CN112469149A - Low-temperature sintered zirconia ceramic substrate - Google Patents
Low-temperature sintered zirconia ceramic substrate Download PDFInfo
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- CN112469149A CN112469149A CN202011430292.4A CN202011430292A CN112469149A CN 112469149 A CN112469149 A CN 112469149A CN 202011430292 A CN202011430292 A CN 202011430292A CN 112469149 A CN112469149 A CN 112469149A
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- ceramic substrate
- zirconia ceramic
- fixedly connected
- low
- temperature sintered
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
Abstract
The invention provides a low-temperature sintered zirconia ceramic substrate, and relates to the field of ceramic substrates. This low temperature sintering zirconia ceramic substrate, including zirconia ceramic substrate, the first insulating layer of bottom fixedly connected with of zirconia ceramic substrate, the first metal protection cover of upper surface one side fixedly connected with of zirconia ceramic substrate, the inside of first metal protection cover is provided with first welding dish, the bottom fixedly connected with zirconia ceramic substrate of first welding dish, the first circular fixed plate of upper surface fixedly connected with of first welding dish, the first lead wire of one side fixedly connected with of first circular fixed plate, the upper surface of zirconia ceramic substrate and with the position fixedly connected with second metal protection cover of first metal protection cover symmetry, the inside of second metal protection cover is provided with the second welding dish. Through the use of the copper oxide connecting layer, the bending strength and the wear resistance of the zirconia ceramic substrate are enhanced.
Description
Technical Field
The invention relates to the technical field of ceramic substrates, in particular to a low-temperature sintered zirconia ceramic substrate.
Background
The ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single side or double sides) of a ceramic substrate at a high temperature. The manufactured ultrathin composite substrate has excellent electrical insulation performance, high heat conduction characteristic, excellent soft solderability and high adhesion strength, can be etched into various patterns like a PCB (printed circuit board), and has great current carrying capacity. Therefore, the ceramic substrate has become a basic material for high-power electronic circuit structure technology and interconnection technology. The high-frequency-resistance high-voltage-resistance high-frequency-resistance high-heat-conductivity high-chemical-stability shock-resistance high-voltage-. However, since the wettability of the oxide ceramic material and the metal material is poor, the bonding force between the metal and the ceramic substrate is not strong.
The applicant finds that a Chinese patent discloses an yttrium-doped zirconia heating element for heating a non-combustible low-temperature cigarette and a manufacturing method thereof through search when applying the invention, the application number is '201810873332.9', the patent mainly prints a wire welding disc film and a heating power resistance film on a plate surface, although the patent in the specification enables the basic temperature rise speed, the thermal compensation speed and the thermal response speed to be high, the connection between the two parts cannot be tighter when the two parts work for a longer time, and the bending strength and the wear resistance of the substrate are reduced, so that the invention discloses a low-temperature sintered zirconia ceramic substrate according to the invention of the applicant, and the problems of the bending strength and the wear resistance of the zirconia ceramic substrate are solved.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a low-temperature sintered zirconia ceramic substrate, which solves the problems of bending strength and wear resistance of the ceramic substrate.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a low-temperature sintering zirconia ceramic substrate comprises a zirconia ceramic substrate, wherein a first insulating layer is fixedly connected to the bottom of the zirconia ceramic substrate, a first metal protective sleeve is fixedly connected to one side of the upper surface of the zirconia ceramic substrate, a first welding disc is arranged inside the first metal protective sleeve, a zirconia ceramic substrate is fixedly connected to the bottom of the first welding disc, a first circular fixing plate is fixedly connected to the upper surface of the first welding disc, a first lead is fixedly connected to one side of the first circular fixing plate, a second metal protective sleeve is fixedly connected to the upper surface of the zirconia ceramic substrate and the position symmetrical to the first metal protective sleeve, a second welding disc is arranged inside the second metal protective sleeve, a second circular fixing plate is fixedly connected to the upper surface of the second welding disc, and a second lead is fixedly connected to one side of the second circular fixing plate far away from the first metal protective sleeve, the upper surface of zirconia ceramic substrate fixedly connected with copper oxide articulamentum, the last fixed surface of copper oxide articulamentum is connected with the resistance protection layer, the last fixed surface of resistance protection layer is connected with the second insulating layer.
Preferably, the first and second bonding pads are square in shape.
Preferably, a side of the first metal protective sleeve close to the first lead is provided with a slot.
Preferably, one side of the second metal protective sleeve, which is close to the second lead, is provided with a slot.
Preferably, the thickness of the zirconia ceramic substrate is 0.1-0.3 mm.
Preferably, the thickness of the copper oxide connecting layer is 0.05-0.1 mm.
Preferably, a plurality of first leads and second leads are provided on the upper surface of the zirconia ceramic substrate.
Preferably, the side fixedly connected with first contact piece of zirconia ceramic substrate, first contact piece is provided with a plurality ofly, and two are adjacent be provided with the second contact piece between the first contact piece, the second contact piece is provided with a plurality ofly, one side fixedly connected with connecting plate of keeping away from zirconia ceramic substrate of first contact piece and second contact piece.
The working principle is as follows: the copper oxide connecting layer 3 is arranged, so that the zirconia ceramic substrate 1 has high toughness, high bending strength, high wear resistance and excellent heat insulation performance, the thermal expansion coefficient is close to that of steel, so that the service performance of the substrate is more stable, the first insulating layer 2 and the second insulating layer 5 are arranged, can prevent the zirconia ceramic substrate 1 from being corroded in high-acidity and high-alkalinity environments, so that the service performance is more stable, and is provided with a first metal protective sleeve 9 and a second metal protective sleeve 10, the service life of the first welding disk 6 and the second welding disk 13 can be prolonged, the use cost can be reduced, the first contact block 14 and the second contact block 15 are arranged, can make zirconia ceramic substrate 1's side inseparabler with external being connected for transmission between is more stable lasting, uses more extensively, easy operation, and the practicality is very strong.
(III) advantageous effects
The invention provides a low-temperature sintered zirconia ceramic substrate. The method has the following beneficial effects:
1. in the invention, the copper oxide connecting layer is arranged, so that the zirconia ceramic substrate has high toughness, high bending strength, high wear resistance and excellent heat insulation performance, and the thermal expansion coefficient is close to that of steel.
2. According to the invention, the first metal protective sleeve and the second metal protective sleeve are arranged, so that the service lives of the first welding disc and the second welding disc are prolonged, and the use cost is reduced.
3. According to the invention, the first insulating layer and the second insulating layer are arranged, so that the zirconia ceramic substrate is not corroded in a high-acidity and high-alkalinity environment, and the service performance is more stable.
4. According to the invention, the first contact block and the second contact block are arranged, so that the side edge of the zirconia ceramic substrate is more tightly connected with the outside, and the transmission between the side edge of the zirconia ceramic substrate and the outside is more stable and durable.
Drawings
FIG. 1 is a cross-sectional view of the present invention;
FIG. 2 is a partial top view of the present invention;
FIG. 3 is a partial view of the present invention;
FIG. 4 is a side view of the present invention;
fig. 5 is a partial view of the present invention.
Wherein, 1, zirconia ceramic substrate; 2. a first insulating layer; 3. a copper oxide connection layer; 4. a resistive protective layer; 5. a second insulating layer; 6. a first bonding pad; 7. a first circular fixing plate; 8. a first lead; 9. a first metal protective sheath; 10. a second metal protective sheath; 11. a second lead; 12. a second circular fixing plate; 13. a second bonding pad; 14. a first contact block; 15. a second contact block; 16. a connecting plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example (b):
as shown in fig. 1 to 5, an embodiment of the present invention provides a low-temperature sintered zirconia ceramic substrate, including a zirconia ceramic substrate 1, a first insulating layer 2 fixedly connected to the bottom of the zirconia ceramic substrate 1, a first metal protection sleeve 9 fixedly connected to one side of the upper surface of the zirconia ceramic substrate 1, a first welding pad 6 disposed inside the first metal protection sleeve 9, a zirconia ceramic substrate 1 fixedly connected to the bottom of the first welding pad 6, a first circular fixing plate 7 fixedly connected to the upper surface of the first welding pad 6, a first lead 8 fixedly connected to one side of the first circular fixing plate 7, a second metal protection sleeve 10 fixedly connected to the upper surface of the zirconia ceramic substrate 1 and at a position symmetrical to the first metal protection sleeve 9, a second welding pad 13 disposed inside the second metal protection sleeve 10, a second circular fixing plate 12 fixedly connected to the upper surface of the second welding pad 13, one side fixedly connected with second lead 11 of the first metal protective sheath 9 of keeping away from of circular fixed plate 12 of second, the last fixed surface of zirconia ceramic substrate 1 is connected with copper oxide articulamentum 3, the last fixed surface of copper oxide articulamentum 3 is connected with resistance protection layer 4, the last fixed surface of resistance protection layer 4 is connected with second insulating layer 5.
The first and second welding discs 6 and 13 are square, and the square can make the connection between the upper multiple connected first circular fixing plates 7 more compact.
One side of the first metal protection sleeve 9 close to the first lead 8 is provided with a slot, and the slot can enable the first lead 8 to penetrate through the first metal protection sleeve 9, so that the matching between the first metal protection sleeve and the first lead 8 is firmer.
The second metal protection sleeve 10 is provided with a slot on one side close to the second lead 11.
The thickness of the zirconia ceramic substrate 1 is 0.1-0.3 mm.
The thickness of the copper oxide connecting layer 3 is 0.05-0.1 mm.
A plurality of first leads 8 and second leads 11 are provided on the upper surface of the zirconia ceramic substrate 1.
The side fixedly connected with first contact piece 14 of zirconia ceramic substrate 1, first contact piece 14 and second contact piece 15 can make zirconia ceramic substrate 1 be connected with the external world more sensitively, first contact piece 14 is provided with a plurality ofly, be provided with second contact piece 15 between two adjacent first contact pieces 14, second contact piece 15 is provided with a plurality ofly, one side fixedly connected with connecting plate 16 of zirconia ceramic substrate 1 of keeping away from of first contact piece 14 and second contact piece 15.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A low-temperature sintered zirconia ceramic substrate comprising a zirconia ceramic substrate (1), characterized in that: the bottom of the zirconia ceramic substrate (1) is fixedly connected with a first insulating layer (2), one side of the upper surface of the zirconia ceramic substrate (1) is fixedly connected with a first metal protective sleeve (9), a first welding disc (6) is arranged inside the first metal protective sleeve (9), the bottom of the first welding disc (6) is fixedly connected with the zirconia ceramic substrate (1), the upper surface of the first welding disc (6) is fixedly connected with a first circular fixing plate (7), one side of the first circular fixing plate (7) is fixedly connected with a first lead (8), the upper surface of the zirconia ceramic substrate (1) is fixedly connected with a second metal protective sleeve (10) at a position symmetrical to the first metal protective sleeve (9), a second welding disc (13) is arranged inside the second metal protective sleeve (10), the upper surface of the second welding disc (13) is fixedly connected with a second circular fixing plate (12), one side fixedly connected with second lead (11) of keeping away from first metal protection cover (9) of circular fixed plate (12) of second, the last fixed surface of zirconia ceramic substrate (1) is connected with copper oxide articulamentum (3), the last fixed surface of copper oxide articulamentum (3) is connected with resistance protection layer (4), the last fixed surface of resistance protection layer (4) is connected with second insulating layer (5).
2. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: the first welding disk (6) and the second welding disk (13) are square.
3. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: one side of the first metal protective sleeve (9) close to the first lead (8) is provided with a slot.
4. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: one side of the second metal protective sleeve (10) close to the second lead (11) is provided with a slot.
5. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: the thickness of the zirconia ceramic substrate (1) is 0.1-0.3 mm.
6. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: the thickness of the copper oxide connecting layer (3) is 0.05-0.1 mm.
7. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: the upper surface of the zirconia ceramic substrate (1) is provided with a plurality of first leads (8) and second leads (11).
8. The low-temperature sintered zirconia ceramic substrate according to claim 1, wherein: the side fixedly connected with first contact piece (14) of zirconia ceramic base plate (1), first contact piece (14) are provided with a plurality ofly, and two are adjacent be provided with second contact piece (15) between first contact piece (14), second contact piece (15) are provided with a plurality ofly, one side fixedly connected with connecting plate (16) of keeping away from zirconia ceramic base plate (1) of first contact piece (14) and second contact piece (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011430292.4A CN112469149A (en) | 2020-12-07 | 2020-12-07 | Low-temperature sintered zirconia ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011430292.4A CN112469149A (en) | 2020-12-07 | 2020-12-07 | Low-temperature sintered zirconia ceramic substrate |
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| Publication Number | Publication Date |
|---|---|
| CN112469149A true CN112469149A (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011430292.4A Pending CN112469149A (en) | 2020-12-07 | 2020-12-07 | Low-temperature sintered zirconia ceramic substrate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102503579A (en) * | 2011-10-13 | 2012-06-20 | 华中科技大学 | Method for preparing metallized ceramic substrate by low-temperature sintering |
| CN207678068U (en) * | 2017-12-25 | 2018-07-31 | 广东全宝科技股份有限公司 | A kind of ultra-high conducting heat type ceramic substrate |
| CN110183225A (en) * | 2019-05-29 | 2019-08-30 | 肇庆市天华电子科技有限公司 | Electronic cigarette ceramic heating sheet and manufacturing method thereof |
| CN211932568U (en) * | 2020-01-22 | 2020-11-17 | 东莞市国研电热材料有限公司 | Zirconia ceramic heating element |
-
2020
- 2020-12-07 CN CN202011430292.4A patent/CN112469149A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102503579A (en) * | 2011-10-13 | 2012-06-20 | 华中科技大学 | Method for preparing metallized ceramic substrate by low-temperature sintering |
| CN207678068U (en) * | 2017-12-25 | 2018-07-31 | 广东全宝科技股份有限公司 | A kind of ultra-high conducting heat type ceramic substrate |
| CN110183225A (en) * | 2019-05-29 | 2019-08-30 | 肇庆市天华电子科技有限公司 | Electronic cigarette ceramic heating sheet and manufacturing method thereof |
| CN211932568U (en) * | 2020-01-22 | 2020-11-17 | 东莞市国研电热材料有限公司 | Zirconia ceramic heating element |
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Application publication date: 20210309 |