of the 30FPC of the front light supplement lamp.
The thickness range of the one-way memory alloy part is 0.10mm-20mm, and the requirements on the temperature are as follows: wherein the low temperature phase temperature is about-15 ℃, and the high temperature phase temperature is about 30 ℃ to 55 ℃, which relatively accords with the ultra-narrow spacing supporting effect of the circuit board assembly 20 realized by nickel-titanium memory alloy.
At high temperature (temperature 30 ℃ -55 ℃), the L-shaped structure is realized through stamping and bending the nickel-titanium memory alloy shielding piece 40, the purpose is to shield high-energy particles sputtered by spot welding, the high-energy particles are prevented from being sputtered onto the light supplement lamp 30 to damage the light supplement lamp 30, meanwhile, the instantaneous high temperature of spot welding is effectively prevented from being transmitted to the position of the light supplement lamp 30, the soldering tin of the light supplement lamp 30 is effectively prevented from being melted by high temperature, and finally, the ultra-narrow-interval spot welding effect of the circuit board assembly 20 is effectively realized.
At low temperature (temperature of-15 ℃), the L-shaped structure of the shielding piece 40 made of the high-temperature phase nickel-titanium memory alloy is flattened by a stamping process to form a flattening piece, so that the spacing piece of the front light supplement lamp 30 cannot block the assembling of the lampshade 50 in the Z direction, and the spatial overlapping is realized.
In a possible embodiment, at least the shade 41 of the shade 40 is nitinol.
The nickel-titanium memory alloy has a better memory function, the shielding part 41 is the nickel-titanium memory alloy, the shielding part 41 can be ensured to be stably recovered to the second shape at a low temperature state, the shielding part 41 does not need to be further operated by a worker, the workload of the worker can be effectively reduced, and the matching tightness of all the components in the electronic equipment is improved.
In one possible embodiment, the shielding member 40 includes a connecting portion 42 and a shielding portion 41, the connecting portion 42 is connected with the circuit board assembly 20, the shielding portion 41 is connected with the connecting portion 42, and the shielding portion 41 is bendable relative to the connecting portion 42.
In this embodiment, it is specifically limited that the shielding member 40 is composed of two parts, since the shielding member 40 includes the connecting portion 42 and the shielding portion 41, only a part of the structure of the shielding member 40 is made of shape memory alloy, the connecting portion 42 is for connecting the shielding member 40 and the circuit board assembly 20, and the connecting portion 42 does not need to be deformed, so that the connecting portion 42 does not need to be made of shape memory alloy, the usage amount of the shape memory alloy is effectively controlled, and the processing cost of the electronic device is reduced.
In a possible embodiment, the connection portion 42 comprises: a first connecting portion located at a first side of the circuit board assembly 20, the first connecting portion being connected to the shielding portion 41; and the second connecting portion is located on the side of the circuit board assembly 20 and the second side of the circuit board assembly 20, is connected with the first connecting portion, and has a gap with the shielding portion 41.
In this embodiment, it is specifically defined that the connection portion 42 includes a first connection portion and a second connection portion, wherein the first connection portion is located on the first side of the circuit board assembly 20, the first connection portion is connected to the shielding portion 41, and the second connection portion is located on the side wall of the circuit board assembly 20 and the second side of the circuit board assembly 20, and by providing the first connection portion and the second connection portion, the connection portion 42 is connected to at least three surfaces of the circuit board assembly 20, so that the connection stability between the connection portion 42 and the circuit board assembly 20 is effectively improved.
Set up the breach between shielding portion 41 and the second connecting portion, the breach can provide the space of buckling for the bending deformation of shielding portion 41, avoids connecting portion to produce the interference to the process of buckling of shielding portion 41, guarantees that shielding portion 41 can stably switch and buckle to target in place between first form and second form.
Referring to fig. 1 and 3, in one possible embodiment, a circuit board assembly 20 includes: the circuit soft board 21, the light supplement lamp 30 and the shielding piece 40 are arranged on the circuit soft board 21; the reinforcing plate 22 is provided on the side of the flexible circuit board 21 facing the circuit board 10, and the reinforcing plate 22 is soldered to the circuit board 10.
In this embodiment, the circuit board assembly 20 includes a flexible circuit board 21 and a reinforcing plate 22, the fill light 30 can be electrically connected to the flexible circuit board 21, and the flexible circuit board 21 has a smaller thickness, so as to reduce the thickness of the electronic device. Reinforcing plate 22 sets up the one side at circuit soft board 21, specifically, reinforcing plate 22 is located circuit soft board 21 towards one side of circuit mainboard 10, reinforcing plate 22 can with circuit soft board 21 electric connection, weld reinforcing plate 22 to circuit mainboard 10 after, circuit mainboard 10 and circuit soft board 21's electric connection has been realized, thereby make circuit soft board 21 ground connection, avoid circuit soft board 21 to produce the influence to electronic equipment's self antenna performance, one side through at circuit soft board 21 sets up reinforcing plate 22, because reinforcing plate 22's area is great, can effectively improve circuit mainboard 10 and circuit board assembly 20's welding convenience, reinforcing plate 22 can also improve circuit soft board 21's structural strength, reduce circuit soft board 21's spoilage, improve electronic equipment's structural stability.
In one possible embodiment, as shown in fig. 1 and 3, a through hole 211 is provided on the flexible circuit board 21, and a portion of the reinforcing plate 22 located at the through hole 211 is configured as a soldering portion 221.
In this embodiment, the soldering position on the circuit board assembly 20 is specifically defined, the through hole 211 is formed on the flexible circuit board, the flexible circuit board 21 is located on the reinforcing board 22 on the exposed side of the through hole 211, if the through hole 211 is not formed on the flexible circuit board 21, the reinforcing board 22 needs to be beyond the edge of the flexible circuit board 21, and then the reinforcing board 22 is soldered to the main circuit board 10, which causes the soldering point to be located on the side of the flexible circuit board, which easily causes the flexible circuit board 21 to shake, and in this embodiment, the soldering portion 221 is defined as the portion of the reinforcing board 22 located at the through hole 211, so that the soldering point can be located near the center of the flexible circuit board 21 rather than the side of the flexible circuit board 21, thereby improving the mounting stability of the flexible circuit board 21.
In one possible application, as shown in fig. 1, 6 and 7, the shielding member 40 can be bent with respect to the circuit board assembly 20 so as to shield the through hole 211.
After the shielding piece 40 is bent, the shielding piece 40 can cover the through hole 211, that is, the shielding piece 40 shields the through hole 211, so that the shielding piece 40 can shield the welding point on the reinforcing plate 22, the welding point is prevented from being damaged, and the welding stability of the circuit board assembly 20 and the circuit main board 10 is improved.
In one possible embodiment, the stiffening plate 22 comprises: phosphor bronze reinforcing plate.
In this embodiment, the material of the reinforcing plate 22 is specifically limited, the circuit board 10 generally consists of a main board body and a main board upper cover, and the main board upper cover is generally made of a magnesium alloy material, and the welding effect is better after the phosphor bronze and the magnesium alloy of the main board upper cover are spot-welded, so that the stability and stability of the welding of the circuit board assembly 20 can be improved.
The thickness of the phosphor bronze reinforcing plate 22 in the present embodiment may be 0.1mm, which effectively reduces the thickness of the electronic device.
In one possible embodiment, the first end of the shield 40 is adhesively secured to the circuit board assembly 20.
In this embodiment, the installation manner of the shielding member 40 is specifically limited, the shielding member 40 is fixed to the circuit board assembly 20 by means of adhesion, so that the installation convenience of the shielding member 40 can be effectively improved, and the structure of the circuit board assembly 20 is not easily damaged by the heat-insulating adhesive member arranged between the shielding member 40 and the circuit board assembly 20, thereby ensuring the functional stability of the circuit board assembly 20.
In one possible embodiment, the electronic device further comprises: a thermal barrier adhesive between the first end of the shield 40 and the circuit board assembly 20 and connecting the shield 40 and the circuit board assembly 20.
In this embodiment, in the welding process, since the shielding member 40 blocks heat generated in the welding process, the temperature of the shielding member 40 will rise, and in order to avoid the heat of the shielding member 40 from being transferred to the circuit board assembly 20, a heat insulation adhesive member is disposed between the shielding member 40 and the circuit board assembly 20, and the heat insulation adhesive member has a good heat insulation effect, so that heat transfer from the shielding member 40 to the circuit board assembly 20 can be effectively blocked, and the circuit board assembly 20 and the fill light 30 are prevented from being damaged due to the temperature rise.
As shown in fig. 1 and 7, in one possible embodiment, the electronic device further includes: the lamp shade 50 is disposed on the circuit board assembly 20, and the light supplement lamp 30 is disposed between the lamp shade 50 and the circuit board assembly 20.
In this embodiment, the lampshade 50 is fixed on the circuit board assembly 20 in a pasting manner, and the lampshade 50 is fixed on the circuit board assembly 20 in a pasting manner, so that the installation convenience of the lampshade 50 can be effectively improved, and moreover, the structure of the circuit board assembly 20 is not easily damaged in the pasting manner, and the functional stability of the circuit board assembly 20 is ensured.
In a possible embodiment, as shown in fig. 1 and fig. 3, in the first mode, a distance between one end of the shielding portion 41 away from the circuit board assembly 20 and the circuit board assembly 20 is greater than or equal to a thickness of the fill light 30.
In this embodiment, it is specifically limited that the height of the shielding member 40 when being bent is higher than the thickness of the light supplement lamp 30, so that the shielding member 40 can shield heat and high-energy particles generated in the welding process in a large range, and the protection effect on the light supplement lamp 30 is improved.
Of course, in other embodiments, the height of the shielding member 40 may be the same as that of the fill-in light 30 or lower than that of the fill-in light 30.
Embodiments of the second aspect of the present application provide a method for assembling an electronic device, which is used for the electronic device in any one of the above possible designs. The electronic device includes: the circuit board assembly is provided with a welding part welded with the circuit board, the shielding part and the light supplementing lamp are arranged on the circuit board, and the shielding part of the shielding part is positioned between the welding part and the shielding part; the shielding part is a shape memory alloy piece;
as shown in fig. 8, the assembling method of the electronic device includes:
step S102, fixing the shielding piece and the light supplementing lamp on the circuit board assembly;
step S104, welding the welding part and the circuit board assembly to fix the circuit board assembly on the circuit main board when the shielding part of the shielding piece is in the first shape;
and S106, when the shielding part of the shielding piece is in the second form, fixing the whole formed by assembling the circuit main board, the circuit board assembly, the light supplementing lamp and the shielding piece in the shell of the electronic equipment so as to enable the light supplementing lamp to be positioned between the lampshade of the electronic equipment and the circuit board assembly.
When the occlusion part is in under the first form, the relative circuit board assembly of occlusion part is buckled promptly, is welding circuit mainboard and circuit board assembly, and the heat that the welding produced and the particle of high energy can cause the damage to the light filling lamp, and the occlusion part of buckling can block the heat that is located the production of welding part department and the high energy particle that produces among the welding process, and the light filling lamp is difficult for taking place to damage. After the welding is completed, the shielding portion is in the second form, namely the shielding portion is flattened, the shielding portion is close to the circuit board assembly, the shielding portion can be attached to the circuit board assembly, interference of the shielding portion on installation of other parts is avoided, the thickness of the electronic equipment is reduced, and the use experience of a user on the electronic equipment is improved.
The shape memory alloy part is assembled between the circuit board components, the shape memory alloy part is firstly punched and bent under the environment within a first temperature value range, the shape memory alloy part is punched and flattened under the environment within the first temperature value range, when the shape memory alloy part needs to be assembled, the electronic device is arranged under the environment within the first temperature value range, the shape memory alloy part is bent and installed and fixed on the circuit board component, after the circuit main board and the circuit board component are welded, the electronic device is arranged under the environment within a second temperature value range, the shape memory alloy part can automatically return to the flattened state, so that the shape memory alloy part is attached to the circuit board component, the shape memory alloy piece is prevented from interfering with the installation of other parts in the electronic equipment. Because the shape memory alloy spare can resume original shape automatically under the environment of second temperature value within range, so need not carry out the punching press operation to shape memory alloy spare, reduce the operation degree of difficulty with shape memory alloy spare laminating to circuit board subassembly, moreover, when the less condition of operating space in the electronic equipment, it causes other parts to damage easily to punch the shape memory alloy spare, can effectively reduce the assembly degree of difficulty to electronic equipment through setting up shape memory alloy spare automatic recovery original shape.
Specifically, the shape memory alloy member in this embodiment is a one-way shape memory alloy member, and the one-way shape memory alloy member can only restore the original shape once, so that, after the one-way shape memory alloy member is attached to the circuit board assembly, even if the ambient temperature is restored to the environment within the first temperature value range, the one-way shape memory alloy member is not bent again, thereby improving the structural stability of each component in the electronic device.
The minimum temperature value in the first temperature value range is greater than the maximum temperature value in the second temperature value range, the first temperature value range can be normal temperature or high temperature, and the second temperature value range can be low temperature.
The ambient temperature value is reduced to a second temperature value range, and the shielding part is bent along a second direction.
After the circuit main board and the circuit board assembly are welded, the electronic equipment is placed in the environment within the second temperature value range, the shape memory alloy piece can automatically return to the flat state, so that the shape memory alloy piece is attached to the circuit board assembly, and the shape memory alloy piece is prevented from interfering with the installation of other parts in the electronic equipment. Because the shape memory alloy spare can resume original shape automatically under the environment of second temperature value within range, so need not carry out the punching press operation to shape memory alloy spare, reduce the operation degree of difficulty with shape memory alloy spare laminating to circuit board subassembly, moreover, when the less condition of operating space in the electronic equipment, it causes other parts to damage easily to punch the shape memory alloy spare, can effectively reduce the assembly degree of difficulty to electronic equipment through setting up shape memory alloy spare automatic recovery original shape.
It should be noted that, in this document, the term "comprises/comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "communicate," "connect," and the like are to be construed broadly, e.g., "communication" may be through a direct connection or through other components. The terms "first," "second," and the like are used for distinguishing between different objects and not for describing a particular order of the objects. In the embodiments, words such as "for example" are used to mean serving as an example, certificate, or illustration. Any embodiment or design described herein as "for example" is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "such as" is intended to present relevant concepts in a concrete fashion. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An electronic device, comprising:
a circuit main board;
the circuit board assembly is provided with a welding part, and the welding part is welded on the circuit main board so as to electrically connect the circuit board assembly and the circuit main board;
the light supplement lamp is arranged on the circuit board assembly and is positioned on the first side of the circuit board assembly;
the shielding part is arranged on the first side of the circuit board assembly and is positioned between the light supplement lamp and the welding part, the shielding part is made of shape memory alloy, and the shielding part can be bent and deformed between a first shape and a second shape so as to be far away from or close to the circuit board assembly;
in the first form, the shielding part is bent to be away from the circuit board assembly and is used for isolating the light supplement lamp from the welding part; in the second state, the shielding portion is flattened to be adjacent to the circuit board assembly.
2. The electronic device of claim 1,
in the shielding piece, at least the shielding part is made of nickel-titanium memory alloy.
3. The electronic device according to claim 1, wherein the shielding member includes a connecting portion and the shielding portion, the connecting portion is connected to the circuit board assembly, the shielding portion is connected to the connecting portion, and the shielding portion is bendable relative to the connecting portion.
4. The electronic device according to claim 3, wherein the connection portion includes:
a first connection portion located at the first side of the circuit board assembly, the first connection portion being connected to the shielding portion;
the second connecting portion are located on the side edge of the circuit board assembly and the second side of the circuit board assembly, the second connecting portion are connected with the first connecting portion, and a gap is formed between the second connecting portion and the shielding portion.
5. The electronic device of claim 1, wherein the circuit board assembly comprises:
the circuit soft board is provided with the light supplementing lamp and the shielding piece;
the stiffening plate is located the soft board orientation of circuit one side of circuit mainboard, the stiffening plate weld in the circuit mainboard.
6. The electronic apparatus according to claim 5, wherein the flexible circuit board is provided with a through hole, and a portion of the reinforcing plate located at the through hole is configured as the soldering portion.
7. The electronic device of claim 6,
the shielding piece can be bent relative to the circuit board assembly so as to shield the through hole.
8. The electronic device of any of claims 1-7, further comprising:
and the heat insulation paste piece is positioned between the shielding piece and the circuit board assembly and is connected with the shielding piece and the circuit board assembly.
9. The electronic device of any of claims 1-7,
in the first state, the distance between one end of the shielding part, which is far away from the circuit board assembly, and the circuit board assembly is larger than or equal to the thickness of the light supplement lamp.
10. An assembling method of an electronic apparatus, characterized by being applied to the electronic apparatus according to any one of claims 1 to 9;
the assembling method of the electronic equipment comprises the following steps:
fixing the shielding piece and the light supplementing lamp on the circuit board assembly;
when the shielding part of the shielding piece is in the first state, welding the welding part and the circuit board assembly to fix the circuit board assembly on the circuit main board;
and under the second state of the shielding part, the circuit main board, the circuit board assembly, the light supplementing lamp and the shielding part are integrally fixed in the shell of the electronic equipment, so that the light supplementing lamp is positioned between the lampshade of the electronic equipment and the circuit board assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110075690.7A CN112631042B (en) | 2021-01-20 | 2021-01-20 | Electronic device and method of assembling electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110075690.7A CN112631042B (en) | 2021-01-20 | 2021-01-20 | Electronic device and method of assembling electronic device |
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| CN112631042A true CN112631042A (en) | 2021-04-09 |
| CN112631042B CN112631042B (en) | 2021-09-24 |
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| US20050185408A1 (en) * | 2004-02-20 | 2005-08-25 | Samsung Electronics Co., Ltd. | Lamp unit and display device of projector system |
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| Publication number | Publication date |
|---|---|
| CN112631042B (en) | 2021-09-24 |
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