CN112577970A

CN112577970A - Detection method, alignment method of detection equipment and detection equipment

Info

Publication number: CN112577970A
Application number: CN201910944507.5A
Authority: CN
Inventors: 陈鲁; 黄有为; 王天民; 庞芝亮; 崔高增
Original assignee: Shenzhen Zhongke Feice Technology Co Ltd
Current assignee: Skyverse Ltd; Shenzhen Zhongke Feice Technology Co Ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2021-03-30

Abstract

The application provides a detection method, an alignment method of detection equipment and the detection equipment, wherein the detection method comprises the following steps: firstly, scanning and detecting an object to be detected to obtain defect information of surface defects of the object to be detected; then, screening the defects according to the defect information to obtain the rechecking defects; and then, rechecking the rechecking defects to acquire rechecking information of the rechecking defects. The technical scheme of this application can effectively improve detection speed and the detection accuracy to the determinand.

Description

Detection method, alignment method of detection equipment and detection equipment

Technical Field

The application belongs to the technical field of display panel detection, and particularly relates to a detection method, an alignment method of detection equipment and the detection equipment.

Background

At present, with the development of the technology, since the OLED has the advantages of being lighter and thinner, high in brightness, low in power consumption, fast in response, high in definition, good in flexibility, high in light emitting efficiency and the like, the OLED is used for high-end display equipment, meanwhile, the quality requirement on the OLED is high, and in order to improve the quality of the OLED display equipment and the yield of production, the substrate of the OLED needs to be subjected to defect detection in the production process so as to ensure the product quality and the production yield. However, since the size of the OLED is large, how to improve the detection speed and the detection accuracy of the OLED substrate is a problem to be solved.

Disclosure of Invention

The present application aims to overcome the above deficiencies in the prior art, and provides a detection method, which aims to solve the problems of slow detection speed and low detection accuracy of the existing defect detection on a display substrate.

The application provides a detection method, which comprises the following steps:

scanning and detecting the object to be detected to obtain the defect information of the surface defects of the object to be detected;

screening the defects according to the defect information to obtain recheck defects;

and carrying out rechecking processing on the rechecking defects to acquire rechecking information of the rechecking defects.

Optionally, the steps from the scanning detection processing to the rechecking processing are repeated for different regions to be detected of the object to be detected.

Optionally, after the first scanning detection process is performed on the object to be detected, the steps of the first screening process and the retesting process are performed.

Optionally, the scanning detection processing and the re-detection processing after the second time are parallel, and the scanning detection processing is performed on the to-be-detected area of the to-be-detected object.

Optionally, after the regions to be detected of the object to be detected are all scanned and detected, the method further includes: and carrying out rechecking treatment on the rechecked defects which are not subjected to the rechecking treatment.

Optionally, the detection device comprises: the bearing table is used for bearing an object to be tested; the first translation platform is used for driving the bearing platform to translate along a first direction.

Optionally, the detection apparatus further comprises: the full-detection module is used for scanning and detecting the object to be detected; the second translation platform is used for driving the full detection module to translate along a second direction, and the first direction is not parallel to the second direction;

the step of scan detection processing includes: translating the object to be detected along the first direction through the first translation platform, and detecting the object to be detected through the full detection module;

after the scanning detection processing of one time, before the scanning detection processing of the next time, the method further comprises the following steps: and moving the full detection module along the second direction by a preset distance.

Optionally, the first direction and the second direction have a first included angle, the object to be detected is a quadrilateral, the object to be detected includes a first edge and a second edge which are intersected, the first edge and the second edge have a second included angle, and the second included angle is equal to the first included angle;

the detection apparatus further includes: the rotating table is used for driving the bearing table to rotate around a rotating shaft, the rotating shaft is perpendicular to the first direction, and the rotating shaft is perpendicular to the second direction;

before the first scanning detection treatment is carried out on the object to be detected, the method further comprises the following steps:

and adjusting the position of the object to be detected to enable the object to be detected to rotate around the rotating shaft, so that the first edge is parallel to the first direction and the second edge is parallel to the second direction.

Optionally, the defect information includes location information of a defect;

the detection equipment also comprises a rechecking module used for rechecking the rechecking defects; the third mobile platform is used for driving the reinspection module to translate along a third direction, and the third direction is different from the first direction;

the rechecking processing of the rechecking defects and the obtaining of the rechecking information of the rechecking defects comprises the following steps:

enabling the object to be detected to translate along the first direction at a preset speed;

according to the position information of the rechecking defects which are not subjected to the rechecking processing, the preset speed and the position of the rechecking module, obtaining a rechecking path for rechecking processing on each rechecking defect;

determining the next reinspection defect subjected to reinspection processing according to the reinspection path, and taking the next reinspection defect as a defect to be reinspected;

and enabling the rechecking module to translate along the third direction according to the position information of the defects to be rechecked, and rechecking the defects to be rechecked.

Optionally, the review module comprises a plurality of review probes, and the moving ranges of the review probes along the third direction are not overlapped;

before obtaining a rechecking path for rechecking each rechecking defect, the step of rechecking the rechecking defect and obtaining the rechecking information of the rechecking defect further comprises: respectively allocating a rechecking area for each rechecking probe according to the moving range of the plurality of rechecking probes, and rechecking the rechecking defects in the respective rechecking areas by the rechecking probes;

the step of obtaining the rechecking path for rechecking each rechecking defect comprises the following steps: and planning a rechecking path for each rechecking probe according to the position information of the rechecking defects.

Optionally, the full inspection module includes a plurality of inspection units, a field of view of each inspection unit is rectangular, the field of view includes a third side and a fourth side that are adjacent to each other, and a length of the third side is greater than or equal to the fourth side;

before the scanning detection process, the detection method further includes:

and carrying out second adjustment on the detection unit to ensure that the third side of the visual field of the detection unit is perpendicular to the first direction.

Optionally, before the scan detection process, the detection method further includes:

acquiring the offset of the visual field of each detection unit along the first direction;

and compensating the moving range of the full detection module along the first direction in the scanning detection processing process according to the offset.

Optionally, during two adjacent scanning detection processes, the field of view of the detection unit partially overlaps in the second direction; the detection areas of adjacent detection cells partially overlap.

Optionally, the first direction is perpendicular to the second direction; the third direction is perpendicular to the first direction.

Optionally, the screening process comprises the steps of:

screening out a preliminary defect set consisting of a plurality of defects according to screening conditions;

calculating the value of each single defect in the preliminary defect set;

forming a defect sequence set which is arranged in a descending order for all defects in the preliminary defect set according to the magnitude of the value;

selecting a preset number of defects in the defect sequence set to form a maximum defect set;

and carrying out rechecking processing on the defects in the maximum defect set.

Optionally, calculating the value D of a single defect according to a preset formula, said preset formula being D1D 2+ D3D 4;

where D1 is the area of the defect, D2 is the area weight of the defect, D3 is the average gray-scale value of the defect image, and D4 is the average gray-scale value weight of the defect image.

The invention also provides an alignment method of the detection equipment, the detection equipment comprises a mechanical alignment module and an optical alignment module, and the alignment method of the detection equipment comprises the following steps:

roughly aligning the object to be measured by using the mechanical alignment module, wherein the surface of the object to be measured is provided with an alignment mark, so that the alignment mark is positioned in a view field of the optical alignment module;

and after the coarse alignment, the optical alignment module is used for carrying out fine alignment on the object to be measured so that the object to be measured is in a preset position.

Optionally, the detection apparatus includes a bearing table, including a bearing area, for bearing the object to be detected; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the bearing area;

the rough alignment of the object to be measured by using the mechanical alignment module to make the alignment mark located in the visual field of the optical alignment module comprises the following steps:

and moving the alignment roller towards the object to be measured until the alignment roller moves to a preset position and clamps the outer edge of the object to be measured.

Optionally, the optical alignment module includes at least one optical alignment probe, the alignment mark set includes at least two standard points, and after the coarse alignment, the optical alignment module is used to perform a fine alignment on the object to be measured, so that the object to be measured is in a predetermined position, including the following sub-steps:

shooting an alignment mark through the optical alignment probe to acquire an alignment image of the alignment mark;

acquiring the position information of the standard point according to the alignment image;

acquiring the position deviation of the object to be detected according to the position information of at least two standard points;

and adjusting the object to be detected according to the position deviation to enable the object to be detected to be in a preset position.

Optionally, the number of the optical alignment probes is multiple, and the multiple optical alignment probes include a first optical alignment probe and a second optical alignment probe; the alignment mark group comprises a first alignment mark and a second alignment mark;

acquiring position information of the standard point according to the alignment image includes: acquiring first position information of the center of a first alignment mark according to the alignment image of the first alignment mark; acquiring second position information of the center of a second alignment mark according to the alignment image of the second alignment mark;

the position deviation comprises one or the combination of the translational offset and the rotational offset of the object to be detected; according to the position information of at least two standard points, the step of obtaining the position deviation of the object to be measured comprises the following steps: acquiring the translation offset of the object to be detected according to the offset between the first position information and the center of the first optical alignment probe view field; and/or acquiring the rotation offset of the object to be detected according to the first position information and the second position information.

Optionally, the step of adjusting the object to be measured according to the position deviation to make the object to be measured in the predetermined position includes:

acquiring the required adjustment amount according to the position deviation of the object to be measured;

and adjusting the object to be detected until the center of the field of view of the optical alignment probe is superposed with the center of the corresponding alignment mark.

The invention also proposes a detection device comprising:

the full inspection module is used for scanning the object to be inspected to realize scanning detection processing, acquiring defect information of the surface defects of the object to be inspected, and screening the defects according to the defect information to acquire rechecking defects;

the rechecking module is used for rechecking the rechecking defects; and the number of the first and second groups,

and the control system is used for controlling the full-detection module and the repeated-detection module to realize the detection method.

Optionally, the detection apparatus further comprises: a mechanical alignment module and an optical alignment module;

the mechanical alignment module is configured to perform coarse alignment on the object to be measured, and the surface of the object to be measured is provided with an alignment mark, so that the alignment mark is positioned in a view field of the optical alignment module;

the optical alignment module is configured to perform fine alignment on the object to be measured by using the optical alignment module after the coarse alignment so that the object to be measured is in a preset position.

Optionally, the device comprises a bearing table, including a bearing area, for bearing the object to be tested; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the bearing area; a drive device for driving the alignment roller to move towards the bearing area.

Optionally, the alignment mark group comprises a first alignment mark and a second alignment mark; the number of the optical alignment probes is multiple, the multiple alignment probes comprise a first optical alignment probe and a second optical alignment probe, the first optical alignment probe is used for shooting an image of the first alignment mark, and the second optical alignment probe is used for shooting an image of the second alignment mark.

The technical scheme of the application has the following beneficial effects: the method comprises the steps of firstly scanning and detecting the object to be detected to obtain defect information, then screening the defect information to obtain recheck defects, and then rechecking the recheck defects, and can achieve the purposes of avoiding missing detection and performing key recheck on the screened defects as much as possible through multiple scanning, detecting and rechecking treatments, thereby being beneficial to improving the detection speed and the detection accuracy of the object to be detected.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a top view of the overall structure of a detection device provided in the embodiments of the present application;

fig. 2 is a schematic view of a detection coverage area of a review module of the detection apparatus provided in the embodiment of the present application;

FIG. 3 is a schematic structural diagram of a mechanical alignment module of a detection apparatus provided in an embodiment of the present application;

FIG. 4 is a flow chart of an alignment method of a detection device provided by an embodiment of the present application;

FIG. 5 is a flow chart of coarse alignment of an alignment method of a detection apparatus provided in an embodiment of the present application;

FIG. 6 is a schematic structural diagram of an optical alignment module of a detection apparatus according to an embodiment of the present disclosure

FIG. 7 is a schematic diagram illustrating a fine alignment effect of the detection apparatus provided in the embodiment of the present application;

FIG. 8 is a flow chart of optical alignment of an alignment method of a detection apparatus provided by an embodiment of the present application;

FIG. 9 is a schematic diagram of a full inspection process of the inspection method provided in the embodiment of the present application;

FIG. 10 is a flow chart of a detection method provided by an embodiment of the present application;

fig. 11 is a flowchart of a review process of a detection method provided in an embodiment of the present application;

FIG. 12 is a schematic view illustrating a deflection correction process of a detecting unit according to an embodiment of the present disclosure;

FIG. 13 is a schematic diagram of start/end scanning signals of a detecting unit of a detecting method according to an embodiment of the present application;

FIG. 14 is a schematic process diagram of a combined scanning detection process and a review process of the detection method provided by the embodiment of the present application;

fig. 15 is a schematic flow chart of a screening process of the detection method provided in the embodiment of the present application.

The reference numbers illustrate:

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It should be noted that the terms of orientation such as left, right, up and down in the embodiments of the present application are only relative to each other or are referred to the normal use state of the product, and should not be considered as limiting.

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner" and "outer" and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The embodiment of the application provides a detection method and detection equipment for realizing the detection method.

Referring to fig. 9, 10 and 14, in a preferred embodiment, the present application provides a detection method, including:

s1, scanning and detecting the object to be detected to obtain the defect information of the surface defects of the object to be detected;

s2, screening the defects according to the defect information to obtain recheck defects;

and S3, performing retest processing on the retest defects to acquire retest information of the retest defects.

It should be noted that, in the embodiment, the object to be measured is specifically the substrate 10 of the OLED display panel, and the defect can be represented as a star-shaped graph in fig. 14. The detection method comprises the steps of firstly scanning and detecting the substrate 10 to obtain defect information, then screening the defect information to obtain recheck defects, and then rechecking the recheck defects for multiple times, so that the purposes of avoiding missed detection and performing key recheck on the screened defects as far as possible can be achieved, and the detection speed and the detection accuracy of the substrate 10 can be improved.

Further, the steps from scanning detection processing to rechecking processing are repeated for different areas to be detected of the object to be detected.

Further, after the first scanning detection processing is carried out on the object to be detected, the steps of first screening processing and rechecking processing are carried out.

And furthermore, the scanning detection processing and the re-detection processing after the second time and the second time are parallel, and the scanning detection processing is carried out on the to-be-detected area of the object to be detected.

For example, the defects that are not screened in the first full-scan and the defects obtained in the second full-scan can be merged together to perform defect value evaluation together to screen the defects of the re-inspection in the third full-scan process, so that all the defects on the substrate 10 can be obtained through repeated scanning for many times, the occurrence of the missing inspection can be effectively reduced, and the accuracy of the detection is further improved. Moreover, the scanning detection processing and the rechecking processing after the second time are parallel, and the detection efficiency can be effectively improved.

Further, after the regions to be detected of the object to be detected are all scanned and detected, the method further comprises the following steps: and carrying out rechecking treatment on the rechecked defects which are not subjected to the rechecking treatment. For example, after the scan detection process is performed on all regions of the dut, N number of partial review defects are obtained, but according to the preset review defect number index (M number, M ≧ N), M-N number of additional shots are still required for the remaining defects. Specifically, in the process, in a total inspection defect result set which is not screened out, defect value evaluation is carried out, M-N global optimal solutions are screened out finally, sorting is carried out, and re-inspection shooting is carried out in sequence according to a fixed-point shooting mode of 'moving-stopping-shooting' until all re-inspection defect shooting is finished.

Referring to fig. 1 to fig. 3, the present invention further provides a detecting apparatus, including:

a stage (not shown) for carrying an object to be tested;

and a control system (not shown) for controlling the full-inspection module and the re-inspection module to implement the inspection method as described above.

And a first translation stage (not shown) for translating the load-bearing stage in a first direction.

And the second translation platform 22 is used for driving the full-detection module to translate along a second direction, wherein the first direction is not parallel to the second direction. Specifically, the first direction is perpendicular to the second direction or has an acute included angle.

The third moving platform 23 is used for driving the reinspection module to translate along a third direction, and the third direction is different from the first direction;

specifically, in this embodiment, the third direction is the same as the second direction.

It should be noted that the first direction and the second direction have a first included angle, the object to be measured is a quadrilateral, the object to be measured includes a first edge and a second edge which are intersected, the first edge and the second edge have a second included angle, and the second included angle is equal to the first included angle; in addition, check out test set still includes the revolving stage, and this revolving stage is used for driving the plummer rotatory around the rotation axis, rotation axis perpendicular to first direction, and rotation axis perpendicular to second direction, so, just can realize that the second contained angle equals first contained angle to it is accurate to follow-up detection, specifically, the determinand can be for being the base plate 10 that the rectangle set up, and its first contained angle and second contained angle are the right angle. The first and second included angles may also be acute angles. Specifically, in the detection method, the scanning detection process includes: translating the object to be detected along a first direction through a first translation platform, and detecting the object to be detected through a full detection module;

after the scanning detection processing of one time, before the scanning detection processing of the next time, the method further comprises the following steps: and moving the full detection module for a preset distance along the second direction.

Referring to fig. 9 and 14, in a preferred embodiment, the full inspection module includes a plurality of inspection units 30, a viewing area of the inspection units 30 is rectangular, the viewing area includes a third side and a fourth side adjacent to each other, and the length of the third side is greater than or equal to the fourth side.

Here, the plurality of detecting units 30 are equally spaced along the second direction, and each detecting unit 30 includes a full-inspection scanning probe that performs scanning using a linear array charge coupled device. Specifically, in a scanning process, the loading platform provides low-delay scanning start and end signals according to the position information, and the full-detection scanning probes of the detection units 30 continuously expose and output images after receiving the scanning start signal until receiving the scanning end signal and stopping exposure. After the first full scan detection process, i.e. the detection scan of the vision area PASS1 of the full scan probe of the detection unit 30, is completed, all the full scan probes move a predetermined distance in the second direction, i.e. step to the position of the second full scan detection process, change the scanning direction to continue scanning to complete PASS2, and so on PASS3 and PASS4, until all the scans of the wheels are completed. In this way, the integrity of the full-inspection scanning is facilitated, and the occurrence of missed inspection caused by incomplete coverage can be avoided as much as possible, but the specific number of the detection units 30, the size and the number of the visual field areas, and the like are set according to actual detection requirements.

In order to achieve better positioning accuracy, it is necessary to consider the influence of the delay of starting to acquire signals on the position information of the image, the positioning error caused by the inconsistency of the scanning directions in the two adjacent scanning detection processes, and the positioning error caused by the positioning accuracy of the substrate 10 and the stage itself. Therefore, further, the detection areas of the adjacent detection units 30 partially overlap; during the two adjacent scanning detection processes, the field of view of the detection unit 30 partially overlaps in the second direction to correct the positional deviation during the multiple scanning detection processes. In other words, the viewing zones of all the detecting units 30 can be combined to cover the substrate 10 in the second direction, so that missing detection can be avoided to the greatest extent, and the detection accuracy can be effectively improved. Since there may be angular deflection of the probe during installation and commissioning of a full-scan probe, for this purpose, the detection method further comprises, before the scan detection process: the second adjustment is performed on the detecting unit 30, so that the third side of the visual field of the detecting unit 30 is perpendicular to the first direction, and thus the detecting unit 30 can be adjusted. Specifically, as shown in fig. 12, a dashed rectangle in the figure represents a certain detection unit 30, the deflection angle of each detection unit 30 is different, and under the premise that the substrate 10 is already aligned, the alignment mark on the substrate 10 can be used to calculate the deflection angle, and then the adjustment mechanism of the detection unit 30 needs to be adjusted, so that the detection unit 30 is aligned.

As shown in fig. 12 and 13, the different detecting units 30 have a certain offset in the first direction, and the offset error will directly cause the deviation of the initial position of the probe shooting. Due to the accuracy limitation of the mechanical adjustment, further, the offset amount of the detecting unit 30 in the first direction needs to be quantified and position compensated by a software algorithm. Therefore, before the scanning detection process, the detection method further includes:

acquiring the offset of the visual field of each detection unit 30 along the first direction;

Here, since the detecting units 30 have an offset in the first direction, in order to ensure that all the detecting units 30 can photograph the complete substrate 10 in the first direction, the positional relationship of the detecting units 30 needs to be comprehensively examined for the start scanning signal and the end scanning signal of the stage. For example, in fig. 12, an arrow indicates a moving direction of the substrate 10, a left portion indicates that the detection unit 30 is to start scanning the substrate 10, a right portion indicates that the detection unit 30 has just finished scanning the substrate 10, a left dotted line indicates a start signal position, and a right dotted line indicates an end signal position. As is clear from the figure, the start signal position is based on the position of the detection unit 30 that has first imaged the area of the substrate 10, and the end signal position is based on the position of the detection unit 30 that has last completed imaging the area of the substrate 10. For other probes, some invalid regions are shot, and the invalid regions are selectively removed according to the position information without defect detection and analysis.

In a preferred embodiment, in order to ensure the imaging quality and the positioning accuracy, before the first scanning detection process of the object to be measured, the method further includes the following steps:

the position of the object to be measured is adjusted, so that the object to be measured rotates around the rotating shaft, and the first edge is parallel to the first direction and the second edge is parallel to the second direction.

In the technical scheme of the application, the defect information comprises position information of the defect;

here, referring to fig. 11, performing a review process on the review defect to obtain review information of the review defect includes the following steps:

s31, translating the object to be detected along a first direction at a preset speed;

s32, acquiring a rechecking path for rechecking each rechecking defect according to the position information, the preset speed and the position of the rechecking module of the rechecking defect which is not subjected to the rechecking processing;

s33, determining the next reinspection defect to be reinspected according to the reinspection path;

and S34, enabling the rechecking module to translate along the third direction according to the position information of the defect to be rechecked, and rechecking the defect to be rechecked.

It can be understood that a simpler reinspection path can be obtained by processing the position information of the defect, the preset speeds of the second moving platform 22 and the third moving platform 23, the position of the reinspection module, and the like, thereby being beneficial to improving the detection efficiency.

It should be noted that the first direction is perpendicular to the second direction; the third direction is perpendicular to the first direction. Specifically, the substrate 10 is rectangular and has two opposite long sides, the direction of the long sides is the length direction of the substrate 10, the moving direction of the substrate 10 during detection is the first direction, and the direction perpendicular to the first direction on the horizontal plane is the second direction and the third direction, after the substrate 10 is aligned, the first direction is consistent with the length direction of the substrate 10, that is, the length direction of the substrate 10 is the first direction, and the width direction thereof is the second direction; in addition, the second translation stage 22 and the third translation stage 23 are both installed on the respective corresponding gantries; wherein, a second translation platform 22 is arranged on the gantry in the middle, a full-detection module is arranged on the second translation platform 22, and the second translation platform 22 drives the full-detection module to translate along a second direction; the other two gantries on the two sides are respectively provided with a third moving platform 23, each third moving platform 23 is provided with a rechecking module, and the third moving platforms 23 drive the rechecking modules to translate along a third direction; the first translation stage drives the carrier stage carrying the substrate 10 to translate along a first direction relative to the full inspection module. Specifically, as the solid-line rectangular boxes in fig. 9 and 13 represent the entire area of the substrate 10, the arrow direction represents the scanning direction of one scanning along the first direction, and the scanning directions of the multiple full-inspection scanning probes included in the full-inspection module are consistent in the same scanning direction. Of course, the number of full scan probes, the number of scans, i.e., the number of scans marked in the figure, and the coverage of one probe do not represent a true proportional relationship with the size of the substrate 10, and this is for convenience of description only.

Referring to fig. 1 and 2, the review module includes a plurality of review probes, and the moving ranges of the review probes along the third direction are not overlapped;

before the rechecking path for rechecking each rechecking defect is acquired, the step of rechecking the rechecking defect and acquiring the rechecking information of the rechecking defect further comprises the following steps: respectively allocating a rechecking area for each rechecking probe according to the moving range of the plurality of rechecking probes, and rechecking the rechecking defects in the respective rechecking areas by the rechecking probes;

As shown in fig. 2, the review module includes two review probes, that is, a first review probe 41 and a second review probe 42, the review area allocated by the first review probe 41 covers the right area of the substrate 10, the review area allocated by the second review probe 42 covers the left area of the substrate 10, the two review areas are combined to cover the substrate 10 along the first direction, and the middle portions of the two review areas are partially overlapped, so that the improvement of the detection efficiency can be realized, and the missing of the inspection cannot occur.

In this embodiment, the plurality of review probes are respectively located on different gantries, and the different gantries are arranged along the first direction.

It can be understood that in the technical scheme of the application, the rechecking and image-taking efficiency is high due to the fact that the rechecking module comprises at least two rechecking modules, and the technical purpose of simultaneously taking two defects in a certain area range can be achieved through operation control of the control system. Here, two retest modules can cover the region of waiting to detect of some base plate 10 respectively, so compare in the design scheme that a retest probe covers complete base plate 10 region, the moving distance of base plate 10 in the first direction of this application is shorter, therefore every scanning can all save certain scanning time, especially when scanning many times, its time saving will be more considerable to can improve this check out test set's detection speed greatly. In addition, by acquiring the position information of the rechecking defect, the rechecking path can be intelligently planned, so that the time can be effectively saved, and the detection speed is improved.

Referring to FIG. 15, in a preferred embodiment, the screening process includes the following steps:

s21, screening out a preliminary defect set consisting of a plurality of defects according to screening conditions;

s22, calculating the value of each single defect in the preliminary defect set;

s23, forming a defect sequence set which is arranged in a descending order for all the defects in the preliminary defect set according to the value;

s24, selecting a preset number of defects in the defect sequence set to form a maximum defect set;

and S25, performing rechecking processing on the defects in the maximum defect set.

Here, the value D of a single defect is calculated according to a preset formula, wherein the preset formula is D1 × D2+ D3 × D4; where D1 is the area of the defect, D2 is the area weight of the defect, D3 is the average gray-scale value of the defect image, and D4 is the average gray-scale value weight of the defect image. Therefore, the defects with higher reinspection value can be screened more effectively through the conditions and the screening process, and the efficiency and the accuracy of defect detection are improved.

Referring to fig. 3 to 8, the present invention further provides an alignment method of a detection apparatus, wherein the detection apparatus includes a mechanical alignment module and an optical alignment module, and the alignment method of the detection apparatus includes the following steps:

s100, roughly aligning an object to be measured by using a mechanical alignment module, wherein the surface of the object to be measured is provided with an alignment mark, and the alignment mark is positioned in a view field of an optical alignment module;

s200, after coarse alignment, the optical alignment module is used for carrying out fine alignment on the object to be measured, so that the object to be measured is located at a preset position.

Specifically, the detection apparatus comprises the aforementioned carrier stage, mechanical alignment module, and driving means (not shown); the carrying table is used for carrying an object to be tested, such as the substrate 10 in the embodiment; the mechanical alignment module includes a plurality of alignment rollers 60 disposed at the periphery of the load-bearing zone; the drive means is used to drive the alignment roller 60 towards the load-bearing zone.

It can be understood that, because the detection device of this application is equipped with mechanical alignment module and optical alignment module, so before base plate 10 detects, just can adjust the direction of base plate 10 through mechanical alignment module, optical alignment module and plummer for the long edge direction of base plate 10 is unanimous with the direction of motion of plummer, is first direction promptly, thereby can reduce the hourglass of examining the module entirely and examine, effectively improves the accuracy that detects.

Specifically, as shown in fig. 5, the rough alignment of the object to be measured by using the mechanical alignment module to locate the alignment mark in the field of view of the optical alignment module includes the following sub-steps:

and S210, moving the alignment roller 60 towards the object to be measured until the alignment roller moves to a preset position and clamps the outer edge of the object to be measured.

Specifically, referring to fig. 3, eight alignment rollers 60 are distributed around the substrate 10, that is, two alignment rollers 60 are disposed outside each side, an arrow represents a moving direction of each alignment roller 60, after the substrate 10 is placed on the moving table, the eight alignment rollers 60 simultaneously move inwards to a predetermined position and clamp the substrate 10, the positions of the eight alignment rollers 60 can form a rectangle, the length-width ratio of the rectangle is consistent with the length-width ratio of the substrate 10, and the length-width ratio of the corresponding rectangle is kept unchanged during the simultaneous inward movement of the eight alignment rollers 60, thereby achieving the technical purpose of aligning the substrate 10.

In addition, after the substeps, the method further comprises the following steps of:

s220, starting a vacuum adsorption device arranged on the bearing table, and adsorbing and fixing the object to be detected on the bearing table;

it can be understood that the arrangement can enable the substrate 10 to be measured and the carrying table to be fixed firmly through vacuum adsorption, thereby facilitating subsequent optical alignment and scanning detection.

And S230, releasing all the alignment rollers 60 at the same time to separate from the object to be tested.

It should be noted that the key points of the coarse alignment using the mechanical alignment module are strength, accuracy and synchronization.

First, in the clamping process of rough alignment, since the alignment roller 60 is a cylinder, and the side surface of the alignment roller is in direct point contact or line contact with the edge of the substrate 10, the acceleration and speed of the alignment roller 60 should not be too large, and need to be adjusted to a suitable range, and if the clamping force is too large, the substrate 10 is subjected to a large local pressure and is easily broken; if the acceleration and speed of the alignment roller 60 are set too low, the mechanical alignment process will take a long time, which will affect the overall detection efficiency of the detection apparatus.

Secondly, in terms of precision, when all the alignment rollers 60 are in a clamping state, the clearance between each alignment roller 60 and the substrate 10 is within a specified target range (on the order of hundreds of microns), and cannot be too large or too small; too large a gap may result in an insufficient degree of alignment of the substrate 10, too small a gap may result in damage to the substrate 10, and there are strict requirements on the repeatability of the clamping position of the alignment rollers 60, the positional repeatability of the alignment rollers 60 themselves determining the repeatability of the alignment of the substrate 10.

A third point, namely, in the course of coarse alignment, each alignment roller 60 needs to move synchronously, the requirement for synchronism of clamping is high, and the requirement for synchronism of releasing is low; and the alignment rollers 60 start to move and clamp simultaneously, so that the edge of the substrate 10 is stressed more uniformly, and the action execution efficiency is higher.

Referring to fig. 5 to 8, in a preferred embodiment, the optical alignment module includes at least one optical alignment probe, the alignment mark set includes at least two standard points, and after the coarse alignment, the optical alignment module is used to perform the fine alignment on the object to be measured, so that the object to be measured is at the predetermined position, including the following sub-steps:

s310, shooting the alignment mark through the optical alignment probe to obtain an alignment image of the alignment mark;

s320, acquiring position information of the standard point according to the alignment image;

s330, acquiring the position deviation of the object to be detected according to the position information of the at least two standard points;

and S340, adjusting the object to be measured according to the position deviation to enable the object to be measured to be in a preset position.

Specifically, the alignment mark group includes a first alignment mark 511 and a second alignment mark 512; the number of the optical alignment probes is plural, and the plural alignment probes include a first optical alignment probe 521 and a second optical alignment probe 522, the first optical alignment probe 521 is used to capture an image of the first alignment mark 511, and the second optical alignment probe 522 is used to capture an image of the second alignment mark 512. Wherein the first and second optical alignment probes 521 and 522 are spaced apart in the second direction, and the first and second alignment marks 511 and 512 are also spaced apart in the second direction.

Wherein acquiring the position information of the standard point according to the alignment image includes: acquiring first position information of the center of the first alignment mark 511 from the alignment image of the first alignment mark 511; acquiring second position information of the center of the second alignment mark 512 according to the alignment image of the second alignment mark 512;

the position deviation comprises the translation offset and/or the rotation offset of the object to be detected; according to the position information of at least two standard points, the step of obtaining the position deviation of the object to be measured comprises the following steps: acquiring the translation offset of the object to be detected according to the offset between the first position information and the center of the field of view of the first optical alignment probe 521; and/or acquiring the rotation offset of the object to be detected according to the first position information and the second position information.

Here, the step of adjusting the object to be measured according to the positional deviation so that the object to be measured is at the predetermined position includes:

and adjusting the object to be detected until the center of the visual field of the optical alignment probe is superposed with the center of the corresponding alignment mark.

In other words, the substrate 10 and the stage may be angularly adjusted by adjusting the azimuth axis of the stage until the center of the first alignment mark 511 coincides with the center of the field of view of the first optical alignment probe 521, and the center of the second alignment mark 512 coincides with the center of the field of view of the second optical alignment probe 522. As shown in fig. 6 and 7, the solid line rectangular frame represents the substrate 10, the upper and lower ends of the right side of the substrate 10 are respectively provided with the first alignment mark 511 and the second alignment mark 512, and the optical alignment module adopts a black-and-white area array CCD probe, so that the complete first alignment mark 511 and the second alignment mark 512 as shown in the dotted line rectangular frame can be photographed in the field of view. In addition, since the alignment mark positions of different substrates 10 may be different, the two optical alignment probes have a degree of freedom of displacement adjustment in the short side direction of the substrate 10, i.e., the second direction, as indicated by the broken line arrows in the drawing. The substrate 10 and the stage have a degree of freedom of angular adjustment with the center position of the substrate 10 as the rotation center. Specifically, in the state shown on the left side in fig. 7 after coarse alignment but not at the time of fine alignment, the first optical alignment probe 521 and the second optical alignment probe 522 respectively photograph the first alignment mark 511 and the second alignment mark 512 of the respective cross type to acquire alignment images of the alignment marks, both of which are within the field of view but not at the center position of the field of view; then, calculating the position deviation by the method, and calculating to obtain the required adjustment amount; then, the angular axis of the movable stage is adjusted to obtain the state shown on the right side of the figure, that is, the centers of the two alignment marks are respectively located at the center positions of the fields of view of the respective optical alignment probes, and at this time, the substrate 10 has completed the precise alignment operation, that is, the long side direction of the substrate 10 is substantially parallel to the moving direction of the substrate 10. Since the position of the alignment mark on the entire substrate 10 is known and determined, after the optical alignment is completed, the position information of the carrier can be corresponded to the position information of the alignment mark on the substrate 10, and the transformation relationship between the coordinate system of the carrier and the coordinate system of the substrate 10 can be determined, so as to realize the accurate positioning of the substrate 10. It should be noted that the sizes of the alignment marks in the drawings are not true to scale with the size of the substrate 10, and the sizes in the drawings are merely for convenience of illustration, and the sizes of the true alignment marks are in the micrometer range.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method of detection, comprising:

2. The method of claim 1, wherein the steps of scanning detection processing to review processing are repeated for different regions of the test object.

3. The method according to claim 2, wherein the step of performing the first screening process and the retesting process is performed after the first scanning detection process is performed on the analyte.

4. The detecting method according to claim 2, wherein the scanning detection process after the second time and the second time is performed in parallel with the re-inspection process until the region to be detected of the object is scanned.

5. The method as claimed in claim 3, wherein after the scanning detection process is performed on the regions of the object, the method further comprises: and carrying out rechecking treatment on the rechecked defects which are not subjected to the rechecking treatment.

6. The detection method according to any one of claims 2 to 5, characterized in that the detection device comprises: the bearing table is used for bearing an object to be tested; the first translation platform is used for driving the bearing platform to translate along a first direction.

7. The detection method of claim 6, wherein the detection device further comprises: the full-detection module is used for scanning and detecting the object to be detected; the second translation platform is used for driving the full detection module to translate along a second direction, and the first direction is not parallel to the second direction;

8. The detection method according to claim 7, wherein the first direction and the second direction have a first included angle, the object to be detected is quadrilateral, the object to be detected comprises a first edge and a second edge which are intersected, the first edge and the second edge have a second included angle, and the second included angle is equal to the first included angle;

9. The inspection method according to claim 7, wherein the defect information includes position information of a defect;

10. The inspection method of claim 9, wherein the review module includes a plurality of review probes, and the ranges of movement of the plurality of review probes in the third direction do not overlap;

11. The detection method according to claim 8, wherein the full detection module comprises a plurality of detection units, the field of view of the detection units is rectangular, the field of view comprises adjacent third and fourth sides, and the length of the third side is greater than or equal to the fourth side;

before the scanning detection process, the detection method further includes:

12. The detection method of claim 11, wherein prior to the scan detection process, the detection method further comprises:

13. The inspection method of claim 9, wherein during two consecutive scan inspection processes, the field of view of the inspection unit partially overlaps in the second direction; the detection areas of adjacent detection cells partially overlap.

14. The detection method of claim 9, wherein the first direction is perpendicular to the second direction; the third direction is perpendicular to the first direction.

15. The assay of claim 1, wherein the screening process comprises the steps of:

calculating the value of each single defect in the preliminary defect set;

16. The inspection method of claim 15, wherein the value D of an individual defect is calculated according to a predetermined formula, D1D 2+ D3D 4;

17. An alignment method of a detection device, the detection device comprising a mechanical alignment module and an optical alignment module, the alignment method of the detection device comprising the steps of:

roughly aligning an object to be measured by using the mechanical alignment module, wherein the surface of the object to be measured is provided with an alignment mark, and the alignment mark is positioned in a view field of the optical alignment module;

18. The alignment method of inspection apparatus according to claim 17, wherein the inspection apparatus comprises a stage including a carrying region for carrying the object to be inspected; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the bearing area;

19. The method of claim 17, wherein the optical alignment module comprises at least one optical alignment probe, the alignment mark set comprises at least two standard points, and the coarse alignment followed by the fine alignment of the object to be tested with the optical alignment module to position the object to be tested in a predetermined position comprises the sub-steps of:

20. The alignment method of inspection equipment according to claim 19, wherein the number of the optical alignment probes is plural, and the plural optical alignment probes include a first optical alignment probe and a second optical alignment probe; the alignment mark group comprises a first alignment mark and a second alignment mark;

21. The alignment method of a inspection apparatus according to claim 19,

adjusting the object to be measured according to the position deviation to enable the object to be measured to be in a preset position, wherein the step of adjusting the object to be measured according to the position deviation comprises the following steps:

22. A detection device, characterized in that the detection device comprises:

a control system for controlling the full-inspection module and the review module to implement the inspection method according to any one of claims 1 to 15.

23. The detection device of claim 22, wherein the detection device further comprises: a mechanical alignment module and an optical alignment module;

24. The detecting device according to claim 23, comprising a carrying stage including a carrying region for carrying the object to be detected; the mechanical alignment module comprises a plurality of alignment rollers arranged at the periphery of the bearing area; a drive device for driving the alignment roller to move towards the bearing area.

25. The inspection apparatus of claim 23, wherein the set of alignment marks includes a first alignment mark and a second alignment mark; the number of the optical alignment probes is multiple, the multiple alignment probes comprise a first optical alignment probe and a second optical alignment probe, the first optical alignment probe is used for shooting an image of the first alignment mark, and the second optical alignment probe is used for shooting an image of the second alignment mark.