CN112297532B - 一种仿生层状隔热材料 - Google Patents

一种仿生层状隔热材料 Download PDF

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Publication number
CN112297532B
CN112297532B CN202010982969.9A CN202010982969A CN112297532B CN 112297532 B CN112297532 B CN 112297532B CN 202010982969 A CN202010982969 A CN 202010982969A CN 112297532 B CN112297532 B CN 112297532B
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heat insulation
insulation material
heat
thin layer
layered
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CN112297532A (zh
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马成良
李祥
王世界
邢益强
杜浩然
靳亲国
原会雨
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Zhengzhou University
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Zhengzhou University
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Priority to US17/478,119 priority patent/US11969986B2/en
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
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    • B32B9/002—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising natural stone or artificial stone
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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Dispersion Chemistry (AREA)
  • Civil Engineering (AREA)
  • Nanotechnology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Thermal Insulation (AREA)
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Abstract

本发明公开了一种仿生层状隔热材料，该材料模仿防火耐腐、隔热性能优异的美国红杉树树皮多薄层叠合、薄层微孔化的结构，采用低导热微孔粉体为主要原料，添加增强剂、增塑剂、造孔剂构成微孔化薄层单元，各薄层单元粘接叠合制成层状隔热材料，制成品导热系数低至0.02~0.05 W/m·k，隔热性能和力学性能好，可以在1000℃以下的温度范围使用，比普通隔热材料具有更好的隔热节能效果和韧性，显著降低隔热层厚度，可广泛应用于工业窑炉、热工装置、保温管道等领域。

Description

一种仿生层状隔热材料
技术领域
本发明公开了一种仿生层状隔热材料，属于耐火材料技术领域。
背景技术
目前，随着中国经济的迅速发展，我国能源供给形势不容乐观。其中能源消耗中最多的是工业能耗，2015年工业能耗占全社会能耗73%，并且所占比例逐年增加。响应国家节约能源、保护环境的基本国策，降低高温工业中的能源和资源的损耗、保护环境势在必行。因此，研发新型高温隔热材料，进一步节约能耗，对于高能耗产业具有重要意义，也符合国家节能减排可持续发展战略目标。
传统的隔热材料有粘土、刚玉、莫来石等各类材质的轻质隔热砖及耐火纤维制品，常用于各类工业窑炉的保温隔热。随着社会的发展，人们在节能材料及生产工艺上的不断创新，采用新技术新工艺成功开发了多种新型隔热材料，如气凝胶保温隔热材料、微孔隔热材料等，以实现高效节能。同时，工业窑炉、热工装置、保温管道等领域对新型隔热材料提出了轻薄化、长寿化、环保的新需求，研究开发高效节能的层状隔热材料尤显重要。
专利号为ZL 201410389034.4的专利“一种保温效率高的复合层状结构保温材料”和专利号为ZL 201520257206.2的专利“一种保温材料的层状结构”是由高反射率材料铝膜反射层以及低热导率材料交替排列、复合而成，该类材料有效限制热传导，而且可以有效减少热对流和热辐射，从而获得较高的保温效果，但也仅限于制冷、建材等低温领域，在高温条件下不能使用。专利号为ZL 20161204383.X的专利，马成良、吕桂英等人发明的“一种真空隔热耐火材料制品及制备方法”是由芯材和包裹芯材外的高阻隔膜构成，经真空热压封装制备成真空隔热材料，该制品可在500~1200℃温度条件下使用，且具有较低的热导率，并能保持真空结构，但是其受制约于封装材料的制备。
为了制备综合性价比更佳且环境友好型的新型层状隔热材料，本发明提出了一种新的方案。
发明内容
因天然生物经历几十亿年的进化，已具有最合理、最优化的宏观、微观复合完美结构，仿生材料则是一种通过模仿天然生物的特征，形成的一种具有天然生物结构和功能的材料。本发明是模仿耐火隔热性能优异的美国红杉树树皮多薄层叠合、薄层微孔化的结构，开发的一种新型仿生层状高温隔热材料，该隔热材料由多薄层单元复合而成，显著降低了层状隔热材料的导热系数和隔热层厚度，增加其使用寿命和适用范围，并降低其成本，为层状隔热材料的制备提供一种新方案。
为达到上述目的，本发明所采用的技术方案是：
一种仿生层状隔热材料，其结构与耐火隔热性能优异的美国红杉树树皮多薄层叠合、薄层微孔化的结构相同；
该隔热材料采用低导热微孔粉体为主要原料，添加增强剂、增塑剂、造孔剂，构成微孔化薄层单元，各薄层单元通过粘结剂粘接叠合制成层状隔热材料。
优选的，所述薄层单元由以下重量百分比的物质组成：低导热微孔粉体70~93wt%，增强剂5~20 wt%，增塑剂1~5 wt%，造孔剂1~5 wt%。
优选的，所述低导热微孔粉体为微纳米级气孔粉状材料的二氧化硅、氧化铝、氧化钛、氧化锆中的一种或几种的混合。
优选的，所述增强剂为硅酸铝、高铝、莫来石、氧化铝、氧化锆无机纤维中的一种或几种的混合。
优选的，所述增塑剂为聚乙二醇-400（PEG-400）、邻苯二甲酸酯（BBP）中的一种或两种的混合。
优选的，所述造孔剂为碳酸氢铵、碳化硅、淀粉、碳粉中的一种或几种的混合。
优选的，所述粘结剂为硅溶胶、铝溶胶中的一种或两种混合的无机高温粘结剂，或聚乙烯吡咯烷酮、聚乙烯醇缩丁醛酯中的一种或两种混合的有机无毒粘结剂。
优选的，所述层状隔热材料的厚度为40-50 mm，薄层单元的厚度为2-3 mm。
上述仿生层状隔热材料的制备方法为：将低导热微孔粉体、增强剂、增塑剂、造孔剂按比例进行混合，形成料浆后进行薄层单元制备，然后使用粘结剂将薄层单元粘接叠合得到坯体，最后将坯体于70-150 ℃的干燥箱内进行干燥4-24小时得到仿生层状隔热材料。
与现有技术相比，本发明具有以下优点：
1、本发明巧妙地以美国红杉树树皮为模板，将隔热材料制备为多薄层叠合、薄层微孔化的稳定合理仿生结构，显著降低垂直于热面方向的热量传导，有效导热系数为0.02~0.05 W/m·k。
2、本发明薄层单元采用低导热微孔粉体为原料，使其隔热性能得到很大地提高，同时加入耐火纤维，不仅使材料具有一定的强度，而且在使用时能减少烧结收缩，具有较好地高温使役性能。薄层单元之间通过粘结剂粘接叠合，使层状隔热材料具有一定的韧性和结合强度。
3、以低导热微孔粉体代替气凝胶，耐高温，成本低，适合规模化商生产、便于推广应用。
附图说明
图1为本发明仿生层状隔热材料的结构示意图；
图2为美国红杉树树皮的SEM图；
其中，1、仿生层状隔热材料，2、薄层单元。
具体实施方式
下面结合附图和具体的实施例对本发明的技术方案及效果做进一步描述，但本发明的保护范围并不限于此。
实施例1
本实施例的仿生层状隔热材料的制备方法为：称取氧化铝微粉（重量占比为86 %，粒度为0.03 mm）、硅酸铝纤维（重量占比为10 %）、淀粉（重量占比为1 %）和BBP（重量占比为3 %），将其全部放入搅拌机中，以1000 r/min的转速搅拌30 min，充分混合得到具有一定黏度的料浆，然后将混合好的料浆使用旋涂法制备薄层单元，其厚度为2 mm。
将制备好的薄层单元进行粘接叠合，单元之间加入硅溶胶粘结剂，制得坯体。将所得坯体于100 ℃的干燥箱内进行干燥12小时，得到仿生层状隔热材料1，厚度为40 mm，其结构为层状结构（与美国红杉树树皮的结构相同，均为层状结构，如图2所示），包括20个薄层单元2。
然后对所得产品进行导热系数进行测试，可在1000 ℃以下的温度范围使用，500℃导热系数低至0.030 W/m·k。
实施例2
本实施例的仿生层状隔热材料的制备方法为：称取气相二氧化硅和氧化铝微粉的混合物（两者重量比为1:1，总重量占比为88 %，粒度为0.04 mm）、莫来石纤维（重量占比为9%）、碳化硅（重量占比为1 %）和PEG-400（重量占比为2 %），将其全部放入搅拌机中，以1000r/min的转速搅拌30 min，充分混合得到具有一定黏度的料浆，然后将混合好的料浆使用刮涂法制备薄层单元，其厚度为3 mm。
将制备好的薄层单元进行粘接叠合，单元之间加入聚乙烯吡咯烷酮粘结剂，制得坯体。将所得坯体于90 ℃的干燥箱内进行干燥12小时，得到仿生层状隔热材料1，厚度为45mm，其结构为层状结构，包括15个薄层单元2。
然后对所得产品进行导热系数进行测试，可在1000 ℃以下的温度范围使用，500℃导热系数低至0.044 W/m·k。
实施例3
本实施例的仿生层状隔热材料的制备方法为：称取氧化铝微粉（重量占比为90 %，粒度为0.03 mm）、氧化锆纤维（重量占比为5 %）、碳化硅（重量占比为1 %）和BBP（重量占比为4 %），将其全部放入搅拌机中，以1000 r/min的转速搅拌30 min，充分混合得到具有一定黏度的料浆，然后将混合好的料浆使用旋涂法制备薄层单元，其厚度为2 mm。
将制备好的薄层单元进行粘接叠合，单元之间加入硅溶胶粘结剂，制得坯体。将所得坯体于150 ℃的干燥箱内进行干燥12小时，得到仿生层状隔热材料1，厚度为40 mm，其结构为层状结构，包括20个薄层单元2。
然后对所得产品进行导热系数进行测试，可在1000 ℃以下的温度范围使用，500℃导热系数低至0.026 W/m·k。
实施例4
本实施例的仿生层状隔热材料的制备方法为：称取氧化铝微粉（重量占比为90 %，粒度为0.02 mm）、氧化锆纤维（重量占比为5 %）、碳粉（重量占比为1 %）和BBP（重量占比为4%），将其全部放入搅拌机中，以1000 r/min的转速搅拌30 min，充分混合得到具有一定黏度的料浆，然后将混合好的料浆使用旋涂法制备薄层单元，其厚度为2.5 mm。
将制备好的薄层单元进行粘接叠合，单元之间加入硅溶胶粘结剂，制得坯体。将所得坯体于100 ℃的干燥箱内进行干燥12小时，得到仿生层状隔热材料1，厚度为45 mm，其结构为层状结构，包括18个薄层单元2。
然后对所得产品进行导热系数进行测试，可在1000 ℃以下的温度范围使用，500℃导热系数低至0.022 W/m·k。
实施例5
本实施例的仿生层状隔热材料的制备方法为：称取气相二氧化硅（重量占比为90%，粒度为0.03 mm）、氧化锆纤维（重量占比为5 %）、碳化硅（重量占比为1 %）和PEG-400（重量占比为4 %），将其全部放入搅拌机中，以1000 r/min的转速搅拌30 min，充分混合得到具有一定黏度的料浆，然后将混合好的料浆使用旋涂法制备薄层单元，其厚度为2.5 mm。
将制备好的薄层单元进行粘接叠合，单元之间加入硅溶胶粘结剂，制得坯体。将所得坯体于100 ℃的干燥箱内进行干燥12小时，得到仿生层状隔热材料1，厚度为40 mm，其结构为层状结构，包括16个薄层单元2。
然后对所得产品进行导热系数进行测试，可在1000 ℃以下的温度范围使用，500℃导热系数低至0.021 W/m·k，隔热性能优异。
发明人对轻质莫来石隔热砖（0.8 g/cm³）在500 ℃导热系数进行对比测量，为0.226 W/m·k，相差10倍；若在同等的温度梯度下，其厚度则需要175 mm，比本发明的隔热材料的厚度厚4-5倍，本发明以低导热微孔粉体、增强剂、增塑剂、造孔剂为原料制备成仿生层状隔热材料，能够明显降低材料的导热系数，提高材料的隔热性能。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在不脱离本发明原理的前提下，可轻易想到的变化或替换，都应涵盖在本发明专利的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (1)

1.一种具有低导热系数和隔热层厚度的仿生层状隔热材料，其特征在于，该隔热材料的结构与耐火隔热性能优异的美国红杉树树皮多薄层叠合、薄层微孔化的结构相同；
该隔热材料采用低导热微孔粉体为主要原料，添加增强剂、增塑剂、造孔剂，构成微孔化薄层单元，各薄层单元通过粘结剂粘接叠合制成层状隔热材料；
所述薄层单元由以下重量百分比的物质组成：低导热微孔粉体70~93 wt%，增强剂5~20wt%，增塑剂1~5 wt%，造孔剂1~5 wt%；
所述低导热微孔粉体为微纳米级气孔粉状材料的二氧化硅、氧化铝、氧化钛、氧化锆中的一种或几种的混合；
所述增强剂为硅酸铝纤维、高铝纤维、莫来石纤维、氧化铝纤维、氧化锆无机纤维中的一种或几种的混合；
所述增塑剂为PEG-400、BBP中的一种或两种的混合；
所述造孔剂为碳酸氢铵、碳化硅、淀粉、碳粉中的一种或几种的混合；
所述粘结剂为硅溶胶、铝溶胶中的一种或两种混合的无机高温粘结剂，或聚乙烯吡咯烷酮、聚乙烯醇缩丁醛酯中的一种或两种混合的有机无毒粘结剂；
所述层状隔热材料的厚度为40-50 mm，薄层单元的厚度为2-3 mm，有效导热系数为0.02~0.05 W/m·k；
所述仿生层状隔热材料的制备方法为：将低导热微孔粉体、增强剂、增塑剂、造孔剂按比例进行混合，形成料浆后进行薄层单元制备，然后使用粘结剂将薄层单元粘接叠合得到坯体，最后将坯体于70-150 ℃的干燥箱内进行干燥4-24小时得到仿生层状隔热材料。
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