CN112311250A - 半导体模块构造 - Google Patents

半导体模块构造 Download PDF

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CN112311250A
CN112311250A CN202010704285.2A CN202010704285A CN112311250A CN 112311250 A CN112311250 A CN 112311250A CN 202010704285 A CN202010704285 A CN 202010704285A CN 112311250 A CN112311250 A CN 112311250A
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bus bar
semiconductor element
semiconductor
capacitor
semiconductor module
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佐佐木义
村山英之
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Denso Corp
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Toyota Motor Corp
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Abstract

提供能够将汇流条有效地冷却并小型化的半导体模块构造。本发明的半导体模块构造的特征在于，具备：半导体元件部；第一汇流条，夹持半导体元件部并且与半导体元件部电连接；及电容器元件，经由第二汇流条而与第一汇流条电连接，在与夹持半导体元件部的位置对应的第一汇流条的表面形成有导电性的冷却翅片，在冷却翅片的内部供给有绝缘性的制冷剂。最好是，半导体元件部具有将半导体元件收容于内部的封装构造，在封装构造内的空间填充有树脂模制件。最好是，第一汇流条由圆环状的构件形成，半导体元件部及电容器元件的组沿着第一汇流条的周向而配置有多个。

Description

半导体模块构造
技术领域
本发明涉及半导体模块构造。
背景技术
在专利文献1中记载了以下的构造：具备开关元件、电容器、将开关元件与电容器电连接的汇流条及将开关元件和电容器配置于同一平面上并冷却的冷却器，为了冷却汇流条，汇流条经由电绝缘性热传导件而与冷却器接触。
现有技术文献
专利文献
专利文献1：日本特开2017-188998号公报
发明内容
发明所要解决的课题
在专利文献1所记载的构造中，由于为了冷却汇流条而需要使汇流条与电绝缘性热传导件接触，所以汇流条的长度变长，难以谋求构造的小型化。而且，在专利文献1所记载的构造中，由于汇流条经由电绝缘性热传导件而与冷却器接触，所以汇流条的冷却性能有可能不足。结果，可能会导致汇流条发热且连接于汇流条的开关元件、电容器等元件成为高温。
本发明鉴于上述课题而完成，其目的在于，提供能够将汇流条有效地冷却并实现小型化的半导体模块构造。
用于解决课题的手段
本发明的半导体模块构造的特征在于，具备：半导体元件部；第一汇流条，夹持所述半导体元件部并且与该半导体元件部电连接；及电容器元件，经由第二汇流条而与所述第一汇流条电连接，在与夹持所述半导体元件部的位置对应的所述第一汇流条的表面形成有导电性的冷却翅片，在该冷却翅片的内部供给有绝缘性的制冷剂。
最好是，半导体元件部具有将半导体元件收容于内部的封装构造，在封装构造内的空间填充有树脂模制件。
最好是，第一汇流条由圆环状的构件形成，半导体元件部及电容器元件的组沿着第一汇流条的周向而配置有多个。
发明效果
根据本发明的半导体模块构造，由于冷却翅片兼具冷却功能和汇流条的功能，所以能够将汇流条有效地冷却并小型化。
附图说明
图1是示出由作为本发明的一实施方式的半导体模块构造形成的电子电路的结构的图。
图2是示出作为本发明的一实施方式的半导体模块构造的结构的俯视图及剖视图。
具体实施方式
以下，参照附图，对作为本发明的一实施方式的半导体模块构造进行说明。
〔电路结构〕
首先，参照图1，对由作为本发明的一实施方式的半导体模块构造形成的电子电路的结构进行说明。
图1是示出由作为本发明的一实施方式的半导体模块构造形成的电子电路的结构的图。如图1所示，由作为本发明的一实施方式的半导体模块构造形成的电子电路1是通过使多个开关元件进行开关动作而将从蓄电池等电源B输出的直流电力变换为三相(U相、V相、W相)的交流电力并从端子T1、T2输出的电子电路，搭载于车辆。需要说明的是，开关动作意味着成为控制对象的开关元件的接通/断开切换的动作。
在本实施方式中，电子电路1具备开关元件S1a、S1b、开关元件S2a、S2b、开关元件S3a、S3b及电容器元件C1、C2、C3。
各开关元件由半导体开关元件构成。作为半导体开关元件，使用IGBT(InsulatedGate Bipolar Transistor：绝缘栅双极型晶体管)。在IGBT的集电极端子与发射极端子之间以与发射极端子连接的一侧为阳极而连接有二极管(整流元件)。在使用IGBT以外的元件作为半导体开关元件的情况下，以使与在开关元件导通时流动的电流反向的电流流动的方式对半导体开关元件并联连接二极管。二极管也可以是伴随于半导体开关元件的寄生二极管。在本说明书中，将半导体开关元件和二极管合起来的结构称作开关元件。
开关元件S1a和开关元件S1b的组在节点N1及节点N12处串联连接于与电源B的正极电连接的正极汇流条(P汇流条)L1和与电源B的负极电连接的负极汇流条(N汇流条)L2之间。另外，电容器元件C1以相对于开关元件S1a和开关元件S1b并联连接的方式在节点N2及节点N11处分别经由电容器汇流条L5a及电容器汇流条L5b而连接于正极汇流条L1及负极汇流条L2。电容器元件C1作为将通过开关元件S1a、S1b的开关动作而输出的U相的交流电力平滑化的平滑电容器发挥功能。
开关元件S2a和开关元件S2b的组在节点N3及节点N10处串联连接于正极汇流条L1与负极汇流条L2之间。另外，电容器元件C2以相对于开关元件S2a和开关元件S2b并联连接的方式在节点N4及节点N9处分别经由电容器汇流条L6a及电容器汇流条L6b而连接于正极汇流条L1及负极汇流条L2。电容器元件C2作为将通过开关元件S2a、S2b的开关动作而输出的V相的交流电力平滑化的平滑电容器发挥功能。
开关元件S3a和开关元件S3b的组在节点N5及节点N8处串联连接于正极汇流条L1与负极汇流条L2之间。另外，电容器元件C3以相对于开关元件S3a和开关元件S3b并联连接的方式在节点N6及节点N7处分别经由电容器汇流条L7a及电容器汇流条L7b而连接于正极汇流条L1及负极汇流条L2。电容器元件C3作为将通过开关元件S3a、S3b的开关动作而输出的W相的交流电力平滑化的平滑电容器发挥功能。
〔构造〕
接着，参照图2(a)、(b)，对作为本发明的一实施方式的半导体模块构造进行说明。
图2(a)、(b)分别是示出作为本发明的一实施方式的半导体模块构造的结构的俯视图及图2(a)的A-A线剖视图。如图2(a)、(b)所示，作为本发明的一实施方式的半导体模块构造具备具有导电性的冷却翅片4的圆环状的正极汇流条L1及负极汇流条L2、由正极汇流条L1和负极汇流条L2夹持的多个半导体元件部5及经由电容器汇流条L5a、L5b、L6a、L6b、L7a、L7b而连接于正极汇流条L1及负极汇流条L2的电容器元件C1～C3。需要说明的是，在图2(a)中，省略了电容器汇流条L5b、L6b、L7b的图示。
半导体元件部5具有将由铜制的散热器6夹持的开关元件的组(在本例中是开关元件S1a和开关元件S1b的组)收容于内部的封装构造，沿着正极汇流条L1及负极汇流条L2的周向隔开规定间隔而配置。半导体元件部5内的开关元件的组与正极汇流条L1和负极汇流条L2电连接，形成了图1所示的电子电路1。另外，形成半导体元件部5的封装构造的内部空间S由树脂模制件填充。
在与夹持半导体元件部5的位置对应的正极汇流条L1及负极汇流条L2的表面形成有导电性的冷却翅片4，在冷却翅片4的内部供给有绝缘性的制冷剂。通过在夹持半导体元件部5的位置设置导电性的冷却翅片4，能够冷却正极汇流条L1及负极汇流条L2和半导体元件部5双方。另外，通过将冷却翅片4设为导电性，能够使冷却翅片4具有汇流条的功能。不过，在将冷却翅片4设为了导电性的情况下，优选在正极汇流条L1与负极汇流条L2之间夹设绝缘性的制冷剂，通过绝缘性的制冷剂来确保正极汇流条L1与负极汇流条L2之间的绝缘性。
从以上的说明明显可知，作为本发明的一实施方式的半导体模块构造具备：半导体元件部5；正极汇流条L1及负极汇流条L2，夹持半导体元件部5并且与半导体元件部5电连接；及电容器元件C1～C3，经由电容器汇流条L5a、L5b、L6a、L6b、L7a、L7b而与正极汇流条L1及负极汇流条L2电连接，在与夹持半导体元件部5的位置对应的正极汇流条L1及负极汇流条L2的表面形成有导电性的冷却翅片4，在冷却翅片4的内部供给有绝缘性的制冷剂。并且，根据这样的结构，由于冷却翅片4兼具冷却功能和汇流条的功能，所以能够将汇流条有效地冷却并小型化。
以上，虽然对应用了由本申请的发明人完成的发明的实施方式进行了说明，但本发明不由基于本实施方式的构成本发明的公开的一部分的记述及附图限定。即，基于本实施方式而由本领域技术人员等完成的其他的实施方式、实施例及运用技术等全部包含于本发明的范畴。
标号说明
1 电子电路
4 冷却翅片
5 半导体元件部
6 散热器
B 电源
C1、C2、C3 电容器元件
L1 正极汇流条
L2 负极汇流条
L5a、L5b、L6a、L6b、L7a、L7b 电容器汇流条
S1a、S1b、S2a、S2b、S3a、S3b 开关元件
T1、T2 端子。

Claims (3)

1.一种半导体模块构造，其特征在于，具备：
多个电容器元件；
半导体元件部；
两个汇流条，夹持所述半导体元件部并且与该半导体元件部电连接；及
导电性的冷却翅片，形成于夹持所述半导体元件部的位置的所述两个汇流条各自的表面，
在该冷却翅片的内部供给有绝缘性的制冷剂。
2.根据权利要求1所述的半导体模块构造，其特征在于，
所述半导体元件部具有将半导体元件收容于内部的封装构造，在该封装构造内的空间填充有树脂模制件。
3.根据权利要求1或2所述的半导体模块构造，其特征在于，
所述两个汇流条分别由圆环状的构件形成，所述半导体元件部及所述多个电容器元件的组沿着所述两个汇流条的周向而配置有多个。
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