CN112313790A - 柔性部件、电子装置及柔性盖板的剥离方法 - Google Patents
柔性部件、电子装置及柔性盖板的剥离方法 Download PDFInfo
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- CN112313790A CN112313790A CN201880090436.0A CN201880090436A CN112313790A CN 112313790 A CN112313790 A CN 112313790A CN 201880090436 A CN201880090436 A CN 201880090436A CN 112313790 A CN112313790 A CN 112313790A
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- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000010410 layer Substances 0.000 claims description 389
- 239000011241 protective layer Substances 0.000 claims description 83
- 239000002346 layers by function Substances 0.000 claims description 36
- 239000012790 adhesive layer Substances 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 24
- 230000003287 optical effect Effects 0.000 claims description 23
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 19
- 230000017525 heat dissipation Effects 0.000 claims description 18
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 18
- -1 polyethylene terephthalate Polymers 0.000 claims description 15
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 12
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 12
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229920001971 elastomer Polymers 0.000 claims description 10
- 230000005684 electric field Effects 0.000 claims description 10
- 239000005060 rubber Substances 0.000 claims description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000004642 Polyimide Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229920002635 polyurethane Polymers 0.000 claims description 6
- 239000004814 polyurethane Substances 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 239000012783 reinforcing fiber Substances 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 150000004395 organic heterocyclic compounds Chemical class 0.000 claims description 3
- CNRZQDQNVUKEJG-UHFFFAOYSA-N oxo-bis(oxoalumanyloxy)titanium Chemical compound O=[Al]O[Ti](=O)O[Al]=O CNRZQDQNVUKEJG-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- PTISTKLWEJDJID-UHFFFAOYSA-N sulfanylidenemolybdenum Chemical class [Mo]=S PTISTKLWEJDJID-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims 2
- 230000004224 protection Effects 0.000 description 28
- 239000010408 film Substances 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 230000000181 anti-adherent effect Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000000903 blocking effect Effects 0.000 description 6
- 229920000058 polyacrylate Polymers 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 239000000499 gel Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005283 ground state Effects 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- DMSSTTLDFWKBSX-UHFFFAOYSA-N 1h-1,2,3-benzotriazin-4-one Chemical compound C1=CC=C2C(=O)N=NNC2=C1 DMSSTTLDFWKBSX-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- UQZIWOQVLUASCR-UHFFFAOYSA-N alumane;titanium Chemical compound [AlH3].[Ti] UQZIWOQVLUASCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 238000012905 input function Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ITRNXVSDJBHYNJ-UHFFFAOYSA-N tungsten disulfide Chemical compound S=[W]=S ITRNXVSDJBHYNJ-UHFFFAOYSA-N 0.000 description 1
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- H10K50/841—Self-supporting sealing arrangements
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- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H10K50/865—Arrangements for improving contrast, e.g. preventing reflection of ambient light comprising light absorbing layers, e.g. light-blocking layers
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Abstract
本发明公开一种柔性部件，其包括用于将柔性部件进行贴合的减黏层。由于所述柔性部件包括减黏层，进而方便所述柔性部件贴合及从所述柔性部件剥离所述柔性盖板。本发明还提供一种电子装置及柔性盖板的剥离方法。
Description
PCT国内申请，说明书已公开。
Claims (38)
- PCT国内申请，权利要求书已公开。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/079629 WO2019178746A1 (zh) | 2018-03-20 | 2018-03-20 | 柔性部件、电子装置及柔性盖板的剥离方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112313790A true CN112313790A (zh) | 2021-02-02 |
Family
ID=67986631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880090436.0A Pending CN112313790A (zh) | 2018-03-20 | 2018-03-20 | 柔性部件、电子装置及柔性盖板的剥离方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20200411790A1 (zh) |
| CN (1) | CN112313790A (zh) |
| WO (1) | WO2019178746A1 (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210019637A (ko) * | 2019-08-12 | 2021-02-23 | 삼성디스플레이 주식회사 | 표시 장치 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100741990B1 (ko) * | 2006-07-10 | 2007-07-23 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| CN104793780A (zh) * | 2014-01-16 | 2015-07-22 | 达鸿先进科技股份有限公司 | 触控面板的工艺方法及其触控面板结构 |
| CN104919591A (zh) * | 2012-08-22 | 2015-09-16 | 康宁股份有限公司 | 挠性玻璃基材和包括挠性玻璃基材与载体基材的基材堆叠件的加工 |
| CN105118837A (zh) * | 2015-09-16 | 2015-12-02 | 京东方科技集团股份有限公司 | 一种柔性基底及其制备方法、显示装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105778806A (zh) * | 2016-03-18 | 2016-07-20 | 张家港康得新光电材料有限公司 | 耐热型uv减粘胶组合物及uv减粘保护膜 |
| CN105895573B (zh) * | 2016-04-18 | 2018-09-04 | 京东方科技集团股份有限公司 | 柔性基板的剥离方法 |
-
2018
- 2018-03-20 WO PCT/CN2018/079629 patent/WO2019178746A1/zh active Application Filing
- 2018-03-20 CN CN201880090436.0A patent/CN112313790A/zh active Pending
-
2020
- 2020-09-14 US US17/020,302 patent/US20200411790A1/en not_active Abandoned
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100741990B1 (ko) * | 2006-07-10 | 2007-07-23 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| CN104919591A (zh) * | 2012-08-22 | 2015-09-16 | 康宁股份有限公司 | 挠性玻璃基材和包括挠性玻璃基材与载体基材的基材堆叠件的加工 |
| CN104793780A (zh) * | 2014-01-16 | 2015-07-22 | 达鸿先进科技股份有限公司 | 触控面板的工艺方法及其触控面板结构 |
| CN105118837A (zh) * | 2015-09-16 | 2015-12-02 | 京东方科技集团股份有限公司 | 一种柔性基底及其制备方法、显示装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019178746A1 (zh) | 2019-09-26 |
| US20200411790A1 (en) | 2020-12-31 |
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