CN112423469A - Circuit board double-chip centered anti-seismic reinforcing structure and controller circuit board - Google Patents
Circuit board double-chip centered anti-seismic reinforcing structure and controller circuit board Download PDFInfo
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- CN112423469A CN112423469A CN202110000647.4A CN202110000647A CN112423469A CN 112423469 A CN112423469 A CN 112423469A CN 202110000647 A CN202110000647 A CN 202110000647A CN 112423469 A CN112423469 A CN 112423469A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The invention discloses a circuit board double-chip centered anti-seismic reinforcing structure and a controller circuit board, which relate to the field of electronic cabin controllers and have the technical scheme that: the first H-shaped frame and the second H-shaped frame are positioned on the same plane, and the second H-shaped frame is arranged in the first H-shaped frame and serves as a cross beam of the first H-shaped frame; the arrangement directions of the first H-shaped frame and the second H-shaped frame are mutually vertical; two opening ends of the first H-shaped frame and the side line beam corresponding to the second H-shaped frame are enclosed to form two reinforcing frames which are distributed in the middle and used for correspondingly mounting the first chip and the second chip. The invention has obvious reinforcing effect and is slightly influenced by resonance; the front stress is transitionally concentrated on the reinforcing structure from the PCB, the stress on the PCB is mainly concentrated on the outer edge of the board card, and the stress distribution at the junction of the rotary transformer decoding module is greatly reduced; the stress of the pin area is reduced, and the generation of fatigue stress cracks is effectively avoided; compared with the stress area of the existing structure, the stress concentration distribution area is reduced, and the structure is effectively improved.
Description
Technical Field
The invention relates to the field of electronic cabin controllers, in particular to a circuit board double-chip centered anti-seismic reinforcing structure and a controller circuit board.
Background
The electronic cabin has the fault phenomena of abnormal jumping of azimuth and pitching signals collected by an upper computer when system debugging is carried out at normal temperature, structural mechanics analysis is carried out on a controller used by the current electronic cabin through Ansys16.0, the result shows that a stress concentration distribution area is formed in the central axis position of a controller product, and under the condition of equivalent acceleration 66G, the local stress of chip pins in the controller in the area is up to 4.1 MPa.
At present, when an electronic cabin is in an operating state, because a rotary transformer decoding module integrated in the center of a controller is used as a board weight distribution point, a board bears huge impact in a vibration process; when the random vibration frequency is superposed with the natural frequency of the board card at the position of the rotary-change decoding module, resonance is formed, and huge damage is caused to the board card. The larger the weight is, the lower the natural frequency of the product is and the more serious the resonance influence is under the condition that the thickness of the board card and the reinforcing mode are not changed. The rotation-change decoding module generates strong damage stress on the central axis of the product. Under the influence of the stress, the pins of the chip in the area, which are also positioned in the central axis, are impacted by the repeated stress of the rotary-change decoding module, and the anti-peeling strength of the positions of the pins is weaker than that of the bonding pads at the positions of other data lines, so that the bonding pads are damaged and separated when the joint of the bonding pads cannot bear the alternating stress.
Therefore, how to research and design a circuit board dual-chip centered anti-seismic reinforcing structure and a controller circuit board is a problem which is urgently needed to be solved at present.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention aims to provide a circuit board double-chip centered anti-seismic reinforcing structure and a controller circuit board.
The technical purpose of the invention is realized by the following technical scheme:
in a first aspect, a circuit board double-chip centered anti-seismic reinforcing structure is provided, which comprises a first H-shaped frame and a second H-shaped frame which are positioned on the same plane, wherein the second H-shaped frame is arranged in the first H-shaped frame and serves as a cross beam of the first H-shaped frame; the arrangement directions of the first H-shaped frame and the second H-shaped frame are mutually vertical; two opening ends of the first H-shaped frame and the side line beam corresponding to the second H-shaped frame are enclosed to form two reinforcing frames which are distributed in the middle and used for correspondingly mounting the first chip and the second chip.
Furthermore, the side line beams of the first H-shaped frame and the second H-shaped frame are combined by a plurality of closed frames in a linear distribution mode.
Furthermore, the edge of the reinforcing frame is provided with a thread through hole, and the first chip and the second chip can be relatively fixed with the corresponding reinforcing frame by passing a screw through the thread through hole.
Furthermore, each reinforcing frame is correspondingly provided with four threaded through holes, and the four threaded through holes are divided into two groups which are symmetrically arranged on the side line beam of the first H-shaped frame.
In a second aspect, a controller circuit board is provided, which includes a PCB board and a circuit board dual-chip centered anti-seismic reinforcing structure as described in any one of the first aspect, wherein the PCB board is mounted with a first chip and a second chip which are matched with two reinforcing frames.
Furthermore, the side surfaces of the first chip and the second chip are provided with mounting lugs which are arranged in one-to-one correspondence with the thread through holes, and screws sequentially penetrate through the PCB and the rear parts of the mounting lugs to be fixedly connected with the thread through holes.
Furthermore, the PCB is also provided with a DSP module, an FPGA module, a rotary transformer excitation module, a photoelectric isolation module, a power supply module, an AD acquisition module, a DA output module, a JTAG interface, an ZRM connector, an operational amplifier module and a power oscillation module; the first chip and the second chip are a pitching rotation-change decoding chip and an azimuth rotation-change decoding chip respectively, and the pitching rotation-change decoding chip and the azimuth rotation-change decoding chip form a rotation-change decoding module.
Furthermore, the rotary change excitation module comprises a pitching excitation module and an azimuth excitation module;
after entering from the ZRM connector, the differential analog signal is converted into a single-ended analog signal through the operational amplifier module, and the analog signal is converted into a digital signal through the AD acquisition module and is sent to the FPGA module;
the FPGA module sends data to the DA output module, the DA output module is controlled through a control line, and the DA output module outputs an analog signal to the ZRM connector;
the pitch excitation module and the azimuth excitation module are connected with a pitch rotation change decoding chip and an azimuth rotation change decoding chip through ZRM connectors, the rotation change decoding module decodes and converts input analog signals and sends the converted digital signals to the FPGA module, and the two decoding modules share a data bus.
Furthermore, JTAG interface devices of the DSP module and the FPGA module are distributed at one side opening end of the first H-shaped frame, and ZRM connectors are distributed at the other side opening end.
Furthermore, the pitch excitation module and the azimuth excitation module are symmetrically distributed on two side line beams of the first H-shaped frame and are positioned at one end close to the ZRM connector.
Compared with the prior art, the invention has the following beneficial effects:
1. through solution modal analysis, the first-order natural frequency of the controller circuit board provided with the reinforcing structure is 769Hz, is increased by nearly one time compared with a bare board, is increased by nearly 50% compared with the first-order natural frequency of a common reinforcing frame, has obvious reinforcing effect and is slightly influenced by resonance;
2. the front stress of the controller circuit board provided with the reinforcing structure is transitionally concentrated on the reinforcing structure from the PCB, the stress on the PCB is mainly concentrated on the outer edge of the board card, and the stress distribution at the junction of the rotary transformer decoding module is greatly reduced;
3. the stress of the pin area of the rotary-change decoding module is reduced to 2.59MPa from the original 4.11MPa, the reinforcing structure has an obvious effect of inhibiting the deformation of the board card, the stress is reduced by 36.9 percent and is less than the safe range of 3MPa, the stress value is far less than the peeling strength of a bonding pad by 10MPa and the breaking strength of a lead by 250MPa, and the generation of fatigue stress cracks is effectively avoided;
4. compared with the stress area of the existing structure, the stress concentration distribution area of the controller circuit board provided with the reinforcing structure is reduced, and the structure is effectively improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. In the drawings:
FIG. 1 is a schematic view of a mounting structure of a reinforcing structure in an embodiment of the present invention;
FIG. 2 is a schematic diagram of a distribution structure of PCB components in an embodiment of the present invention;
fig. 3 is a functional block diagram of a controller according to an embodiment of the present invention.
Reference numbers and corresponding part names in the drawings:
101. a first H-shaped frame; 102. a second H-shaped frame; 103. a threaded through hole; 104. closing the frame; 105. a reinforcing frame; 106. a screw; 201. a PCB board; 202. a rotation change decoding module; 203. mounting lugs; 204. a JTAG interface; 205. ZRM a connector; 206. a pitching excitation module; 207. and an azimuth excitation module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to examples and accompanying drawings, and the exemplary embodiments and descriptions thereof are only used for explaining the present invention and are not meant to limit the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Example 1: a circuit board double-chip centered anti-seismic reinforcing structure is shown in figure 1 and comprises a first H-shaped frame 101 and a second H-shaped frame 102 which are positioned on the same plane, wherein the second H-shaped frame 102 is arranged in the first H-shaped frame 101 and serves as a cross beam of the first H-shaped frame 101; the arrangement directions of the first H-shaped frame 101 and the second H-shaped frame 102 are mutually vertical; two opening ends of the first H-shaped frame 101 and the corresponding side line beams of the second H-shaped frame 102 enclose into two centrally distributed reinforcing frames 105 for the corresponding installation of the first chip and the second chip. In the embodiment, the material of the earthquake-resistant reinforcing structure is AL7075 with better strength.
The boundary beams of the first H-shaped frame 101 and the second H-shaped frame 102 are combined by a plurality of closed frames 104 in a linear distribution manner.
The edge of the reinforcing frame 105 is provided with a threaded through hole 103, and the first chip and the second chip can be relatively fixed with the corresponding reinforcing frame 105 by passing a screw 106 through the threaded through hole 103.
Each reinforcing frame 105 is correspondingly provided with four threaded through holes 103, and the four threaded through holes 103 are divided into two groups and symmetrically arranged on the side line beam of the first H-shaped frame 101.
Example 2: a controller circuit board is shown in FIG. 2 and comprises a PCB board 201 and a circuit board double-chip centered anti-seismic reinforcing structure as described in embodiment 1, wherein the PCB board 201 is provided with a first chip and a second chip which are matched with two reinforcing frames 105.
The side surfaces of the first chip and the second chip are provided with mounting lugs 203 which are in one-to-one correspondence with the threaded through holes 103, and the screws 106 are fixedly connected with the threaded through holes 103 after sequentially penetrating through the PCB 201 and the mounting lugs 203.
As shown in fig. 2 and fig. 3, the PCB 201 further includes a DSP module, an FPGA module, a rotary transformer excitation module, a photoelectric isolation module, a power module, an AD acquisition module, a DA output module, a JTAG interface 204, an ZRM connector 205, an operational amplifier module, and a power oscillation module; the first chip and the second chip are a pitch rotation decoding chip and an azimuth rotation decoding chip, respectively, and the pitch rotation decoding chip and the azimuth rotation decoding chip form a rotation decoding module 202. The DSP module, the FPGA module, the rotary transformer excitation module, the photoelectric isolation module, the power module, the AD acquisition module, the DA output module, the operational amplifier module and the power oscillation module are correspondingly installed with the closed frame 104, and the closed frame 104 is set to be rectangular or similar to rectangular according to specific modules.
The rotary change excitation module comprises a pitching excitation module 206 and an azimuth excitation module 207; after entering from the ZRM connector 205, the differential analog signal is converted into a single-ended analog signal by the operational amplifier module, and the analog signal is converted into a digital signal by the AD acquisition module and sent to the FPGA module; the FPGA module sends data to the DA output module, the DA output module is controlled through a control line, and the DA output module outputs an analog signal to the ZRM connector 205; the pitch excitation module 206 and the azimuth excitation module 207 are connected with a pitch rotation transformation decoding chip and an azimuth rotation transformation decoding chip through ZRM connectors 205, the rotation transformation decoding module 202 decodes and converts input analog signals and sends the converted digital signals to the FPGA module, and the two decoding modules share a data bus.
In this embodiment, the DSP module has 1 floating point TMS320F28335, the maximum processing frequency is 150MHz, and a high-speed FLASH is added to share the external memory bus with the FPGA module of model EP3C120F484I 7.
In this embodiment, the AD acquisition module is SAD7656MQ, and has 16-bit data lines, chip select, read, write control, and other signals in parallel.
In this embodiment, the DA output module is SDA396A, and has 8-bit data lines, two-bit address lines, write control, channel selection, and other signals in a parallel interface manner.
In this embodiment, the resolver decoding module 202 is an HTS18R16-65-6/3-a, which has two chips, the two decoding chips share an 18-bit data line interface and are connected to the FPGA module through an isolator SM245, and the remaining control lines are connected to the FPGA module through the isolator SM245, respectively.
In the embodiment, the interface conversion between the FPGA module and the device 1, the device 2 and the device 3 is performed through 4 pieces of SM3490 and one piece of GH 0630J.
In the present embodiment, the interface conversion between the FPGA module and the device 4 is performed through SM3490, GH5631Z, and JT54LS 14.
In this embodiment, the FPGA module is connected to a control line of the FLASH chip SM29LV160, and the rest of the data and address lines are connected to the EMIF bus.
In this embodiment, the FPGA module and the 6 TTL signals are driven by JT5407 and then output.
In this embodiment, a parallel access mode is adopted between the FPGA module and the DSP module, including 20-bit address lines, 16-bit data lines, and read, write, strobe, interrupt signals, etc., and the signal connection relationship between the DSP module and the FPGA module is as shown in fig. 3.
The pitch excitation module 206 and the azimuth excitation module 207 are symmetrically distributed on two side line beams of the first H-shaped frame 101 and are located at one end close to the ZRM connector 205. In the present embodiment, the model number of the ZRM connector 205 is ZRM 452-110-321-9501.
And (3) experimental verification: through solution modal analysis, the first-order natural frequency of the controller circuit board provided with the reinforcing structure is 769Hz, is increased by nearly one time compared with a bare board, is increased by nearly 50% compared with the first-order natural frequency of a common reinforcing frame, has obvious reinforcing effect and is slightly influenced by resonance; the front stress of the controller circuit board provided with the reinforcing structure is transitionally concentrated on the reinforcing structure from the PCB, the stress on the PCB is mainly concentrated on the outer edge of the board card, and the stress distribution at the junction of the rotary transformer decoding module 202 is greatly reduced; the stress of the pin area of the rotary transformer decoding module 202 is reduced to 2.59MPa from the original 4.11MPa, the reinforcing structure has an obvious effect of inhibiting the deformation of the board card, the stress is reduced by 36.9 percent and is less than the safety range of 3MPa, the stress value is far less than the peeling strength of a bonding pad by 10MPa and the breaking strength of a lead by 250MPa, and the generation of fatigue stress cracks is effectively avoided; compared with the stress area of the existing structure, the stress concentration distribution area of the controller circuit board provided with the reinforcing structure is reduced, and the structure is effectively improved.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are merely exemplary embodiments of the present invention, and are not intended to limit the scope of the present invention, and any modifications, equivalent substitutions, improvements and the like made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A circuit board double-chip centered anti-seismic reinforcing structure is characterized by comprising a first H-shaped frame (101) and a second H-shaped frame (102) which are positioned on the same plane, wherein the second H-shaped frame (102) is arranged in the first H-shaped frame (101) and serves as a cross beam of the first H-shaped frame (101); the arrangement directions of the first H-shaped frame (101) and the second H-shaped frame (102) are mutually vertical; two opening ends of the first H-shaped frame (101) and corresponding edge line beams of the second H-shaped frame (102) are encircled to form two centrally distributed reinforcing frames (105) for correspondingly mounting the first chip and the second chip.
2. The circuit board double-chip centered earthquake-resistant reinforcing structure as claimed in claim 1, wherein the side beams of the first H-shaped frame (101) and the second H-shaped frame (102) are combined by a plurality of closed frames (104) in a linear distribution manner.
3. The circuit board double-chip centered anti-seismic reinforcing structure of claim 1, wherein the edge of the reinforcing frame (105) is provided with a threaded through hole (103), and the first chip and the second chip can be fixed relative to the corresponding reinforcing frame (105) by a screw (106) penetrating through the threaded through hole (103).
4. The centered anti-seismic circuit board double-chip strengthening structure as claimed in claim 3, wherein each strengthening frame (105) is correspondingly provided with four threaded through holes (103), and the four threaded through holes (103) are divided into two groups and symmetrically arranged on the boundary beams of the first H-shaped frame (101).
5. A controller circuit board comprising a PCB board (201) and a dual-chip centered seismic enhancement structure of a circuit board according to any of claims 1-4, the PCB board (201) having mounted thereon a first chip and a second chip that cooperate with two of the enhancement frames (105).
6. The controller circuit board of claim 5, wherein the side surfaces of the first chip and the second chip are provided with mounting lugs (203) which are arranged corresponding to the threaded through holes (103) one by one, and the screws (106) are fixedly connected with the threaded through holes (103) after sequentially penetrating through the PCB (201) and the mounting lugs (203).
7. The controller circuit board of claim 5, wherein the PCB (201) is further provided with a DSP module, an FPGA module, a rotary transformer excitation module, a photoelectric isolation module, a power supply module, an AD acquisition module, a DA output module, a JTAG interface unit (204), an ZRM connector (205), an operational amplifier module and a power oscillation module; the first chip and the second chip are a pitch rotation decoding chip and an azimuth rotation decoding chip respectively, and the pitch rotation decoding chip and the azimuth rotation decoding chip form a rotation decoding module (202).
8. The controller circuit board of claim 7, wherein the rotation excitation module comprises a pitch excitation module (206), an azimuth excitation module (207);
after entering from the ZRM connector (205), the differential analog signal is converted into a single-ended analog signal through the operational amplifier module, and the analog signal is converted into a digital signal through the AD acquisition module and is sent to the FPGA module;
the FPGA module sends data to the DA output module, the DA output module is controlled through a control line, and the DA output module outputs an analog signal to the ZRM connector (205);
the pitch excitation module (206) and the azimuth excitation module (207) are connected with a pitch rotation transformation decoding chip and an azimuth rotation transformation decoding chip through ZRM connectors (205), the rotation transformation decoding module (202) decodes and converts input analog signals and sends the converted digital signals to the FPGA module, and the two decoding modules share a data bus.
9. The controller circuit board of claim 8, wherein the JTAG interface (204) of the DSP module and the FPGA module are distributed at one side of the first H-shaped frame (101) and the ZRM connector (205) is distributed at the other side of the first H-shaped frame.
10. The controller circuit board of claim 9, wherein the pitch excitation module (206) and the azimuth excitation module (207) are symmetrically distributed on two side boundary beams of the first H-shaped frame (101) and are located at one end close to the ZRM connector (205).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110000647.4A CN112423469A (en) | 2021-01-04 | 2021-01-04 | Circuit board double-chip centered anti-seismic reinforcing structure and controller circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110000647.4A CN112423469A (en) | 2021-01-04 | 2021-01-04 | Circuit board double-chip centered anti-seismic reinforcing structure and controller circuit board |
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Application publication date: 20210226 |