CN112333978A - Heat dissipation assembly, electronic equipment and heat dissipation control method - Google Patents
Heat dissipation assembly, electronic equipment and heat dissipation control method Download PDFInfo
- Publication number
- CN112333978A CN112333978A CN202011120075.5A CN202011120075A CN112333978A CN 112333978 A CN112333978 A CN 112333978A CN 202011120075 A CN202011120075 A CN 202011120075A CN 112333978 A CN112333978 A CN 112333978A
- Authority
- CN
- China
- Prior art keywords
- thermoelectric
- heat
- film
- current
- thermoelectric film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/32—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from a charging set comprising a non-electric prime mover rotating at constant speed
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B40/00—Technologies aiming at improving the efficiency of home appliances, e.g. induction cooking or efficient technologies for refrigerators, freezers or dish washers
Abstract
The embodiment of the present application provides a heat dissipation assembly, heat dissipation assembly includes: a heat generating device, a first thermoelectric thin film, and a second thermoelectric thin film; the first thermoelectric film is arranged between the heating device and the second thermoelectric film, the refrigerating end of the first thermoelectric film covers the heating device, and the second thermoelectric film covers the heating end of the first thermoelectric film; the first thermoelectric film is used for absorbing heat generated by the heating device and conducting the heat generated by the heating device to the heating end when power supply current passes through the cooling end; and the second thermoelectric film is used for absorbing the heat of the heat receiving end and outputting the absorbed heat. The embodiment of the application also provides the electronic equipment and a heat dissipation control method.
Description
Technical Field
The present disclosure relates to the field of electronic technologies, and in particular, to a heat dissipation assembly, an electronic device, and a heat dissipation control method.
Background
As the functions of the electronic device are more and more diversified, the power consumption speed of the electronic device is gradually increased, so that the user has higher requirements on the charging speed of the electronic device. Aiming at the existing electronic equipment with the function of quick charging, the power with higher charging current loss can be converted into heat, so that the electronic equipment generates heat seriously.
Disclosure of Invention
The embodiment of the application provides a heat dissipation assembly, electronic equipment and a heat dissipation control method.
The technical scheme of the application is realized as follows:
providing a heat dissipation assembly, the heat dissipation assembly comprising: a heat generating device, a first thermoelectric thin film, and a second thermoelectric thin film;
the first thermoelectric film is arranged between the heating device and the second thermoelectric film, the refrigerating end of the first thermoelectric film covers the heating device, and the second thermoelectric film covers the heating end of the first thermoelectric film;
the first thermoelectric film is used for absorbing heat generated by the heating device and conducting the heat generated by the heating device to the heating end when power supply current passes through the cooling end;
and the second thermoelectric film is used for absorbing the heat of the heat-emitting end and outputting the absorbed heat.
There is provided a heat dissipation control method, which can be applied to the heat dissipation assembly, the method including:
providing a supply current to a first thermoelectric film, so that when the supply current passes through a cooling end of the first thermoelectric film, heat generated by a heating device is absorbed, and the heat generated by the heating device is conducted to the heating end;
and absorbing the heat of the heat-emitting end through the second thermoelectric film, and outputting the absorbed heat.
An electronic device is provided, which comprises a shell and the heat dissipation component; wherein the content of the first and second substances,
the shell is arranged on one side of the heat dissipation assembly, and the shell covers the second thermoelectric film in the heat dissipation assembly;
the shell is used for absorbing heat transferred by the second thermoelectric film and outputting the absorbed heat to the external environment.
The heat dissipation assembly provided by the embodiment of the application comprises: a heat generating device, a first thermoelectric thin film, and a second thermoelectric thin film; the first thermoelectric film is arranged between the heating device and the second thermoelectric film, the refrigerating end of the first thermoelectric film covers the heating device, and the second thermoelectric film covers the heating end of the first thermoelectric film; the first thermoelectric film is used for absorbing heat generated by the heating device and conducting the heat generated by the heating device to the heating end when power supply current passes through the cooling end; the second thermoelectric thin film is used for absorbing heat of the heat-emitting end and outputting the absorbed heat; therefore, the refrigeration end can rapidly absorb the heat generated by the heating device by supplying power to the first thermoelectric film, the temperature of the heating device is reduced, and meanwhile, the heat is conducted to the external environment through the second thermoelectric film. Therefore, the temperature rise of the heating device of the electronic equipment is reduced, the overcurrent capacity of the heating device is improved, and the heating device is prevented from being burnt due to overhigh temperature rise.
Drawings
Fig. 1 is a first schematic structural component diagram of an exemplary heat dissipation assembly according to an embodiment of the present disclosure;
fig. 2 is a schematic structural composition diagram ii of an exemplary heat dissipation assembly according to an embodiment of the present disclosure;
fig. 3 is a schematic structural composition diagram three of an exemplary heat dissipation assembly provided in the embodiment of the present application;
fig. 4 is a schematic structural composition diagram of an exemplary heat dissipation assembly provided in the embodiment of the present application;
fig. 5 is a schematic structural composition diagram five of an exemplary heat dissipation assembly provided in the embodiment of the present application;
fig. 6 is a schematic structural composition diagram six of an exemplary heat dissipation assembly provided in an embodiment of the present application;
fig. 7 is a first schematic structural component diagram of an exemplary electronic device according to an embodiment of the present disclosure;
fig. 8 is a schematic structural composition diagram ii of an exemplary electronic device according to an embodiment of the present application;
fig. 9 is a schematic structural composition diagram three of an exemplary electronic device provided in an embodiment of the present application;
fig. 10 is a schematic structural composition diagram of an exemplary electronic device provided in an embodiment of the present application;
fig. 11 is a schematic structural composition diagram five of an exemplary electronic device provided in an embodiment of the present application;
fig. 12 is a schematic flowchart of an exemplary heat dissipation control method according to an embodiment of the present disclosure.
Detailed Description
So that the manner in which the features and elements of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.
It should be noted that the terms "first", "second", and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
At present, users have high requirements on the charging speed of electronic devices, and the index of the charging speed of the battery is usually charging power, and the power is equal to voltage × current, so the way of increasing the charging speed usually includes two ways of increasing the voltage or the current. For example, the maximum charging power supported by a super fast-charging mobile phone is 120W, and the main technical scheme is to increase the charging power of the mobile phone by connecting a plurality of batteries in series to increase the charging voltage, or increase the charging current to increase the charging power of the mobile phone under the condition that the charging voltage is constant.
Since the rated voltage of the battery is fixed and the charging voltage of the electronic device should not exceed the safe voltage of the human body in view of safety issues, the realization of the rapid charging by increasing the charging voltage is limited, and the realization of the rapid charging by increasing the charging current is not limited.
However, the line loss increases with the increase of the charging current, and according to the law of conservation of energy, the high charging current, the power loss thereof is converted into heat, and the heat is larger and larger, so that the electronic device becomes a hot iron lump. In consideration of the portability of the electronic device, the electronic device cannot increase the charging power in such a manner that the charging current is increased, so that the user cannot experience the effect of faster charging.
In order to solve the above problems in the related art, an embodiment of the present application provides a heat dissipation assembly, as shown in fig. 1, the heat dissipation assembly includes: a heat generating device 11, a first thermoelectric thin film 12, and a second thermoelectric thin film 13.
Here, the heat generating device 11 may include a part of power devices in the heat dissipating assembly, or all of the power devices, for example, the heat generating device 11 may be a power manager, a battery charging and discharging module, a battery assembly, or the like, and the embodiment of the present application does not limit the heat generating device 11 in any way.
In practical application, the thermoelectric film is made of thermoelectric materials, the thermoelectric materials are also called thermoelectric materials, have cross-coupled thermoelectric transmission properties, are novel functional materials with mutual conversion of thermal effect and electric effect, and can directly convert heat energy and electric energy mutually by utilizing the properties of the thermoelectric film.
In the embodiment provided in the present application, the first thermoelectric thin film 12 can perform cooling using the peltier effect. That is, when an external current is applied to the first thermoelectric thin film 12, charges in the first thermoelectric thin film 12 can be moved, and the movement of the charges can generate a cooling effect at one end of the first thermoelectric thin film 12 to absorb heat, and generate a heat dissipation effect at the other end of the first thermoelectric thin film 12 to release heat.
It should be noted that, in the embodiment of the present application, the second thermoelectric film 13 has a different function from the first thermoelectric film 12, and the second thermoelectric film 13 may not be connected to the power supply, and the temperature difference characteristic of the second thermoelectric film itself is utilized to conduct and diffuse heat, that is, the second thermoelectric film does not perform active cooling.
In the embodiment provided herein, the first thermoelectric film 12 includes a cooling side 121 and a heating side 122, and the second thermoelectric film 13 includes a first side 131 and a second side 132 disposed opposite to each other.
The first thermoelectric film 12 is disposed between the heat generating device 11 and the second thermoelectric film 13, the cooling end 121 of the first thermoelectric film 12 covers the heat generating device 11, the second thermoelectric film 13 covers the heating end 122 of the first thermoelectric film 12, and specifically, the first end 131 of the second thermoelectric film 13 covers the heating end of the first thermoelectric film 12.
In the embodiment provided by the present application, the first thermoelectric film 12 is configured to absorb heat generated by the heat generating device 11 when a supply current provided by a power supply passes through the cooling end 121, and to conduct the heat generated by the heat generating device 11 to the heating end 122;
and a second thermoelectric film 13 for absorbing heat of the heat receiving end 122 and outputting the absorbed heat.
That is, the first thermoelectric film 12 may be connected to a power supply source, which supplies a power current to the first thermoelectric film 12. Thus, when the power supply current passes through the cooling end 121 of the first thermoelectric film 12, the heat inside the cooling end 121 can rapidly flow to the heating end 122, and thus, the cooling end 121 can absorb the heat in the surrounding environment to reduce the temperature of the heating device 11 adjacent to the cooling end 121, and ensure that the heating device 11 can normally work.
In the embodiments provided herein, the second end 132 of the second thermoelectric film 13 may be adjacent to the external environment.
The first thermoelectric thin film 12 conducts heat of the cooling side 121 to the heating side by the peltier effect. In addition, the first end 131 of the second thermoelectric film 13 covers the heat emitting end 122, and the second end 132 is adjacent to the external environment, so that there is a large temperature difference between the first end 131 and the second end 132 of the second thermoelectric film 13. The second thermoelectric film 13 can conduct heat from the first end 131 to the second end 132 by using a temperature difference between the first end 131 and the second end 132, and output the heat to the external environment through the second end 132.
It can be understood that in the embodiment of the present application, a double-layer thermoelectric film is used for heat dissipation, specifically, the heat generating device 11 is wrapped by the cooling end 121 of the first thermoelectric film 12, and then the first end 132 of the second thermoelectric film 13 is tightly attached to the heating end 122 of the first thermoelectric film 12; in this way, the cooling side 121 rapidly absorbs the heat generated from the heat generating device 11 by supplying power to the first thermoelectric film 12, and the temperature of the heat generating device 11 is reduced while the heat is conducted to the external environment through the second thermoelectric film 13. Therefore, the temperature rise of the heating device 11 of the electronic equipment is reduced, the overcurrent capacity of the heating device 11 is improved, and the heating device 11 is prevented from being burnt due to overhigh temperature rise.
In the embodiment provided in the present application, the first end 131 of the second thermoelectric film 13 covers the heat emitting end 122, and the second end 132 is adjacent to the external environment, so that after the first end 131 of the second thermoelectric film 13 absorbs heat of the heat emitting end 122, a large temperature difference can be generated between the first end 131 and the second end 132. The second hot spot film 13 is further configured to perform thermoelectric conversion on heat absorbed by the first end based on a temperature difference generated between the first end and the second end, so as to obtain a thermoelectric current.
In practical applications, when the temperatures of different parts of the second thermoelectric thin film 13 are different, electrons in the second thermoelectric thin film 13 will flow along the temperature difference from one end to the other end, thereby generating a thermoelectric current.
Specifically, the first end 131 of the second thermoelectric film 13 is adjacent to the heat generating end 122 of the first thermoelectric film 12, and the first end 131 can absorb heat emitted from the heat generating end 122, so that the temperature near the first end 131 is high; and the second end 132 of the second thermoelectric film 13 is adjacent to the external environment, so the temperature near the second end 132 is low. Based on this, a temperature difference can be formed between the first end 131 and the second end 132 of the second thermoelectric film 13, so that a thermoelectric current can be generated between the second heat emitting end 132 and the second cooling end 131.
In one possible implementation, as shown in fig. 2, the heat dissipation assembly may further include an energy collection module 21; wherein the content of the first and second substances,
the energy collection module 21 is electrically connected with the second thermoelectric thin film 13;
and the energy collecting module 21 is used for acquiring thermoelectric current and providing electric energy to the target electronic component 22 based on the thermoelectric current.
In embodiments provided herein, the thermal current may also be used as a power source to power a target electronic component in an electronic device. Here, the target electronic component 22 may include a battery assembly, the first thermoelectric thin film 12, and the like, and the embodiment of the present application is not limited herein.
Here, the thermoelectric current generated by the second thermoelectric thin film 13 is acquired by the energy collection module 21. Specifically, the energy harvesting module 21 may be electrically connected with the target electronic component 22, and the energy harvesting module 21 transmits the acquired thermal current to the target electronic component 22 to provide electrical energy to the target electronic component 22.
In the embodiment provided by the present application, the first thermoelectric film is powered to enable the cooling end 121 to rapidly absorb heat generated by the heat generating device 11, so as to dissipate heat of the heat generating device 11. Meanwhile, the second thermoelectric film 13 is used for thermoelectric conversion, and the heat energy is collected by the energy collecting circuit 21 to supply power to the target electronic component, so that the charging efficiency of the radiating component is improved.
In one possible implementation, the target electronic component 22 is a battery component.
Based on this, in the heat dissipation assembly provided in the embodiment of the present application, as shown in fig. 3, the heat dissipation assembly may further include: a battery charge and discharge module 31;
the battery charging and discharging module 31 is electrically connected with the energy collecting module 21;
the energy collection module 21 is configured to transmit a thermoelectric current to the battery charging and discharging module 31 after acquiring the thermoelectric current, so that the battery charging and discharging module charges the battery assembly based on the thermoelectric current.
It is understood that the battery charging and discharging module refers to a battery charging and discharging circuit of the battery assembly, and can manage and protect the charging and discharging process of the battery assembly.
Specifically, the battery charge and discharge module 31 is electrically connected to the energy collection module 21 and the battery assembly, so that the battery charge and discharge module 31 can directly store the electric energy generated by the thermal current acquired by the energy collection module 21 in the battery assembly. In this way, the energy collection module 21 collects the electric energy converted by the second thermoelectric film to supply power to the battery assembly, so that the charging efficiency of the battery assembly 32 can be improved.
In another possible implementation, as shown in fig. 4, the battery charge-discharge module 31 may also be connected with the first thermoelectric film 12;
the battery charge and discharge module 31 is used for transmitting the electric energy provided by the battery assembly to the first thermoelectric film 12 to provide a supply current to the first thermoelectric film.
In the embodiment provided by the present application, the battery charge-discharge module 31 may be connected to the first thermoelectric film, and when the battery charge-discharge module 31 may communicate the battery assembly and the first thermoelectric film, the battery assembly may supply power to the first thermoelectric film 12 through the battery charge-discharge module 31, so that the first cooling end 121 of the first thermoelectric film 12 absorbs heat.
Based on the foregoing embodiment, as shown in fig. 5, the heat dissipation assembly in the embodiment of the present application may further include a boost module 51; wherein the content of the first and second substances,
the boosting module 51 is electrically connected with the energy collecting module 21, and the boosting module 51 is used for boosting the voltage corresponding to the thermal current to obtain the boosted thermal current;
the boost module 51 may also be electrically connected to the battery charging and discharging module, and the boost module 51 is further configured to transmit the boosted thermal current to the battery charging and discharging module 31, so that the battery charging and discharging module 31 charges the battery assembly based on the boosted thermal current.
In practical application, the voltage of the thermoelectric current obtained by thermoelectric conversion of the second thermoelectric film 13 is usually smaller than the actual charging requirement of the battery assembly, so that the voltage corresponding to the collected thermoelectric current can be boosted by the boosting module 51, and the boosted thermoelectric current meets the actual charging requirement, so that the charging efficiency of the battery assembly is improved.
In one possible implementation, as shown in fig. 6, the heat sink assembly may further include a microprocessor 61, a temperature sensor 62, and a load switch 63; wherein the content of the first and second substances,
the input end of the microprocessor 61 is electrically connected with the temperature sensor 62;
the output end of the microprocessor 61 is connected with the control input end of the load switch 63; the current input end of the load switch is connected with the battery assembly; the current output end of the load switch is connected with the first thermoelectric film;
the temperature sensor 62 is disposed within a preset range of the heat generating device 11; the temperature sensor 62 is used for acquiring the temperature of the heating device 11 and transmitting the temperature of the heating device 11 to the microprocessor 61;
and the microprocessor 61 is used for controlling the working state of the load switch 63 based on the temperature of the heat generating device 11 so as to adjust the current value of the power supply current provided by the battery assembly to the first thermoelectric film 12, so that the current value of the power supply current is matched with the temperature of the heat generating device 11.
In the embodiment provided by the present application, the temperature sensor 62 is disposed within a predetermined range of the heat generating device 11, where the predetermined range may be a small distance; that is, the temperature sensor 62 may be adjacent to the heat generating device 11 to accurately acquire the real-time temperature of the heat generating device 11.
Here, the microprocessor 61 can monitor the temperature of the heat generating device 11 inside the heat dissipating assembly in real time through the temperature sensor 62, that is, the microprocessor 61 can periodically read the temperature value collected by the temperature sensor 62, and adjust the power supply current of the first thermoelectric film 12 according to the temperature value.
Specifically, when the collected temperature value becomes large, the supply current of the first thermoelectric film 12 may be increased to make the cooling effect of the cooling end 121 of the first thermoelectric film 12 stronger, so as to rapidly reduce the temperature of the heat generating device 11. When the collected temperature value becomes smaller, the supply current of the first thermoelectric film 12 can be reduced, so that the refrigeration effect of the refrigeration end 121 of the first thermoelectric film 12 is matched with the heat generated by the current heat generating device 11, thereby saving energy consumption.
In a possible implementation, the heat dissipation assembly may further include a load switch connected between the first thermoelectric film 11 and its corresponding power supply circuit 63; the microprocessor 61 can adjust the current value of the current supplied from the power supply to the first thermoelectric film 11 by controlling the operating state of the load switch.
To sum up, this application embodiment can reduce the temperature of the device that generates heat among the radiator unit through thermoelectric film initiative heat dissipation technology, and then, can improve charging current and reach the effect that improves charging power, like this, can further improve electronic equipment's the speed of charging, make the user experience the effect of filling soon of higher power and faster speed.
Based on the same inventive concept of the foregoing embodiments, the present application further provides an electronic device, which may include a heat dissipation assembly 71 and a housing 72, as shown in fig. 7; wherein the content of the first and second substances,
the heat dissipation assembly 71 includes a heat generating device 711, a first thermoelectric film 712, and a second thermoelectric film 713;
in the embodiment provided by the present application, the first thermoelectric film 712 is disposed between the heat generating device 711 and the second thermoelectric film 713, and the cooling end of the first thermoelectric film 713 covers the heat generating device 711 and the second thermoelectric film 713 covers the heat generating end of the first thermoelectric film 712;
the housing 72 is disposed on one side of the heat sink 71, and the housing 72 covers the second thermoelectric film in the heat sink 71.
The first thermoelectric film 712 is used for absorbing heat generated by the heating device 711 and conducting the heat generated by the heating device 711 to the heating end when a power supply current provided by a power supply passes through the cooling end;
a second thermoelectric film 713 for absorbing heat at the hot side and transferring the absorbed heat to the case 72;
and a case 72 for absorbing heat of the second thermoelectric thin film 713 and transferring the heat to an external environment.
The embodiment of the application can reduce the temperature of a heating device in the heat dissipation assembly through the active heat dissipation technology of the thermoelectric film, and further can improve the charging current to achieve the effect of improving the charging power of the electronic equipment, so that the charging speed of the electronic equipment can be further improved, and a user can experience the quick charging effect of higher power and higher speed.
It should be noted that, in the embodiment of the present application, functions implemented by the heat dissipation assembly in the electronic device may be understood by referring to the related description of the heat dissipation assembly. The embodiments of the present application are not described herein in detail.
The above scheme is described in detail below in connection with an exemplary application scenario.
An electronic device according to an embodiment of the present application is provided, fig. 8 is a schematic side structure diagram of the electronic device according to the embodiment of the present application, and fig. 9 is a side view of the electronic device shown in fig. 8 along a direction a to B.
Referring to fig. 8 and fig. 9 together, an electronic device according to an embodiment of the present application includes: a heat generating device 81, a first thermoelectric film 82, a second thermoelectric film 83, and a case 84. Wherein, the heat generating device 81 is covered with the first heat conducting layer 85, and the cooling end 821 of the first thermoelectric film 82 covers the first heat conducting layer 85; the heat generating end 822 of the first thermoelectric film 82 is covered with the second heat conducting layer 86, and the first end 831 of the second thermoelectric film 83 covers the second heat conducting layer 86.
Here, the first heat conduction layer 85 and the second heat conduction layer 86 may be made of insulating heat conduction solder paste, or insulating heat conduction silicone, and the embodiment of the present application is not limited herein.
In the embodiment provided in the present application, as shown in fig. 8, each of the first thermoelectric thin film 82 and the second thermoelectric thin film 83 may be formed by connecting a P-type semiconductor material and an N-type semiconductor material by a copper plate.
In the embodiment provided by the present application, as shown in fig. 10, the electronic device may further include a battery charging and discharging module 87, a battery assembly 88, an energy collecting module 89, a boosting module 810, and a circuit board system 811.
Specifically, the energy collection module 89 is electrically connected to the voltage boost circuit 810, the voltage boost module 810 is electrically connected to the battery charge and discharge module 87 and the circuit board system 811, and the battery charge and discharge module 87 is electrically connected to the circuit board system 811 and the battery assembly 88.
The battery charge-discharge module 87 may include: a positive supply V1+ and a negative supply V1-. Specifically, the battery charge and discharge module 87 shown in fig. 10 may be electrically connected to the first thermoelectric film 82 shown in fig. 8 through the power feeding positive electrode V1+ and the power feeding negative electrode V1-. Specifically, the power supply positive electrode V1+ is connected to the N-type semiconductor in the first thermoelectric film 82, and the power supply negative electrode V1-is connected to the P-type semiconductor in the first thermoelectric film 82.
The battery charging and discharging module 87 is electrically connected to the battery assembly 88, so that the battery charging and discharging module 87 can supply a power supply current to the first thermoelectric film 82 through the power supply positive electrode V1+ and the power supply negative electrode V1 "while being connected to an external power supply to charge the battery assembly 88. Specifically, the supply current flows from the N-type semiconductor material to the P-type semiconductor material in the first thermoelectric thin film 82, so that the node of the N-type semiconductor material and the P-type semiconductor material with the copper plate forms a cooling end 821 that absorbs heat around the heat generating device 81. And the end of the first thermoelectric film 82 to which the power supply positive electrode V1+ and the power supply negative electrode V1-are connected forms the heat emitting end 822. The heat flow is conducted from the heat generating device 81 to the heat generating end 822 of the first thermoelectric film 82.
In addition, as shown in FIG. 10, the energy harvesting module 89 in the electronic device includes a positive energy harvesting output voltage V2+ and a negative energy harvesting output voltage V2-. Wherein the energy collection module 89 shown in fig. 10 can be electrically connected to the second thermoelectric film 83 shown in fig. 8 through V2+ and V2-. Wherein V2+ is connected to the P-type semiconductor in the second thermoelectric film 83 and V2-is connected to the N-type semiconductor in the second thermoelectric film 83.
In the embodiment provided herein, when the heat flow is conducted to the heat generating end 822 of the first thermoelectric thin film 82, a temperature difference may be generated at both ends of the second thermoelectric thin film 83. Thus, electrons received by the second thermoelectric film 83 at the first end 831 can move from a high temperature region (i.e., the first end 831) to a low temperature region (i.e., the second end 832) according to a temperature gradient, and a heat flow is conducted from the first thermoelectric film 82 to the case 84 of the electronic device. Meanwhile, the electrons in the second thermoelectric thin film 83 can also generate a thermoelectric current during the movement.
Further, the thermal current may flow to the energy collection module 89 through V2+ and V2-, the thermal current reaches the battery charge/discharge module 87 after being boosted by the voltage boost module 810, and the battery charge/discharge module 87 may convert the thermal current into electrical energy to be stored in the battery assembly 88.
In another possible implementation, as shown in fig. 11, the electronic device may further include a temperature sensor 91, a microprocessor 92, and a load switch 93.
Specifically, the temperature sensor 91 may be disposed beside the internal heat generating device 81 of the electronic apparatus. The temperature sensor 91 can acquire the real-time temperature of the heat generating device 81. The temperature sensor 91 is connected to the microprocessor 92, and the microprocessor 92 can read the temperature measured by the temperature sensor 91 at regular time intervals or at regular time periods.
In addition, the control input end of the load switch 93 is connected with the output end of the microprocessor 91; the current input end of the load switch 93 is connected with the battery charging and discharging module 87; the current output terminal of the load switch 93 is connected to the first thermoelectric film.
Here, the microprocessor 92 can control the operation state of the load switch 93 to adjust the current value of the supply current provided by the battery assembly 88 to the first thermoelectric film 82 through the battery charge and discharge module 87.
In this way, when the temperature value collected by the temperature sensor 91 becomes larger, the microprocessor 92 can control the load switch 93 to increase the power supply current of the first thermoelectric film 82, so that the cooling effect of the cooling end 821 of the first thermoelectric film 82 is stronger, and the temperature of the heat generating device 81 is rapidly reduced. When the temperature value collected by the temperature sensor 91 becomes smaller, the load switch 93 may be controlled to reduce the supply current of the first thermoelectric film 82, so that the cooling effect of the cooling end 821 of the first thermoelectric film 82 matches with the heat generated by the current heat generating device 81, thereby saving the energy consumption of the system.
As can be seen from this, in the hardware structure of the electronic apparatus, the cooling end 821 can rapidly absorb the temperature of the heat generating device 81 by supplying power to the first thermoelectric film 82, and a very good heat dissipation effect is achieved. Meanwhile, the second thermoelectric film 83 is used for thermoelectric conversion, and the electric energy converted by the thermal energy is collected by the energy collecting circuit 89 to supply power to the system and charge the battery pack. Therefore, the temperature rise of the heating device in the heat dissipation assembly of the electronic equipment is reduced, the overcurrent capacity of the heating device is provided, and the heating device is prevented from being damaged due to overhigh temperature rise.
Based on the hardware implementation of the heat dissipation assembly, an embodiment of the present application further provides a heat dissipation control method, which may be applied to the heat dissipation assembly, as shown in fig. 12, where the heat dissipation control method includes:
and 1202, absorbing heat of the heat-emitting end through a second thermoelectric film, and outputting the absorbed heat.
In one possible implementation, the method further includes:
performing thermoelectric conversion on the absorbed heat through the second thermoelectric film to obtain thermoelectric current;
acquiring thermoelectric current generated by the second thermoelectric thin film through an energy collection module;
and charging the target electronic component through a battery charging and discharging module based on the thermal current.
In one possible implementation, step 1201 provides a supply current to the first thermoelectric film, and may be implemented by:
step 1201a, collecting the temperature of a heating device through a temperature sensor;
step 1201b, determining a current value of the supply current based on the temperature of the heating device, and providing the supply current for the first thermoelectric film based on the current value.
In the several embodiments provided in the present application, it should be understood that the disclosed terminal and method can be implemented in other manners. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may be separately regarded as one unit, or at least two units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for implementing the method embodiments may be implemented by hardware related to program instructions, and the program may be stored in a computer readable storage medium, and when executed, the program performs the steps including the method embodiments; and the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.
Alternatively, the integrated units described above in the present application may be stored in a computer-readable storage medium if they are implemented in the form of software functional modules and sold or used as independent products. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially implemented or portions thereof contributing to the prior art may be embodied in the form of a software product stored in a storage medium, and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, a ROM, a RAM, a magnetic or optical disk, or various other media that can store program code.
It should be noted that: the technical solutions described in the embodiments of the present application can be arbitrarily combined without conflict.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (12)
1. A heat dissipation assembly, comprising: a heat generating device, a first thermoelectric thin film, and a second thermoelectric thin film;
the first thermoelectric film is arranged between the heating device and the second thermoelectric film, the refrigerating end of the first thermoelectric film covers the heating device, and the second thermoelectric film covers the heating end of the first thermoelectric film;
the first thermoelectric film is used for absorbing heat generated by the heating device and conducting the heat generated by the heating device to the heating end when power supply current passes through the cooling end;
and the second thermoelectric film is used for absorbing the heat of the heat-emitting end and outputting the absorbed heat.
2. The heat dissipation assembly of claim 1, wherein the second thermoelectric film has oppositely disposed first and second ends; the first end of the second thermoelectric thin film covers the heat-emitting end of the first thermoelectric thin film and is used for absorbing heat of the heat-emitting end;
the second thermoelectric thin film is further configured to perform thermoelectric conversion on heat absorbed by the first end based on a temperature difference generated between the first end and the second end, so as to obtain a thermoelectric current.
3. The heat dissipation assembly of claim 2, further comprising: an energy harvesting module;
the energy collection module is electrically connected with the second thermoelectric thin film;
the energy collection module is used for acquiring the thermoelectric current and providing electric energy to a target electronic component based on the thermoelectric current.
4. The heat dissipation assembly of claim 3, wherein the target electronic component comprises a battery component.
5. The heat sink assembly of claim 3 or 4, further comprising a battery charge-discharge module;
the battery charge-discharge module is electrically connected with the energy collection module;
the energy collection module is used for transmitting the thermal current to the battery charging and discharging module after the thermal current is obtained, so that the battery charging and discharging can charge the battery assembly based on the thermal current.
6. The heat dissipation assembly of claim 5, wherein the battery charge and discharge module is further coupled to the first thermoelectric film;
the battery charging and discharging module is used for transmitting the electric energy provided by the battery assembly to the first thermoelectric film so as to provide the power supply current for the first thermoelectric film.
7. The heat dissipation assembly of claim 3 or 4, further comprising a boost module;
the boosting module is electrically connected with the energy collecting module and is used for boosting the voltage corresponding to the thermal current to obtain boosted thermal current;
the boost module is connected with the battery charge-discharge module, and the boost module is also used for transmitting the boosted thermal current to the battery charge-discharge module so as to charge the battery assembly based on the boosted thermal current.
8. The heat sink assembly of any of claims 1-4, further comprising a temperature sensor, a microprocessor, and a load switch;
the input end of the microprocessor is electrically connected with the temperature sensor;
the output end of the microprocessor is connected with the control input end of the load switch; the current input end of the load switch is connected with the battery assembly; the current output end of the load switch is connected with the first thermoelectric film;
the temperature sensor is arranged in a preset range of the heating device; the temperature sensor is used for collecting the temperature of the heating device and transmitting the temperature of the heating device to the microprocessor;
the microprocessor is used for controlling the working state of the load switch based on the temperature of the heating device so as to adjust the current value of the power supply current provided by the battery assembly to the first thermoelectric film, so that the current value of the power supply current is matched with the temperature of the heating device.
9. A method for controlling heat dissipation, the method being applied to the heat dissipation assembly of any one of claims 1 to 8, the method comprising:
providing a supply current to a first thermoelectric film, so that when the supply current passes through a cooling end of the first thermoelectric film, heat generated by a heating device is absorbed, and the heat generated by the heating device is conducted to the heating end;
and absorbing the heat of the heat-emitting end through the second thermoelectric film, and outputting the absorbed heat.
10. The method of claim 9, further comprising:
performing thermoelectric conversion on the absorbed heat through the second thermoelectric film to obtain thermoelectric current;
acquiring the thermoelectric current through an energy collection module;
and charging the target electronic component based on the thermoelectric current through a battery charging and discharging circuit.
11. The method of claim 9 or 10, wherein providing a supply current to the first thermoelectric film comprises:
acquiring the temperature of the heating device through a temperature sensor;
determining a current value of the supply current based on the temperature of the heat generating device, and supplying the supply current to the first thermoelectric film based on the current value.
12. An electronic device, comprising a housing, and the heat dissipation assembly of any of claims 1-8; wherein the content of the first and second substances,
the shell is arranged on one side of the heat dissipation assembly, and the shell covers the second thermoelectric film in the heat dissipation assembly;
the shell is used for absorbing the heat of the second thermoelectric film and outputting the absorbed heat to the external environment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011120075.5A CN112333978B (en) | 2020-10-19 | 2020-10-19 | Heat dissipation assembly, electronic equipment and heat dissipation control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011120075.5A CN112333978B (en) | 2020-10-19 | 2020-10-19 | Heat dissipation assembly, electronic equipment and heat dissipation control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112333978A true CN112333978A (en) | 2021-02-05 |
| CN112333978B CN112333978B (en) | 2023-06-06 |
Family
ID=74314340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011120075.5A Active CN112333978B (en) | 2020-10-19 | 2020-10-19 | Heat dissipation assembly, electronic equipment and heat dissipation control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112333978B (en) |
Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303469A (en) * | 1997-04-23 | 1998-11-13 | Sharp Corp | Thin film thermoelectric transducer, semiconductor device using the transducer and printed board using the semiconductor |
| CN1274953A (en) * | 2000-06-16 | 2000-11-29 | 中国科学院上海冶金研究所 | Film thermopile with new structure |
| CN1281545A (en) * | 1997-12-10 | 2001-01-24 | 国际商业机器公司 | Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms |
| CN1352467A (en) * | 2001-10-24 | 2002-06-05 | 王彬 | Split thermocouple refrigeration and power generation technology |
| JP2004071969A (en) * | 2002-08-08 | 2004-03-04 | Okano Electric Wire Co Ltd | Thermoelectric cooling apparatus |
| JP2008192968A (en) * | 2007-02-07 | 2008-08-21 | Nec Corp | Heat radiator, communications equipment and heat radiating method of equipment |
| WO2009084172A1 (en) * | 2007-12-27 | 2009-07-09 | Daikin Industries, Ltd. | Thermoelectric device |
| CN202546687U (en) * | 2012-05-09 | 2012-11-21 | 京东方科技集团股份有限公司 | Heat dissipation device of LED (light emitting diode) light bar, backlight module and display device |
| CN103259460A (en) * | 2013-05-10 | 2013-08-21 | 广东欧珀移动通信有限公司 | Movable terminal with power generation system |
| CN104717871A (en) * | 2013-12-13 | 2015-06-17 | 中兴通讯股份有限公司 | Terminal cooling system and cooling method |
| EP3021369A1 (en) * | 2014-11-14 | 2016-05-18 | J Touch Corporation | Thermoelectric power generator |
| US20160343929A1 (en) * | 2015-05-20 | 2016-11-24 | Mediatek Inc. | Semiconductor package assembly with thermal recycling function |
| CN106935560A (en) * | 2015-12-30 | 2017-07-07 | 恩斯迈电子(深圳)有限公司 | Thermoelectric cooling module and heat sink comprising same |
| CN107464795A (en) * | 2017-06-30 | 2017-12-12 | 西安易朴通讯技术有限公司 | Thermoelectric conversion device and electronic equipment |
| CN109087989A (en) * | 2018-07-24 | 2018-12-25 | 北京航空航天大学 | A kind of preparation method of Multifunction thermoelectric film power generation and light intensity sensor part |
| CN109104138A (en) * | 2018-06-22 | 2018-12-28 | 东华大学 | A kind of flexible film-like photo-thermal power conversion device |
| CN109168302A (en) * | 2018-10-23 | 2019-01-08 | 歌尔科技有限公司 | A kind of wearable device |
| US20190349690A1 (en) * | 2018-05-10 | 2019-11-14 | Tymphany Acoustic Technology (Huizhou) Co., Ltd. | System with thermoelectric conversion device |
| CN210838998U (en) * | 2019-11-22 | 2020-06-23 | Oppo广东移动通信有限公司 | Wireless charger and electronic equipment |
| US20200248913A1 (en) * | 2019-01-31 | 2020-08-06 | Imam Abdulrahman Bin Faisal University | Enhanced performance thermoelectric generator |
-
2020
- 2020-10-19 CN CN202011120075.5A patent/CN112333978B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10303469A (en) * | 1997-04-23 | 1998-11-13 | Sharp Corp | Thin film thermoelectric transducer, semiconductor device using the transducer and printed board using the semiconductor |
| CN1281545A (en) * | 1997-12-10 | 2001-01-24 | 国际商业机器公司 | Thermoelectric cooling apparatus with dynamic switching to isolate heat transport mechanisms |
| CN1274953A (en) * | 2000-06-16 | 2000-11-29 | 中国科学院上海冶金研究所 | Film thermopile with new structure |
| CN1352467A (en) * | 2001-10-24 | 2002-06-05 | 王彬 | Split thermocouple refrigeration and power generation technology |
| JP2004071969A (en) * | 2002-08-08 | 2004-03-04 | Okano Electric Wire Co Ltd | Thermoelectric cooling apparatus |
| JP2008192968A (en) * | 2007-02-07 | 2008-08-21 | Nec Corp | Heat radiator, communications equipment and heat radiating method of equipment |
| WO2009084172A1 (en) * | 2007-12-27 | 2009-07-09 | Daikin Industries, Ltd. | Thermoelectric device |
| CN202546687U (en) * | 2012-05-09 | 2012-11-21 | 京东方科技集团股份有限公司 | Heat dissipation device of LED (light emitting diode) light bar, backlight module and display device |
| CN103259460A (en) * | 2013-05-10 | 2013-08-21 | 广东欧珀移动通信有限公司 | Movable terminal with power generation system |
| CN104717871A (en) * | 2013-12-13 | 2015-06-17 | 中兴通讯股份有限公司 | Terminal cooling system and cooling method |
| EP3021369A1 (en) * | 2014-11-14 | 2016-05-18 | J Touch Corporation | Thermoelectric power generator |
| US20160343929A1 (en) * | 2015-05-20 | 2016-11-24 | Mediatek Inc. | Semiconductor package assembly with thermal recycling function |
| CN106935560A (en) * | 2015-12-30 | 2017-07-07 | 恩斯迈电子(深圳)有限公司 | Thermoelectric cooling module and heat sink comprising same |
| CN107464795A (en) * | 2017-06-30 | 2017-12-12 | 西安易朴通讯技术有限公司 | Thermoelectric conversion device and electronic equipment |
| US20190349690A1 (en) * | 2018-05-10 | 2019-11-14 | Tymphany Acoustic Technology (Huizhou) Co., Ltd. | System with thermoelectric conversion device |
| CN109104138A (en) * | 2018-06-22 | 2018-12-28 | 东华大学 | A kind of flexible film-like photo-thermal power conversion device |
| CN109087989A (en) * | 2018-07-24 | 2018-12-25 | 北京航空航天大学 | A kind of preparation method of Multifunction thermoelectric film power generation and light intensity sensor part |
| CN109168302A (en) * | 2018-10-23 | 2019-01-08 | 歌尔科技有限公司 | A kind of wearable device |
| US20200248913A1 (en) * | 2019-01-31 | 2020-08-06 | Imam Abdulrahman Bin Faisal University | Enhanced performance thermoelectric generator |
| CN210838998U (en) * | 2019-11-22 | 2020-06-23 | Oppo广东移动通信有限公司 | Wireless charger and electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 赵亮;张丰华;杨明明;吴波;: "热电制冷器散热性能实验研究" * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112333978B (en) | 2023-06-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6570362B1 (en) | Portable electronic device with enhanced battery life and cooling | |
| CN102680125B (en) | Wireless temperature sensor | |
| US8519254B2 (en) | Device and method for generating electrical power | |
| WO2013178123A1 (en) | Device for improving endurance of terminal and terminal thereof | |
| CN104279678A (en) | Air conditioner with waste heat recovery function | |
| WO2019185036A1 (en) | Integrated vr device and operation method thereof | |
| KR102328095B1 (en) | Lithium ion battery module | |
| JP2021097590A (en) | Wireless charging device | |
| US10193371B2 (en) | Charging/discharging apparatus using thermoelectric conversion effect | |
| CN203455028U (en) | A passive wireless temperature-measuring and current-measuring system | |
| WO2014180368A1 (en) | Terminal heat-dissipation system and method | |
| CN105827003A (en) | Mobile terminal charged through self power consumption heating | |
| CN112333978B (en) | Heat dissipation assembly, electronic equipment and heat dissipation control method | |
| CN107819361B (en) | Wireless charging coil structure with heat dissipation function | |
| CN210940758U (en) | Composite structure membrane with heat insulation and energy storage functions | |
| CN218450993U (en) | Energy recovery device and electronic equipment | |
| CN217606907U (en) | Battery module | |
| CN208385396U (en) | Central Processor Module, electronic equipment, mobile phone | |
| CN102723899A (en) | Electric appliance possessing thermoelectric convertor | |
| CN104602484B (en) | Portable apparatus and cooling device thereof | |
| CN104883095A (en) | Heat energy gathering device of wearable equipment | |
| CN204497854U (en) | Wireless power transmission system | |
| CN212323769U (en) | Wireless charging seat | |
| CN114142564A (en) | Charging box capable of reversely charging unmanned aerial vehicle battery and control method | |
| CN208862588U (en) | A kind of wireless charger with active temperature control |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |