CN112589976B - Production method of ceramic wafer for ceramic packaging base - Google Patents
Production method of ceramic wafer for ceramic packaging base Download PDFInfo
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- CN112589976B CN112589976B CN202011608190.7A CN202011608190A CN112589976B CN 112589976 B CN112589976 B CN 112589976B CN 202011608190 A CN202011608190 A CN 202011608190A CN 112589976 B CN112589976 B CN 112589976B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/08—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads
- B28B11/0863—Apparatus or processes for treating or working the shaped or preshaped articles for reshaping the surface, e.g. smoothing, roughening, corrugating, making screw-threads for profiling, e.g. making grooves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/12—Apparatus or processes for treating or working the shaped or preshaped articles for removing parts of the articles by cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/24—Apparatus or processes for treating or working the shaped or preshaped articles for curing, setting or hardening
- B28B11/243—Setting, e.g. drying, dehydrating or firing ceramic articles
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Abstract
The invention relates to a method for producing a ceramic wafer for a ceramic packaging base, which comprises the following steps: manufacturing a ceramic green plate, and dividing the plate-shaped ceramic green plate into a plurality of ceramic green sheets; step two, carrying out technological edge cutting and trimming on each ceramic green sheet; and step three, sintering and hardening the ceramic green sheet trimmed in the step two to obtain the ceramic sheet. The ceramic green sheet is produced in the production process, and the ceramic green sheet is subjected to process edge cutting and trimming based on the characteristic that the hardness of the ceramic green sheet is relatively low, so that the size of the produced ceramic sheet can meet the precision requirement conveniently.
Description
Technical Field
The invention relates to a production method of a ceramic wafer for a ceramic packaging base.
Background
Ceramic wafers are used as ceramic packaging bases, and at present, the production method of the ceramic wafers comprises the following steps: the method comprises the steps of producing a large plate-shaped ceramic green body, pressing indentation separation grooves on main surfaces of the upper surface, the lower surface and the like of the large plate-shaped ceramic green body, separating each ceramic plate through the indentation separation grooves, applying bending stress to the large plate on two sides of the indentation separation grooves through a splitting device after sintering and hardening, bending the large plate, and enabling the large plate to be broken from the indentation separation grooves, so that the single ceramic plates are formed.
The method is easy to cause the phenomena of uneven technological edges, more burrs and the like of the ceramic chip product under the condition that the indentation separation grooves on the upper plate surface and the lower plate surface are not overlapped or the splitting process is unstable, so that the actual size of the ceramic chip is larger than the design size, the side surface of the ceramic chip is uneven, and the ceramic packaging base which has high requirements on the size precision of the ceramic chip and the flatness of each side surface cannot meet the use requirements.
Disclosure of Invention
The invention aims to provide a method for producing a ceramic wafer for a ceramic packaging base, which aims to solve the technical problem that the size precision and the side flatness of the ceramic wafer produced in the prior art cannot meet the high-precision requirement.
The invention relates to a method for producing a ceramic wafer for a ceramic packaging base, which adopts the following technical scheme:
a production method of a ceramic wafer for a ceramic packaging base comprises the following steps:
manufacturing a ceramic green plate, and dividing the plate-shaped ceramic green plate into a plurality of ceramic green sheets;
step two, carrying out technological edge cutting and trimming on each ceramic green sheet;
and step three, sintering and hardening the ceramic green sheet trimmed in the step two to obtain the ceramic sheet.
The beneficial effects are that: the ceramic green sheet is produced in the production process, and the ceramic green sheet is subjected to process edge cutting and trimming based on the characteristic that the hardness of the ceramic green sheet is relatively low, so that the size of the produced ceramic sheet can meet the precision requirement conveniently.
Further, the upper surface and/or the lower surface of the ceramic green sheet is formed with a weak portion in the first step, and a ceramic green sheet is obtained by breaking the ceramic green sheet at the weak portion.
The beneficial effects are that: the ceramic green sheet can be easily segmented into ceramic green sheets by the weak portions.
Further, in the second step, the first side and the second side which are opposite to each other of the ceramic green sheet are sequentially subjected to process side cutting treatment; when cutting a first side and a second side of the ceramic green sheet which are opposite to each other, the first side is cut to form a plane, and then the second side is cut based on the target dimension of the ceramic sheet in the direction with reference to the cut plane.
The beneficial effects are that: firstly, a plane is cut on one side of the ceramic green sheet, and then the other side of the ceramic green sheet is cut by taking the plane as a reference, so that the ceramic green sheet subjected to the cutting process on the technical side has higher dimensional precision.
Further, the ceramic green sheet is subjected to process edge cutting by using a cutting auxiliary device, wherein the cutting auxiliary device is provided with a positioning reference surface, and a first cutting reference surface and a second cutting reference surface which are positioned on the upper side of the positioning reference surface and used for providing cutting references for a first edge and a second edge which are opposite to each other and used for cutting the ceramic green sheet; when cutting and trimming the first and second sides facing each other, the second side of the ceramic green sheet is placed on a positioning reference surface, the cutting and trimming of the first side is completed based on the first cutting reference surface, and then a plane cut by the first side is bonded to the positioning reference surface, and the cutting processing of the second side is completed based on the second cutting reference surface.
The beneficial effects are that: the cutting auxiliary device is adopted for assisting cutting, so that the cutting processing of the ceramic green sheet can be conveniently realized.
Further, the cutting auxiliary device comprises a fixed platform and a fixed block arranged on the table top of the fixed platform through magnetic attraction, the upper table top of the fixed platform forms a positioning reference surface, and the first cutting reference surface and the second cutting reference surface are both arranged on the fixed block.
The beneficial effects are that: the fixing block can be conveniently arranged on the fixing platform through magnetic attraction, and the fixing block can be conveniently replaced due to the fact that the process edge cutting processing needs to be carried out on different edges.
Furthermore, at least two fixing blocks are arranged, the at least two fixing blocks form a fixing block group, the ceramic green sheets are clamped along the thickness direction of the ceramic green sheets through the group of fixing blocks, the ceramic green sheets are subjected to process edge cutting and trimming, and the first cutting reference surfaces are arranged on at least one group of fixing blocks so that when the first edges of the ceramic green sheets are trimmed, the cutting knives are simultaneously positioned through the first cutting reference surfaces on the group of fixing blocks; the second cutting reference surfaces are arranged on at least one group of the fixed blocks, so that when the second edge of the ceramic green sheet is trimmed, the cutting tools can be simultaneously positioned through the second cutting reference surfaces on the group of the fixed blocks.
The beneficial effects are that: the fixing block clamps and fixes the ceramic green sheet to be cut and trimmed, so that the ceramic green sheet to be cut and trimmed is stably positioned, meanwhile, the first cutting reference surface and the second cutting reference surface are distributed on the grouped fixing blocks, and when the ceramic green sheet to be cut and trimmed is cut, the first cutting reference surface and the second cutting reference surface are distributed on two sides of the ceramic green sheet to be cut and trimmed, so that the cutting knife can stably and precisely cut the ceramic green sheet along the stable sliding of the first cutting reference surface and the second cutting reference surface.
Further, the ceramic green sheet is formed by laminating at least two ceramic green substrates and then pressing, and a circuit is printed on a side surface of at least one of the ceramic green substrates facing in the laminating direction.
The beneficial effects are that: based on ceramic green sheet is formed by pressing after at least two ceramic green substrate layers are laminated, when cutting and trimming, the fixed block group further compresses the ceramic green sheet, so that the cutting and trimming process can not only not cause harmful influence on the hardness of the ceramic green sheet, but also promote the strength of the ceramic green sheet to be enhanced.
Furthermore, the cutting auxiliary device comprises a fixed platform and a fixed block group arranged on the fixed platform, the fixed block group comprises at least two fixed blocks, and an upper table top of the fixed platform forms a positioning reference surface; clamping the ceramic green sheets along the thickness direction of the ceramic green sheets through the group of fixing blocks, and then carrying out technological edge cutting and trimming on the ceramic green sheets; the first cutting reference surfaces are arranged on at least one group of fixed blocks, and when the first edges of the ceramic green sheets are trimmed, the cutting knives are simultaneously positioned through the first cutting reference surfaces on the group of fixed blocks; and the second cutting reference surfaces are arranged on at least one group of fixed blocks, and when the second edge of the ceramic green sheet is trimmed, the cutting tools are simultaneously positioned through the second cutting reference surfaces on the group of fixed blocks.
The beneficial effects are that: the fixing block clamps and fixes the ceramic green sheet to be cut and trimmed, so that the ceramic green sheet to be cut and trimmed is stably positioned, meanwhile, the first cutting reference surface and the second cutting reference surface are distributed on the grouped fixing blocks, and when the ceramic green sheet to be cut and trimmed is cut, the first cutting reference surface and the second cutting reference surface are distributed on two sides of the ceramic green sheet to be cut and trimmed, so that the cutting knife can stably and precisely cut the ceramic green sheet along the stable sliding of the first cutting reference surface and the second cutting reference surface.
Further, the ceramic green sheet is formed by laminating at least two ceramic green substrates and then pressing, and a circuit is printed on a side surface of at least one of the ceramic green substrates facing in the laminating direction.
The beneficial effects are that: based on ceramic green sheet is formed by pressing after at least two ceramic green substrate layers are laminated, when cutting and trimming, the fixed block group further compresses the ceramic green sheet, so that the cutting and trimming process can not only not cause harmful influence on the hardness of the ceramic green sheet, but also promote the strength of the ceramic green sheet to be enhanced.
Drawings
FIG. 1 is a view showing a structure and a state of use of a cutting assisting apparatus used in a method for producing a ceramic sheet for a ceramic package base according to the present invention;
the names of the components corresponding to the corresponding reference numerals in the drawings are:
1-a fixed platform; 2, fixing blocks; 3-ceramic green sheets; 4-technological edge.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that relational terms such as "first" and "second," and the like, which may be present in the embodiments of the present invention, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the recitation of "comprising an … …" may occur without the exclusion of additional like elements present in the process, method, article, or apparatus that comprises the element.
In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" when they are used are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art from specific situations.
In the description of the present invention, unless otherwise specifically stated or limited, the term "provided" may be used in a broad sense, for example, the object of "provided" may be a part of the body, or may be arranged separately from the body and connected to the body, and the connection may be detachable or non-detachable. The specific meaning of the above terms in the present invention can be understood by those skilled in the art from specific situations.
The present invention will be described in further detail with reference to examples.
In example 1 of the method for producing a ceramic sheet for a ceramic package base according to the present invention, a method for producing a ceramic sheet for a ceramic package base according to the present invention is described, taking as an example that a trimmed ceramic green sheet is a ceramic green sheet formed by laminating a plurality of ceramic green substrates in a thickness direction and then pressing the laminated ceramic green sheets, wherein at least one layer of the ceramic green substrates has a circuit printed thereon, and the method specifically includes:
in the first step, a ceramic green sheet is produced, and an indentation process is performed on the upper and lower surfaces of a large-sheet-shaped ceramic green sheet to form a weak portion on the ceramic green sheet, and the ceramic green sheet is segmented into ceramic green sheets from the weak portion. In other embodiments, the weakened portions may be provided in only one of the upper and lower surfaces, and the weakened portions may be in the form of spaced apart holes.
And secondly, carrying out size trimming on the produced ceramic green sheets, wherein the trimming content mainly comprises that each pair of opposite first edges and second edges of the ceramic green sheets are subjected to process edge cutting treatment, so that the length and width dimensions of the finally prepared ceramic sheets and the flatness of each side surface meet the precision requirement. Specifically, the following description is given by taking the cutting process of the process edges of the first edge and the second edge opposite to each other in the length direction of the ceramic sheet as an example:
the target dimension of the ceramic sheet in the length direction is h, and the dimension of the produced ceramic green sheet is h + s, so that the ceramic green sheet needs to be cut and trimmed by a process with the cutting amount s in the length direction. Specifically, first, the ceramic green sheet was subjected to a process-side cutting process to cut a plane with a cutting amount of 1/2s on a first side in the longitudinal direction, and then, based on the cut plane, the ceramic green sheet was subjected to a cutting process on a second side in accordance with a target dimension of the ceramic sheet in the direction, and the length dimension of the ceramic green sheet was trimmed to h by the cutting process.
The technical edges of the first edge and the second edge which are opposite to each other in the width direction of the ceramic green sheet are also cut by referring to the cutting treatment of the technical edges on the two sides in the length direction, so that the size precision of the ceramic sheet meets the use requirement, and meanwhile, the side surfaces of the ceramic green sheet are ensured to be flat and smooth through the cutting treatment of the technical edges, so that the flatness of each side surface of the ceramic sheet meets the requirement of printing a circuit.
And thirdly, sintering and hardening the ceramic green sheet subjected to the process edge cutting treatment to obtain the ceramic sheet with dimensional precision and side flatness meeting the use requirements.
Wherein the second step can carry out size processing with the help of corresponding cutting auxiliary device, the device's structure is shown in fig. 1, including magnetism fixed platform 1, because the length dimension and the width dimension of ceramic green sheet all need to be maintained, consequently, correspond fixed platform 1 and dispose four groups of metal block fixed block 2, during the use, fixed block 2 is fixed on fixed platform through magnetism to press from both sides tight location along the thickness direction by corresponding fixed block group, wherein two sets of fixed block group are for being used for the length maintenance fixed block group of maintaining ceramic green sheet length, other two sets of height maintenance fixed block group of maintaining the height of ceramic green sheet, every fixed block group all includes two fixed blocks 2. The structure and the using method of the ceramic green sheet dimension trimming device are described by taking trimming of the process edges on two sides of the ceramic green sheet in the length direction as an example, and specifically the following steps are included:
the two groups of length trimming fixed blocks are respectively a first group of length trimming fixed blocks and a second group of length trimming fixed blocks, the heights of the two length trimming fixed blocks of the first group of length trimming fixed blocks are h +1/2s, and the heights of the two length trimming fixed blocks 2 of the second group of length trimming fixed blocks are h.
When the ceramic green sheet trimming device is used specifically, a first group of length trimming fixing blocks are fixed on a fixing platform 1 in an adsorption mode, the upper table top of the fixing platform 1 is a positioning reference surface, the second edge of the ceramic green sheet 3 in the length direction is attached to the upper table top of the fixing platform 1, the upper table tops of the two fixing blocks form a first cutting reference surface, a handheld cutting knife cuts off the technological edge of the ceramic green sheet 3 exposed out of the upper end face of the length fixing block along the first cutting reference surface, then a second length trimming fixing block group is replaced, the upper table top of the second length trimming fixing block forms a second cutting reference surface, and the distance between the second cutting reference surface and the positioning reference surface is consistent with the target size of the ceramic sheet in the trimming direction. As shown in fig. 1, the ceramic green sheet 3 with the finished trimming of the first edge in the length direction is added between the two length trimming fixing blocks 2, the cut plane is attached to the positioning reference plane, and then the cutting blade is held by hand to cut off the part of the process edge 4 of the ceramic green sheet 3 higher than the second length trimming fixing block group along the second cutting reference plane, so that the process edges on both sides of the ceramic green sheet 3 in the length direction can be cut off, and the length dimension of the ceramic green sheet 3 and the flatness of the end faces at both ends in the length direction can meet the use requirements.
Finishing the trimming of the ceramic green sheet 3 in the height direction can be completed by the same operation method. In other embodiments, the ceramic green sheet may also be made by tape casting.
Example 4 of the method for producing a ceramic sheet for a ceramic package base according to the present invention is different from example 1 in that, in this example, when a ceramic green sheet is produced, the ceramic green sheet is directly cut by a cutter to obtain a ceramic green sheet.
Embodiment 5 of the method for producing a ceramic wafer for a ceramic package base according to the present invention is different from embodiment 1 in that each fixing block of the fixing block group is movably guided to be mounted on the fixing platform, and a locking structure for locking the position of the fixing block is provided, and after the fixing block is moved to a position for clamping a ceramic green sheet, the position of the fixing block is locked.
Example 6 of the method for producing a ceramic sheet for a ceramic package base according to the present invention is different from example 1 in that the cutting assistance device used in this example is an integrated block structure, and a positioning reference surface and a corresponding cutting reference surface are machined on the cutting assistance device of the block structure.
Embodiment 7 of the method for producing a ceramic wafer for a ceramic package base according to the present invention is different from embodiment 1 in that a set of fixed blocks is provided for each pair of opposite sides, and the fixed block is provided with a first cutting reference surface and a second cutting reference surface at the same time.
The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be embraced therein.
Claims (7)
1. A production method of a ceramic wafer for a ceramic packaging base is characterized by comprising the following steps:
manufacturing a ceramic green plate, and dividing the plate-shaped ceramic green plate into a plurality of ceramic green sheets (3);
step two, carrying out technological edge cutting and trimming on each ceramic green sheet (3);
step three, sintering and hardening the ceramic green sheet (3) trimmed in the step two to obtain a ceramic sheet;
in the second step, the first side and the second side which are opposite to each other of the ceramic green sheet are sequentially subjected to process side cutting treatment; when a first edge and a second edge which are opposite to each other of the ceramic green sheet are cut, the first edge is cut to form a plane, and then the second edge is cut according to the target size of the ceramic sheet in the direction by taking the cut plane as a reference;
performing process edge cutting on the ceramic green sheet (3) by using a cutting auxiliary device, wherein the cutting auxiliary device is provided with a positioning reference surface, and a first cutting reference surface and a second cutting reference surface which are positioned on the upper side of the positioning reference surface and used for providing cutting references for a first edge and a second edge which are opposite to each other for cutting the ceramic green sheet; when cutting and trimming the first and second sides facing each other, the second side of the ceramic green sheet (3) is placed on a positioning reference surface, the cutting and trimming of the first side is completed based on the first cutting reference surface, and then a plane cut from the first side is bonded to the positioning reference surface, and the cutting processing of the second side is completed based on the second cutting reference surface.
2. The method of producing a ceramic sheet for a ceramic package base as claimed in claim 1, wherein the upper surface and/or the lower surface of the ceramic green sheet is formed with a weak portion in the first step, and the ceramic green sheet is obtained by breaking the ceramic green sheet at the weak portion.
3. The method for producing a ceramic wafer for a ceramic package base as claimed in claim 1 or 2, wherein the cutting assistance device comprises a fixed platform (1) and a fixed block (2) magnetically attached to a table top of the fixed platform, an upper table top of the fixed platform forms a positioning reference surface, and the first cutting reference surface and the second cutting reference surface are both disposed on the fixed block (2).
4. The method for producing a ceramic wafer for a ceramic package base as claimed in claim 3, wherein the fixing blocks are provided in at least two, the at least two fixing blocks form a fixing block group, the ceramic green sheets (3) are trimmed by process edge cutting after being clamped in the thickness direction of the ceramic green sheets (3) by the set of fixing blocks (2), the first cutting reference surface is provided on at least one set of fixing blocks (2) to simultaneously position the cutting tools by the first cutting reference surface on the set of fixing blocks (2) when trimming the first edges of the ceramic green sheets; the second cutting reference surfaces are arranged on at least one group of the fixed blocks (2) so that the cutting tools can be simultaneously positioned through the second cutting reference surfaces on the group of the fixed blocks (2) when the second edges of the ceramic green sheets are trimmed.
5. The method of producing a ceramic sheet for a ceramic package base as recited in claim 4, wherein the ceramic green sheet is formed by laminating at least two ceramic green sheets and then pressing, and at least one ceramic green sheet has a circuit printed on a side surface thereof facing in the laminating direction.
6. The method for producing the ceramic wafer for the ceramic package base as claimed in claim 1 or 2, wherein the cutting auxiliary device comprises a fixed platform (1) and a fixed block set arranged on the fixed platform, the fixed block set comprises at least two fixed blocks, and an upper table surface of the fixed platform forms a positioning reference surface; clamping the ceramic green sheets (3) along the thickness direction of the ceramic green sheets (3) through the group of fixing blocks (2), and then carrying out process edge cutting and trimming on the ceramic green sheets; the first cutting reference surfaces are arranged on at least one group of fixed blocks (2), and when the first edge of the ceramic green sheet is trimmed, the cutting knives are simultaneously positioned through the first cutting reference surfaces on the group of fixed blocks (2); the second cutting reference surfaces are arranged on at least one group of the fixed blocks (2), and when the second edges of the ceramic green sheets are trimmed, the cutting tools are simultaneously positioned through the second cutting reference surfaces on the group of the fixed blocks (2).
7. The method of producing a ceramic sheet for a ceramic package base as recited in claim 6, wherein the ceramic green sheet is formed by laminating at least two ceramic green sheets and then pressing, and at least one ceramic green sheet has a circuit printed on a side surface thereof facing in the laminating direction.
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| CN116021615B (en) * | 2022-12-28 | 2023-09-29 | 江苏迪丞光电材料有限公司 | Ceramic wafer production method for ceramic package base |
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| JPH05131431A (en) * | 1991-11-08 | 1993-05-28 | Matsushita Electric Ind Co Ltd | Production of ceramic substrate |
| JP2003246680A (en) * | 2002-02-26 | 2003-09-02 | Murata Mfg Co Ltd | Method of manufacturing multilayered ceramic substrate |
| EP1918082A3 (en) * | 2006-10-30 | 2010-09-15 | Maincer, S.L. | Machine for precutting ceramic tiles |
| CN102080437B (en) * | 2010-12-10 | 2012-07-04 | 梁裕恩 | Fragmentary splicing ceramic tile and production method thereof |
| TWM463020U (en) * | 2013-05-17 | 2013-10-01 | Neng Light Source Company Ltd De | Substrate Matrix material of miniature passive element |
| CN204800825U (en) * | 2015-07-01 | 2015-11-25 | 潍坊弘业建材有限公司 | Production board material removes end skin equipment |
| CN106113239B (en) * | 2016-06-17 | 2018-10-26 | 蒋春生 | Air-entrained concrete building block production method and roll-over table for this method |
| CN106760367A (en) * | 2016-11-28 | 2017-05-31 | 孙天波 | A kind of method of special-shaped porcelain brick shaping |
| CN207402956U (en) * | 2017-10-31 | 2018-05-25 | 遂宁市华全建材有限责任公司 | A kind of continuous side integer type device of brickmaking moulded pottery not yet put in a kiln to bake material |
| CN211806863U (en) * | 2019-12-17 | 2020-10-30 | 洛阳索莱特材料科技有限公司 | Cutting tool for ceramic mud pieces |
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