CN112488276A - RFID electronic tag composite forming process - Google Patents
RFID electronic tag composite forming process Download PDFInfo
- Publication number
- CN112488276A CN112488276A CN202011524041.2A CN202011524041A CN112488276A CN 112488276 A CN112488276 A CN 112488276A CN 202011524041 A CN202011524041 A CN 202011524041A CN 112488276 A CN112488276 A CN 112488276A
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- Prior art keywords
- electronic tag
- rfid electronic
- chip
- composite
- cutting
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- 239000002131 composite material Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 53
- 238000005520 cutting process Methods 0.000 claims abstract description 43
- 238000001514 detection method Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 238000013329 compounding Methods 0.000 claims abstract description 10
- 238000005507 spraying Methods 0.000 claims abstract description 8
- 230000000007 visual effect Effects 0.000 claims abstract description 6
- 239000002699 waste material Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 238000004026 adhesive bonding Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 210000004877 mucosa Anatomy 0.000 claims description 3
- 239000002313 adhesive film Substances 0.000 claims description 2
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 238000010073 coating (rubber) Methods 0.000 claims 4
- 238000002372 labelling Methods 0.000 abstract description 6
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000012937 correction Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 230000005611 electricity Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000017105 transposition Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention provides a RFID electronic tag composite forming process, which mainly relates to the technical field of wireless radio frequency tags, has reasonable design, reduces the steps of labeling, labeling detection and die cutting one-time detection in the traditional process, directly compounds a surface material, a substrate and a chip by using a deviation rectifying device in the compounding process, and ensures the compounding precision; the composite material is directly subjected to die cutting, detection is carried out after the die cutting is carried out twice, the detection comprises the steps of utilizing read-write equipment to detect and visual detection equipment to detect, and then code spraying treatment is carried out on qualified products.
Description
Technical Field
The invention mainly relates to the technical field of radio frequency identification tags, in particular to a composite forming process of an RFID electronic tag.
Background
The RFID electronic tag is a popular call method of Radio Frequency Identification (RFID) and consists of a tag, an interpreter and a data transmission and processing system. A tag, also called an electronic tag or a smart tag, is a chip having an antenna stored therein, and information capable of identifying an object is stored in the chip. The RFID label has the characteristics of durability, strong information receiving and transmitting penetrability, large capacity of stored information, multiple types and the like.
The technology of RFID (radio frequency identification) electronic tags is very widely used, typically in: animal wafers, access control, aviation package identification, document tracking management, package tracking identification, animal husbandry, logistics management, mobile commerce, product anti-counterfeiting, sports timekeeping, ticket management, automobile wafer anti-theft equipment, parking lot control, production line automation, material management and the like. At present, the electronic tags in China are mainly applied to the aspects of logistics management field, medical industry, tracking management and monitoring of goods and dangerous goods, civil aviation luggage and package management, mandatory product inspection, certificate anti-counterfeiting, non-stop toll collection of roads and bridges, electronic micropayment tickets and the like.
Meanwhile, along with the increasing popularization of the electronic tags, the electronic tags are widely applied to daily production of people, and the updating and upgrading period of products is shorter and shorter, so that higher requirements are provided for the manufacturing industry of RFID (radio frequency identification) tags which are related assorted products. The traditional forming process has complicated steps, low product yield and low precision, and the product with high precision requirement can not meet the requirement.
Disclosure of Invention
Technical problem to be solved by the invention
The invention provides a composite molding process of an RFID electronic tag, which is used for solving the technical problems of complicated steps, low product yield and low precision of the existing molding process in the background technology.
Technical scheme
In order to achieve the purpose, the technical scheme provided by the invention is as follows: a composite molding process of an RFID electronic tag comprises the following steps:
unwinding a chip material, a substrate and a surface material, and respectively performing deviation rectification treatment on the chip material, the substrate and the surface material;
cutting, transferring and pasting the chip material and the substrate after gluing to obtain a first composite material;
the first composite material reaches a traction station and is compounded with the glued surface material to obtain a second composite material;
the second composite material is subjected to primary die cutting under the traction of a traction station;
compounding the die-cut second composite material with a mucosa to obtain a third composite material;
the third composite material is subjected to secondary die cutting and stripping treatment in sequence under the traction of a traction station;
detecting finished products of the products subjected to slitting treatment;
code spraying treatment is carried out on the qualified product;
and rolling the product after code spraying.
Furthermore, the winding and unwinding of the chip material, the substrate, the surface material and the adhesive film are realized by using auxiliary shafts.
Further, the chip lining paper produced by the chip material is collected by the auxiliary shaft.
Furthermore, waste materials generated by die cutting and waste materials generated by slitting treatment are collected through corresponding auxiliary shafts.
Further, before cutting and transferring, the base material and before compounding, the surface material needs to be subjected to gluing, wherein gluing equipment is used for gluing.
Further, the finished product detection at least comprises one of read-write equipment detection and visual detection equipment.
Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
the invention has reasonable design, reduces the steps of labeling, labeling detection and die cutting one-time detection in the traditional process, directly compounds the surface material, the substrate and the chip, and uses the deviation rectifying equipment to rectify deviation in the compounding process, thereby ensuring the compounding precision;
the composite material is directly subjected to die cutting, detection is carried out after the die cutting is carried out twice, the detection comprises the steps of utilizing read-write equipment to detect and visual detection equipment to detect, and then code spraying treatment is carried out on qualified products.
Drawings
FIG. 1 is a schematic process flow diagram of the present invention;
FIG. 2 is a schematic view of the process flow apparatus of the present invention;
FIG. 3 is an enlarged partial schematic view of FIG. 2 of the present invention;
fig. 4 is an enlarged view of a portion of the structure of fig. 2 according to the present invention.
Detailed Description
In order to facilitate an understanding of the invention, the invention will now be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which may be embodied in many different forms and are not limited to the embodiments described herein, but rather are provided for the purpose of providing a more thorough disclosure of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present; the terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Examples
Referring to fig. 1-4, there are shown composite forming process diagrams of the present invention; wherein:
the auxiliary shaft S3 and the auxiliary shaft S5 are used for unwinding the chip material; the auxiliary shafts S2 and S4 collect the interleaving paper of the chip material fed from the auxiliary shafts S3 and S5, respectively;
the unreeled chip material is subjected to deviation correction through a deviation correction station, and the deviation-corrected chip material enters traction stations P1 and P2 and then reaches a cutting transfer station T2;
the auxiliary shaft S15 unreels the substrate, the substrate is subjected to deviation correction through a deviation correction station, the substrate after deviation correction enters a traction station P9, the substrate is subjected to glue coating through glue coating equipment after passing through the traction station P9, and the substrate after glue coating reaches a cutting transfer station T2;
at a cutting and transferring station T2, the substrate and the chip material are compounded for the first time to form a first composite material, and the first composite material enters a traction station P4;
the auxiliary shaft S1 unreels a surface material, the surface material is subjected to deviation rectification through a deviation rectification station, the surface material subjected to deviation rectification enters a traction station P3, the surface material is subjected to glue coating through glue coating equipment after passing through a traction station P3, and the glued surface material enters the traction station P4 and is subjected to second compounding with the first composite material to obtain a second composite material;
the second composite material enters a die-cutting station T3 through a traction station P5 to be subjected to primary die-cutting, and waste materials after die-cutting at the die-cutting station T3 are collected by an auxiliary shaft S7;
the second composite material after die cutting enters a traction station P6, the mucosa is unreeled by an auxiliary shaft S8 and then enters a traction station P6 to be compounded with the second composite material for the third time, and a third composite material is obtained;
the third composite material enters a die-cutting station T4 through a traction station P6 to be subjected to secondary die-cutting, and waste materials after die-cutting at the die-cutting station T4 are collected by an auxiliary shaft S9;
after secondary die cutting, the obtained product passes through a traction station P7 and then is subjected to slitting treatment through a slitting station, and slitting waste is collected by an auxiliary shaft S13;
the products after being stripped are detected by reading and writing equipment and visual detection equipment, the qualified products are sprayed by code spraying equipment, are drawn by a drawing station P8 and are collected by an auxiliary shaft S11 and an auxiliary shaft S12.
In this embodiment, the auxiliary shaft can receive and discharge the supplied materials, tension control over the material belt is realized by the torque control of the servo motor through the PLC, and the tension and release of the material roll are realized by the expansion and contraction of the shaft body controlled by the electromagnetic valve;
the deviation correcting station is used for correcting the material to enable the material to be in a correct feeding position, and judging whether the material is in the correct position or not through the sensor;
the traction station controls the material correctly, keeps the tension of the material belt stable, compensates the material feeding speed and is realized by controlling a servo motor through a sensor and a PLC (programmable logic controller); the cutting transfer station is used for cutting and vacuum adsorption transposition transfer of the chip material; cutting a supplied chip by matching a cutting knife with a vacuum shaft, carrying out adsorption transposition and section transfer on the cut chip by the vacuum shaft, and realizing cutting precision and section transfer precision by controlling a servo motor through a PLC (programmable logic controller);
the die cutting station is used for cutting the shape of the material; the die cutting device is realized by the combined action of the power bottom shaft, the die cutting bottom shaft, the cutter shaft and the pressurizing mechanism, and the accuracy of the die cutting position is realized by the control of a PLC (programmable logic controller) on a servo motor;
the slitting station is used for slitting or cutting off multiple paths of materials.
Meanwhile, in the embodiment, an anti-sticking material guide roller, a static electricity eliminating device, a sensor and a waste absorbing device are further arranged;
the anti-sticking material guide roller is used for supporting the material to ensure the running path of the material and prevent bonding;
the static electricity eliminating device eliminates static electricity generated by material running friction through ion wind, and prevents chips from being broken down to cause waste products;
the sensor is used for detecting information such as speed, position and the like of materials and products, and feeding the information back to the control system to be controlled by each actuating mechanism controlled by the system;
the small and narrow waste suction device is not beneficial to pneumatic waste suction treatment of waste collected by the auxiliary shaft.
In conclusion, the invention has reasonable design, reduces the steps of labeling, labeling detection and die cutting one-time detection in the traditional process, directly compounds the surface material, the substrate and the chip, and uses the deviation rectifying equipment to rectify deviation in the compounding process, thereby ensuring the compounding precision;
the composite material is directly subjected to die cutting, detection is carried out after the die cutting is carried out twice, the detection comprises the steps of utilizing read-write equipment to detect and visual detection equipment to detect, and then code spraying treatment is carried out on qualified products.
The above-mentioned embodiments only express a certain implementation mode of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which are within the protection scope of the present invention; therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (6)
1. A RFID electronic tag composite molding process is characterized in that: the method comprises the following steps:
unwinding a chip material, a substrate and a surface material, and respectively performing deviation rectification treatment on the chip material, the substrate and the surface material;
cutting, transferring and pasting the chip material and the substrate after gluing to obtain a first composite material;
the first composite material reaches a traction station and is compounded with the glued surface material to obtain a second composite material;
the second composite material is subjected to primary die cutting under the traction of a traction station;
compounding the die-cut second composite material with a mucosa to obtain a third composite material;
the third composite material is subjected to secondary die cutting and stripping treatment in sequence under the traction of a traction station;
detecting finished products of the products subjected to slitting treatment;
code spraying treatment is carried out on the qualified product;
and rolling the product after code spraying.
2. The RFID electronic tag composite molding process as claimed in claim 1, wherein: the winding and unwinding of the chip material, the substrate, the surface material and the adhesive film are realized by using auxiliary shafts.
3. The RFID electronic tag composite molding process as claimed in claim 1, wherein: the chip liner paper produced by the chip material is collected by the secondary shaft.
4. The RFID electronic tag composite molding process as claimed in claim 1, wherein: the waste material that the cross cutting produced and the waste material that divides the strip to handle all have corresponding supplementary axle to collect.
5. The RFID electronic tag composite molding process as claimed in claim 1, wherein: the base material need carry out the rubber coating before cutting changes to paste the processing and the plane materiel all needs to carry out the rubber coating processing before carrying out the combined processing, wherein uses rubber coating equipment to carry out the rubber coating processing.
6. The RFID electronic tag composite molding process as claimed in claim 1, wherein: the finished product detection mark comprises one of read-write equipment detection and visual detection equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011524041.2A CN112488276A (en) | 2020-12-22 | 2020-12-22 | RFID electronic tag composite forming process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011524041.2A CN112488276A (en) | 2020-12-22 | 2020-12-22 | RFID electronic tag composite forming process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112488276A true CN112488276A (en) | 2021-03-12 |
Family
ID=74915262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011524041.2A Pending CN112488276A (en) | 2020-12-22 | 2020-12-22 | RFID electronic tag composite forming process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112488276A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488766A (en) * | 2021-06-03 | 2021-10-08 | 维聚智控科技(北京)有限公司 | Production process and production system of environment-friendly antenna |
| CN115648344A (en) * | 2022-12-28 | 2023-01-31 | 成都普什信息自动化有限公司 | Die cutting method and system for RFID label structure |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060108097A (en) * | 2005-04-12 | 2006-10-17 | 주식회사 모텍스 | Apparatus for production of rfid label |
| CN208737514U (en) * | 2018-08-27 | 2019-04-12 | 上海鸿涛纸制品有限公司 | A kind of RFID high frequency Anti-fake electronic label |
| CN110399962A (en) * | 2019-07-24 | 2019-11-01 | 江阴市浩天绮科技有限公司 | The production technology of compound coding RFID label tag |
| CN110796218A (en) * | 2018-08-01 | 2020-02-14 | 深圳市科彩印务有限公司 | RFID ticket card and label integrated forming production equipment and production process |
| JP3225905U (en) * | 2019-09-11 | 2020-04-16 | アライゾン アールエフアイディー テクノロジー カンパニー リミテッド | Highly reliable flexible tag |
| CN111191763A (en) * | 2020-03-10 | 2020-05-22 | 维聚智控科技(北京)有限公司 | Rapid customized full-function module combined RFID compound machine and work flow thereof |
-
2020
- 2020-12-22 CN CN202011524041.2A patent/CN112488276A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060108097A (en) * | 2005-04-12 | 2006-10-17 | 주식회사 모텍스 | Apparatus for production of rfid label |
| CN110796218A (en) * | 2018-08-01 | 2020-02-14 | 深圳市科彩印务有限公司 | RFID ticket card and label integrated forming production equipment and production process |
| CN208737514U (en) * | 2018-08-27 | 2019-04-12 | 上海鸿涛纸制品有限公司 | A kind of RFID high frequency Anti-fake electronic label |
| CN110399962A (en) * | 2019-07-24 | 2019-11-01 | 江阴市浩天绮科技有限公司 | The production technology of compound coding RFID label tag |
| JP3225905U (en) * | 2019-09-11 | 2020-04-16 | アライゾン アールエフアイディー テクノロジー カンパニー リミテッド | Highly reliable flexible tag |
| CN111191763A (en) * | 2020-03-10 | 2020-05-22 | 维聚智控科技(北京)有限公司 | Rapid customized full-function module combined RFID compound machine and work flow thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488766A (en) * | 2021-06-03 | 2021-10-08 | 维聚智控科技(北京)有限公司 | Production process and production system of environment-friendly antenna |
| CN115648344A (en) * | 2022-12-28 | 2023-01-31 | 成都普什信息自动化有限公司 | Die cutting method and system for RFID label structure |
| CN115648344B (en) * | 2022-12-28 | 2023-03-21 | 成都普什信息自动化有限公司 | Die cutting method and system for RFID label structure |
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