CN112312750A - Heat dissipation device of PCIE interface private network module and implementation method - Google Patents

Heat dissipation device of PCIE interface private network module and implementation method Download PDF

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Publication number
CN112312750A
CN112312750A CN202011362529.XA CN202011362529A CN112312750A CN 112312750 A CN112312750 A CN 112312750A CN 202011362529 A CN202011362529 A CN 202011362529A CN 112312750 A CN112312750 A CN 112312750A
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China
Prior art keywords
resistor
radiator
heat
fan
private network
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CN202011362529.XA
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Chinese (zh)
Inventor
张青平
王智超
赵云龙
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Tianjin 712 Communication and Broadcasting Co Ltd
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Tianjin 712 Communication and Broadcasting Co Ltd
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Priority to CN202011362529.XA priority Critical patent/CN112312750A/en
Publication of CN112312750A publication Critical patent/CN112312750A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a heat sink of a PCIE interface private network module and an implementation method, wherein the heat sink is fixed on a chassis bottom plate of a radio frequency transceiver in a 4G and 5G communication system through a printed board, and a heat-conducting rubber pad is pressed; the PCIE interface private network module produces a large amount of heat because its consumption is great in the course of the work, the heat that the device that generates heat produced conducts the shield cover through the inside heat conduction glue of PCIE interface private network module, the rethread heat conduction cushion conducts the radiator, give off the heat by the radiator, still be equipped with temperature control circuit and fan in the radiator recess, the temperature control circuit detects the temperature of radiator, start the fan when the temperature is higher than 50 ℃, for the radiator forces the heat dissipation of airing exhaust, the temperature of radiator is less than 40 ℃ and stops the fan operation. After the heat dissipation device is installed, the equipment can stably work for a long time no matter in a normal working environment with an air conditioner or a high-temperature environment, and the reliability of the communication equipment is greatly improved.

Description

Heat dissipation device of PCIE interface private network module and implementation method
Technical Field
The invention relates to the field of electronic circuits, in particular to a heat dissipation device of a PCIE interface private network module and an implementation method thereof, which are used in an LTE communication system and solve the heat dissipation problem of an LTE module which is a core component of the LTE communication system.
Background
The modern subway wireless communication widely adopts a private network module based on a Mini PCI Express interface (namely a PCIE interface), so that multimode wireless internet access can be realized, and digital communication between mobile equipment and the ground is realized. The private network module based on the Mini PCI Express interface has strong functions, high component density and large heat productivity, and if the heat dissipation problem cannot be solved well, the working performance of the module is influenced, even the module stops working due to overhigh temperature rise, so that the heat dissipation problem is solved very importantly.
At present, the commonly adopted heat dissipation measure for the module is a radiator with natural convection heat dissipation or simple installation, and the problem of module heat dissipation is not ideal.
Disclosure of Invention
In view of the defects of the existing heat dissipation scheme, the invention provides a heat dissipation device of a PCIE interface private network module and an implementation method thereof, aiming at solving the problem of temperature rise of an LTE module and ensuring the normal work of the LTE module aiming at most of communication systems using the PCIE interface private network module, especially aiming at the module with larger power consumption.
In order to achieve the purpose, the invention adopts the technical scheme that: a heat abstractor of PCIE interface private network module which characterized in that: the device comprises a radiator, a temperature control circuit, a fan, a PCIE interface private network module and a heat-conducting rubber pad;
one side of the heat-conducting rubber pad is attached to a shielding cover of the PCIE interface private network module, the other side of the heat-conducting rubber pad is attached to one end face of the radiator, the fan is fixed in a groove in the middle of the other end face of the radiator through four studs, and the temperature control circuit is fixed in a radiator groove on one side of the fan;
the temperature control circuit comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C3, a negative temperature coefficient thermistor RT1, an operational amplifier N1, a field effect transistor VT1 and a switch diode VD 1;
the resistor R1 and the resistor R2 are connected in series between a power supply and the ground, the junctions of the resistor R1 and the resistor R2 are respectively connected with the pin 5 of the non-inverting input end of the operational amplifier N1 and one end of the resistor R5 and one end of the capacitor C3, the resistor R3, the resistor R4 and the negative temperature coefficient thermistor RT1 are connected in series between the power supply and the ground, the junction of the resistor R3 and the resistor R4 is connected with the pin 6 of the inverting input end of the operational amplifier N1, the pin 7 of the output end of the operational amplifier N1 is respectively connected with one end of the resistor R6 and the other end of the resistor R5, the other end of the resistor R5 is respectively connected with one end of the resistor R5 and the grid of the field effect transistor VT 5, the drain of the field effect transistor VT 5, the positive pole of the switch diode VD 5 and the negative pole of the fan are connected together, the positive pole of the fan and the positive pole of the power supply and the diode VD 5, the negative pole of the capacitor C5 and the capacitor C5 are, The other end of the resistor R2 and the resistor R7 are grounded with the pin 4 of the grounding end of the operational amplifier N1 and the source of the field effect transistor VT1 respectively.
A method for realizing a heat dissipation device of a PCIE interface private network module is characterized by comprising the following steps:
fixing the heat dissipation device on a chassis base plate of radio frequency transceiver equipment in a 4G and 5G communication system through a printed board, and pressing a heat conduction rubber pad;
the whole heat dissipation device is divided into 2 parts: a conductive heat dissipation part and a forced air cooling heat dissipation part;
the PCIE interface private network module generates a large amount of heat due to large power consumption in the working process, a shielding cover is welded outside the whole PCIE interface private network module, the heat generated by a heating device is conducted to the shielding cover through heat conducting glue inside the PCIE interface private network module and then conducted to a radiator through a heat conducting glue pad, the heat is radiated by the radiator, a temperature control circuit and a fan are further arranged in a groove of the radiator, the temperature control circuit detects the temperature of the radiator, the fan is started when the temperature is higher than 50 ℃, the radiator is forcibly exhausted for radiating, and the fan stops running until the temperature of the radiator is lower than 40 ℃;
the working process of the temperature control circuit is as follows: the negative temperature coefficient thermistor RT1 is tightly attached to the radiator to detect the temperature of the radiator, when the temperature of the radiator is higher than 50 ℃, the partial pressure of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is lower than the partial pressure of the resistor R1 and the resistor R2, namely the voltage of the same phase end of the operational amplifier N1 is higher than the voltage of the opposite phase end, high level is output, the field effect tube VT1 is driven to be conducted, the fan is powered on to operate,
when the temperature of the radiator is reduced to below 40 ℃, the partial voltage of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is higher than the partial voltage of the resistor R1 and the resistor R2, namely the non-inverting terminal voltage of the operational amplifier N1 is lower than the inverting terminal voltage, the output is low, the field effect transistor VT1 is cut off, and the fan is not rotated when the power is cut off.
The invention has the technical effects that:
the original equipment without the heat dissipation device has the occasional network breaking phenomenon in long-time work, and after the heat dissipation device is installed, the equipment can stably work for a long time no matter in a normal working environment with an air conditioner or a high-temperature environment, so that the reliability of communication equipment is greatly improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a cross-sectional view A-A of the structure of FIG. 1;
FIG. 3 is a schematic diagram of a temperature control circuit of the present invention.
Fig. 4 is a use state diagram of the present invention.
The specific implementation mode is as follows:
as shown in fig. 1, fig. 2, and fig. 3, a heat dissipation device for a PCIE interface private network module includes a heat sink 1, a temperature control circuit 2, a fan 3, a PCIE interface private network module 4, and a heat conductive rubber pad 5;
taking a heat-conducting rubber pad 5 with the size of 30 multiplied by 48mm, attaching one surface of the heat-conducting rubber pad 5 to a shielding cover of a PCIE interface private network module 4, attaching the other surface of the heat-conducting rubber pad 5 to one end surface of a radiator 1, fixing a fan 3 in a groove in the middle of the other end surface of the radiator 1 through four studs, and fixing a temperature control circuit 2 in the groove of the radiator 1 on one side of the fan 3;
the temperature control circuit 2 comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C3, a negative temperature coefficient thermistor RT1, an operational amplifier N1, a field effect transistor VT1 and a switch diode VD 1;
the resistor R1 and the resistor R2 are connected between a power supply and the ground in series, the junctions of the resistor R1 and the resistor R2 are respectively connected with the pin 5 of the non-inverting input end of the operational amplifier N1, one end of the resistor R5 and one end of the capacitor C3, the resistors R3, R4 and the negative temperature coefficient thermistor RT1 are connected between the power supply and the ground in series, the junction of the resistor R3 and the resistor R4 is connected with the pin 6 of the inverting input end of the operational amplifier N1, the pin 7 of the output end of the operational amplifier N1 is respectively connected with one end of the resistor R1 and the other end of the resistor R1, the other end of the resistor R1 is respectively connected with one end of the resistor R1 and the grid of the field-effect tube VT1, the drain of the field-effect tube VT1 is respectively connected with the positive pole of the switch diode VD1 and the negative pole of the fan 3, the negative pole of the switch diode VD1 is connected with the power supply and the positive pole of the fan 3, the power supply, the pin 8 of the operational amplifier N, The other end of the resistor R7 is grounded to the ground terminal 4 pin of the operational amplifier N1 and the source of the field effect transistor VT1, respectively.
As shown in fig. 4, a method for implementing a heat dissipation device of a PCIE interface private network module includes the following steps:
fixing the heat dissipation device on a chassis bottom plate 7 of radio frequency transceiver equipment in a 4G and 5G communication system through a printed board 6, and pressing a heat conduction rubber pad 5;
the whole heat dissipation device is divided into 2 parts: a conductive heat dissipation part and a forced air cooling heat dissipation part;
the PCIE interface private network module 4 generates a large amount of heat due to large power consumption in the working process, a shielding cover is welded outside the whole PCIE interface private network module 4, the heat generated by a heating device is conducted to the shielding cover through heat conducting glue inside the PCIE interface private network module 4 and then conducted to the radiator 1 through a heat conducting glue pad 5, the heat is radiated by the radiator 1, a temperature control circuit 2 and a fan 3 are also arranged in a groove of the radiator 1, the temperature control circuit 2 detects the temperature of the radiator 1, when the temperature is higher than 50 ℃, the fan 3 is started to forcibly exhaust air and radiate the heat of the radiator 1, and the fan stops running until the temperature of the radiator 1 is lower than 40 ℃;
the working process of the temperature control circuit 2 is as follows: the negative temperature coefficient thermistor RT1 is tightly attached to the radiator 1 to detect the temperature of the radiator 1, when the temperature of the radiator 1 is higher than 50 ℃, the voltage division of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is lower than the voltage division of the resistor R1 and the resistor R2, namely the voltage of the in-phase end of the operational amplifier N1 is higher than the voltage of the reverse end, the high level is output, the field effect tube VT1 is driven to be conducted, the fan 3 is powered to operate, when the temperature of the radiator 1 is reduced to be lower than 40 ℃, the voltage division of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is higher than the voltage division of the resistor R1 and the resistor R2, namely the voltage of the in-phase end of the operational amplifier N1 is lower than the voltage of the reverse end, the low level is,
the output of the operational amplifier N1 is connected to the non-inverting terminal of the operational amplifier N1 through a resistor R5 as feedback to avoid frequent fan start.
The fan is made by Nippon mountain company, model 109P0412H901, and the fan parameters are as follows:
supply voltage: 7V-13.8V; current: 0.07A; rotating speed: 6200/min; air volume: 0.15m3/min
Wind pressure: 41.2 Pa; service life: 40000 hours.
The radiator adopts standard section bars, can be according to different application scenarios, the corresponding mounting hole of processing.

Claims (2)

1. A heat abstractor of PCIE interface private network module which characterized in that: the device comprises a radiator (1), a temperature control circuit (2), a fan (3), a PCIE interface private network module (4) and a heat-conducting rubber mat (5);
one surface of the heat-conducting rubber pad (5) is attached to a shielding cover of the PCIE interface private network module (4), the other surface of the heat-conducting rubber pad (5) is attached to one end surface of the radiator (1), the fan (3) is fixed in a groove in the middle of the other end surface of the radiator (1) through four studs, and the temperature control circuit (2) is fixed in the groove of the radiator (1) on one side of the fan (3);
the temperature control circuit (2) comprises a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a capacitor C1, a capacitor C2, a capacitor C3, a negative temperature coefficient thermistor RT1, an operational amplifier N1, a field effect transistor VT1 and a switch diode VD 1;
the resistor R1 and the resistor R2 are connected in series between a power supply and the ground, the joints of the resistor R1 and the resistor R2 are respectively connected with a pin 5 at the non-inverting input end of the operational amplifier N1 and one end of the resistor R5 and one end of the capacitor C3, the resistors R3, R4 and the negative temperature coefficient thermistor RT1 are connected in series between the power supply and the ground, the joint of the resistor R3 and the resistor R4 is connected with a pin 6 at the inverting input end of the operational amplifier N1, a pin 7 at the output end of the operational amplifier N1 is respectively connected with one end of the resistor R6 and the other end of the resistor R5, the other end of the resistor R6 is respectively connected with one end of the resistor R7 and the grid of the field effect transistor VT1, the drain of the field effect transistor VT1, the positive electrode of the switch diode VD1 and the negative electrode of the fan (3) are connected together, the positive electrode of the fan (3) and the positive electrode of the power supply, the diode VD1 are connected together, the negative electrode of, The other ends of the capacitor C2, the capacitor C3, the resistor R2 and the resistor R7 are grounded to the pin 4 of the ground terminal of the operational amplifier N1 and the source of the field-effect transistor VT1, respectively.
2. An implementation method of a heat dissipation device using the PCIE interface private network module according to claim 1, is characterized by including the following steps:
fixing a heat dissipation device on a chassis base plate (7) of radio frequency transceiver equipment in a 4G and 5G communication system through a printed board (6), and pressing a heat conduction rubber pad (5);
the whole heat dissipation device is divided into 2 parts: a conductive heat dissipation part and a forced air cooling heat dissipation part;
the PCIE interface private network module (4) generates a large amount of heat due to large power consumption in the working process, a shielding cover is welded outside the whole PCIE interface private network module (4), the heat generated by a heating device is conducted to the shielding cover through heat conducting glue inside the PCIE interface private network module (4) and then conducted to the radiator (1) through a heat conducting glue pad (5), the radiator (1) dissipates the heat, a temperature control circuit (2) and a fan (3) are further arranged in a groove of the radiator (1), the temperature control circuit (2) detects the temperature of the radiator (1), the fan (3) is started when the temperature is higher than 50 ℃, the fan (1) is forcibly exhausted for heat dissipation, and the fan stops running until the temperature of the radiator (1) is lower than 40 ℃;
the working process of the temperature control circuit (2) is as follows: when the temperature of the radiator (1) is higher than 50 ℃, the partial pressure of the negative temperature coefficient thermistor RT1 which is connected in series with the resistor R3 and the resistor R4 is lower than the partial pressure of the resistor R1 and the resistor R2, namely the voltage of the non-inverting end of the operational amplifier N1 is higher than the voltage of the inverting end, high level is output, the field effect tube VT1 is driven to be conducted, the fan (3) is powered to operate,
when the temperature of the radiator (1) is reduced to below 40 ℃, the partial voltage of the negative temperature coefficient thermistor connected in series with the resistor R3 and the resistor R4 is higher than the partial voltage of the resistor R1 and the resistor R2, namely the non-inverting terminal voltage of the operational amplifier N1 is lower than the inverting terminal voltage, low level is output, the field effect transistor VT1 is cut off, and the fan (3) is not rotated when power is cut off.
CN202011362529.XA 2020-11-27 2020-11-27 Heat dissipation device of PCIE interface private network module and implementation method Pending CN112312750A (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172416B1 (en) * 1997-02-10 2001-01-09 Matsushita Electric Industrial Co., Ltd. Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same
JP3096118U (en) * 2003-02-26 2003-09-05 迎廣科技股▲ふん▼有限公司 Fan rotation speed control device
CN102238843A (en) * 2010-04-23 2011-11-09 建准电机工业股份有限公司 Radiating module
CN202975955U (en) * 2012-11-30 2013-06-05 北京航天测控技术有限公司 Radiating device for CPU (Central Processing Unit)
CN103790845A (en) * 2012-10-31 2014-05-14 鸿富锦精密工业（深圳）有限公司 Fan control circuit
CN207124646U (en) * 2017-05-29 2018-03-20 南京码讯光电技术有限公司 A kind of interchanger
CN213638708U (en) * 2020-11-27 2021-07-06 天津七一二通信广播股份有限公司 Heat radiator for PCIE interface private network module

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6172416B1 (en) * 1997-02-10 2001-01-09 Matsushita Electric Industrial Co., Ltd. Heat sink unit for cooling a plurality of exothermic units, and electronic apparatus comprising the same
JP3096118U (en) * 2003-02-26 2003-09-05 迎廣科技股▲ふん▼有限公司 Fan rotation speed control device
CN102238843A (en) * 2010-04-23 2011-11-09 建准电机工业股份有限公司 Radiating module
CN103790845A (en) * 2012-10-31 2014-05-14 鸿富锦精密工业（深圳）有限公司 Fan control circuit
CN202975955U (en) * 2012-11-30 2013-06-05 北京航天测控技术有限公司 Radiating device for CPU (Central Processing Unit)
CN207124646U (en) * 2017-05-29 2018-03-20 南京码讯光电技术有限公司 A kind of interchanger
CN213638708U (en) * 2020-11-27 2021-07-06 天津七一二通信广播股份有限公司 Heat radiator for PCIE interface private network module

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