CN112289893A - Efficient solar panel manufacturing method - Google Patents
Efficient solar panel manufacturing method Download PDFInfo
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- CN112289893A CN112289893A CN202011478069.7A CN202011478069A CN112289893A CN 112289893 A CN112289893 A CN 112289893A CN 202011478069 A CN202011478069 A CN 202011478069A CN 112289893 A CN112289893 A CN 112289893A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims abstract description 49
- 235000012431 wafers Nutrition 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 34
- 150000002500 ions Chemical class 0.000 claims abstract description 21
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 229910001430 chromium ion Inorganic materials 0.000 claims abstract description 9
- 229910001429 cobalt ion Inorganic materials 0.000 claims abstract description 9
- XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000003475 lamination Methods 0.000 claims abstract description 9
- 229910001453 nickel ion Inorganic materials 0.000 claims abstract description 9
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000005468 ion implantation Methods 0.000 claims abstract description 7
- 239000010410 layer Substances 0.000 claims description 44
- 239000000463 material Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 15
- 239000010703 silicon Substances 0.000 claims description 15
- 230000004224 protection Effects 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000010248 power generation Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000005341 toughened glass Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009417 prefabrication Methods 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a high-efficiency solar panel manufacturing method, and relates to the technical field of solar panel manufacturing. The method comprises the following steps: providing a protective plate and a back plate, wherein the length and the width of the protective plate are greater than or equal to those of the back plate, and the length and the width of the back plate are greater than or equal to those of the solar cell; in the process of providing the back plate, at least one ion of chromium ions, nickel ions or cobalt ions is implanted by an ion implantation method; providing a solar cell, wherein the solar cell is formed by a plurality of single solar wafers which are connected in series and parallel; and arranging the solar cell between the protective plate and the back plate, and performing lamination or glue sealing treatment among the protective plate, the solar cell and the back plate. The invention provides a solar cell panel manufacturing method capable of mechanically producing and assembling a protective plate, a back plate and a solar cell, and overcomes the defects of the traditional manual manufacturing process of the solar cell panel.
Description
Technical Field
The invention relates to the technical field of solar panel manufacturing, in particular to a high-efficiency solar panel manufacturing method.
Background
The solar panel is a core part in a solar power generation system and is also the most valuable part in the solar power generation system, and the function of the solar panel is to convert the radiation capacity of the sun into electric energy. The quality and cost of the solar panel will directly determine the quality and cost of the overall system.
The manufacturing process of the existing solar cell panel comprises the following steps: preparing materials, preparing a plurality of independent film layers, wherein the size of each film layer corresponds to the size of a single battery chip, then overlapping and laying the plurality of film layers and the single battery chip, and then placing the layer after radiation completion on a high-temperature plate for lamination.
The back plate of the existing solar cell panel only plays a role in protecting a solar wafer (ultraviolet protection, corrosion resistance, insulation and the like), and heat generated in the process of converting light radiation energy into electric energy is accumulated inside the solar cell panel, so that the solar cell panel operates at high temperature, and the service life of the solar cell panel is shortened.
Therefore, in order to solve the above technical problem, a new technical solution needs to be proposed to solve the problem. In particular to a method for manufacturing a high-efficiency solar panel.
Disclosure of Invention
The invention provides an efficient solar panel manufacturing method, aiming at solving the technical problems that the existing solar panel in the market needs to be cut layer by layer and then laminated, solar cell wafers are manually attached to the solar panel, and the service life of the solar panel is influenced due to the poor heat absorption effect of a back plate of the solar panel.
The following technical scheme is provided for achieving the purpose: a method for fabricating a high efficiency solar panel, comprising:
providing a protective plate and a back plate, wherein the length and the width of the protective plate are greater than or equal to those of the back plate, and the length and the width of the back plate are greater than or equal to those of the solar cell;
in the process of providing the back plate, at least one ion of chromium ions, nickel ions or cobalt ions is implanted by an ion implantation method;
providing a solar cell, wherein the solar cell is formed by a plurality of single solar wafers which are connected in series and parallel;
and arranging the solar cell between the protective plate and the back plate, and performing lamination or glue sealing treatment among the protective plate, the solar cell and the back plate.
Preferably, the step of providing the protection plate comprises:
providing a protective layer material, a waterproof layer material and an insulating layer material in sequence, and laminating and spraying the materials of all layers successively to form a composite layer material;
coating the adhesive layer material on the composite layer material to form a primary material;
and cutting the primary material to form a protection plate, wherein the length of the protection plate is greater than or equal to that of the back plate, and the width of the protection plate is greater than or equal to that of the back plate.
Preferably, the step of providing the back plate comprises:
providing a silicon wafer substrate;
implanting one or more of chromium ions, nickel ions or cobalt ions into the surface of the silicon wafer substrate by an ion implantation method;
then mixing and forming injected ions on the surface of the silicon wafer substrate by a melting precipitation method to form an ion layer;
and printing a tin layer on the other surface of the silicon wafer substrate.
Preferably, the step of providing the solar cell sheet includes:
providing a PCB board; at least two bonding pads are arranged on the PCB; a solar cell mounting position is arranged between the two bonding pads and at least comprises two rows and two columns of solar cell welding positions, the single solar wafer is mounted on the solar cell welding positions and is electrically connected with the solar wafers in the front and rear rows, and the single solar wafer is electrically connected with the solar wafers in the upper and lower rows;
welding the solar battery pieces at the two ends of the PCB with the two bonding pads respectively, and taking the solar battery pieces as the positive output of a power supply and the negative output of the power supply respectively;
and cutting the PCB according to the sizes of the protective plate and the back plate to form the solar cell.
Preferably, the step of performing lamination or adhesive sealing treatment among the protective plate, the solar cell and the back plate comprises:
the back plate, the solar cell piece and the protective plate are sequentially laid, so that the surface of the back plate, which is provided with the ion layer, is adjacent to the solar cell piece, and the surface of the solar cell piece, which is provided with the solar wafer, is adjacent to the protective plate.
The invention has the beneficial effects that: the protective plate and the back plate are manufactured according to the planned size and cut to correspond to the size of the solar cell piece, so that the solar cell panel can be quickly assembled and formed during assembly and lamination, and the protective plate and the back plate do not need to be temporarily cut according to the matching degree during assembly.
Meanwhile, the solar wafers are assembled on the PCB in a serial connection and parallel connection mode to form a plurality of power supply circuits, and a plurality of selectable current and electric quantities with different sizes are provided for the solar photovoltaic power generation system.
A chromium ion, nickel ion or cobalt ion layer is injected on a back plate of the solar cell panel through an ion injection method and is used for absorbing heat generated in the power generation process of the solar cell and reducing the working temperature of a solar cell skin.
Drawings
FIG. 1 is a schematic structural diagram of a manufacturing method flow of the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, a method for manufacturing a high efficiency solar panel includes:
s10, providing a protective plate and a back plate, wherein the length and the width of the protective plate are greater than or equal to those of the back plate, and the length and the width of the back plate are greater than or equal to those of the solar cell sheet;
s11, at least one of chromium ions, nickel ions or cobalt ions are implanted in the process of providing the back plate by an ion implantation method;
s20, providing a solar cell, wherein the solar cell is formed by a plurality of single solar wafers which are connected in series and parallel;
s30, arranging the solar cell between the protective plate and the back plate, and laying the back plate, the solar cell and the protective plate in sequence to ensure that the surface of the back plate provided with the ion layer is adjacent to the solar cell, and the surface of the solar cell provided with the solar wafer is adjacent to the protective plate;
and S40, performing lamination or glue sealing treatment among the protective plate, the solar cell and the back plate.
The solar cell panel comprises a solar cell sheet in the middle, and a protective plate and a back plate on two sides of the solar cell sheet, wherein the protective plate comprises a protective layer material, a waterproof layer material, an insulating layer material and a pasting layer material. The solar cell comprises a PCB substrate, a solar wafer attached to the PCB substrate, and positive and negative bonding pads on the PCB, wherein the positive and negative bonding pads are electrically connected with the junction box through leads. The back plate adopts a silicon wafer material as a substrate, an ion layer is formed on the silicon wafer material after one or more ions of chromium ions, nickel ions or cobalt ions are injected by an ion injection method, and the ion layer is arranged on the contact surface of the back plate and the solar cell plate, so that heat generated by the solar cell plate in the power generation process of the solar cell plate is absorbed, and the working temperature of the solar cell plate is reduced.
Specifically speaking:
S1O, providing the protection plate, comprising:
s101, sequentially providing a protective layer material, a waterproof layer material and an insulating layer material, and sequentially laminating and spraying the materials to form a composite layer material. The protective layer material can be made of the existing toughened glass material, the waterproof layer and the insulating layer are sequentially sprayed on the toughened glass layer, and the waterproof layer and the insulating layer are made of transparent materials so as to reduce the refraction loss rate of sunlight.
And S102, brushing an adhesive layer material on the composite layer material to form a primary material, wherein the adhesive layer is also made of transparent adhesive after drying.
S103, cutting the primary material to form a protection plate, wherein the length of the protection plate is greater than or equal to that of the back plate, and the width of the protection plate is greater than or equal to that of the back plate. The sizes of the protective plate, the back plate and the solar cell piece are designed to be that the surface area of the protective plate is larger than or equal to that of the back plate, the surface area of the back plate is larger than that of the solar cell piece, the length of the protective plate is larger than or equal to that of the back plate, the width of the protective plate is larger than or equal to that of the back plate, and the back plate and the solar cell piece adopt the same size corresponding relation. By adopting the design structure, the solar cell panel can be manufactured in advance according to the calculated corresponding relation of the sizes of the protective plate, the solar cell and the back plate, and then laminating or glue sealing treatment is carried out after the manufacturing, so that the process mode that the protective plate and the back plate are cut according to the size of the pasted solar cell in the traditional manufacturing process is changed, the solar cell panel can be produced in an industrial flow mode, and the production efficiency is improved. Meanwhile, the size relationship among the protective plate, the back plate and the solar cell can ensure the protective and supporting effects of the protective plate and the back plate on the solar cell in the middle.
S11, providing the backboard, comprising:
and S111, providing a silicon wafer substrate.
And S112, implanting one or more of chromium ions, nickel ions or cobalt ions into the surface of the silicon wafer substrate by an ion implantation method. One of the ions may be selectively implanted or mixed ions may be implanted at the same time, and in this embodiment, one of the ions is preferably implanted as a heat absorption layer for generating heat during the photoelectric conversion process of the solar cell.
S113, mixing and forming the injected ions on the surface of the silicon wafer substrate by a melting precipitation method to form an ion layer.
And S114, printing a tin layer on the other surface of the silicon wafer substrate. The tin layer is used as a contact layer of the back plate and the external environment, and provides corrosion-resistant and ageing-resistant protection for the silicon wafer substrate.
S20, providing the solar cell piece, which comprises the following steps:
s201, providing a PCB. The PCB is used for drawing a circuit structure according to the serial and parallel connection mode of the solar wafers.
S202, at least two welding pads are arranged on the PCB, the solar cells at two ends of the PCB are respectively welded with the two welding pads and respectively used as positive output of a power supply and negative output of the power supply, and the positive and negative electrodes of the solar cells are respectively and electrically connected with an external junction box.
S203, a solar cell installation position is arranged between the two bonding pads and at least comprises two rows and two columns of solar cell welding positions, a single solar wafer is installed on the solar cell welding positions and electrically connected with the solar wafers in the front and back rows, and the single solar wafer is electrically connected with the solar wafers in the upper and lower rows. There are three connection ways for each solar wafer: (1) the solar wafers are connected in series in sequence and then connected with the bonding pad. (2) The solar wafers are connected in parallel in sequence and then connected with the bonding pad. (3) Each solar wafer is electrically connected to the left and right solar wafers and also electrically connected to the upper and lower solar wafers. Each solar wafer acts as a solar conversion cell. The solar cell panel can provide various generated energies with different sizes by adopting the connection mode.
S204, cutting the PCB according to the sizes of the protective plate and the back plate to form the solar cell.
The solar wafer is attached to one side of the PCB, meanwhile, the solar cell mounting positions are arranged among the bonding pads in advance, the solar wafer can be mechanically mounted on the solar cell mounting positions on the PCB, and production efficiency is improved.
And S30, arranging the back sheet, the solar cell sheet and the protective sheet according to the regulation. The arrangement mode is as follows: the back plate, the solar cell piece and the protective plate are sequentially laid, so that the surface of the back plate, which is provided with the ion layer, is adjacent to the solar cell piece, and the surface of the solar cell piece, which is provided with the solar wafer, is adjacent to the protective plate.
S40, performing a laminating or sealing treatment among the protective plate, the solar cell and the back plate, wherein the laminating and sealing technology adopts the prior art.
According to the invention, the protective plate and the back plate of the solar cell panel are prefabricated according to specified performance and specified size, the solar cell pieces are prefabricated according to requirements and then assembled in sequence, the prefabrication processes of the protective plate, the back plate and the solar cell pieces can be mechanically produced, can be synchronously produced or carried out successively, and mechanical assembly including lamination and glue sealing treatment is carried out through a production line after the first batch of protective plate, the first batch of back plate and the first batch of solar cell pieces are produced, so that the production efficiency and the production mechanization are ensured.
As will be appreciated by one skilled in the art, the above-described embodiments may be provided as a method, apparatus, or computer program product. These embodiments may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. All or part of the steps in the methods according to the embodiments may be implemented by a program instructing associated hardware, where the program may be stored in a storage medium readable by a computer device and used to execute all or part of the steps in the methods according to the embodiments. The computer devices, including but not limited to: personal computers, servers, general-purpose computers, special-purpose computers, network devices, embedded devices, programmable devices, intelligent mobile terminals, intelligent home devices, wearable intelligent devices, vehicle-mounted intelligent devices, and the like; the storage medium includes but is not limited to: RAM, ROM, magnetic disk, magnetic tape, optical disk, flash memory, U disk, removable hard disk, memory card, memory stick, network server storage, network cloud storage, etc. The computer device can also be replaced by other intelligent devices, such as a smart phone smart tablet and the like.
The above embodiments are only for illustrating the invention and are not to be construed as limiting the invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, therefore, all equivalent technical solutions also belong to the scope of the invention, and the scope of the invention is defined by the claims.
Claims (5)
1. A method for manufacturing a high-efficiency solar panel is characterized by comprising the following steps:
providing a protective plate and a back plate, wherein the length and the width of the protective plate are greater than or equal to those of the back plate, and the length and the width of the back plate are greater than or equal to those of the solar cell;
in the process of providing the back plate, at least one ion of chromium ions, nickel ions or cobalt ions is implanted by an ion implantation method;
providing a solar cell, wherein the solar cell is formed by a plurality of single solar wafers which are connected in series and parallel;
and arranging the solar cell between the protective plate and the back plate, and performing lamination or glue sealing treatment among the protective plate, the solar cell and the back plate.
2. A method according to claim 1, wherein the solar panel is manufactured by the following steps: providing the protective plate, comprising:
providing a protective layer material, a waterproof layer material and an insulating layer material in sequence, and laminating and spraying the materials of all layers successively to form a composite layer material;
coating the adhesive layer material on the composite layer material to form a primary material;
and cutting the primary material to form a protection plate, wherein the length of the protection plate is greater than or equal to that of the back plate, and the width of the protection plate is greater than or equal to that of the back plate.
3. A method according to claim 2, wherein the solar panel is manufactured by the following steps: providing the back sheet, comprising:
providing a silicon wafer substrate;
implanting one or more of chromium ions, nickel ions or cobalt ions into the surface of the silicon wafer substrate by an ion implantation method;
then mixing and forming injected ions on the surface of the silicon wafer substrate by a melting precipitation method to form an ion layer;
and printing a tin layer on the other surface of the silicon wafer substrate.
4. A method for fabricating a high efficiency solar panel as claimed in claim 1 or 3, wherein: the step of providing the solar cell piece comprises the following steps:
providing a PCB board; at least two bonding pads are arranged on the PCB; a solar cell mounting position is arranged between the two bonding pads and at least comprises two rows and two columns of solar cell welding positions, the single solar wafer is mounted on the solar cell welding positions and is electrically connected with the solar wafers in the front and rear rows, and the single solar wafer is electrically connected with the solar wafers in the upper and lower rows;
welding the solar battery pieces at the two ends of the PCB with the two bonding pads respectively, and taking the solar battery pieces as the positive output of a power supply and the negative output of the power supply respectively;
and cutting the PCB according to the sizes of the protective plate and the back plate to form the solar cell.
5. The method of claim 4, wherein the solar panel is manufactured by a high efficiency solar panel manufacturing method, comprising: and the step of carrying out lamination or glue sealing treatment among the protective plate, the solar cell and the back plate comprises the following steps:
the back plate, the solar cell piece and the protective plate are sequentially laid, so that the surface of the back plate, which is provided with the ion layer, is adjacent to the solar cell piece, and the surface of the solar cell piece, which is provided with the solar wafer, is adjacent to the protective plate.
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| CN202011478069.7A CN112289893A (en) | 2020-12-15 | 2020-12-15 | Efficient solar panel manufacturing method |
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| CN202011478069.7A CN112289893A (en) | 2020-12-15 | 2020-12-15 | Efficient solar panel manufacturing method |
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Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101217168A (en) * | 2007-12-26 | 2008-07-09 | 王东旗 | A solar panel and the corresponding manufacturing method |
| WO2012053042A1 (en) * | 2010-10-19 | 2012-04-26 | Fujifilm Corporation | Solar cell module and method of manufacturing the same |
| CN102740595A (en) * | 2012-06-15 | 2012-10-17 | 杨东 | Solar cell panel having serial connection or parallel connection structure and manufacturing method for solar cell panel |
| CN202839697U (en) * | 2012-10-10 | 2013-03-27 | 广东汉能光伏有限公司 | Novel building integrated photovoltaics (BIPV) solar cell module |
| CN103022199A (en) * | 2012-12-27 | 2013-04-03 | 张保宏 | BIPV (building integrated photovoltaic) solar module and manufacturing method thereof |
| CN103413847A (en) * | 2013-08-22 | 2013-11-27 | 烟台斯坦普精工建设有限公司 | Photovoltaic tile on roof and manufacturing method thereof |
| CN103681900A (en) * | 2013-12-25 | 2014-03-26 | 厦门大学 | Ni-doped crystalline silicon intermediate zone material and preparation method thereof |
| CN103956399A (en) * | 2014-04-16 | 2014-07-30 | 江苏盎华光伏工程技术研究中心有限公司 | Silicon solar cell backboard and manufacturing method thereof |
| US8987754B1 (en) * | 2013-09-16 | 2015-03-24 | Sandia Corporation | Highly directional thermal emitter |
| CN104638037A (en) * | 2015-02-14 | 2015-05-20 | 厦门大学 | Nickel-doped mono-crystalline silicon material with pn junction structure and preparation method thereof |
| CN107060222A (en) * | 2017-06-12 | 2017-08-18 | 合肥欧仕嘉机电设备有限公司 | A kind of roofing photovoltaic waterproof roll and preparation method |
| CN209447823U (en) * | 2018-12-27 | 2019-09-27 | 汉能移动能源控股集团有限公司 | A kind of plate and solar components |
| CN209832839U (en) * | 2018-12-27 | 2019-12-24 | 汉能移动能源控股集团有限公司 | Panel and solar energy component |
| CN112018201A (en) * | 2019-05-28 | 2020-12-01 | 广东汉能薄膜太阳能有限公司 | Solar cell module laminating process |
-
2020
- 2020-12-15 CN CN202011478069.7A patent/CN112289893A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101217168A (en) * | 2007-12-26 | 2008-07-09 | 王东旗 | A solar panel and the corresponding manufacturing method |
| WO2012053042A1 (en) * | 2010-10-19 | 2012-04-26 | Fujifilm Corporation | Solar cell module and method of manufacturing the same |
| CN102740595A (en) * | 2012-06-15 | 2012-10-17 | 杨东 | Solar cell panel having serial connection or parallel connection structure and manufacturing method for solar cell panel |
| CN202839697U (en) * | 2012-10-10 | 2013-03-27 | 广东汉能光伏有限公司 | Novel building integrated photovoltaics (BIPV) solar cell module |
| CN103022199A (en) * | 2012-12-27 | 2013-04-03 | 张保宏 | BIPV (building integrated photovoltaic) solar module and manufacturing method thereof |
| CN103413847A (en) * | 2013-08-22 | 2013-11-27 | 烟台斯坦普精工建设有限公司 | Photovoltaic tile on roof and manufacturing method thereof |
| US8987754B1 (en) * | 2013-09-16 | 2015-03-24 | Sandia Corporation | Highly directional thermal emitter |
| CN103681900A (en) * | 2013-12-25 | 2014-03-26 | 厦门大学 | Ni-doped crystalline silicon intermediate zone material and preparation method thereof |
| CN103956399A (en) * | 2014-04-16 | 2014-07-30 | 江苏盎华光伏工程技术研究中心有限公司 | Silicon solar cell backboard and manufacturing method thereof |
| CN104638037A (en) * | 2015-02-14 | 2015-05-20 | 厦门大学 | Nickel-doped mono-crystalline silicon material with pn junction structure and preparation method thereof |
| CN107060222A (en) * | 2017-06-12 | 2017-08-18 | 合肥欧仕嘉机电设备有限公司 | A kind of roofing photovoltaic waterproof roll and preparation method |
| CN209447823U (en) * | 2018-12-27 | 2019-09-27 | 汉能移动能源控股集团有限公司 | A kind of plate and solar components |
| CN209832839U (en) * | 2018-12-27 | 2019-12-24 | 汉能移动能源控股集团有限公司 | Panel and solar energy component |
| CN112018201A (en) * | 2019-05-28 | 2020-12-01 | 广东汉能薄膜太阳能有限公司 | Solar cell module laminating process |
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