CN112382587A - Semiconductor packaging equipment - Google Patents
Semiconductor packaging equipment Download PDFInfo
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- CN112382587A CN112382587A CN202011256056.5A CN202011256056A CN112382587A CN 112382587 A CN112382587 A CN 112382587A CN 202011256056 A CN202011256056 A CN 202011256056A CN 112382587 A CN112382587 A CN 112382587A
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- sliding
- workbench
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 238000007599 discharging Methods 0.000 claims abstract description 26
- 230000000712 assembly Effects 0.000 claims abstract description 15
- 238000000429 assembly Methods 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims description 19
- 230000005540 biological transmission Effects 0.000 description 16
- 239000003292 glue Substances 0.000 description 7
- 230000009471 action Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention discloses semiconductor packaging equipment, which belongs to the technical field of semiconductor packaging and comprises a workbench, two layers of rotating assemblies, a fixing assembly, an automatic feeding assembly, a dispensing assembly and an automatic discharging assembly, wherein the rotating assemblies are arranged on the workbench, the fixing assembly is provided with a plurality of groups, the fixing assemblies are respectively arranged on the working ends of the rotating assemblies, the automatic feeding assembly is fixedly arranged at one end of the workbench, the working end of the automatic feeding assembly is arranged above the fixing assembly, the dispensing assembly is fixedly arranged on the workbench, the working end of the dispensing assembly is arranged above the fixing assembly, the automatic discharging assembly is fixedly arranged at the other end of the workbench, and automatic feeding, discharging and dispensing treatment can be carried out on a semiconductor through the matching of the assemblies, the efficiency and the quality of processing have been improved.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to semiconductor packaging equipment.
Background
The conductor is a substance with conductivity between the insulator and the conductor, and the conductivity of the conductor is easy to control and can be used as an element material for information processing. Semiconductors are very important from the viewpoint of technological or economic development. The core elements of many electronic products, such as computers, mobile phones, and digital recorders, utilize the conductivity change of semiconductors to process information. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications.
In order to prevent the semiconductor device from short circuit caused by falling dust in the using process of the semiconductor device, a protective film is coated on the surface of the semiconductor in the production process. On one hand, the device is isolated from the outside so as to prevent the electric performance from being reduced due to the corrosion of impurities in the air to a device circuit; on the other hand, the packaged device is more convenient to install and transport. The existing semiconductor packaging equipment has low efficiency and poor packaging effect.
Disclosure of Invention
It is an object of the present invention to provide a semiconductor packaging apparatus that overcomes the above-mentioned deficiencies.
The invention provides semiconductor packaging equipment which comprises a workbench, a rotating assembly, a fixing assembly, an automatic feeding assembly, a dispensing assembly and an automatic discharging assembly, wherein the workbench is provided with two layers, the rotating assembly is arranged on the workbench, the fixing assembly is provided with a plurality of groups, the fixing assemblies are respectively arranged on the working ends of the rotating assembly, the automatic feeding assembly is fixedly arranged at one end of the workbench, the working end of the automatic feeding assembly is arranged above the fixing assembly, the dispensing assembly is fixedly arranged on the workbench, the working end of the dispensing assembly is arranged above the fixing assembly, the automatic discharging assembly is fixedly arranged at the other end of the workbench, and the working end of the automatic discharging assembly is positioned above the fixing assembly;
the automatic feeding assembly comprises a first supporting column, a second supporting column, a power part and a pushing part, the first supporting column is fixedly arranged on the workbench, the pushing part is fixedly arranged on the first supporting column, the second supporting column is provided with two supporting columns, the two supporting columns are arranged on the workbench at intervals, and the power part is fixedly arranged on the second supporting column.
Further, the power component comprises a first mounting box body, a second rotating motor, a third gear, a fourth gear, a second rotating shaft, a sliding column and a sliding plate, wherein the first mounting box body is fixedly arranged on the second supporting column, one side of the first mounting box body is hollow, the second rotating motor is fixedly arranged on one side outside the first mounting box body, an output shaft of the second rotating motor penetrates through the first mounting box body, the second rotating shaft is rotatably arranged on the first mounting box body, one end of the second rotating shaft extends into the first mounting box body, the third gear is fixedly arranged on the output shaft of the second rotating motor, the fourth gear is fixedly arranged on the extending end of the second rotating shaft, the third gear and the fourth gear are mutually meshed, the sliding plate is fixedly arranged on one side of the fourth gear, and an annular groove is formed in the sliding plate, one end of the sliding column is fixedly arranged in the annular groove on the sliding plate.
Further, the pushing component comprises a feeding plate, a moving block, a pushing rod and a connecting block, the feeding plate is T-shaped and is provided with a feeding hole, a discharging hole and a pushing hole, the feeding plate is fixedly arranged on the first supporting column, the discharging hole in the feeding plate is located above the fixing component, the moving block is arranged in the feeding plate in a sliding mode, one end of the pushing rod is fixedly connected with the moving block, the other end of the pushing rod is fixedly connected with the connecting block, a moving groove is formed in the connecting block, the other end of the sliding column is arranged in the moving groove of the connecting block in a sliding mode, and a semiconductor needing to be packaged is placed into the feeding hole of the feeding plate.
Compared with the prior art, the invention has the beneficial effects that:
one is as follows: the automatic blanking device is provided with the workbench, the rotating assembly, the fixing assemblies, the automatic feeding assembly, the dispensing assembly and the automatic blanking assembly, wherein the rotating assembly is used for driving the plurality of groups of fixing assemblies to rotate, the automatic feeding assembly is used for replacing manual work to carry out automatic blanking, the plurality of groups of fixing assemblies are used for placing semiconductors to be processed, the dispensing assembly is used for dispensing the semiconductors, the automatic blanking assembly is used for replacing manual blanking for the semiconductors after dispensing, automatic feeding, discharging and dispensing can be carried out on the semiconductors through the matching of the assemblies, and a full-automatic processing mode is adopted, so that the processing efficiency and quality are improved.
The second step is as follows: according to the automatic feeding assembly, the second rotating motor rotates to drive the third gear connected with the automatic feeding assembly to rotate, the third gear rotates to drive the fourth gear meshed with the third gear to rotate under the action of the second rotating shaft, the fourth gear rotates to drive the sliding plate to rotate, the sliding plate rotates to drive the sliding column connected with the sliding plate to rotate, the sliding column drives the connecting block to reciprocate, the connecting block drives the pushing rod connected with the connecting block to move, and the pushing rod drives the moving block connected with the pushing rod to move so as to push a semiconductor at the feeding port to the discharging port.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a perspective view of the rotary assembly of the present invention;
FIG. 3 is a perspective view of the fixing assembly of the present invention;
FIG. 4 is a cross-sectional view of the automatic feeding assembly of the present invention;
FIG. 5 is a schematic perspective view of a dispensing assembly according to the present invention;
FIG. 6 is a first schematic perspective view of an automatic blanking assembly according to the present invention;
fig. 7 is a schematic perspective view of the automatic blanking assembly of the present invention.
Reference numerals:
the automatic feeding device comprises a workbench 1, a rotating assembly 2, a fixing assembly 3, an automatic feeding assembly 4, a dispensing assembly 5, an automatic discharging assembly 6, a first rotating motor 21, a first gear 22, a second gear 23, a rotating disc 24, a first rotating shaft 25, a cylinder 31, a pushing plate 32, a placing block 33, a placing groove 331, a first supporting column 41, a second supporting column 42, a power part 43, a pushing part 44, a first mounting box 431, a second rotating motor 432, a third gear 433, a fourth gear 434, a second rotating shaft 435, a sliding column 436, a sliding plate 437, an annular groove 4371, a feeding plate 441, a moving block 442, a pushing rod 443, a connecting block 444, a moving groove 4441, a first mounting plate 51, a lifting part 52, a dispensing machine 53, a second mounting box 521, a first driving motor 522, a first helical gear 523, a second helical gear 524, a first driving shaft, a rotating screw 526, a screw groove 527, a second mounting plate 528, a dispensing machine 53, the lifting rod 529, the motor mounting plate 61, the second transmission motor 62, the third support plate 63, the rotating disc 64, the first connecting rod 65, the second connecting rod 66, the blanking plate 67, the sliding block 68, the connecting rod 69, the suction cup 610, the buffer spring 611, the moving column 612, the finished product placing groove 613, the trapezoidal groove 671, the L-shaped sliding groove 672 and the inclined groove 681.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 7, an embodiment of the present invention provides a semiconductor packaging apparatus, including a workbench 1, a rotating assembly 2, a fixing assembly 3, an automatic feeding assembly 4, a dispensing assembly 5, and an automatic discharging assembly 6, where the workbench 1 is provided with two layers, the rotating assembly 2 is disposed on the workbench 1, the fixing assembly 3 is provided with a plurality of groups, the fixing assemblies 3 are respectively disposed on working ends of the rotating assembly 2, the automatic feeding assembly 4 is fixedly disposed at one end of the workbench 1, a working end of the automatic feeding assembly 4 is disposed above the fixing assembly 3, the dispensing assembly 5 is fixedly disposed on the workbench 1, a working end of the dispensing assembly 5 is disposed above the fixing assembly 3, the automatic discharging assembly 6 is fixedly disposed at the other end of the workbench 1, and a working end of the automatic discharging assembly 6 is located above the fixing assembly 3, rotating assembly 2 is used for driving fixed subassembly 3 of a plurality of groups to carry out rotary processing, automatic feeding subassembly 4 is used for replacing the manual work and carries out automatic unloading, fixed subassembly 3 of a plurality of groups is used for placing the semiconductor that needs processing, it is used for gluing semiconductor to point dumpling subassembly, automatic unloading subassembly 6 is used for replacing artifical unloading to the semiconductor that the point was glued and is handled, cooperation through between each subassembly can carry out automatic unloading and the point processing of gluing to semiconductor, adopt full automatic processing mode, the efficiency and the quality of processing have not only been improved, also liberated artifical work.
The rotating assembly 2 comprises a first rotating motor 21, a first gear 22, a second gear 23, a rotating disc 24 and a first rotating shaft 25, the first rotating motor 21 is fixedly arranged on the lower layer of the workbench 1, an output shaft of the first rotating motor 21 penetrates through the upper layer of the workbench 1, the first rotating motor 21 is used as the power of the rotating assembly 2, the first rotating shaft 25 is rotatably arranged on the workbench 1, one end of the first rotating shaft 25 extends out of the workbench 1, the first gear 22 is fixedly arranged on the output shaft of the first rotating motor 21, the second gear 23 is fixedly arranged on the first rotating shaft 25, the first gear 22 and the second gear 23 are mutually meshed, the rotating disc 24 is fixedly arranged on the extending end of the first rotating shaft 25, and the rotating disc 24 is used for mounting a plurality of groups of fixing assemblies 3 for rotating operation, rotate through first rotating electrical machines 21 and drive the rotation rather than the first gear 22 who is connected, first gear 22 rotates and drives rather than being connected second gear 23 and rotate, second gear 23 rotates and drives rather than the first axis of rotation 25 rotation of being connected, first axis of rotation 25 rotates and drives and rotate rather than the rolling disc 24 who is connected, rolling disc 24 rotates and drives a plurality of fixed subassemblies 3 of group and carry out rotatory operation, can carry out rotary processing to a plurality of semiconductor simultaneously, the efficiency of great improvement processing.
Each group of the fixing assemblies 3 comprises an air cylinder 31, a pushing plate 32 and a placing block 33, the air cylinder 31 is fixedly arranged below the rotating disc 24, the output end of the air cylinder 31 penetrates through the rotating disc 24, the placing block 33 is fixedly arranged above the rotating disc 24, a placing groove 331 is formed in the placing block 33, the placing groove 331 is the same as a semiconductor in size, the pushing plate 32 is slidably arranged in the placing groove 331 of the placing block 33, the pushing plate 32 is connected with the output end of the air cylinder 31, the pushing plate 32 is pushed and driven by an output rod of the air cylinder 31 to move, and materials can be taken more conveniently.
Automatic material loading subassembly 4 includes first support column 41, second support column 42, power part 43 and pushing member 44, first support column 41 is fixed to be set up on workstation 1, pushing member 44 is fixed to be set up on first support column 41, second support column 42 is equipped with two, two second support column 42 interval sets up on workstation 1, power part 43 is fixed to be set up two on the second support column 42.
The power part 43 includes a first mounting case 431 fixedly provided on the second support column 42, a second rotary motor 432 having a hollow side of the first mounting case 431, a third gear 433, a fourth gear 434, a second rotary shaft 435, a sliding column 436, and a sliding plate 437, the second rotary motor 432 is fixedly provided on the first mounting case 431 at a side outside the first mounting case 431, and an output shaft of the second rotary motor 432 penetrates the first mounting case 431, the second rotary shaft 435 is rotatably mounted on the first mounting case 431, and one end of the second rotary shaft 435 extends into the first mounting case 431, the third gear 433 is fixedly provided on the output shaft of the second rotary motor 432, the fourth gear 434 is fixedly provided on the extending end of the second rotary shaft 435, the third gear 433 is engaged with the fourth gear 434, the sliding plate 437 is fixedly disposed on one side of the fourth gear 434, an annular groove 4371 is formed in the sliding plate 437, the annular groove 4371 is used for fixing the sliding column 436, one end of the sliding column 436 is fixedly disposed in the annular groove 4371 of the sliding plate 437, the second rotating motor 432 rotates to drive the third gear 433 connected thereto to rotate, the third gear 433 rotates to drive the fourth gear 434 engaged therewith to rotate under the action of the second rotating shaft 435, the fourth gear 434 rotates to drive the sliding plate 437 to rotate, the sliding plate 437 rotates to drive the sliding column 436 connected thereto to rotate, and the sliding column 436 drives the pushing component 44 to reciprocate.
The pushing component 44 includes an upper material plate 441, a moving block 442, a pushing rod 443 and a connecting block 444, the upper material plate 441 is T-shaped, the upper material plate 441 is provided with a feeding port, a discharging port and a pushing port, the upper material plate 441 is fixedly arranged on the first supporting column 41, the discharging port on the upper material plate 441 is positioned above the fixing component 3, the moving block 442 is slidably arranged in the upper material plate 441, the moving block 442 is used for pushing the semiconductor to reach the discharging port of the upper material plate 441 during movement, one end of the pushing rod 443 is fixedly connected with the moving block 442, the other end of the pushing rod 443 is fixedly connected with the connecting block 444, the connecting block 444 is provided with a moving groove 4441, the other end of the sliding column 436 is slidably arranged in the moving groove 4441 of the connecting block 444, the semiconductor to be packaged is placed in the feeding port of the upper material plate 441, and the connecting block 444 connected with the sliding column 436 of the power component 43 is driven, the connecting block 444 drives the push rod 443 connected with the connecting block to move, the push rod 443 drives the moving block 442 connected with the connecting block to move, the semiconductor at the feeding port is pushed to the discharging port, manual automatic feeding can be replaced, manual labor is liberated, and dangers encountered in the machining process are avoided.
The subassembly 5 is glued to point includes first mounting panel 51, lifting means 52 and point gum machine 53, first mounting panel 51 is L shape, first mounting panel 51 is fixed to be set up on workstation 1, and first mounting panel 51 is located rolling disc 24 side, lifting means 52 is fixed to be set up in the below of first mounting panel 51 one end, and lifting means 52 is located the top of fixed subassembly 3, the fixed setting of point gum machine 53 is served at the work of lifting means 52.
The lifting member 52 includes a second mounting case 521, a first driving motor 522, a first bevel gear 523, a second bevel gear 524, a first driving shaft 525, a rotating screw 526, a screw groove 527, a second mounting plate 528, and a lifting lever 529, the second mounting case 521 is fixedly disposed below one end of the first mounting plate 51, the first driving motor 522 is fixedly disposed on one side outside the second mounting case 521, and an output end of the first driving motor 522 extends into the second mounting case 521, the first driving shaft 525 is rotatably mounted on the second mounting case 521, and both ends of the first driving shaft 525 extend out of the second mounting case 521, the first bevel gear 523 is fixedly disposed on an output shaft of the first driving motor, the second bevel gear 524 is fixedly disposed on one end of the first driving shaft 525, the first bevel gear 523 and the second bevel gear 524 are engaged with each other, one end of the rotary screw 526 is fixedly arranged at the other end of the first transmission shaft 525, the screw groove 527 is rotatably arranged at the other end of the rotary screw 526, the second mounting plate 528 is fixedly arranged at the other end of the screw groove 527, two lifting rods 529 are arranged, the two lifting rods 529 are respectively and fixedly arranged between the second mounting box 521 and the second mounting plate 528, the two lifting rods 529 are used for guiding, the first bevel gear 523 connected with the first lifting rods is driven to rotate through the rotation of the first transmission motor 522, the first bevel gear 523 drives the second bevel gear 524 meshed with the first bevel gear to rotate, the second bevel gear 524 drives the first transmission shaft 525 connected with the second bevel gear to rotate, the first transmission shaft 525 drives the rotary screw 526 connected with the first transmission shaft to lift in the screw groove 527, so that the lifting of the dispensing machine 53 can be adjusted to reach the optimal position, so that the dispensing packaging effect is better.
The automatic blanking assembly 6 comprises a motor mounting plate 61, a second transmission motor 62, a third support plate 63, a rotating disc 64, a first connecting rod 65, a second connecting rod 66, a blanking plate 67, a sliding block 68, a sliding column 436, a suction cup 610, a buffer spring 611, a moving column 612 and a finished product placing groove 613, wherein the motor mounting plate 61 is fixedly arranged on the workbench 1, the second transmission motor 62 is fixedly arranged on one side of the motor mounting plate 61, the output end of the second transmission motor 62 penetrates through the motor mounting plate 61, the third support plate 63 is fixedly arranged on the workbench 1, the blanking plate 67 is fixedly arranged on the third support plate 63, a trapezoidal groove 671 and an L-shaped sliding groove 672 are arranged on the blanking plate 67, the sliding block 68 is trapezoidal, a chute is arranged on one side of the sliding block 68, the sliding block 68 is slidably arranged in the trapezoidal groove 671 of the blanking plate 67, one end of the sliding column 436 is round and the other end is rectangular, the sliding column 436 is slidably disposed in the L-shaped sliding groove 672 of the lower material plate 67 and the inclined groove 681 of the sliding block 68, one end of the moving column 612 is movably disposed on the rectangular end of the sliding column 436, the suction cup 610 is fixedly disposed on the other end of the moving column 612, the buffer spring 611 is disposed between the suction cup 610 and the sliding column 436, the finished product placement groove 613 is fixedly disposed on the workbench 1, the finished product placement groove 331 is disposed below the suction cup 610, the rotating disc 64 is fixedly disposed on the output shaft of the second transmission motor 62, one end of the first connecting rod 65 is fixedly disposed on the rotating disc 64, the other end of the first connecting rod 65 is rotatably connected with one end of the second connecting rod 66, the other end of the second connecting rod 66 is rotatably connected with one end of the sliding block 68, and the rotating disc 24 connected with the second connecting rod is driven to rotate by the rotation of the second transmission motor 62, the rotating disc 24 rotates to drive the first connecting rod 65 connected with the rotating disc to rotate, the first connecting rod 65 rotates to drive the second connecting rod 66 connected with the first connecting rod to move, the second connecting rod 66 drives the sliding block 68 connected with the second connecting rod to reciprocate in the trapezoidal groove 671 in the blanking plate 67, and the sliding block 68 moves to drive the sliding column 436 connected with the sliding block to move and descend under the action of the inclined groove 681 and the L-shaped groove, so that automatic blanking can be performed instead of manual operation, and the blanking efficiency is higher.
The working principle is as follows: the semiconductor to be packaged is put into the feeding port of the feeding plate 441, the second rotating motor 432 of the automatic feeding component 4 rotates to drive the third gear 433 connected with the feeding port to rotate, the third gear 433 rotates to drive the fourth gear 434 engaged with the third gear to rotate under the action of the second rotating shaft 435, the fourth gear 434 rotates to drive the sliding plate 437 to rotate, the sliding plate 437 rotates to drive the sliding column 436 connected with the sliding plate to rotate, the sliding column 436 drives the connecting block 444 to reciprocate, the connecting block 444 drives the push rod 443 connected with the connecting block to move, the push rod 443 drives the moving block 442 connected with the connecting block to move so as to push the semiconductor at the feeding port to the discharging port, manual automatic feeding can be replaced, manual labor is released, risks encountered in the processing process are avoided, and the first rotating motor 21 of the rotating component 2 rotates to drive the first gear 22 connected with the rotating block to rotate, the first gear 22 rotates to drive the second gear 23 connected with the first gear to rotate, the second gear 23 rotates to drive the first rotating shaft 25 connected with the second gear to rotate, the first rotating shaft 25 rotates to drive the rotating disc 24 connected with the first gear to rotate, the rotating disc 24 rotates to drive a plurality of groups of fixing assemblies 3 to rotate, a plurality of semiconductors can be simultaneously subjected to rotary processing, the processing efficiency is greatly improved, then the first transmission motor 522 of the glue dispensing assembly 5 rotates to drive the first helical gear 523 connected with the glue dispensing assembly to rotate, the first helical gear 523 rotates to drive the second helical gear 524 meshed with the first helical gear to rotate, the second helical gear 524 rotates to drive the first transmission shaft 525 connected with the glue dispensing assembly to rotate, the first transmission shaft 525 rotates to drive the rotating screw 526 connected with the first transmission shaft to lift in the screw groove 527, the lifting of the glue dispensing machine 53 can be adjusted, and the best glue dispensing position can be reached, the glue dispensing packaging effect is better, the second transmission motor 62 of the automatic discharging component 6 rotates to drive the rotating disc 24 connected with the rotating disc to rotate, the rotating disc 24 rotates to drive the first connecting rod 65 connected with the rotating disc to rotate, the first connecting rod 65 rotates to drive the second connecting rod 66 connected with the first connecting rod to move, the second connecting rod 66 drives the sliding block 68 connected with the second connecting rod to reciprocate in the trapezoidal groove 671 on the discharging plate 67, the sliding block 68 moves to drive the sliding column 436 connected with the sliding block to move and descend under the action of the chute 681 and the L-shaped groove, manual automatic discharging can be replaced, discharging efficiency is higher, automatic feeding and discharging and glue dispensing treatment can be carried out on the semiconductor through matching among the components, a full-automatic processing mode is adopted, processing efficiency and quality are improved, and manual labor is liberated.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, those skilled in the art will appreciate that; the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (3)
1. The semiconductor packaging equipment is characterized by comprising a workbench (1), a rotating assembly (2), a fixing assembly (3), an automatic feeding assembly (4), a dispensing assembly (5) and an automatic discharging assembly (6), wherein the rotating assembly (2) is arranged on the workbench (1), the fixing assembly (3) is provided with a plurality of groups, the fixing assemblies (3) are respectively arranged on the working ends of the rotating assembly (2), the automatic feeding assembly (4) is fixedly arranged at one end of the workbench (1), the working end of the automatic feeding assembly (4) is arranged above the fixing assembly (3), the dispensing assembly (5) is fixedly arranged on the workbench (1), the working end of the dispensing assembly (5) is arranged above the fixing assembly (3), the automatic discharging assembly (6) is fixedly arranged at the other end of the workbench (1), the working end of the automatic blanking assembly (6) is positioned above the fixed assembly (3);
automatic material loading subassembly (4) include first support column (41), second support column (42), power part (43) and pushing part (44), first support column (41) are fixed to be set up on workstation (1), pushing part (44) are fixed to be set up on first support column (41), second support column (42) are equipped with two, two second support column (42) interval sets up on workstation (1), power part (43) are fixed to be set up two on second support column (42).
2. A semiconductor package apparatus according to claim 1, wherein the power part (43) comprises a first mounting case (431), a second rotating electrical machine (432), a third gear (433), a fourth gear (434), a second rotating shaft (435), a sliding column (436) and a sliding plate (437), the first mounting case (431) is fixedly provided on the second supporting column (42), one side of the first mounting case (431) is hollow, the second rotating electrical machine (432) is fixedly provided on the side outside the first mounting case (431), and an output shaft of the second rotating electrical machine (432) penetrates the first mounting case (431), the second rotating shaft (435) is rotatably mounted on the first mounting case (431), and one end of the second rotating shaft (435) extends into the first mounting case (431), the third gear (433) is fixedly arranged on an output shaft of the second rotating motor (432), the fourth gear (434) is fixedly arranged on an extending end of the second rotating shaft (435), the third gear (433) is meshed with the fourth gear (434), the sliding plate (437) is fixedly arranged on one side of the fourth gear (434), an annular groove (4371) is formed in the sliding plate (437), and one end of the sliding column (436) is fixedly arranged in the annular groove (4371) in the sliding plate (437).
3. The semiconductor package device according to claim 2, wherein the pushing member (44) includes a feeding plate (441), a moving block (442), a pushing rod (443), and a connecting block (444), the feeding plate (441) having a T-shape, the upper material plate (441) is provided with a feed inlet, a discharge outlet and a pushing opening, the upper material plate (441) is fixedly arranged on the first supporting column (41), and the discharge hole on the upper material plate (441) is positioned above the fixed component (3), the moving block (442) is arranged in the upper material plate (441) in a sliding manner, one end of the push rod (443) is fixedly connected with the moving block (442), the other end of the push rod is fixedly connected with the connecting block (444), a moving groove (4441) is formed in the connecting block (444), and the other end of the sliding column (436) is arranged in the moving groove (4441) of the connecting block (444) in a sliding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011256056.5A CN112382587A (en) | 2020-11-11 | 2020-11-11 | Semiconductor packaging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011256056.5A CN112382587A (en) | 2020-11-11 | 2020-11-11 | Semiconductor packaging equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112382587A true CN112382587A (en) | 2021-02-19 |
Family
ID=74582736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011256056.5A Withdrawn CN112382587A (en) | 2020-11-11 | 2020-11-11 | Semiconductor packaging equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112382587A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093794A (en) * | 2022-01-20 | 2022-02-25 | 武汉飞恩微电子有限公司 | Multi-station rotating disc type chip packaging production line |
-
2020
- 2020-11-11 CN CN202011256056.5A patent/CN112382587A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114093794A (en) * | 2022-01-20 | 2022-02-25 | 武汉飞恩微电子有限公司 | Multi-station rotating disc type chip packaging production line |
| CN114093794B (en) * | 2022-01-20 | 2022-04-19 | 武汉飞恩微电子有限公司 | Multi-station rotating disc type chip packaging production line |
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Application publication date: 20210219 |