TWM463020U - Substrate Matrix material of miniature passive element - Google Patents

Description

微型被動元件之基板母材Substrate base material for miniature passive components

    本創作係關於一種微型被動元件之基板母材，尤指一種被切割件做線切割之對未燒結之生坯板之微型被動元件之基板母材。
The present invention relates to a substrate base material of a miniature passive component, and more particularly to a substrate base material of a micro passive component of an unsintered green sheet which is cut by a cutting member.

    被動元件係大致上可分為電阻、電容以及電感等三個類型，其在電子電路中並不會主動發揮功能，因此被稱呼為被動元件。Passive components are roughly classified into three types: resistors, capacitors, and inductors. They do not actively function in electronic circuits and are therefore referred to as passive components.

    而在被動元件的範疇中，電阻的功用在於限制電路中的電流，其被大量地運用在各式電子產品中，以手機、平板電腦等智慧型電子產品為例，其單一機體內部之電路板上即使用了數百個電阻，不但數量龐大，同時也意味著這些被動元件已微縮至相當程度之體積，方能大量地運用在手持產品之中。因此，如何能夠快速且穩定地大量製備微型被動元件，即是相關產業所關切的一個議題。In the category of passive components, the function of the resistor is to limit the current in the circuit. It is widely used in various electronic products. For example, a smart electronic product such as a mobile phone or a tablet computer has a circuit board inside a single body. Hundreds of resistors are used on the top, not only in large quantities, but also because these passive components have been reduced to a considerable volume in order to be widely used in handheld products. Therefore, how to prepare a large number of passive components quickly and stably is an issue of concern to related industries.

    以晶片型電阻而言，無論是薄膜電阻或是厚膜電阻，其皆使用絕緣的氧化鋁或氮化鋁陶瓷為基板，然後於其上設置電阻薄膜(印刷或濺/蒸鍍方式)而形成電阻層，之後再印上保護用的薄層玻璃粉，經過高溫烘烤後就成為晶片型電阻。In the case of a wafer type resistor, whether it is a thin film resistor or a thick film resistor, an insulating aluminum oxide or aluminum nitride ceramic is used as a substrate, and then a resistive film (printing or sputtering/evaporation) is formed thereon. The resistive layer is then printed with a thin layer of glass frit for protection, and after being baked at a high temperature, it becomes a wafer type resistor.

    然而，在製造的過程中，尚需要透過切割的方式，才能將過程中的母材分割為一粒粒的晶片型電阻。現有技藝中，一種是透過沖壓(punch)的方式，使用治具在氧化鋁基板上形成沖壓槽，然後再以撓折的方式將之截斷。但這種沖壓的技術有其尺寸瓶頸，已無法適用於微型化的晶片型電阻，例如0402規格以下等主流產品。However, in the manufacturing process, it is still necessary to cut the base material into a single wafer type resistor by means of cutting. One of the prior art techniques is to form a punching groove on an alumina substrate by means of a punch, and then cut it in a flexible manner. However, this type of stamping technology has a size bottleneck and is not suitable for miniaturized wafer type resistors, such as mainstream products such as 0402 size.

    更進一步而言，使用沖壓技術於微型被動元件的加工處理時，被沖壓的部分會因應力推擠而變形，使形狀產生變化，這在巨觀的角度下並無太大差異，但對於微型被動元件來說，這種結構變化遠超出了容許範圍。Furthermore, when stamping technology is used in the processing of miniature passive components, the stamped part will be deformed by stress pushing, and the shape will change, which is not much different from the macroscopic point of view, but for the micro For passive components, this structural change is far beyond the allowable range.

    因此針對微型被動元件，較新的技術是在燒結後的氧化鋁熟坯板上，使用雷射進行切割(Laser Scribing)，使氧化鋁熟坯板的表面形成U狀之切割槽，然後再以撓折的方式將之截斷。但這種切割方法的機具成本和維護費用非常驚人，而且切割的品質也存在多項後製程加工良率問題，因為雷射切割的過程中，基於雷射光束焦距、能量與切割槽深度之間的變化差異，因此其形成的切割槽在後續撓折時，會有不規則的狀況發生，無法確實地沿著切割槽的走向而做整齊的分離，使得良率偏低。Therefore, for the micro passive components, the newer technology is to use the laser scribing on the sintered alumina blank, so that the surface of the alumina mature blank forms a U-shaped cutting groove, and then The method of flexing cuts it off. However, the cost of the tool and the maintenance cost of this cutting method are very amazing, and the quality of the cutting also has a number of post-process processing yield problems, because the laser cutting process is based on the focal length of the laser beam, the energy and the depth of the cutting groove. The difference is changed, so that the cutting groove formed by the cutting groove may have an irregular condition when it is subsequently flexed, and it is impossible to make a neat separation along the direction of the cutting groove, so that the yield is low.

    因此，在微型被動元件的製造方法中，如何更有效率地取得更佳品質的基板，以在此品質穩定的基板上做進一步的加工，使得優質之微型被動元件能夠成形，即是此技術領域所要突破的瓶頸。
Therefore, in the manufacturing method of the miniature passive component, how to obtain a substrate of a better quality more efficiently, and further processing on the substrate of stable quality, so that a high-quality miniature passive component can be formed, that is, the technical field The bottleneck to be broken.

    本創作之主要目的，係提供一種微型被動元件之基板母材，其在製備時係使用切割線或極薄之切割刀等切割件，對未燒結之生坯板進行線切割處理，以切割出複數個切割槽，其可於將生坯板經燒結為熟坯板，並經印刷、濺鍍或蒸鍍上電性元件後，透過切割槽而撓折熟坯板為複數個微型熟坯條，再經切割而製備品質良好的基板。The main purpose of the present invention is to provide a substrate base material of a miniature passive component, which is prepared by cutting a non-sintered green sheet by cutting a cutting member such as a cutting line or an extremely thin cutting blade. a plurality of cutting grooves, which can be used to sinter the green sheet into a mature blank, and after printing, sputtering or vapor-depositing the electrical component, the mature blank is flexed through the cutting groove into a plurality of micro slabs And then cutting to prepare a substrate of good quality.

    本創作之再一目的，係提供一種微型被動元件之基板母材，其並非使用現有之治具沖壓，避免在微米尺寸的被動元件製作過程中，因治具沖壓所造成的形變而使基板良率下降，甚至於報廢；同時也排除了使用昂貴之雷射切割技術，不但得以降低成本，也可避免出現雷射切割所造成的不良切割紋路。A further object of the present invention is to provide a substrate base material of a miniature passive component, which is not stamped using the existing jig, and avoids the deformation of the micro-sized passive component during the manufacturing process of the passive component. The rate is reduced, even scrapped; it also eliminates the use of expensive laser cutting technology, which not only reduces costs, but also avoids the bad cutting lines caused by laser cutting.

    為了達到上述之目的，本創作揭示了一種微型被動元件之基板母材，其係包含：一生坯板，其具有複數個切割槽位於其表面，該些切割槽之間距，於該生坯板表面之經線方向或緯線方向上，係小於或等於0.02英吋；其中，該些切割槽係以一切割件而經線切割所形成。據此結構，微型被動元件的製造效率將得以大幅提升，同時品質也一併獲得良好的控制。
In order to achieve the above object, the present invention discloses a substrate base material of a miniature passive component, comprising: a green plate having a plurality of cutting grooves on a surface thereof, the cutting grooves being spaced apart from each other on the surface of the green plate The warp direction or the weft direction is less than or equal to 0.02 inches; wherein the cutting grooves are formed by wire cutting with a cutting member. According to this structure, the manufacturing efficiency of the miniature passive component can be greatly improved, and the quality is also well controlled.

S1~S3‧‧‧步驟
S21~S23‧‧‧步驟
S31~S34‧‧‧步驟
1‧‧‧熟坯板
2‧‧‧生坯板
3‧‧‧切割槽
4‧‧‧切割件
5‧‧‧微型熟坯條
D‧‧‧間距
M‧‧‧經線方向
W‧‧‧緯線方向
S1~S3‧‧‧ steps
S21~S23‧‧‧Steps
S31~S34‧‧‧Steps
1‧‧‧ Mature billet
2‧‧‧Green sheet
3‧‧‧Cutting trough
4‧‧‧Cut parts
5‧‧‧Miniature slabs
D‧‧‧ spacing
M‧‧‧ warp direction
W‧‧‧Weft direction

第一圖：其係為本創作之結構示意圖；
第二圖：其係為本創作於製作時之步驟流程圖；
第三圖：其係為本創作於製作時之步驟流程之示意圖；
第四圖：其係為本創作之電子顯微鏡照片；
第五圖：其係為本創作於製備後，熟坯板形成後之步驟流程圖；以及
第六圖：其係為本創作於製備後，微型熟坯條形成後之步驟流程圖。
The first picture: it is a schematic diagram of the structure of the creation;
The second picture: it is a flow chart of the steps in the creation of the creation;
The third picture: it is a schematic diagram of the steps of the creation process at the time of production;
The fourth picture: it is the electron microscope photo of the creation;
The fifth figure is a flow chart of the steps after the preparation of the mature blank after the preparation, and the sixth figure: it is a flow chart of the steps after the preparation of the miniature mature strip after the preparation.

    為使本創作之特徵及所達成之功效有更進一步之瞭解與認識，謹佐以較佳之實施例及配合詳細之說明，說明如後：For a better understanding and understanding of the features of the creation and the efficacies achieved, please refer to the preferred examples and detailed explanations as follows:

    首先，請參考第一圖，其係為本創作之結構示意圖，其係包含了一生坯板2，其具有複數個切割槽3位於其表面，該些切割槽之間距D，於該生坯板2表面之經線方向M或緯線方向W上，係小於或等於0.02英吋；其中，該些切割槽3係以切割件而經線切割所形成。First, please refer to the first figure, which is a schematic structural view of the present invention, which comprises a green sheet 2 having a plurality of cutting grooves 3 on the surface thereof, and the distance between the cutting grooves is D, in the green sheet. 2 The warp direction M or the weft direction W of the surface is less than or equal to 0.02 inches; wherein the cutting grooves 3 are formed by wire cutting with a cutting member.

    接著，請一併參考第二圖和第三圖，其係為本創作中的基板母材之製造步驟流程圖以及其示意圖；如圖所示，其核心步驟係包含：
步驟S1：使用一切割件，線切割一生坯板(green plate)，使該生坯板具有複數個切割槽；
步驟S2：燒結(annealing)該生坯板，形成一熟坯板(sintered plate)；以及
步驟S3：撓折該熟坯板，使該熟坯板沿著該些切割槽斷折為複數個微型熟坯條。Next, please refer to the second and third figures together, which is a flow chart of the manufacturing steps of the substrate base material in the creation and a schematic diagram thereof; as shown in the figure, the core steps include:
Step S1: using a cutting member, wire cutting a green plate, so that the green sheet has a plurality of cutting grooves;
Step S2: annealing the green sheet to form a sintered plate; and step S3: flexing the mature sheet to break the mature sheet along the cutting grooves into a plurality of miniatures Mature strips.

    本創作的重點技術特徵，係在於生產微型被動元件的過程當中，對未經燒結的生坯板2先行使用切割件4作線切割，以在微型被動元件的尺寸規格隨著技術提升而不斷縮小之下，能快速且高良率地獲得結構上所必要之基板母材。The key technical feature of this creation is that in the process of producing miniature passive components, the unsintered green sheet 2 is first used for cutting the cutting member 4 to reduce the size of the miniature passive components as the technology improves. Under the above, the structural base material necessary for the structure can be obtained quickly and with high yield.

    於步驟S1中，生坯板2之材質係為氧化鋁(Al₂ O₃ )或氮化鋁(AlN)，而考量到成本及可允許的散熱能力範圍等因素，氧化鋁是本創作較佳的選擇對象。加工用的切割件4切割線體或一切割刀體，若其為切割線體，則可選用鑽石線(diamond wires)、鋼琴線(piano wire) 或其他金屬線材或複合材料線材等具有抗拉強度高，耐磨性佳之線材；不過考量到切割線體之結構較圓滑而切割能力有限，因此也可使用諸如鎢鋼刀片等切割刀體，其係為厚度小於0.02英吋之極薄金屬片，與生坯板2做線切割而相接觸的一面具有刀尖而可提供較強之切割能力。In the step S1, the material of the green sheet 2 is alumina (Al ₂ O ₃ ) or aluminum nitride (AlN), and the alumina is preferred in terms of cost and allowable heat dissipation capability. The choice of objects. The cutting member 4 for processing cuts the wire body or a cutting blade body, and if it is a cutting wire body, diamond wire, piano wire or other metal wire or composite wire can be used for tensile strength. High-strength, wear-resistant wire; however, considering that the structure of the cutting wire is smoother and has limited cutting ability, it is also possible to use a cutting blade such as a tungsten steel blade, which is a very thin metal piece having a thickness of less than 0.02 inches. The side that is in contact with the green sheet 2 for wire cutting has a cutting edge to provide a strong cutting ability.

    本創作使用切割件對物理性質較軟之生坯板2作線切割，其在切割的時後，可以透過細長或薄片之切割件4同時將切割所產生的壓力和應力向外推，也就是透過切割件4而將壓力和應力向四周圍帶走，使被切割的生坯板2在形成切割槽3之兩側不會產生形變，避免現有技藝透過機械、治具沖壓而致使形變發生、後續無法用於製備微型被動元件的狀況，也不必考慮到雷射切割時的光束焦距、能量問題。The present invention uses a cutting member to perform wire cutting on the soft physical green sheet 2, which can be pushed outward by the cutting member 4 of the elongated or thin sheet at the same time, that is, the pressure and stress generated by the cutting, that is, The pressure and the stress are carried away around the cutting member 4, so that the cut green sheet 2 does not deform on both sides of the cutting groove 3, and the prior art is prevented from being deformed by mechanical and jig stamping. Subsequent conditions cannot be used to prepare miniature passive components, and it is not necessary to consider the beam focal length and energy problems during laser cutting.

    透過線切割，請參考第四圖，生坯板2之表面形成了複數個切割槽3，此些切割槽3之間距係小於0.02英吋，目的是為了後續製備微型化的薄膜/厚膜電阻等被動元件。Through the wire cutting, please refer to the fourth figure. The surface of the green sheet 2 is formed with a plurality of cutting grooves 3, and the distance between the cutting grooves 3 is less than 0.02 inches for the purpose of preparing the miniaturized film/thick film resistor. Passive components.

    以現有或開發中的移動裝置所大量使用的薄膜/厚膜電阻為例，其尺寸已逐步縮小為0402、0201、01005等，或是更小之規格，此即表示其尺寸之長乘寬分別為0.04英吋×0.02英吋、0.02英吋×0.01英吋以及0.01英吋×0.005英吋或更小。因此，本創作在此使用線切割，係針對切割槽3之間距係小於或等於0.02英吋之尺寸級距。以一英吋見方的生坯板2為母材為例，若製備0402規格之薄膜/厚膜電阻，則其於生坯板2表面之經線方向或緯線方向其中之一者，至少要使用切割件4或是其陣列而切割出49個平行之切割槽3，使生坯板2能形成間距0.02英吋之細微區段，方能續行製備寬度為0.02英吋之微型基板。故本創作可透過線切割的方式，克服被動元件在微型化時，習知之生坯板沖壓方法無法適用的問題。For example, a film/thick film resistor widely used in existing or developing mobile devices has been gradually reduced in size to 0402, 0201, 01005, etc., or a smaller size, which means that the length and width of the size are respectively It is 0.04 inches x 0.02 inches, 0.02 inches x 0.01 inches, and 0.01 inches x 0.005 inches or less. Therefore, the present invention uses wire cutting here for a step size of less than or equal to 0.02 inches for the distance between the cutting grooves 3. Taking the green sheet 2 of one inch square as the base material as an example, if a film/thick film resistor of 0402 size is prepared, at least one of the warp direction or the weft direction of the surface of the green sheet 2 should be used. The cutting member 4 or the array thereof cuts 49 parallel cutting grooves 3 so that the green sheet 2 can form a fine section with a pitch of 0.02 inches to continue the preparation of a micro-substrate having a width of 0.02 inches. Therefore, this creation can overcome the problem that the conventional green sheet stamping method cannot be applied when the passive component is miniaturized by means of wire cutting.

    於步驟S2中，被切割後的生坯板2經過燒結的程序後，生坯板2內部的顆粒間空洞就會排除，並且也將其所含有的少量氣體和雜質排除，使顆粒相互結合而形成熟坯板1，得做進一步的加工利用。In step S2, after the green sheet 2 after being cut is subjected to a sintering process, the interparticle voids in the green sheet 2 are removed, and a small amount of gas and impurities contained therein are also removed, so that the particles are bonded to each other. The mature blank board 1 has to be further processed and utilized.

    燒結而成的熟坯板1可以透過撓折的方式，使熟坯板1得以沿著在步驟S1當中所切割出的切割槽3而斷折為複數個長條狀的微型熟坯條5。這些微型熟坯條5就是用於製備微型被動元件之基板的重要材料。The sintered mature blank 1 can be folded into a plurality of elongated micro-bri of strips 5 along the cutting groove 3 cut in step S1 by means of flexing. These miniature slabs 5 are important materials for the preparation of substrates for miniature passive components.

    以製備薄膜電阻為例，其在將生坯板燒結為熟坯板後，於撓折為微型熟坯條之前，請參考第五圖，其係進行步驟：
步驟S21：設置至少一正面電極以及至少一背面電極於該熟坯板之兩面；
步驟S22：設置一電阻層於該熟坯板具有該正面電極之一面之上；以及
步驟S23：印刷一保護層(overcoat)於該電阻層之上。For example, in the preparation of the thin film resistor, after the green sheet is sintered into a mature blank, before the flexing into a micro-powder strip, please refer to the fifth figure, which is followed by steps:
Step S21: providing at least one front electrode and at least one back electrode on both sides of the mature blank;
Step S22: providing a resistive layer on the side of the mature blank having one of the front electrodes; and step S23: printing an overcoat on the resistive layer.

    於上述步驟中，係先透過網印或濺鍍的方式在熟坯板的正面以及背面上預先設置了以銅(Cu)、銀(Ag)或鈀(Pd)為材質之第一電極以及第二電極，其設置手段和材質視需求而定，並無特殊限制；接著再於具有正面電極的一面設置上電阻層。此電阻層的材質可為鎳合金，例如鎳鉻合金，其性質影響薄膜電阻之電阻大小，若電阻層的單位電阻值越高，則相同電阻值的薄膜電阻尺寸就可以越小。In the above steps, the first electrode and the first electrode made of copper (Cu), silver (Ag) or palladium (Pd) are preliminarily disposed on the front and back sides of the mature blank by screen printing or sputtering. The two electrodes, the setting means and the material are determined according to requirements, and are not particularly limited; and then the upper resistive layer is disposed on the side having the front electrode. The material of the resistive layer may be a nickel alloy, such as a nickel-chromium alloy, whose properties affect the resistance of the sheet resistance. If the unit resistance of the resistive layer is higher, the sheet resistance of the same resistance value may be smaller.

    在電阻層的設置技術上，概略而言，若是以濺鍍法(sputtering)的製程來製作，則為薄膜電阻；而若以印刷燒結的方式來製作，則係為厚膜電阻。不過無論電阻層是以濺鍍或是印刷燒結的方式來設置，都可一體適用本創作透過線切割生坯板的方法來製備基板，能無障礙地通用於薄／厚膜電阻之製程。In terms of the technique of disposing the resistance layer, it is roughly a sheet resistance when it is produced by a sputtering process, and a thick film resistor when it is produced by printing and sintering. However, regardless of whether the resistive layer is provided by sputtering or printing and sintering, the substrate can be integrally prepared by wire-cutting the green sheet, and can be used for the thin/thick film resistor process without any trouble.

    接著，可再於電阻層上印刷由氧化矽所阻成的保護層，也就是一玻璃層面，其可以保護電阻層不會與空氣接觸而發生氧化變性，或是受外力刮損，避免電阻值受影響而產生變化。Then, a protective layer formed by yttrium oxide can be printed on the resistive layer, that is, a glass layer, which can protect the resistive layer from oxidative degeneration by contact with air, or be scratched by external force, and avoid resistance value. Affected and changed.

    待熟坯板上的電極、膜層佈置完畢後，接續之步驟S3就會將熟坯板做撓折，使得熟坯板沿著該些切割槽斷折為複數個微型熟坯條。這些微型熟坯條係呈長條狀，寬度則視步驟S1所切割出的切割槽間距而定，每一微型熟坯條上皆已完成了正面電極、背面電極、電阻層以及保護層等結構設置，只待更進一步加工就可完成以顆為單位計算之薄膜電阻，也就是本創作所訴求之微型被動元件。   After the electrode and the film layer on the mature blank plate are arranged, the subsequent step S3 will flex the mature blank plate, so that the mature blank plate is broken along the cutting grooves into a plurality of micro mature strips. These miniature slabs are strip-shaped, and the width is determined by the spacing of the cutting grooves cut in step S1. The structure of the front electrode, the back electrode, the resistive layer and the protective layer are completed on each of the micro-bri of slabs. Set, only to further processing can complete the film resistance calculated in units of particles, which is the micro passive component claimed by this creation.

請參考第六圖，於步驟S3形成微型熟坯條後，更包含步驟：
步驟S31：堆疊該些微型熟坯條；
步驟S32：濺鍍(sputtering)至少一側電極於該些微型熟坯條之側邊；
步驟S33：切割該些微型熟坯條，形成複數個微型熟坯粒；以及
步驟S34：電鍍線路於該些微型熟坯粒，形成複數個膜電阻顆粒。Please refer to the sixth figure. After forming the miniature slab in step S3, the steps further include:
Step S31: stacking the micro slabs;
Step S32: sputtering at least one side electrode on the side of the micro-bri of solid strips;
Step S33: cutting the micro-powder strips to form a plurality of micro-powder pellets; and step S34: electroplating the micro-powder pellets to form a plurality of membrane resistor particles.

    於步驟S31~步驟S34，其係先將微型熟坯條堆疊後，濺鍍側電極於微型熟坯條之側邊；於此，側電極之材質可為銅、錫、鉻或是鎳，其可使正面電極和背面電極達成電性連接。In step S31 to step S34, after stacking the micro-powder strips, the side electrodes are sputtered on the side of the micro-slab strip; here, the material of the side electrodes may be copper, tin, chromium or nickel. The front electrode and the back electrode can be electrically connected.

    接著，再將微型熟坯條進行切割，使長條狀的微型熟坯條被截斷為複數個微型熟坯粒；如前所述，若單位電阻層的絕緣係數越高，則在此階段的截斷就越密集，可使相同長度之微型熟坯條被截斷為更多的微型熟坯粒。Then, the micro slabs are cut to make the strips of micro sized slabs cut into a plurality of micro slabs; as described above, if the insulation coefficient of the unit resistance layer is higher, then at this stage The denser the truncation, the more the micro-sized slabs of the same length can be cut into more micro-pure granules.

    最後，再對這些微型熟坯粒電鍍上金屬線路，就可製備完成膜電阻顆粒，其視電阻層之態樣而為薄膜電阻顆粒或是厚膜電阻顆粒。Finally, the micro-pure granules are plated with metal wires to prepare the film-resistance particles, which are thin film resistor particles or thick film resistor particles in the view of the resistance layer.

    配合透過上述之步驟揭示，本創作所揭示之微型被動元件之基板母材結構特異，係於製備過程中，特別使用切割件對尚未燒結的生坯板做線切割，以預留後續用於撓折的切割槽，排除了現有技藝使用機械、治具沖壓，或是雷射切割等技術之缺點，不但可以加速生產而提高效率，同時也可兼顧成品之品質，滿足了產業各方面的需求，故無疑提供了一具經濟和實用價值之微型被動元件之基板母材。In conjunction with the above steps, the substrate of the micro passive component disclosed in the present invention has a specific structure, which is used in the preparation process, and particularly uses a cutting member to perform wire cutting on the unsintered green sheet to reserve a subsequent use for scratching. The folding cutting groove eliminates the shortcomings of the prior art using mechanical, jig stamping, or laser cutting technology, which not only accelerates production and improves efficiency, but also satisfies the quality of the finished product and meets the needs of various aspects of the industry. Therefore, it is undoubtedly provided a substrate base material of micro passive components with economical and practical value.

    惟以上所述者，僅為本創作之較佳實施例而已，並非用來限定本創作實施之範圍，舉凡依本創作申請專利範圍所述之形狀、構造、特徵及精神所為之均等變化與修飾，均應包括於本創作之申請專利範圍內。
However, the above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and the variations, modifications, and modifications of the shapes, structures, features, and spirits described in the scope of the patent application. , should be included in the scope of the patent application of this creation.

2‧‧‧生坯板 2‧‧‧Green sheet

3‧‧‧切割槽 3‧‧‧Cutting trough

Claims (1)

一種微型被動元件之基板母材，其係包含：
一生坯板，其具有複數個切割槽位於其表面，該些切割槽之間距，於該生坯板表面之經線方向或緯線方向上，係小於或等於0.02英吋；
其中，該些切割槽係以一切割件而經線切割所形成。A substrate base material for a miniature passive component, the system comprising:
a green sheet having a plurality of cutting grooves on a surface thereof, the distance between the cutting grooves being less than or equal to 0.02 inches in the warp direction or the weft direction of the surface of the green sheet;
Wherein, the cutting grooves are formed by wire cutting with a cutting member.