CN112406212A - Be applied to alkene carbon heat conduction membrane at 5G terminal - Google Patents

Be applied to alkene carbon heat conduction membrane at 5G terminal Download PDF

Info

Publication number
CN112406212A
CN112406212A CN202011210038.3A CN202011210038A CN112406212A CN 112406212 A CN112406212 A CN 112406212A CN 202011210038 A CN202011210038 A CN 202011210038A CN 112406212 A CN112406212 A CN 112406212A
Authority
CN
China
Prior art keywords
layer
carbon
heat
heat conduction
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011210038.3A
Other languages
Chinese (zh)
Inventor
郑志成
朱全红
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Hongyi Thermal Conductmty Material Co ltd
Original Assignee
Dongguan Hongyi Thermal Conductmty Material Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Hongyi Thermal Conductmty Material Co ltd filed Critical Dongguan Hongyi Thermal Conductmty Material Co ltd
Priority to CN202011210038.3A priority Critical patent/CN112406212A/en
Publication of CN112406212A publication Critical patent/CN112406212A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention belongs to the technical field of heat-conducting films, and particularly discloses an alkene-carbon heat-conducting film applied to a 5G terminal, which sequentially comprises a carbon heat-conducting sheet layer, a first diamond layer, a graphene heat-conducting layer and a second diamond layer from bottom to top; the carbon heat conduction sheet layer comprises a metal substrate and a nano carbon layer arranged on the upper surface of the metal substrate; the upper end face of the graphene heat conduction layer is provided with first grooves which are arranged in a grid-shaped cross mode, and the lower end face of the graphene heat conduction layer is provided with second grooves which are arranged in a grid-shaped cross mode; the first diamond layer is deposited in the first groove, and the second diamond layer is deposited in the second groove; the thickness ratio of the carbon heat conduction sheet layer to the first diamond layer to the graphene heat conduction layer to the second diamond layer is 2-3:1-2:5-12: 1-2. The whole heat transfer efficiency of the graphene heat-conducting film is greatly improved, the heat-conducting performance of the graphene heat-conducting film is improved, the heat dissipation requirements of high-energy-consumption equipment such as 5G are met, and meanwhile, the external electromagnetic interference can be effectively shielded.

Description

Be applied to alkene carbon heat conduction membrane at 5G terminal
Technical Field
The invention belongs to the technical field of heat-conducting films, and particularly relates to an alkene-carbon heat-conducting film applied to a 5G terminal.
Background
The high speed and low latency of the 5G era bring better experience to our lives, but power consumption increases and heat generation increases for electronic devices. On the other hand, in the 5G era, functions integrated on electronic equipment are gradually increased and complicated, and the volume of the equipment is gradually reduced, so that higher requirements are put on the thermal management technology of the electronic equipment, and as the 5G mobile phone is more and more powerful in function and stronger in processing capability, the power consumption is increased, and the absolute value of the heating density of the mobile phone is increased; on the other hand, due to the increase of the number of the 5G mobile phone antennas and the weakening of the penetration capability of electromagnetic waves, the material of the mobile phone body gradually approaches to nonmetal, and meanwhile, the 5G mobile phone is more and more light, thin and compact, and the heat dissipation design of the mobile phone is more and more difficult.
However, the conventional heat dissipation film for electronic devices is an artificial heat conduction graphite film, which has excellent heat conductivity coefficient, but cannot realize high heat conduction power due to the limitation of a heat conduction channel, and cannot meet the heat dissipation requirements of 5G series.
Disclosure of Invention
The invention aims to: aiming at the defects of the prior art, the olefinic carbon heat-conducting film applied to the 5G terminal is provided to solve the problems that the existing heat-conducting film is poor in heat-conducting and heat-dissipating performance, cannot isolate electromagnetic interference, cannot meet the heat-dissipating requirements of high-energy-consumption equipment such as 5G and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
the alkene-carbon heat-conducting film applied to the 5G terminal sequentially comprises a carbon heat-conducting sheet layer, a first diamond layer, a graphene heat-conducting layer and a second diamond layer from bottom to top;
the carbon heat conduction sheet layer comprises a metal substrate and a nano carbon layer arranged on the upper surface of the metal substrate;
the upper end face of the graphene heat conduction layer is provided with first grooves which are arranged in a grid-shaped crossed manner, and the lower end face of the graphene heat conduction layer is provided with second grooves which are arranged in a grid-shaped crossed manner;
the first diamond layer is deposited in the first groove, and the second diamond layer is deposited in the second groove;
the thickness ratio of the carbon heat conduction sheet layer to the first diamond layer to the graphene heat conduction layer to the second diamond layer is 2-3:1-2:5-12: 1-2.
As an improvement of the olefinic carbon heat-conducting film applied to the 5G terminal, the metal substrate is a copper, aluminum or titanium foil layer.
As an improvement of the alkene-carbon heat-conducting film applied to the 5G terminal, an insulating layer is arranged on the upper layer of the second diamond layer, and the insulating layer is one of a PE polyethylene insulating layer, a heat-conducting silica gel insulating layer or an expanded polytetrafluoroethylene insulating layer.
As an improvement of the alkene-carbon heat-conducting film applied to the 5G terminal, a flame-retardant layer is arranged on the upper layer of the insulating layer, and comprises a polyester layer and a polyamide resin layer.
As an improvement of the alkene-carbon heat-conducting film applied to the 5G terminal, the thickness ratio of the insulating layer, the flame-retardant layer and the graphene heat-conducting film is 1-2:1-2: 4-6.
As an improvement of the olefinic carbon thermal conductive film applied to a 5G terminal, according to the present invention, a surface of the metal substrate in contact with the nanocarbon layer is provided with first protrusions and second protrusions, the first protrusions and the second protrusions have a gap therebetween, and the first protrusions and the second protrusions are alternately arranged, wherein a ratio of a height of the first protrusions to a height of the second protrusions is 1.3-1.5: 1-1.2.
As an improvement of the alkene-carbon heat conduction film applied to the 5G terminal, the tops of the first protrusions and the second protrusions are both in an arc structure, and the radian is 15-30 degrees.
As an improvement of the alkene-carbon heat-conducting film applied to the 5G terminal, the alkene-carbon heat-conducting film has 90-108.5 dB of shielding effectiveness on 500MHz wave intensity.
As an improvement of the alkene carbon heat-conducting film applied to the 5G terminal, the alkene carbon heat-conducting film has a thermal diffusion coefficient of 1200mm2/s-1500mm2And the thermal conductivity coefficient of the alkene-carbon thermal conductive film is 1200W/(mK) -1500W/(mK).
As an improvement of the alkene-carbon heat-conducting film applied to the 5G terminal, the tensile strength of the alkene-carbon heat-conducting film is 17-20MPa, and the elongation at break of the alkene-carbon heat-conducting film is 3.8-4.5%.
The invention has the beneficial effects that: the invention provides an alkene-carbon heat-conducting film applied to a 5G terminal, which sequentially comprises a carbon heat-conducting sheet layer, a first diamond layer, a graphene heat-conducting layer and a second diamond layer from bottom to top; the carbon heat conduction sheet layer comprises a metal substrate and a nano carbon layer arranged on the upper surface of the metal substrate; the upper end face of the graphene heat conduction layer is provided with first grooves which are arranged in a grid-shaped crossed manner, and the lower end face of the graphene heat conduction layer is provided with second grooves which are arranged in a grid-shaped crossed manner; the first diamond layer is deposited in the first groove, and the second diamond layer is deposited in the second groove; the thickness ratio of the carbon heat conduction sheet layer to the first diamond layer to the graphene heat conduction layer to the second diamond layer is 2-3:1-2:5-12: 1-2. Wherein, the carbon heat-conducting sheet layer can reduce the thermal contact resistance generated between the surface of the heat source and the contact surface of the heat dissipation device, the carbon heat-conducting sheet layer can well fill the gap of the contact surface, because air is a poor heat conductor and can seriously obstruct the heat transfer between the contact surfaces, the carbon heat-conducting sheet layer is additionally arranged to extrude the air out of the contact surfaces, the reaction at temperature can reach the temperature difference as small as possible, the integral heat transfer efficiency of the graphene heat-conducting film is greatly improved, meanwhile, the external electromagnetic wave generates eddy current on the metal substrate of the carbon heat conducting sheet, so that the interference of the external electromagnetic wave on electronic elements in the electronic information product can be effectively shielded, the diamond layers are arranged at the upper end and the lower end of the graphene heat conduction layer, so that the overall heat transfer efficiency of the graphene heat conduction film is improved, the heat diffusion coefficient, the heat conduction performance and the like of the graphene heat conduction film are improved, and the heat dissipation requirements of 5G high-energy-consumption equipment are met.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of a graphene thermal conduction layer according to the present invention.
Wherein: 1-a carbon thermally conductive sheet layer; 11-a metal substrate; 12-a nano-carbon layer; 2-a first diamond layer; 3-a graphene heat conducting layer; 31-a first groove; 32-a second groove; 4-a second diamond layer; 5-an insulating layer; 6-a flame retardant layer; 7-a first protrusion; 8-second projection.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
As shown in fig. 1-2, the alkene-carbon thermal conductive film applied to a 5G terminal provided in this embodiment sequentially includes, from bottom to top, a carbon thermal conductive sheet layer 1, a first diamond layer 2, a graphene thermal conductive layer 3, and a second diamond layer 4; the carbon heat conduction sheet layer 1 comprises a metal substrate 11 and a nano carbon layer 12 arranged on the upper surface of the metal substrate 11; the upper end face of the graphene heat conduction layer 3 is provided with first grooves 31 which are arranged in a grid-shaped crossed manner, and the lower end face of the graphene heat conduction layer 3 is provided with second grooves 32 which are arranged in a grid-shaped crossed manner; the first diamond layer 2 is deposited in the first groove 31, and the second diamond layer 4 is deposited in the second groove 32; the thickness ratio of the carbon heat-conducting sheet layer 1, the first diamond layer 2, the graphene heat-conducting layer 3 and the second diamond layer 4 is 2: 1:6: 1. Wherein, because the air is a bad conductor of heat, can hinder the transmission of heat among the contact surface seriously, and install the carbon heat conduction lamellar 1 between heat source and radiator and can push the air out of the contact surface, the reaction on the temperature can reach the temperature difference as small as possible, has greatly improved the whole heat transfer efficiency of the graphene heat conduction membrane, the carbon heat conduction lamellar 1 can reduce the contact thermal resistance produced between heat source surface and the contact surface of the heat dissipating device, the upper and lower surfaces of graphene heat conduction layer 3 have first recess 31 and second recess 32, first diamond layer 2 and second diamond layer 4 are deposited in first recess 31 and second recess 32 respectively, this kind of structural design, improve the heat-conducting property of the graphene heat conduction layer 3 on the whole, thus has improved the thermal conductivity coefficient, thermal diffusivity, tensile strength, bending strength, etc. performance of the carbon heat conduction membrane, can meet the high heat-dissipating demand of the 5G electronic equipment, the service life of the electronic equipment is prolonged, and the use cost is reduced.
Preferably, the metal substrate 11 is a copper, aluminum or titanium foil layer. The foil layer that metal such as copper, aluminium and titanium made has high heat conductivility, can strengthen alkene carbon thermal conductive film's coefficient of heat conductivity, strengthens alkene carbon thermal conductive film's compliance and ductility, and the handling ease and the transportation of curling packing have fine electromagnetic interference resistance effect simultaneously, and outside electromagnetic wave forms the electric vortex on 11 surfaces of metal substrate, effectively avoids the interference of external electromagnetism to the inside source of generating heat.
Example 2
Different from embodiment 1, the second diamond layer 4 of this embodiment is provided with an insulating layer 5 on the upper layer, and the insulating layer 5 is one of a PE polyethylene insulating layer, a heat conductive silica gel insulating layer, or an expanded polytetrafluoroethylene insulating layer. Insulating layer 5 and second diamond layer 4 are glued through an adhesion in ultra-temperature heat conduction glue, polyethylene glue, organosilicon heat conduction glue or epoxy AB glue, and insulating layer 5's thickness is 0.02 ~ 0.05mm, can effectively play insulating, high temperature resistant and wear-resisting effect, reinforcing alkene carbon heat conduction membrane's performance.
The rest is the same as embodiment 1, and the description is omitted here.
Example 3
Different from the embodiment 2, the flame retardant layer 6 is arranged on the upper layer of the insulating layer 5 in the embodiment, the flame retardant layer 6 comprises a polyester layer and a polyamide resin layer, and the thickness ratio of the insulating layer to the flame retardant layer to the graphene heat conducting layer is 1-2:1-2: 4-6. Insulating layer 5 passes through the ultra-temperature heat conduction glue with fire-retardant layer 6, the polyethylene is glued, an adhesion in organosilicon heat conduction glue or the epoxy AB glue, fire-retardant layer 6's thickness is 0.02 ~ 0.05mm, polyester and amide resin have high temperature resistant, corrosion-resistant, oil resistance, shock resistance and processing property advantage such as good, through this kind of structural design, insulating layer 5 and fire-retardant layer 6 cooperation, make the alkene carbon heat conduction membrane reach fire-retardant insulating effectual advantage, it does not possess fire-retardant insulating effect ability to have solved current graphite alkene heat conduction membrane in the use, the phenomenon of having avoided the easy burning of graphite alkene heat conduction membrane takes place, the life of graphite alkene heat conduction membrane has been prolonged simultaneously, use cost is reduced.
The rest is the same as embodiment 2, and the description is omitted here.
Example 4
Unlike embodiment 3, the surface of the metal base 11 in contact with the nanocarbon layer 12 of the present embodiment is provided with first protrusions 7 and second protrusions 8, the first protrusions 7 and the second protrusions 8 have a space therebetween, and the first protrusions 7 and the second protrusions 8 are alternately arranged, and the ratio of the height of the first protrusions 7 to the height of the second protrusions 8 is 1.3 to 1.5: 1-1.2, the tops of the first bulge 7 and the second bulge 8 are both provided with arc structures, and the radian is 15-30 degrees. This kind of structural design makes graphite alkene heat conduction membrane have good heat conductivility, has improved graphite alkene heat conduction membrane's thermal capacity and heat accumulation ability, satisfies high power consumption electronic equipment's heat dissipation demand, and metal substrate 11 is provided with interval first arch 7 and the second arch 8 of alternate arrangement simultaneously, can effectively scatter partial electromagnetic wave, reduces the interference of electromagnetic wave.
The rest is the same as embodiment 3, and is not described herein.
Example 5
Different from embodiment 4, in embodiment 5, the thickness ratio of the carbon heat-conducting sheet layer 1, the first diamond layer 2, the graphene heat-conducting layer 3, and the second diamond layer of the alkene-carbon heat-conducting film applied to a 5G terminal is 3: 2:12: 2; the thickness ratio of the insulating layer 5, the flame-retardant layer 6 and the graphene heat conduction layer 3 is 2:2: 6.
The rest is the same as embodiment 4, and the description is omitted here.
Example 6
Different from embodiment 5, in embodiment 6, the thickness ratio of the carbon heat-conducting sheet layer 1, the first diamond layer 2, the graphene heat-conducting layer 3, and the second diamond layer of the alkene-carbon heat-conducting film applied to a 5G terminal is 2: 1:8: 1; the thickness ratio of the insulating layer 5, the flame-retardant layer 6 and the graphene heat conduction layer 3 is 1:1: 5.
The rest is the same as embodiment 5, and the description is omitted here.
The olefinic carbon heat-conducting films of examples 1 to 6 were subjected to performance tests, and the test results are shown in table 1:
TABLE 1
Figure 812832DEST_PATH_IMAGE001
As can be seen from the test results in Table 1, the shielding effectiveness of the olefinic carbon thermal conductive film provided by the present application to 500MHz wave is 90-108.5 dB, and the thermal diffusion coefficient of the olefinic carbon thermal conductive film can reach 1500mm2And/s, the thermal conductivity coefficient of the alkene-carbon thermal conductive film can reach 1500W/(m.K), the tensile strength of the alkene-carbon thermal conductive film is 17-20MPa, and the elongation at break of the alkene-carbon thermal conductive film is 3.8-4.5%. This shows that the alkene carbon heat conduction membrane of this application has better heat conduction heat dispersion, electromagnetic shielding effectiveness and good tensile strength.
This application is through the surface design to graphite alkene heat-conducting layer 3, it has structural design such as diamond layer to fill, make alkene carbon heat-conducting membrane have good heat conductivility and tensile strength, make it have good processing technology nature, alkene carbon heat-conducting membrane has excellent heat diffusion characteristic, and its coefficient of heat conductivity can reach 1500W/(m K), contrast ordinary artifical graphite membrane, it is provided with the groove structure of netted range, the recess intussuseption is filled with the diamond layer, the heat conduction passageway increases several times, its radiating efficiency is far higher than present artifical graphite fin. The metal substrate is arranged, so that the olefinic carbon heat-conducting film has good flexibility and diamagnetism, and has good reprocessing performance, and can be compounded with other thin film materials such as PET and the like according to purposes.
Further, as can be seen from comparison between examples 3 and 4, by providing the first protrusions 7 and the second protrusions 8 on the surface of the metal base 11 in contact with the nanocarbon layer 12 with a space between the first protrusions 7 and the second protrusions 8 and arranging the first protrusions 7 and the second protrusions 8 alternately, the ratio of the height of the first protrusions 7 to the height of the second protrusions 8 is 1.3 to 1.5: 1-1.2, the tops of the first protrusion 7 and the second protrusion 8 are both designed into arc structures, the radian is 15-30 degrees, and the structural design can effectively reflect electromagnetic waves on the surface of the metal substrate 11, so that the electromagnetic waves are reflected back and forth between the first protrusion 7 and the second protrusion 8 with different heights, partial electromagnetic waves are absorbed, and meanwhile, current vortexes are formed on the surface of the metal substrate 11, and the effect of shielding external electromagnetic interference can be effectively achieved.
Variations and modifications to the above-described embodiments may also occur to those skilled in the art, which fall within the scope of the invention as disclosed and taught herein. Therefore, the present invention is not limited to the above-mentioned embodiments, and any obvious improvement, replacement or modification made by those skilled in the art based on the present invention is within the protection scope of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims (10)

1. The utility model provides an olefinic carbon heat conduction membrane for 5G terminal which characterized in that: the carbon heat conduction layer, the first diamond layer, the graphene heat conduction layer and the second diamond layer are sequentially arranged from bottom to top;
the carbon heat conduction sheet layer comprises a metal substrate and a nano carbon layer arranged on the upper surface of the metal substrate;
the upper end face of the graphene heat conduction layer is provided with first grooves which are arranged in a grid-shaped crossed manner, and the lower end face of the graphene heat conduction layer is provided with second grooves which are arranged in a grid-shaped crossed manner;
the first diamond layer is deposited in the first groove, and the second diamond layer is deposited in the second groove;
the thickness ratio of the carbon heat conduction sheet layer to the first diamond layer to the graphene heat conduction layer to the second diamond layer is 2-3:1-2:5-12: 1-2.
2. The olefinic carbon thermal conductive film according to claim 1, wherein: the metal substrate is a copper, aluminum or titanium foil layer.
3. The olefinic carbon thermal conductive film according to claim 1, wherein: the second diamond layer upper strata is provided with the insulating layer, the insulating layer is one of PE polyethylene insulating layer, heat conduction silica gel insulating layer or expanded polytetrafluoroethylene insulating layer.
4. The olefinic carbon thermal conductive film according to claim 3, wherein: the insulating layer upper strata is provided with fire-retardant layer, fire-retardant layer includes polyester layer and polyamide resin layer.
5. The olefinic carbon thermal conductive film according to claim 4, wherein: the thickness ratio of the insulating layer to the flame-retardant layer to the graphene heat-conducting layer is 1-2:1-2: 4-6.
6. The olefinic carbon thermal conductive film according to claim 1, wherein: the surface of the metal substrate, which is in contact with the nano carbon layer, is provided with first protrusions and second protrusions, intervals are arranged between the first protrusions and the second protrusions, the first protrusions and the second protrusions are arranged alternately, and the ratio of the height of the first protrusions to the height of the second protrusions is 1.3-1.5: 1-1.2.
7. The olefinic carbon thermal conductive film according to claim 6, wherein: the tops of the first protrusions and the second protrusions are both in arc structures, and the radian is 15-30 degrees.
8. The olefinic carbon thermal conductive film according to claim 1, wherein: the shielding effectiveness of the alkene-carbon heat-conducting film on 500MHz wave intensity is 90-108.5 dB.
9. The olefinic carbon thermal conductive film according to claim 1, wherein: the thermal diffusion coefficient of the alkene-carbon heat-conducting film is 1200mm2/s-1500mm2And the thermal conductivity coefficient of the alkene-carbon thermal conductive film is 1200W/(mK) -1500W/(mK).
10. The olefinic carbon thermal conductive film according to claim 1, wherein: the tensile strength of the alkene-carbon heat-conducting film is 17-20MPa, and the elongation at break of the alkene-carbon heat-conducting film is 3.8-4.5%.
CN202011210038.3A 2020-11-03 2020-11-03 Be applied to alkene carbon heat conduction membrane at 5G terminal Pending CN112406212A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011210038.3A CN112406212A (en) 2020-11-03 2020-11-03 Be applied to alkene carbon heat conduction membrane at 5G terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011210038.3A CN112406212A (en) 2020-11-03 2020-11-03 Be applied to alkene carbon heat conduction membrane at 5G terminal

Publications (1)

Publication Number Publication Date
CN112406212A true CN112406212A (en) 2021-02-26

Family

ID=74827469

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011210038.3A Pending CN112406212A (en) 2020-11-03 2020-11-03 Be applied to alkene carbon heat conduction membrane at 5G terminal

Country Status (1)

Country Link
CN (1) CN112406212A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114613609A (en) * 2022-03-30 2022-06-10 安徽碳华新材料科技有限公司 Alkene-carbon composite material for surface heat dissipation of super battery
CN114801357A (en) * 2022-04-28 2022-07-29 安徽碳华新材料科技有限公司 Heat radiation structure for integrated chip based on film-like artificial graphite sheet

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114613609A (en) * 2022-03-30 2022-06-10 安徽碳华新材料科技有限公司 Alkene-carbon composite material for surface heat dissipation of super battery
CN114613609B (en) * 2022-03-30 2023-12-08 安徽碳华新材料科技有限公司 Allyl carbon composite material for super battery surface heat dissipation
CN114801357A (en) * 2022-04-28 2022-07-29 安徽碳华新材料科技有限公司 Heat radiation structure for integrated chip based on film-like artificial graphite sheet
CN114801357B (en) * 2022-04-28 2024-02-09 安徽碳华新材料科技有限公司 Heat radiation structure for integrated chip based on film-shaped artificial graphite sheet

Similar Documents

Publication Publication Date Title
CN112406212A (en) Be applied to alkene carbon heat conduction membrane at 5G terminal
CN102573417B (en) Shell structure and electronic device having the same
CN112455038A (en) High heat conduction power graphite film
CN206547250U (en) A kind of radiating graphite flake with electro-magnetic screen function
CN207820461U (en) High heat conduction, high electromagnetic shielding copper mesh enhance the compound foam of graphite
CN111935964B (en) Directional heat conduction belt
CN211352977U (en) Wave absorbing plate for shielding electromagnetic interference
CN210535228U (en) Display module and display screen
CN209461203U (en) A kind of cable of fire-proof damage-proof
CN208241926U (en) A kind of light-duty composite heating cable of graphene
CN206341549U (en) One kind radiating graphite flake
CN206611702U (en) A kind of radiating structure based on composite stone layer of ink
CN213187075U (en) Heat conduction shielding film
CN215069398U (en) Air conditioner wire and cable convenient to heat dissipation
JP2020057507A (en) Heat dissipation structure and battery
CN211129871U (en) Heat dissipation device and helmet using same
CN114793411A (en) Composite heat conduction structure with flame retardance and heat conduction performance
CN207742976U (en) It is resistance to be thermally integrated robotically-driven control line
JPWO2005083783A1 (en) Heat dissipation sheet
CN215850022U (en) Graphite flake composite heat dissipation material for electronic product
CN109257868A (en) A kind of electronic equipment
CN218826334U (en) High-temperature-resistant flame-retardant cable
CN217694154U (en) Heat conducting sheet and electronic product
CN209824292U (en) High heat conduction heat dissipation graphite flake
CN215819213U (en) High heat conduction shielding structure

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination