CN112510126A - 深紫外发光二极管及其制造方法 - Google Patents
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- CN112510126A CN112510126A CN202011283746.XA CN202011283746A CN112510126A CN 112510126 A CN112510126 A CN 112510126A CN 202011283746 A CN202011283746 A CN 202011283746A CN 112510126 A CN112510126 A CN 112510126A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
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CN202011283746.XA CN112510126B (zh) | 2020-11-17 | 2020-11-17 | 深紫外发光二极管及其制造方法 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113594312A (zh) * | 2021-06-11 | 2021-11-02 | 厦门士兰明镓化合物半导体有限公司 | 深紫外led芯片及其制造方法 |
CN113594310A (zh) * | 2021-06-11 | 2021-11-02 | 厦门士兰明镓化合物半导体有限公司 | 深紫外led芯片及其制造方法 |
CN113594305A (zh) * | 2021-06-11 | 2021-11-02 | 厦门士兰明镓化合物半导体有限公司 | 垂直结构led芯片的制造方法 |
CN113964249A (zh) * | 2021-09-15 | 2022-01-21 | 厦门士兰明镓化合物半导体有限公司 | 发光二极管及其制造方法 |
CN117941082A (zh) * | 2021-09-14 | 2024-04-26 | Lg电子株式会社 | 半导体发光器件及显示装置 |
Citations (7)
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CN101305477A (zh) * | 2006-01-09 | 2008-11-12 | 首尔Opto仪器股份有限公司 | 具有氧化铟锡层的发光二极管及其制造方法 |
CN103165775A (zh) * | 2013-04-07 | 2013-06-19 | 中国科学院半导体研究所 | 一种具有高反射薄膜的紫外发光二极管及其制作方法 |
CN106299050A (zh) * | 2016-11-17 | 2017-01-04 | 河北工业大学 | 一种深紫外半导体发光二极管及其制备方法 |
US10091850B2 (en) * | 2015-06-26 | 2018-10-02 | Seoul Semiconductor Co., Ltd. | Backlight unit using multi-cell light emitting diode |
CN108987546A (zh) * | 2013-09-24 | 2018-12-11 | 首尔伟傲世有限公司 | 发光二极管、发光二极管模块和制造发光二极管的方法 |
CN110690327A (zh) * | 2019-09-11 | 2020-01-14 | 佛山市国星半导体技术有限公司 | 一种高亮度紫光led芯片的制备方法及led芯片 |
CN111599906A (zh) * | 2020-05-12 | 2020-08-28 | 武汉大学 | 一种垂直结构深紫外led芯片的制造方法 |
-
2020
- 2020-11-17 CN CN202011283746.XA patent/CN112510126B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101305477A (zh) * | 2006-01-09 | 2008-11-12 | 首尔Opto仪器股份有限公司 | 具有氧化铟锡层的发光二极管及其制造方法 |
CN103165775A (zh) * | 2013-04-07 | 2013-06-19 | 中国科学院半导体研究所 | 一种具有高反射薄膜的紫外发光二极管及其制作方法 |
CN108987546A (zh) * | 2013-09-24 | 2018-12-11 | 首尔伟傲世有限公司 | 发光二极管、发光二极管模块和制造发光二极管的方法 |
US10091850B2 (en) * | 2015-06-26 | 2018-10-02 | Seoul Semiconductor Co., Ltd. | Backlight unit using multi-cell light emitting diode |
CN106299050A (zh) * | 2016-11-17 | 2017-01-04 | 河北工业大学 | 一种深紫外半导体发光二极管及其制备方法 |
CN110690327A (zh) * | 2019-09-11 | 2020-01-14 | 佛山市国星半导体技术有限公司 | 一种高亮度紫光led芯片的制备方法及led芯片 |
CN111599906A (zh) * | 2020-05-12 | 2020-08-28 | 武汉大学 | 一种垂直结构深紫外led芯片的制造方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113594312A (zh) * | 2021-06-11 | 2021-11-02 | 厦门士兰明镓化合物半导体有限公司 | 深紫外led芯片及其制造方法 |
CN113594310A (zh) * | 2021-06-11 | 2021-11-02 | 厦门士兰明镓化合物半导体有限公司 | 深紫外led芯片及其制造方法 |
CN113594305A (zh) * | 2021-06-11 | 2021-11-02 | 厦门士兰明镓化合物半导体有限公司 | 垂直结构led芯片的制造方法 |
CN113594305B (zh) * | 2021-06-11 | 2023-01-31 | 厦门士兰明镓化合物半导体有限公司 | 垂直结构led芯片的制造方法 |
CN113594310B (zh) * | 2021-06-11 | 2023-09-08 | 厦门士兰明镓化合物半导体有限公司 | 深紫外led芯片及其制造方法 |
CN113594312B (zh) * | 2021-06-11 | 2023-10-24 | 厦门士兰明镓化合物半导体有限公司 | 深紫外led芯片及其制造方法 |
CN117941082A (zh) * | 2021-09-14 | 2024-04-26 | Lg电子株式会社 | 半导体发光器件及显示装置 |
CN113964249A (zh) * | 2021-09-15 | 2022-01-21 | 厦门士兰明镓化合物半导体有限公司 | 发光二极管及其制造方法 |
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Inventor after: Fan Weihong Inventor after: Li Dongsheng Inventor after: Zhang Xiaoping Inventor after: Ma Xingang Inventor after: Gao Moran Inventor after: Zhao Jinchao Inventor before: Fan Weihong Inventor before: Xue Tuo Inventor before: Li Dongsheng Inventor before: Zhang Xiaoping Inventor before: Ma Xingang Inventor before: Gao Moran Inventor before: Zhao Jinchao |
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