CN112420967A - Preparation method of display panel, display panel and display device - Google Patents
Preparation method of display panel, display panel and display device Download PDFInfo
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- CN112420967A CN112420967A CN201910772130.XA CN201910772130A CN112420967A CN 112420967 A CN112420967 A CN 112420967A CN 201910772130 A CN201910772130 A CN 201910772130A CN 112420967 A CN112420967 A CN 112420967A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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Abstract
The invention discloses a preparation method of a display panel, which comprises the steps of providing a substrate base plate; forming a lower-layer bank structure with isolation column grooves on the substrate base plate, wherein the lower-layer bank structure has a hydrophilic characteristic; and correspondingly forming an upper layer bank structure on the lower layer bank structure, wherein the upper layer bank structure has a hydrophobic characteristic. The lower layer bank structure of the display panel prepared by the invention has hydrophilic property, and the upper layer bank structure has hydrophobic property, so that when the color resistance material is injected into the isolation column groove, ink can be effectively prevented from overflowing the isolation column groove, and the probability of generating color mixing and mura phenomenon is reduced.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a preparation method of a display panel, the display panel and a display device.
Background
The flat display device has many advantages of thin body, power saving, no radiation, etc., and is widely used. With the development of information technology, the demand of flat display devices has been rapidly increased. In order to meet such a demand, Display devices typified by Liquid Crystal Displays (LCDs), Plasma Displays (PDPs), and Organic Light Emitting Displays (OLEDs) have been rapidly developed.
The organic light emitting display device has characteristics of self-luminescence, high brightness, wide viewing angle, high contrast, flexibility, low energy consumption, no need of backlight source, fast response speed, etc., so it has attracted extensive attention, and as a new generation of display mode, it has begun to gradually replace the conventional liquid crystal display device, is considered as a new application technology of the next generation of flat panel display device, and is widely applied in the fields of mobile phone screen, computer display, full color television, etc. Unlike the conventional liquid crystal display, the organic electroluminescent device directly provides a very thin organic material coating on a glass substrate without a backlight, and the organic material coating emits light when a current flows therethrough.
However, in the organic electroluminescent device, the pixel defining layer (Bank structure) is very important for the yield of printing and the uniformity of film formation in the later period during the inkjet printing process, and the phenomenon of color mixing and mura (brightness unevenness) is easily caused by the overflow of ink from the isolation pillar groove during the inkjet printing process.
Disclosure of Invention
In order to solve the above problems in the prior art, the invention provides a method for manufacturing a display panel, a display panel and a display device. The technical problem to be solved by the invention is realized by the following technical scheme:
a method of manufacturing a display panel, comprising:
providing a substrate base plate;
forming a lower-layer bank structure with isolation column grooves on the substrate base plate, wherein the lower-layer bank structure has a hydrophilic characteristic;
and correspondingly forming an upper layer bank structure on the lower layer bank structure, wherein the upper layer bank structure has a hydrophobic characteristic.
In an embodiment of the invention, the material of the lower bank structure is a negative photoresist, and the material of the upper bank structure is a positive photoresist.
In one embodiment of the present invention, forming a lower bank structure having isolation pillar trenches on the substrate base plate includes:
coating a layer of negative photoresist material on the substrate;
and processing the negative photoresist material by utilizing the processes of exposure, development and etching to obtain a lower-layer bank structure with the isolation column groove.
In an embodiment of the present invention, processing the negative photoresist material by using exposure, development and etching processes to obtain a lower bank structure with an isolation pillar groove, includes:
forming a first mask layer on the negative photoresist material;
and carrying out exposure, development and etching treatment on the first mask layer and the negative photoresist material to obtain a lower-layer bank structure with the isolation column groove.
In an embodiment of the present invention, forming an upper bank structure on the lower bank structure correspondingly includes:
coating a layer of positive photoresist material on the lower-layer bank structure;
and processing the positive photoresist material by utilizing the processes of exposure, development and etching to obtain the upper-layer bank structure.
In an embodiment of the present invention, processing the positive photoresist material by using an exposure, development and etching process to obtain the upper bank structure, includes:
forming a second mask layer on the positive photoresist material;
and carrying out exposure, development and etching treatment on the second mask layer and the positive photoresist material to obtain the upper-layer bank structure.
In an embodiment of the present invention, after forming an upper bank structure on the lower bank structure, the method further includes:
and injecting a color resistance material into the isolation column groove-shaped color resistance layer.
In one embodiment of the present invention, after injecting the color-resistant material into the separation column groove-shaped color-resistant layer, the method further includes:
and stripping the upper layer bank structure from the lower layer bank structure by using a photoresist.
An embodiment of the present invention further provides a display panel, which is manufactured by the method for manufacturing a display panel according to any one of the embodiments.
An embodiment of the present invention further provides a display device, including the display panel according to any one of the above embodiments.
The invention has the beneficial effects that:
the lower layer bank structure of the display panel prepared by the invention has hydrophilic property, and the upper layer bank structure has hydrophobic property, so that when the color resistance material is injected into the isolation column groove, ink can be effectively prevented from overflowing the isolation column groove, and the probability of generating color mixing and mura phenomenon is reduced.
The present invention will be described in further detail with reference to the accompanying drawings and examples.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a display panel according to an embodiment of the present invention;
fig. 2a to fig. 2i are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another display panel according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to specific examples, but the embodiments of the present invention are not limited thereto.
Example one
The mature display technology in the market is LCD (liquid crystal display) technology, and new display technologies such as OLED (organic electroluminescent display) and QLED (quantum dot electroluminescent display) are focused on the advantages of high contrast, high color gamut, wide viewing angle, low energy consumption, low reaction time and lighter weight due to self-luminescence.
At present, large-size OLED television products are launched by display macros such as Samsung and LG, and more curved-surface-screen OLED television products are produced. However, since the cost of large-sized OLED products is high, mass-produced OLED displays in the market are mainly small-sized, and the number of large-sized OLEDs is small, so that the competitive advantage is difficult to be formed in the face of harsh market environments. The main factor limiting large-sized OLED displays is the fabrication of OLED devices. At present, the mainstream OLED display device is generally manufactured by adopting an evaporation process, but the process technology mainly faces to the problems of yield and cost. The OLED display panel manufactured by using the Ink-jet printing technology (IJP) is a feasible method for reducing the production cost compared to the evaporation process. The ink-jet printing technology has the advantages of multiple aspects, on one hand, the ink-jet printing technology has the advantages of simple manufacturing process, higher evaporation efficiency of OLED materials and convenience for mass production; the second aspect has the advantage that the ink jet printing technology can save raw materials, thereby reducing production cost; the third aspect has the advantage of better precision of inkjet printing compared to conventional evaporation techniques, especially when used for processing large-sized panels.
A typical inkjet printing apparatus has a plurality of print heads for printing polymer color resist materials of different colors, each having a plurality of micro nozzles, and the red, green, and blue resist material solutions are precisely deposited in isolated pillar grooves of an ITO (Indium tin oxide) glass substrate, respectively, and a solvent is volatilized to form a nano thin layer (with a thickness of about 100 nm) to form a light emitting pixel.
Although the ink-jet printing technique has advantages over the evaporation technique and is promising, there are some problems to be solved in the production of flat panel displays by using the ink-jet printing technique, such as the preparation of Bank structures needs to be further optimized to improve the resolution of the printed devices. In the ink-jet printing process, the Bank structure is very important for the printing yield and the later-stage film-forming uniformity, and the phenomenon of color mixing and mura is easily caused when ink overflows from the isolation column groove in the printing process.
Referring to fig. 1, fig. 1 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, in order to solve the above problem, the embodiment provides a method for manufacturing a display panel, where the method for manufacturing a display panel specifically includes:
step one, providing a substrate base plate;
forming a lower-layer bank structure with isolation column grooves on the substrate base plate, wherein the lower-layer bank structure has a hydrophilic characteristic;
and step three, forming an upper layer bank structure on the lower layer bank structure correspondingly, wherein the upper layer bank structure has a hydrophobic characteristic.
Specifically, in this embodiment, a substrate is first selected, a lower bank structure having an isolation pillar groove is then formed on the substrate, the bank structure has a hydrophobic property, the isolation pillar groove is a structure for injecting a red color-resistant material, a green color-resistant material, and a blue color-resistant material, an upper bank structure is then correspondingly formed on the lower bank structure, the upper bank structure has a hydrophobic property, the lower bank structure and the upper bank structure together form a dam for surrounding a pixel region (i.e., an isolation pillar groove), the hydrophilic and hydrophobic properties of the lower bank structure are not consistent with those of the upper bank structure, and because the upper bank structure has a hydrophobic property, when a red color-resistant material, a green color-resistant material, and a blue color-resistant material are correspondingly injected into the isolation pillar groove by using an inkjet printing technology, the red color-resistant material, the green color-resistant material, and the blue color-resistant material are mistakenly sprayed onto the top surface of the upper bank structure, The green color resistance material or the blue color resistance material does not stay on the top surface of the upper bank structure, but flows into the corresponding isolation post groove due to the hydrophobic characteristic of the upper bank structure, does not stay on the top surface of the upper bank structure due to error spraying to the top surface of the upper bank structure, even flows into the adjacent isolation post groove to cause color mixing problem, and simultaneously, because the lower bank structure is positioned below the upper bank structure and has hydrophilic characteristic, and the common pixel area is provided with an electrode which is generally an anode electrode, and the electrode is generally made of hydrophilic conductive material, such as Indium Tin Oxide (ITO), the red color resistance material, the green color resistance material or the blue color resistance material which flows into the isolation post groove can be fully and uniformly spread in the corresponding isolation post groove, and finally the red color resistance material, the green color resistance material and the blue color resistance material can be prevented from overflowing out of the isolation post groove, therefore, the problem that the color mixing phenomenon easily occurs to the display panel is thoroughly avoided, and meanwhile, because the red color resistance material, the green color resistance material and the blue color resistance material can be uniformly spread in the isolation column groove, the mura phenomenon is further reduced.
It should be noted that the method for manufacturing a display panel in the present invention only shows the steps related to the present invention, and other steps may be included before, after, and in the above steps, and these steps are also well known in the art, so that other steps are not described in detail in this embodiment.
Example two
In order to better explain the method for manufacturing the display panel of the first embodiment, this embodiment specifically explains the method for manufacturing the display panel on the basis of the above embodiments.
Referring to fig. 2a to fig. 2i, fig. 2a to fig. 2i are schematic diagrams illustrating a method for manufacturing a display panel according to an embodiment of the invention. The method for manufacturing the display panel may specifically include:
providing a substrate 10, wherein the substrate 10 is a TFT substrate, the TFT substrate may be a rigid TFT substrate or a flexible TFT substrate, the TFT substrate may specifically include a substrate, a TFT array layer, a planarization layer covering the TFT array layer, and a plurality of anodes disposed on the planarization layer and corresponding to a plurality of pixel regions, the TFT array layer may specifically include a plurality of TFTs (Thin Film transistors), scanning signal lines (or gate lines) for transmitting scanning signals, and image signal lines (or data lines) for transmitting image signals, and the TFTs are respectively connected to the gate lines and the data lines; a pixel electrode connected to the TFT; a gate insulating layer covering and insulating the gate line; and a protective layer covering the TFT and the data line and insulating the TFT and the data line. Here, the gate insulating layer and the protective layer are generally made of silicon nitride. Further, the TFT includes: a gate electrode which is a part of the gate line; a semiconductor layer forming a channel portion; a source electrode which is a part of the data line; a drain electrode; a gate insulating layer; a protective layer; and so on. The TFT is a switching element, which is a main driving element in an active matrix driving type organic electroluminescent display device, and transmits or interrupts an image signal transmitted through a data line according to a scan signal transmitted through a gate line. The TFT may be a Low Temperature Polysilicon (LTPS) TFT, an Oxide semiconductor (Oxide) TFT, a Solid Phase Crystallization (SPC) TFT, or other TFTs commonly used in OLED displays.
In addition, if the TFT substrate is a rigid TFT substrate, the substrate of the TFT substrate may be one of rigid carrier plates such as silicon wafer, metal, and glass, and if the TFT substrate is a flexible TFT substrate, the substrate of the TFT substrate includes a rigid carrier substrate and a flexible film on the rigid carrier substrate, and the flexible film may be PI, PET, PEN, or other materials.
Step two, forming a lower layer bank structure with isolation column grooves on the substrate base plate, wherein the lower layer bank structure has a hydrophilic characteristic, and the method specifically comprises the following steps:
step 2.1, referring to fig. 2b, if the material of the lower bank structure 20 may be, for example, a negative photoresist material, a layer of negative photoresist material may be coated on the substrate base first. For example, a negative photoresist material may be coated on the substrate base plate 10 by a spray coating process, a spin coating process or other coating processes, and then the negative photoresist material is formed on the substrate base plate 10 in a solid state by performing the process steps of vacuum drying, pre-baking, cooling, etc. on the negative photoresist material.
And 2.2, processing the negative photoresist material by utilizing exposure, development and etching processes to obtain a lower-layer bank structure with the isolation column groove.
Specifically, referring to fig. 2c and 2d, a first mask layer 30 is formed on a negative photoresist material, the first mask layer 30 is a mask, and a light-transmitting channel of the first mask layer 30 is disposed at a corresponding position above a lower bank structure to be formed, so that light passing through the light-transmitting channel can enter the negative photoresist material, and then the negative photoresist material provided with the first mask layer 30 is subjected to exposure, development, etching and other steps, and the negative photoresist material corresponding to an exposure region is crosslinked and is insoluble in a developing solution, and an exposed portion is dissolved in the developing solution and is easily removed, so that the negative photoresist material of the exposed portion is removed after etching, and the lower bank structure 40 with the isolation pillar groove 50 is formed on the substrate 10. The isolation post groove of the present embodiment is used to form the pixel region, and the specific shape of the isolation post groove is not particularly limited, and it should be understood that the shape of the isolation post groove may be any suitable shape, such as a circle, an ellipse, and the like.
Further, the material of the lower bank structure of this embodiment may be a negative photoresist material, and the negative photoresist material has a hydrophilic property, so that when the color-resisting material is injected into the isolation column groove, the color-resisting material can be fully and uniformly spread in the isolation column groove.
Further, the specific process comprises the following steps: by using a slit coating method, the pressure is 10-60Pa, the pre-baking temperature is 100-120 ℃, the pre-baking time is 70-90s, and the exposure energy is 30-50mJ/cm2The gap between the mask and the photoresist is 200-250 μm, the developing solution is 0.04% KOH, the developing time is 50-60sec, the hard baking temperature is 230 ℃, the hard baking time is 20-30min, and the remained pattern is baked after the hard baking is developed so as to be convenient for cross-linking molding.
And step three, correspondingly forming an upper layer bank structure on the lower layer bank structure, wherein the upper layer bank structure has a hydrophobic characteristic.
Step 3.1, please refer to fig. 2e, for example, the material of the upper bank structure 50 may be a positive photoresist, and a layer of the positive photoresist 60 may be coated on the lower bank structure 50 first, but the embodiment of the present invention is not limited to the method of coating the positive photoresist 60 on the lower bank structure 50, and any coating method commonly used in the art can be implemented. For example, a spray coating process, a spin coating process or other coating processes may be used to coat the positive photoresist material 60 on the lower bank structure 50, and then the positive photoresist material is formed in a solid state on the lower bank structure 50 by performing the process steps of vacuum drying, pre-baking, cooling, etc. on the positive photoresist material 60.
And 3.2, processing the positive photoresist material by utilizing the processes of exposure, development and etching to obtain the upper-layer bank structure.
Specifically, referring to fig. 2f and 2g, first, a second mask layer 70 is formed on the positive photoresist material 60, where the second mask layer 70 is a mask, and a light-transmitting channel of the second mask layer 70 is disposed at a corresponding position above the upper bank structure to be formed, so that light passing through the light-transmitting channel can enter the positive photoresist material 60, and then the positive photoresist material provided with the second mask layer 70 is subjected to exposure, development, and etching, and the positive photoresist material corresponding to the exposure region is crosslinked and is insoluble in a developing solution, and the exposed portion is easily dissolved in the developing solution, so that the positive photoresist material of the exposed portion is removed after etching, and thus the upper bank structure 40 having the isolation pillar grooves 50 is formed on the lower bank structure 40, it should be understood that the present embodiment does not specifically limit the shapes of the lower bank structure 40 and the upper bank structure 80, the shapes of the lower bank structure 40 and the upper bank structure 80 may be adjusted according to the shape of the isolation pillar groove 50.
Further, the specific process comprises the following steps: by using a slit coating method, the pressure is 10-60Pa, the pre-baking temperature is 100-120 ℃, the pre-baking time is 70-90s, and the exposure energy is 30-50mJ/cm2The gap between the mask and the photoresist is 200-250 μm, the developing solution is 0.38% TMAH, the developing time is 50-60sec, the hard baking temperature is 230 ℃, and the hard baking time is 20-30 min.
Further, the material of the upper bank structure of the embodiment may be a positive photoresist material, when the inkjet printing technology is used to correspondingly inject the red color resistance material, the green color resistance material and the blue color resistance material into the isolation pillar groove, because the positive photoresist material has a hydrophobic property, in the subsequent process of using the inkjet printing technology, the red color resistance material, the green color resistance material or the blue color resistance material which is mistakenly sprayed onto the top surface of the upper bank structure will not stay on the top surface of the upper bank structure, but will flow into the corresponding isolation pillar groove due to the hydrophobic property of the top surface of the upper bank structure, so that the color resistance material will not stay on the top surface of the upper bank structure due to the mistaken spraying onto the top surface of the upper bank structure, and even flow into the adjacent isolation pillar groove to cause a color mixing problem, and because the lower bank structure is located below the upper bank structure, and the lower bank structure has a hydrophilic property, and the electrodes in the isolated column grooves generally have hydrophilic characteristics, so that the red color resistance materials, the green color resistance materials or the blue color resistance materials flowing into the isolated column grooves under the action of the lower bank structure and the electrodes can be fully and uniformly spread in the corresponding isolated column grooves, and finally the red color resistance materials, the green color resistance materials and the blue color resistance materials can be prevented from overflowing out of the isolated column grooves, so that the problem that the display panel is easy to have a color mixing phenomenon is thoroughly avoided.
Preferably, the ratio of the thickness of the upper bank structure to the thickness of the lower bank structure is 2:5-2:7, and the thickness of the lower bank structure should be greater than the thickness of the color-resistant layer, because the hydrophilicity and hydrophobicity of the upper bank structure is not consistent with that of the lower bank structure, and the thickness ratio is 2:5-2:7, so that a proper amount of color-resistant ink can be dropped into the isolation pillar groove 50 and can be limited in the isolation pillar groove 50, and if the thickness of the upper bank structure is too thick and the thickness of the lower bank structure is too thin, a sufficient amount of color-resistant solution cannot be accommodated in the pixel pit because the hydrophobic layer is too thick, for example, the thickness of the lower bank structure is 2.5-3.5 μm, and the thickness of the upper bank structure is 0.7-1 μm.
The manufacturing method of the display panel of the embodiment does not need to add a new process flow, only needs to add a manufacturing flow of the positive photoresist by one step, can meet the requirements by prolonging the use of the original equipment and the original working procedures, and has small cost increase.
Step four, please refer to fig. 2h, injecting the color-resisting material into the isolation column groove 50 to form a color-resisting layer 90;
specifically, a red color resist material, a green color resist material and a blue color resist material are respectively injected into corresponding isolation column grooves by using an inkjet printing technology, and then the red color resist material, the green color resist material and the blue color resist material injected into the isolation column grooves are exposed, and finally a red color resist layer, a green color resist layer and a blue color resist layer are correspondingly formed, wherein the red color resist layer corresponds to a red pixel unit, the green color resist layer corresponds to a green pixel unit, and the blue color resist layer corresponds to a blue pixel unit, the red pixel unit, the green pixel unit and the blue pixel unit are sequentially arranged in an array manner, colors of adjacent pixel units are different, and the display panel of the embodiment realizes color imaging through the red pixel unit, the green pixel unit and the blue pixel unit.
Step five, referring to fig. 2i, the upper bank structure 80 is stripped from the lower bank structure 40 by using a resist remover.
In this embodiment, the upper bank structure 80 may be selectively peeled off from the lower bank structure 40, or the upper bank structure 80 may not be selectively peeled off, and after the upper bank structure 80 is peeled off from the lower bank structure 40 by using a resist remover, since the color resist layer and the lower bank structure both have hydrophilic characteristics, coating of a subsequent Planarization Layer (PLN) and preparation of a package structure are more facilitated.
It should be noted that the method for manufacturing a display panel in the present invention only shows the steps related to the present invention, and other steps may be included before, after, and in the above steps, and these steps are also well known in the art, so that other steps are not described in detail in this embodiment.
EXAMPLE III
The present embodiment further provides a display panel on the basis of the foregoing embodiments, where the display panel is prepared according to the preparation method of any one of the foregoing embodiments, please refer to fig. 3, and fig. 3 is a schematic structural diagram of the display panel provided in the embodiments of the present invention, and the display panel specifically includes a substrate base 10, a lower bank structure 40 having an isolation pillar groove 50, an upper bank structure 80, and a color resistance layer 90, where:
the substrate 10 is a TFT substrate, and the TFT substrate may specifically include a glass substrate, a TFT array layer, a planarization layer covering the TFT array layer, and a plurality of anodes disposed on the planarization layer and corresponding to the plurality of pixel regions.
The lower bank structure 40 with the isolation column grooves 50 is located on the substrate base plate 10, the lower bank structure 40 has a hydrophilic characteristic, and a specific material of the lower bank structure 40 can be a negative photoresist material.
The upper bank structure 80 is located on the lower bank structure 40, the upper bank structure 80 has a hydrophobic characteristic, and the specific material of the upper bank structure 80 can be a positive photoresist material.
The color resistance layer 90 is located in the isolation column groove 50, the color resistance layer 90 comprises a red color resistance layer, a green color resistance layer and a blue color resistance layer, one of the red color resistance layer, the green color resistance layer and the blue color resistance layer is correspondingly arranged in each isolation column groove 50, and the color of the color resistance layer in the two adjacent isolation column grooves 50 is different.
It should be noted that the display panel in the present invention only shows the structure related to the present invention, and the display panel of the present invention also includes other structures, which are not described in detail herein.
The display panel provided in the embodiment of the present invention has the similar implementation principle and technical effect to the display panel manufacturing method described in the above embodiment, and is not described herein again.
Example four
The present embodiment further provides a display panel on the basis of the foregoing embodiments, where the display panel is prepared according to the preparation method of any one of the foregoing embodiments, please refer to fig. 4, and fig. 4 is a schematic structural diagram of another display panel provided in the embodiments of the present invention, and the display panel specifically includes a substrate base 10, a lower bank structure 40 having an isolation pillar groove 50, and a color resistance layer 90, where:
the substrate 10 is a TFT substrate, and the TFT substrate may specifically include a glass substrate, a TFT array layer, a planarization layer covering the TFT array layer, and a plurality of anodes disposed on the planarization layer and corresponding to the plurality of pixel regions.
The lower bank structure 40 with the isolation column grooves 50 is located on the substrate base plate 10, the lower bank structure 40 has a hydrophilic characteristic, and a specific material of the lower bank structure 40 can be a negative photoresist material.
The color resistance layer 90 is located in the isolation column groove 50, the color resistance layer 90 comprises a red color resistance layer, a green color resistance layer and a blue color resistance layer, one of the red color resistance layer, the green color resistance layer and the blue color resistance layer is correspondingly arranged in each isolation column groove 50, and the color of the color resistance layer in the two adjacent isolation column grooves 50 is different.
It should be noted that the display panel in the present invention only shows the structure related to the present invention, and the display panel of the present invention also includes other structures, which are not described in detail herein.
The display panel provided in the embodiment of the present invention has the similar implementation principle and technical effect to the display panel manufacturing method described in the above embodiment, and is not described herein again.
EXAMPLE five
The embodiment of the invention also provides a display device which comprises the display panel in the embodiment. The display device may be, for example: any product or component with a display function, such as an LTPO display device, a Micro LED display device, electronic paper, an OLED panel, an AMOLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and the like.
Specifically, referring to fig. 3 again, the display panel may specifically include a substrate base plate 10, a lower bank structure 40 having an isolation pillar groove 50, an upper bank structure 80, and a color resistance layer 90, wherein:
the substrate 10 is a TFT substrate, and the TFT substrate may specifically include a glass substrate, a TFT array layer, a planarization layer covering the TFT array layer, and a plurality of anodes disposed on the planarization layer and corresponding to the plurality of pixel regions.
The lower bank structure 40 with the isolation column grooves 50 is located on the substrate base plate 10, the lower bank structure 40 has a hydrophilic characteristic, and a specific material of the lower bank structure 40 can be a negative photoresist material.
The upper bank structure 80 is located on the lower bank structure 40, the upper bank structure 80 has a hydrophobic characteristic, and the specific material of the upper bank structure 80 can be a positive photoresist material.
The color resistance layer 90 is located in the isolation column groove 50, the color resistance layer 90 comprises a red color resistance layer, a green color resistance layer and a blue color resistance layer, one of the red color resistance layer, the green color resistance layer and the blue color resistance layer is correspondingly arranged in each isolation column groove 50, and the color of the color resistance layer in the two adjacent isolation column grooves 50 is different.
The display device provided in the embodiment of the present invention has the same implementation principle and technical effect as the display panel described in the above embodiment, and is not described herein again.
EXAMPLE six
The embodiment of the invention also provides a display device which comprises the display panel in the embodiment. The display device may be, for example: any product or component with a display function, such as an LTPO display device, a Micro LED display device, electronic paper, an OLED panel, an AMOLED panel, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and the like.
Specifically, referring to fig. 4 again, the display panel may specifically include a substrate base plate 10, a lower bank structure 40 having an isolation pillar groove 50, and a color resistance layer 90, wherein:
the substrate 10 is a TFT substrate, and the TFT substrate may specifically include a glass substrate, a TFT array layer, a planarization layer covering the TFT array layer, and a plurality of anodes disposed on the planarization layer and corresponding to the plurality of pixel regions.
The lower bank structure 40 with the isolation column grooves 50 is located on the substrate base plate 10, the lower bank structure 40 has a hydrophilic characteristic, and a specific material of the lower bank structure 40 can be a negative photoresist material.
The color resistance layer 90 is located in the isolation column groove 50, the color resistance layer 90 comprises a red color resistance layer, a green color resistance layer and a blue color resistance layer, one of the red color resistance layer, the green color resistance layer and the blue color resistance layer is correspondingly arranged in each isolation column groove 50, and the color of the color resistance layer in the two adjacent isolation column grooves 50 is different.
The display device provided in the embodiment of the present invention has the same implementation principle and technical effect as the display panel described in the above embodiment, and is not described herein again.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
For the sake of simplicity of the drawing, only the parts relevant to the present invention are schematically shown in the respective drawings, and they do not represent the actual structure as a product. In addition, in order to make the drawings concise and understandable, components having the same structure or function in some of the drawings are only schematically illustrated or only labeled. Herein. "a" or "an" means not only "but also" more than one ".
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A method for manufacturing a display panel, comprising:
providing a substrate base plate;
forming a lower-layer bank structure with isolation column grooves on the substrate base plate, wherein the lower-layer bank structure has a hydrophilic characteristic;
and correspondingly forming an upper layer bank structure on the lower layer bank structure, wherein the upper layer bank structure has a hydrophobic characteristic.
2. The method for manufacturing a display panel according to claim 1, wherein the material of the lower bank structure is a negative photoresist, and the material of the upper bank structure is a positive photoresist.
3. The method for manufacturing a display panel according to claim 2, wherein forming a lower bank structure having an isolation pillar groove on the substrate base plate comprises:
coating a layer of negative photoresist material on the substrate;
and processing the negative photoresist material by utilizing the processes of exposure, development and etching to obtain a lower-layer bank structure with the isolation column groove.
4. The method for manufacturing a display panel according to claim 3, wherein the negative photoresist material is processed by exposure, development and etching processes to obtain a lower bank structure with isolation post grooves, comprising:
forming a first mask layer on the negative photoresist material;
and carrying out exposure, development and etching treatment on the first mask layer and the negative photoresist material to obtain a lower-layer bank structure with the isolation column groove.
5. The method for manufacturing a display panel according to claim 2, wherein forming an upper bank structure on the lower bank structure comprises:
coating a layer of positive photoresist material on the lower-layer bank structure;
and processing the positive photoresist material by utilizing the processes of exposure, development and etching to obtain the upper-layer bank structure.
6. The method for manufacturing a display panel according to claim 5, wherein the processing of the positive photoresist material by exposure, development and etching processes to obtain the upper bank structure comprises:
forming a second mask layer on the positive photoresist material;
and carrying out exposure, development and etching treatment on the second mask layer and the positive photoresist material to obtain the upper-layer bank structure.
7. The method for manufacturing a display panel according to claim 1, wherein after the forming of the corresponding upper bank structure on the lower bank structure, the method further comprises:
and injecting a color resistance material into the isolation column groove-shaped color resistance layer.
8. The method for manufacturing a display panel according to claim 7, further comprising, after injecting a color resist material into the separation column groove-shaped color resist layer:
and stripping the upper layer bank structure from the lower layer bank structure by using a photoresist.
9. A display panel produced by the production method for a display panel according to any one of claims 1 to 8.
10. A display device characterized by comprising the display panel according to claim 9.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910772130.XA CN112420967A (en) | 2019-08-21 | 2019-08-21 | Preparation method of display panel, display panel and display device |
| KR1020200102318A KR20210023720A (en) | 2019-08-21 | 2020-08-14 | Manufacturing method of display panel, and display panel and display apparatus |
| KR1020220116343A KR20220132489A (en) | 2019-08-21 | 2022-09-15 | Manufacturing method of display panel, and display panel and display apparatus |
| KR1020220116361A KR102654412B1 (en) | 2019-08-21 | 2022-09-15 | Manufacturing method of display panel, and display panel and display apparatus |
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| CN201910772130.XA CN112420967A (en) | 2019-08-21 | 2019-08-21 | Preparation method of display panel, display panel and display device |
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| CN112420967A true CN112420967A (en) | 2021-02-26 |
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