CN205491441U - ceramic substrate circuit board - Google Patents
ceramic substrate circuit board Download PDFInfo
- Publication number
- CN205491441U CN205491441U CN201520865475.7U CN201520865475U CN205491441U CN 205491441 U CN205491441 U CN 205491441U CN 201520865475 U CN201520865475 U CN 201520865475U CN 205491441 U CN205491441 U CN 205491441U
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- Prior art keywords
- ceramic substrate
- circuit board
- palladium
- substrate circuit
- resisting layer
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Abstract
The utility model discloses a ceramic substrate circuit board, include ceramic substrate, set palladium -silver pad and oxidation resisting layer on ceramic substrate through sintering process, the oxidation resisting layer pass through electroplating process attached to the palladium -silver pad is kept away from ceramic substrate's surface, the oxidation resisting layer is made for gold or nickel material. The utility model provides a ceramic substrate circuit board can effectively improve ceramic substrate circuit board's oxidation resistance and wearability, extension ceramic substrate circuit board's life, through electroplating process with oxidation resisting layer on attached to the palladium -silver pad, the oxidation resisting layer structure is leveled stably more, the wholeness that can effectively improve ceramic substrate circuit board can, owing to saved the soldering tin layer between oxidation resisting layer and the palladium -silver pad to can effectively reduce ceramic substrate circuit board's thickness, provide more design spaces for the electronic product that utilizes this circuit board manufacturing.
Description
Technical field
This utility model relates to electronic circuit field, particularly relates to ceramic substrate circuit board.
Background technology
Ceramic substrate circuit board refers to the special process plate that Copper Foil is at high temperature bonded directly in aluminium oxide (Al2O3) or aluminium nitride (AlN) ceramic substrate surface (single or double).Made ultra-thin composite base plate has good electrical insulation performance, excellent solderability and high adhesive strength, and can etch various figure as pcb board, there is the biggest current capacity, ceramic substrate circuit board also has high thermal conduction characteristic, effectively thermal conductance produced by high thermoelectric elements can be gone out, thus increase stabilization member degree and increase the service life, therefore, ceramic substrate circuit board has become high-power electric and electronic circuit structure technology and the basic material of interconnection technique, it is widely used in automobile, oil well, the high pressure such as electric power pick-up, high insulation, high frequency, high temperature, highly reliable, in the electronic product of small size.
As it is shown in figure 1, circuit production technique of the prior art, it is sintering palladium-silver slurry 2 on ceramic substrate 1, forms conducting wire and pad, then utilize scolding tin 3 to weld aluminium flake 4 on circuit and pad, thus circuit and pad are carried out antioxidation and wearability protection.This technique being welded aluminium flake 4 by scolding tin 3 of the prior art, owing to scolding tin 3 has surface tension, easily there is out-of-flatness or crooked in the aluminium flake 4 of welding, thus affects the subsequent machining technology of ceramic substrate 1, affects the overall performance of ceramic substrate circuit board 1.
Utility model content
The purpose of this utility model is to provide a kind of ceramic substrate circuit board.
Ceramic substrate circuit board provided by the utility model, the palladium-silver pad including ceramic substrate, being embedded on ceramic substrate by sintering process and anti oxidation layer, described anti oxidation layer is attached to the described palladium-silver pad outer surface away from described ceramic substrate by electroplating technology；Described anti oxidation layer is made for gold or nickel material.
Ceramic substrate circuit board provided by the utility model, non-oxidizability and the wearability of ceramic substrate circuit board can be effectively improved, extend the service life of ceramic substrate circuit board, by electroplating technology, anti oxidation layer is attached on palladium-silver pad, anti oxidation layer structure is the most smooth stable, can be effectively improved the overall performance of ceramic substrate circuit board；Owing to eliminating soldering-tin layer between anti oxidation layer and palladium-silver pad, thus can effectively reduce the thickness of ceramic substrate circuit board, be utilized the electronic product of this circuit board fabrication to provide more design space.
Accompanying drawing explanation
Fig. 1 is ceramic substrate board structure of circuit schematic diagram in the prior art described in background technology；
Fig. 2 is the ceramic substrate board structure of circuit schematic diagram described in this utility model embodiment.
Detailed description of the invention
For making the purpose of this utility model embodiment, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in this utility model embodiment, technical scheme in this utility model embodiment is clearly and completely described, obviously, described embodiment is a part of embodiment of this utility model rather than whole embodiments.Based on the embodiment in this utility model, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of this utility model protection.
As shown in Figure 2, the present embodiment provides a kind of ceramic substrate 21 circuit board, the palladium-silver pad 23 including ceramic substrate 21, being embedded in by sintering process on ceramic substrate 21 and anti oxidation layer 22, described anti oxidation layer 22 is attached to the described palladium-silver pad 23 outer surface away from described ceramic substrate 21 by electroplating technology.It will be understood by those skilled in the art that and be attached on palladium-silver pad 23 by anti oxidation layer 22 by electroplating technology, anti oxidation layer 22 structure is the most smooth stable, can be effectively improved the overall performance of ceramic substrate 21 circuit board.Additionally, compared with scolding tin solder technology of the prior art, owing to eliminating soldering-tin layer between anti oxidation layer 22 and palladium-silver pad 23, thus can effectively reduce the thickness of ceramic substrate 21 circuit board, be utilized the electronic product of this circuit board fabrication to provide more design space.Still further, owing to palladium can serve as catalyst in traditional electroplating technology, and containing palladium composition in palladium-silver slurry, ceramic substrate 21 circuit board that the present embodiment provides can omit the process of plating palladium when electroplating anti oxidation layer 22, utilize the characteristic of palladium-silver slurry itself, realize plating anti oxidation layer 22 the most in the electrolytic solution.Further, described palladium-silver pad away from described ceramic substrate outer surface adhere to anti oxidation layer, advantageously in carrying out routing and the binding technique of subsequent handling on ceramic substrate, as used aluminium material, gold or nickel or nickel material or nickel material to carry out routing technique, tension pull out force is more preferably.
Described anti oxidation layer 22 is made for gold or nickel material.It will be understood by those skilled in the art that gold or the non-oxidizability of nickel material and wearability are good, non-oxidizability and the wearability of ceramic substrate 21 circuit board can be effectively improved, extend the service life of ceramic substrate 21 circuit board.
Last it is noted that above example is only in order to illustrate the technical solution of the utility model, it is not intended to limit；Although this utility model being described in detail with reference to previous embodiment, it will be understood by those within the art that: the technical scheme described in foregoing embodiments still can be modified by it, or wherein portion of techniques feature is carried out equivalent；And these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of this utility model each embodiment technical scheme.
Claims (2)
1. a ceramic substrate circuit board, it is characterised in that: include ceramic substrate, be embedded on ceramic substrate by sintering process
Palladium-silver pad and anti oxidation layer, described anti oxidation layer is attached to described palladium-silver pad away from described ceramic substrate by electroplating technology
Outer surface.
2. ceramic substrate circuit board as claimed in claim 1, it is characterised in that: described anti oxidation layer is made for gold or nickel material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520865475.7U CN205491441U (en) | 2015-11-03 | 2015-11-03 | ceramic substrate circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520865475.7U CN205491441U (en) | 2015-11-03 | 2015-11-03 | ceramic substrate circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205491441U true CN205491441U (en) | 2016-08-17 |
Family
ID=56660180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520865475.7U Active CN205491441U (en) | 2015-11-03 | 2015-11-03 | ceramic substrate circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205491441U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338734A (en) * | 2015-11-03 | 2016-02-17 | 畅博电子(上海）有限公司 | Ceramic substrate circuit board and manufacturing method thereof |
-
2015
- 2015-11-03 CN CN201520865475.7U patent/CN205491441U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105338734A (en) * | 2015-11-03 | 2016-02-17 | 畅博电子(上海）有限公司 | Ceramic substrate circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220906 Address after: Building 2, No. 383, Xingye Road, Pinghu Economic Development Zone, Jiaxing City, Zhejiang Province, 314200 Patentee after: PINGHU WEIGEBOER ELECTRICAL APPLIANCE Co.,Ltd. Address before: 1st and 2nd Floor, No. 36 Factory Building, No. 215, Debao Road, Pudong New Area, Shanghai, 200131 Patentee before: TRANSPO ELECTRONICS SHANGHAI LTD. |