CN112291937A - Lead etching missing fool-proof visual inspection method - Google Patents
Lead etching missing fool-proof visual inspection method Download PDFInfo
- Publication number
- CN112291937A CN112291937A CN202011177595.XA CN202011177595A CN112291937A CN 112291937 A CN112291937 A CN 112291937A CN 202011177595 A CN202011177595 A CN 202011177595A CN 112291937 A CN112291937 A CN 112291937A
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- CN
- China
- Prior art keywords
- fool
- etching
- proof
- lead
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000011179 visual inspection Methods 0.000 title claims abstract description 12
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 230000008569 process Effects 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims description 5
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000009467 reduction Effects 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
Abstract
A lead wire etching missing fool-proof visual inspection method comprises the following steps: adding a fool-proof mark, and setting the fool-proof mark on the process edge of the PCB to obtain a first prefabricated board; coating ink on the first prefabricated plate for shielding, leaving the area where the lead is not shielded, and shielding the part of the foolproof mark to obtain a second prefabricated plate; etching off a lead on the second prefabricated plate, and etching off an area where the foolproof mark is not shielded; and checking whether a part of the fool-proof mark is etched, if so, etching the lead, otherwise, not etching the lead. Compared with the prior art, the fool-proof mark designed by the invention has a simple structure and is convenient to distinguish compared with a golden finger. Whether the lead wire is etched or not is checked through designing the easily-identified fool-proof mark, the fact that the lead wire is etched or not is detected by scanning a golden finger through an AOI scanning device is avoided, cost reduction is facilitated, and meanwhile the detection speed can be effectively improved through the easily-identified fool-proof mark.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) manufacturing, in particular to a lead missing etching fool-proof visual inspection method.
Background
A plurality of rectangular metal contact pieces are arranged in rows at positions close to the board edges on the printed circuit board, and the metal contact pieces are formed by electroplating a layer of nickel-gold on the copper surface of the printed circuit board. These metal contacts are part of the printed circuit board and are called gold fingers because their surfaces are plated with nickel and gold and are shaped like fingers. The golden fingers are used for connection between printed circuit boards, and can connect circuits and transmit signals. In the gold finger manufacturing process, the lead needs to be etched away after gold plating of the gold finger. However, for a board requiring lead etching, especially for an inner-drawn lead, whether the lead is etched or not is not easy to distinguish compared with a drawing after the lead is etched and stripped, so a special AOI flow is required to be set up, and AOI scanning equipment is used for scanning whether the lead is etched or not; prevent the lead from flowing into the post-process without etching. This inspection step requires 100% scanning with specialized AOI scanning equipment, resulting in increased cost and reduced throughput.
Therefore, it is necessary to provide a new method for visually inspecting lead missing etching fool-proofing.
Disclosure of Invention
The invention aims to solve the technical problem of providing an easily-identified fool-proof mark for checking whether a lead is etched or not, thereby reducing the cost, improving the detection efficiency and the production performance and being a visual checking method for the missing etching and fool-proof of the lead.
The invention solves the technical problem by adopting the technical scheme that a lead missing etching fool-proof visual inspection method comprises the following steps:
adding a fool-proof mark: setting a fool-proof mark on the process edge of the PCB to obtain a first prefabricated board;
selecting and changing photosensitive oil: coating ink on the first prefabricated plate for shielding, leaving the area where the lead is not shielded, shielding the part of the foolproof mark, and obtaining a second prefabricated plate after shielding;
etching: etching off a lead on the second prefabricated plate, simultaneously etching off an area where the foolproof mark is not shielded, and obtaining a third prefabricated plate after etching;
and (3) lead inspection: and checking whether a part of the fool-proof mark on the technical edge of the third prefabricated plate is etched, if so, etching the lead, otherwise, not etching the lead.
Preferably, in the step of adding the fool-proof mark, the fool-proof mark is arranged at four corners of the technological edge of the PCB;
preferably, the fool-proof mark is cross-shaped.
Preferably, in the step of selectively using the photosensitive oil, the middle position of the foolproof mark is not covered by ink.
Preferably, in the step of selectively dissolving the photosensitive oil, the upper end and the lower end of the foolproof mark are not covered by ink for shielding.
The invention also provides another fool-proof mark which is round.
Preferably, in the step of selectively using the photosensitive oil, the area of the foolproof mark coated with the ink is a circular ring.
Compared with the prior art, the fool-proof mark designed by the invention has a simple structure and is convenient to distinguish compared with a golden finger, and the distinguishing speed is effectively improved. Whether the fool-proof mark is etched or not is checked by designing the fool-proof mark which is easy to recognize, and whether the lead is etched or not is deduced. The problem that a special AOI scanning device is occupied to scan a golden finger to detect whether the lead is etched or not is avoided, cost reduction is facilitated, meanwhile, the detection speed can be effectively improved through the easily-identified fool-proof mark, and the yield is improved.
Secondly, when the lead is etched and deviated, the deviation degree of the lead can be judged by comparing the deviation degree of the area of the foolproof mark which is not covered by the ink and the etched area.
Drawings
FIG. 1 is a schematic flow chart of the present invention;
FIG. 2 is a schematic diagram illustrating an unetched structure of a fool-proof mark according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of the fool-proof mark after being etched according to the first embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating an unetched structure of a fool-proof mark according to a second embodiment of the present invention;
fig. 5 is a schematic structural diagram of the second embodiment of the invention after the fool-proof mark is etched.
In the figure:
1. prevent slow-witted sign.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Example one
Referring to fig. 1-3, the present invention provides a lead wire missing etching fool-proof visual inspection method, comprising the following steps:
adding a fool-proof mark 1: arranging a fool-proof mark 1 on the technical edge of the PCB to obtain a first prefabricated plate; in this embodiment, be equipped with one respectively in the four corners on technology limit and prevent slow-witted sign 1, prevent slow-witted sign 1 and be the cross shape, the staff no matter stand and can both see the fast-witted sign 1 of preventing of neighbour department at a glance on which edge of PCB board, should set up and make things convenient for the staff to inspect, does benefit to and improves detection efficiency.
Selecting and changing photosensitive oil: coating ink on the first prefabricated plate for shielding, leaving the area where the lead is not shielded, not coating ink at the middle position of the foolproof mark 1 for shielding, and obtaining a second prefabricated plate after shielding is finished; in this embodiment, if the first prefabricated board has a through hole, a dry film is further used for covering in the step of shielding, and the ink is photosensitive electroplating-resistant ink.
Etching: etching off a lead in the second prefabricated plate, simultaneously etching off an area where the foolproof mark 1 is not shielded, and obtaining a third prefabricated plate after etching; in the step, the middle area of the foolproof mark 1 is etched, the original two mutually perpendicular lines are etched to form four mutually independent lines after the middle area is etched, the foolproof mark 1 before etching and the foolproof mark 1 after etching form obvious contrast, and the setting is convenient for a worker to quickly distinguish whether the foolproof mark 1 is etched or not.
And (3) lead inspection: and checking whether a part of the fool-proof mark 1 on the technical edge of the third prefabricated plate is etched, if so, etching the lead, otherwise, not etching the lead. The partial area of the fool-proof mark 1 and the lead are etched together, if part of the fool-proof mark 1 is etched, the lead can be judged to be etched; otherwise the leads are not etched. Secondly, when the lead is etched, the degree of deviation of the etched lead can be determined by comparing the degree of deviation of the etched area of the fool-proof mark 1 and the area not covered by the ink.
In the above-mentioned inspection method, in the step of selectively dissolving the photosensitive oil, the upper and lower ends of the foolproof mark 1 can be shielded without being coated with ink. Then, during etching, the upper and lower ends of the fool-proof mark 1 are etched away, and only the lines arranged in the horizontal direction are left. The design can also enable the fool-proof mark 1 before etching and the fool-proof mark 1 after etching to form obvious contrast, and through the arrangement, workers can conveniently and rapidly distinguish whether the fool-proof mark 1 is etched or not.
Example two
This embodiment is substantially the same as the first embodiment, except that:
referring to fig. 4-5, the fool-proof mark 1 arranged on the technical edge is circular.
In the step of selectively using the photosensitive oil, the area of the foolproof mark 1 coated with the ink is a circular ring. The design can also enable the foolproof mark 1 before etching and the foolproof mark 1 after etching to form obvious contrast, and through the arrangement, workers can also conveniently and rapidly distinguish whether the foolproof mark 1 is etched or not.
It is understood that the fool-proof mark 1 may also be in a shape of triangle or light spot, which is easy to recognize.
Compared with a golden finger, the fool-proof mark 1 designed by the invention has a simple structure, is convenient to distinguish, and effectively improves the distinguishing speed. Whether the fool-proof mark 1 is etched or not is checked by designing the fool-proof mark 1 which is easy to recognize, and whether a lead is etched or not is deduced. The problem that a special AOI scanning device is occupied to scan a golden finger to detect whether the lead is etched or not is avoided, cost reduction is facilitated, meanwhile, the detection speed can be effectively improved through the easily-identified fool-proof mark, and the yield is improved.
Secondly, when the lead is etched, the deviation degree of the lead can be judged by comparing the deviation degree of the area of the fool-proof mark 1 which is not covered by the ink and the etched area.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A lead wire etching missing fool-proof visual inspection method is characterized by comprising the following steps:
adding a fool-proof mark: setting a fool-proof mark on the process edge of the PCB to obtain a first prefabricated board;
selecting and changing photosensitive oil: coating ink on the first prefabricated plate for shielding, leaving the area where the lead is not shielded, shielding the part of the foolproof mark, and obtaining a second prefabricated plate after shielding;
etching: etching off a lead on the second prefabricated plate, simultaneously etching off an area where the foolproof mark is not shielded, and obtaining a third prefabricated plate after etching;
and (3) lead inspection: and checking whether a part of the fool-proof mark on the technical edge of the third prefabricated plate is etched, if so, etching the lead, otherwise, not etching the lead.
2. The method for etching and fool-proof visual inspection of lead leakage according to claim 1, wherein in the step of adding the fool-proof mark, the fool-proof mark is arranged at four corners of the process edge of the PCB.
3. The method for lead wire missing etching fool-proof visual inspection as claimed in claim 2, wherein the fool-proof mark is cross-shaped.
4. The method for etching and fool-proof visual inspection of lead wire leakage according to claim 3, wherein in the step of selectively dissolving photosensitive oil, the middle position of the fool-proof mark is shielded without being coated with ink.
5. The method for etching and fool-proof visual inspection of lead wire leakage according to claim 3, wherein in the step of selectively dissolving photosensitive oil, the upper and lower ends of the fool-proof mark are not covered by ink.
6. The method of claim 2, wherein the fool-proof mark is a circle.
7. The method for etching and fool-proof visual inspection of lead wire according to claim 6, wherein in the step of selectively dissolving photosensitive oil, the area of the fool-proof mark coated with ink is a circular ring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011177595.XA CN112291937A (en) | 2020-10-28 | 2020-10-28 | Lead etching missing fool-proof visual inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011177595.XA CN112291937A (en) | 2020-10-28 | 2020-10-28 | Lead etching missing fool-proof visual inspection method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112291937A true CN112291937A (en) | 2021-01-29 |
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ID=74373764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011177595.XA Pending CN112291937A (en) | 2020-10-28 | 2020-10-28 | Lead etching missing fool-proof visual inspection method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112291937A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040046194A (en) * | 2002-11-26 | 2004-06-05 | 엘지전자 주식회사 | pattern inspector structure of circuit board |
| CN108235590A (en) * | 2017-12-29 | 2018-06-29 | 深圳欣强智创电路板有限公司 | A kind of golden grading connecting finger optic module PCB production method of plate internalization |
-
2020
- 2020-10-28 CN CN202011177595.XA patent/CN112291937A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040046194A (en) * | 2002-11-26 | 2004-06-05 | 엘지전자 주식회사 | pattern inspector structure of circuit board |
| CN108235590A (en) * | 2017-12-29 | 2018-06-29 | 深圳欣强智创电路板有限公司 | A kind of golden grading connecting finger optic module PCB production method of plate internalization |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210129 |
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| RJ01 | Rejection of invention patent application after publication |