CN112268627A - Temperature rise fault monitoring system - Google Patents
Temperature rise fault monitoring system Download PDFInfo
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- CN112268627A CN112268627A CN202011109582.9A CN202011109582A CN112268627A CN 112268627 A CN112268627 A CN 112268627A CN 202011109582 A CN202011109582 A CN 202011109582A CN 112268627 A CN112268627 A CN 112268627A
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 39
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 10
- 239000003990 capacitor Substances 0.000 claims description 253
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- 238000003199 nucleic acid amplification method Methods 0.000 description 7
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- 238000012423 maintenance Methods 0.000 description 4
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/024—Means for indicating or recording specially adapted for thermometers for remote indication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
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Abstract
Temperature rise fault monitoring system belongs to fault monitoring technical field, especially relates to a temperature rise fault monitoring system. The invention provides a temperature rise fault monitoring system with a good using effect. The temperature measurement device comprises a temperature sensor, a temperature collector and a data transmission part, and is characterized in that the temperature collector collects temperature measurement signals sent by the temperature sensor, and a signal output port of the temperature collector is connected with a signal input port of the data transmission part.
Description
Technical Field
The invention belongs to the technical field of fault monitoring, and particularly relates to a temperature rise fault monitoring system.
Background
The power switch cabinet is an important electrical device of a power plant and a transformer substation. In the long-term operation process of the electric contacts in the switch cabinet and the loop cabinet, the impedance of the electric contacts is easily increased and the contact surfaces are oxidized due to long-term overload and loose joints at the joints or the joints of the bus bars, and local overheating and fire disasters are easily caused under the action of strong current and high voltage. Through the monitoring to power switch cabinet temperature, can know the operational aspect of power switch cabinet in real time, when monitoring the temperature rise trouble, can report to the police immediately and inform the information of maintainer fault point, in time eliminate the trouble hidden danger.
Disclosure of Invention
The invention aims at the problems and provides a temperature rise fault monitoring system with a good using effect.
In order to achieve the purpose, the invention adopts the following technical scheme that the temperature sensor comprises a temperature sensor, a temperature collector and a data transmission part, and is characterized in that the temperature collector collects temperature measurement signals sent by the temperature sensor, and a signal output port of the temperature collector is connected with a signal input port of the data transmission part.
As a preferable scheme, the temperature sensor adopts a passive wireless temperature sensor.
In another preferred embodiment, the signal of the passive wireless temperature sensor of the present invention is JT-CT-012430.
As another preferred scheme, the passive wireless temperature sensor is fixedly connected with a device to be measured through a heat-conducting adhesive.
As another preferable scheme, the temperature sensor of the present invention is plural, and the interval between adjacent temperature sensors is not less than 10 CM.
As another preferred scheme, the temperature collector of the present invention includes an RFID core circuit and an RFID control circuit, and a signal transmission port of the RFID control circuit is connected to a signal transmission port of the RFID core circuit.
As another preferred scheme, the RFID core circuit of the present invention includes a radio frequency module, a power amplification section, an antenna, a single chip microcomputer, and a power supply module, wherein a signal input port of the single chip microcomputer is connected to a signal output port of the radio frequency module, a signal input port of the radio frequency module is tapped with the antenna through the power amplification section, and a power output port of the power supply module is connected to a power input port of the single chip microcomputer, a power input port of the radio frequency module, and a power input port of the power amplification section.
AS another preferred scheme, the radio frequency module of the invention includes an AS3991 chip U4, a pin 49 of U4 is connected to CLKSYS, a pin 50 of U4 is connected to CLK, a pin 51 of U4 is respectively connected to a pin 38 of U4, one end of a capacitor C4, one end of a capacitor C5, and 3V3, and the other end of the capacitor C4 and the other end of a capacitor C5 are grounded;
a pin 52 of the U4 is respectively connected with one end of a capacitor C17 and one end of a capacitor C11, and the other end of the C17 is respectively connected with the other end of the C11, one end of a capacitor C16, one end of a capacitor C15, one end of a capacitor C14, one end of a capacitor C10 and the ground; the other end of the capacitor C14 and the other end of the capacitor C10 are connected with a pin 54 of the U4, and the other end of the capacitor C16 and the other end of the capacitor C15 are connected with a pin 53 of the U4;
a pin 59 of the U4 is respectively connected with one end of a capacitor C23 and one end of a capacitor C24, and the other end of the capacitor C23 and the other end of the capacitor C24 are grounded;
a pin 60 of U4 is respectively connected with one end of a capacitor C25 and one end of a resistor R9 through a resistor R8, the other end of C25 is grounded, the other end of R9 is respectively connected with one end of a resistor R10, a pin 62 of U4 and one end of a capacitor C32, the other end of C32 is grounded, the other end of R10 is respectively connected with one end of a capacitor C30 and one end of a capacitor C31, and the other end of the capacitor C30 and the other end of the capacitor C31 are grounded;
a pin 63 of the U4 is respectively connected with one end of a capacitor C33 and one end of a capacitor C34, and the other end of the capacitor C33 and the other end of the capacitor C34 are grounded;
5V is respectively connected with one end of a capacitor C52 and one end of a capacitor C53, and the other end of the capacitor C52 and the other end of the capacitor C53 are grounded;
a 64 pin of the U4 is respectively connected with one end of a capacitor C50, one end of a capacitor C43, one end of a capacitor C44, one end of a capacitor C45, a 5 pin of the U4, a 13 pin of the U4, one end of a capacitor C48, one end of a capacitor C47, one end of a capacitor C49 and a 15 pin of the U4 through a capacitor C42, the other end of the C50, the other end of the C48 and the other end of the C49 are grounded, the other end of the C43 is connected with a 1 pin of the U4, the other end of the C44 is connected with a 2 pin of the U4, the other end of the C45 is connected with a 3 pin of the U4, the other end of the C47;
a pin 16 of the U4 is respectively connected with a pin 17 of the 5V, U4, one end of a capacitor C40 and one end of a capacitor C41, and the other end of the capacitor C40 and the other end of the capacitor C41 are grounded;
a pin 19 of the U4 is respectively connected with one end of a capacitor C36, one end of a capacitor C37, one end of a capacitor C20, one end of a capacitor C21, one end of an inductor L3 and one end of an inductor L5, the other end of the capacitor C36, the other end of the capacitor C37, the other end of the capacitor C20 and the other end of the capacitor C21 are grounded, the other end of the L5 is respectively connected with a pin 32 of the U4, one end of the capacitor C28 and one end of the capacitor C13, the other end of the C28 is connected with a pin 6 of a Balun _0900BL18B100 chip T3, and a pin 4 of the T3 is respectively connected with the other end of the L3, the other;
a pin 34 of the U4 is respectively connected with one end of a capacitor C8 and one end of a capacitor C9;
a pin 37 of U4 is respectively connected with one end of a capacitor C79 and one end of a resistor R14 through a capacitor C78, the other end of C79 is grounded, the other end of R14 is connected with a pin 3 of an X1 of the TCXO chip, pins 1 and 2 of X1 are grounded, a pin 4 of X1 is respectively connected with one ends of 3V3 and the capacitor C55, and the other end of C55 is grounded;
As another preferable scheme, the power amplification part of the invention includes an SPA-2118 chip U11, where a pin 1 of the U11 is respectively connected to a pin 4V5, a pin L4, a pin C70, a pin C71, a pin C73, a pin C72, and a pin L9, another pin L4 is respectively connected to a pin 2 of a resistor R15 and a pin U11, another pin R15 is respectively connected to a pin 3 of a capacitor C68 and a pin U11, another pin C68 is respectively connected to a pin 2 of a capacitor C67 and a pin 2 of a Balun _0900BL18B100 chip T3, another pin C67 is grounded, another pin 4 of the U11 is respectively connected to a pin R21 and a pin C69, another pin R21 is connected to a pin 4V5, and another pin C69 is grounded;
the other end of the L9 is respectively connected with a pin 5 of the U11, a pin 6 of the U11, a pin 7 of the U11, a pin 8 of the U11, one end of a capacitor C75 and one end of a capacitor C74, the other end of the C75 is grounded, the other end of the C74 is connected with a pin 1 of the LFCN-1000D + chip U6, a pin 2 of the U6 is connected with a pin 4 of the Coupler _ RCP890A05 chip T2, a pin 1 of the T2 is connected with an antenna J1, a pin 2 of the T2 is respectively connected with one end of a resistor R11 and one end of a resistor R12, and the other end of the resistor R11 and the other end; the pin 3 of the T2 is connected with the pin 2 of the Balun _0900BL18B100 chip T4 through the C51, the pin 4 of the T4 is connected with the pin 9 of the AS3991 chip U4 through the capacitor C76, and the pin 6 of the T4 is connected with the pin 7 of the AS3991 chip U4 through the capacitor C77.
As another preferable scheme, the singlechip adopts a chip U1 of C8051F340, a pin 11 of U1 is respectively connected with a pin 10 of 3V3 and U1 and one end of a capacitor C1, and the other end of C1 is grounded;
the 12 pins of U1 are respectively connected with 5V and one end of an inductor L1, the other end of L1 is respectively connected with the 1 pin of a USB connector J46, one end of a resistor R3 and the 1 pin of a USB _ Mini _ B connector J11, and the other end of R3 is connected with J5;
the pin 13 of U1 is respectively connected with one end of a resistor R2 and one end of a resistor R4, the other end of R2 is respectively connected with one end of a capacitor C3, one end of a capacitor C2, one end of a resistor R1, one end of a Reset connector J40 and one end of a switch S1, the other end of S1 is respectively connected with the other end of J40 and the ground, the other end of R1 is connected with 3V3, the other end of the capacitor C3 and the other end of a capacitor C2 are grounded, and the other end of R4 is connected with the pin 15 of;
the 8 feet of U1 are respectively connected with the 2 feet of J46 and the 3 feet of J11;
the 9 feet of U1 are respectively connected with the 3 feet of J46 and the 2 feet of J11;
the pin 22 of the U1 is connected with the cathode of a light-emitting diode D4, and the anode of D4 is connected with 3V3 through a resistor R23;
the pin 21 of the U1 is connected with the cathode of a light-emitting diode D5, and the anode of D5 is connected with 3V3 through a resistor R24;
the pins 17 and 16 of the U1 are correspondingly connected with the pins 2 and 3 of the SBUS connector J45 respectively,
the pin 36 of the U1 is connected with the cathode of the light emitting diode D1 through a resistor R5, and the anode of the D1 is connected with 3V 3;
pins 39-46 of U1 are correspondingly connected with IO 7-IO 0 respectively;
the pin 3 of U1 is connected with IRQ, and the pin 4 of U1 is connected with PA _ xON;
AS another preferred solution, the power module according to the present invention includes an AS1340_ TDFN8 chip U7, an AS1340_ TDFN8 chip U8, an AS1326A _ TDFN10 chip U9, and an AS1364_ TDFN8 chip U10, where a pin 2 of U7 is respectively connected to one end of an inductor L7, a pin 1 of U7, one end of a capacitor C22, one end of a capacitor C19, one end of an inductor L19, one end of a resistor R19, a cathode of a schottky diode D19, one end of a fuse F19, the other end of F19 is connected to 3.6V, an anode of D19 is respectively connected to ground, the other end of a capacitor C19, the other end of a pin 9 of a capacitor C19, a pin 7 of a U19, one end of a resistor R19, one end of a capacitor C19, a terminal of a capacitor C19, a pin 72, a terminal of a capacitor C19, one end of a capacitor C61, one end of a capacitor C64, the pin 8 of U10, the pin 9 of U10, one end of a resistor R29 and one end of a capacitor C65 are connected;
the other end of the L7 is respectively connected with a pin 5 of the U7 and the anode of a Schottky diode D2, the cathode of the D2 is respectively connected with one end of a capacitor C56, one end of a resistor R16, 5.5V, the other end of a capacitor C80, the other end of a capacitor C59, the other end of a capacitor C57, a pin 3 of U8, a pin 4 of U8, a pin 2 of U8 and one end of a resistor R25, the other end of the R25 is respectively connected with a pin 6 of U8, a pin 5 of U8, one end of the resistor R28, 5V and the other end of the capacitor C58, and the other end of the R28 is respectively connected with a pin 7 of U8 and;
the other end of the L8 is connected with an 8 pin of a U9, the other end of the R22 is respectively connected with a 10 pin of PA _ xON and U9, the other end of the C9 is respectively connected with a 1 pin and a 2 pin of the U9, a 4 pin of the U9 is respectively connected with the other end of the R9 and one end of a resistor R9, the other end of the R9 is respectively connected with a 5 pin of the U9, the other end of the C9 and one end of the resistor R9, the other end of the R9 is respectively connected with a 9 pin of the U9, the other end of the C9, the other end of the 5.0 9, one end of the resistor R9, a 3 pin of the U9 and a 4 pin of the U9, the other end of the R9 is respectively connected with an EN _ PA and a 2 pin of the U9, the other end of the R9 is respectively connected with a 5 pin of the U9, a 6 pin of the U36.
As another preferred scheme, the RFID control circuit of the present invention includes an SP-10S5-CE type 5V SOURCE chip, an admm 1201 chip, a MAX485 type 485 chip, a TLV1117LV33DCYR chip, wherein a pin 1 of the 5V SOURCE chip is connected to an anode of a diode D1, a cathode of D1 is connected to one end of a resistor R2 and a 5V-RF, respectively, the other end of R2 is connected to an anode of a light emitting diode LD2, and a cathode of LD2 is connected to GND; 3 pins of the 5V SOURCE chip are connected with L, and 4 pins of the 5V SOURCE chip are connected with N;
pins 1-7 of the 485 chip are correspondingly connected with 5Vin, RXDOUT, TXDOUT, GND, 485A, 485B and 485G respectively;
the 3 pins of the TLV1117LV33DCYR chip are respectively connected with the 5Vin, the anode of a capacitor CT1 and one end of a capacitor C3, the cathode of CT1 is respectively connected with the other end of C3, GND, the 1 pin of the TLV1117LV33DCYR chip, one end of a capacitor C4, the cathode of a capacitor CT2 and the cathode of a light-emitting diode LD1, the 2 pins of the TLV1117LV33DCYR chip are respectively connected with the other end of C4, the anode of 3V3-1, the anode of CT2 and one end of a resistor R1, and the other end of R1 is connected with the anode of LD 1.
As another preferred scheme, the data transmission part of the invention comprises a power supply part, a transmission module, a single chip microcomputer and a transceiver, wherein an electric energy output port of the power supply part is respectively connected with an electric energy input port of the transmission module, an electric energy input port of the single chip microcomputer and an electric energy input port of the transceiver, a signal input port of the transceiver is connected with a signal output port of the temperature collector, a signal output port of the transceiver is connected with a signal input port of the single chip microcomputer, and a signal output port of the single chip microcomputer is connected with a signal input port of the transmission module.
As another preferred scheme, the transmission module of the invention adopts a WH-NB73 chip U6, pins 1 and 2 of U6 are respectively connected to one end of a capacitor C2, an anode of a capacitor C10, an anode of a capacitor C9 and V BATT, a cathode of a capacitor C2, a cathode of a capacitor C10 and a cathode of a capacitor C9 are connected to GND, a pin 5 of U6 is connected to NB _ Reload, a pin 9 of U6 is connected to NB _ Reset, a pin 14 of U6 is connected to NB _ Work, a pin 35 of U6 is respectively connected to one end of a resistor txr 12 and a cathode of a light emitting diode LD1, another end of R12 is connected to RXD, an anode of LD 9 is respectively connected to VBATT and one end of a resistor R7 through a resistor rxr 10, another end of R7 is connected to an anode of the light emitting diode LD3, a cathode of LD3 is respectively connected to a pin 36 of U6 and one end of a resistor R36.
As another preferable scheme, the power supply part of the invention comprises an L5973D chip U3 and a TLV1117LV chip U7, wherein a pin 8 of U3 is respectively connected with VCC, a positive electrode of a capacitor C4 and a positive electrode of a capacitor C5, a negative electrode of a capacitor C4 and a negative electrode of a capacitor C5 are respectively connected with one end of a capacitor C7, one end of a resistor R9, a pin 3 of U3, a pin 7 of U3, an anode of a diode D2, one end of a resistor R8, a negative electrode of a capacitor C6 and GND, and the other end of R9 is respectively connected with the other end of C7 and a pin 4 of U3 through a capacitor C8; a pin 5 of the U3 is respectively connected with the other end of a resistor R8 and one end of a resistor R3, the other end of the R3 is respectively connected with one end of an inductor L1, the positive electrode of C6, VBATT and one end of a capacitor C3, and the other end of the C3 is connected with GND; the other end of the L1 is respectively connected with a pin 1 of the U3 and a D2 cathode;
an INPUT end of the U7 is connected with VCC, an Output end of the U7 is respectively connected with an anode of a capacitor C100, 3.3V, one end of a capacitor C22 and an anode of a light emitting diode LED2, and a cathode of the LED2 is respectively connected with the ground, the GND end of the U7, the cathode of the C100 and the other end of the C22 through a resistor R27;
VBATT is connected with the anode of the light emitting diode LD2, and the cathode of the LD2 is connected with GND through a resistor R21.
As another preferred scheme, the single chip microcomputer adopts an STM32L476RGT6 chip U5, pins 16 and 17 of U5 are correspondingly connected with TXD and RXD respectively, pins 41, 42 and 43 of U5 are correspondingly connected with RS485_ EN, TXD1 and RXD1 respectively, pins 46 and 49 of U5 are correspondingly connected with SW _ DIO and SW _ CLK respectively, pin 5 of U5 is connected with pin 1 of CSTCE8M00G52 chip and one end of a resistor R13 respectively, pin 6 of U5 is connected with pin 3 of cstcce 8M00G52 chip and the other end of resistor R13 respectively, pin 60 of U5 is connected with GND and one end of a capacitor C13 respectively through a resistor R14, the other end of C13 is connected with pin 7 of U5, and 3.3V is connected with a capacitor C16; capacitors C23-C29 are connected between 3.3V and GND in parallel;
u5 has pin 29 connected to Arm _ Work.
As another preferable scheme, the transceiver of the invention adopts an SN75176B chip U2, a pin 1 of U2 is connected to a cathode of a diode D1, an anode of D1 is connected to one ends of RXD1 and a resistor R2, respectively, the other end of R2 is connected to 3.3V, a pin 2 of U2 is connected to a pin 3 of RS485_ EN and U2 and one end of a resistor R6, and a pin 4 of U2 is connected to TXD 1;
the other end of R6 is respectively connected with ground, the 5 pin of U2 and one end of a resistor R5, the other end of R5 is respectively connected with the 7 pin of U2, the B and one end of a resistor R4, the other end of R4 is respectively connected with the A, one end of a resistor R1 and the 6 pin of U2, the other end of R1 is respectively connected with one end of a capacitor C1, the 8 pin of U2 and VCC, and the other end of C1 is grounded.
As another preferable scheme, the data transmission part of the invention comprises an NPN triode Q1, the collector of Q1 is connected to NB _ Reload and one end of a capacitor C12, respectively, and the other end of C12 is connected to GND; the base of Q1 is connected with one end of a resistor R17 and one end of a resistor R18 respectively, the other end of R17 is connected with Reload, and the other end of R18 is connected with the emitter of Q1 and GND respectively.
As another preferred scheme, the data transmission part of the invention comprises an NPN triode Q2, the collector of Q2 is respectively connected with NB _ Reset and one end of a capacitor C11, and the other end of C11 is connected with GND; the base of Q2 is connected with one end of a resistor R23 and one end of a resistor R24 respectively, the other end of R23 is connected with Reset, and the other end of R24 is connected with the emitter of Q2 and GND respectively.
Secondly, the data transmission part of the invention comprises an NPN triode Q3, wherein the collector of the Q3 is respectively connected with the cathode of a diode LED1 and one end of a capacitor C14, the other end of the C14 is connected with GND, and the anode of an LED1 is connected with VBATT through a resistor R15; the base of Q3 is connected with one end of resistor R19 and one end of resistor R22 respectively, the other end of R19 is connected with NB _ Work, and the other end of R22 is connected with the emitter of Q3 and GND respectively.
In addition, the data transmission part of the invention comprises an NPN triode Q4, wherein the collector of the Q4 is respectively connected with the cathode of the LED3 and one end of a capacitor C15, the other end of the C15 is connected with GND, and the anode of the LED3 is connected with VBATT through a resistor R16; the base of Q4 is connected with one end of a resistor R20 and one end of a resistor R25 respectively, the other end of R20 is connected with Arm _ Work, and the other end of R25 is connected with the emitter of Q4 and GND respectively.
The invention has the beneficial effects.
The temperature sensor can measure the temperature of a measured point, the temperature collector collects temperature measurement signals sent by the temperature sensor, the temperature collector sends the collected temperature measurement signals to the data transmission part, and the data transmission part can send the temperature measurement information to the server, so that equipment maintenance personnel can conveniently monitor the temperature of the equipment, and the hidden trouble of the equipment can be eliminated in time.
Drawings
The invention is further described with reference to the following figures and detailed description. The scope of the invention is not limited to the following expressions.
Fig. 1 is a schematic circuit diagram of a power module of the present invention.
Fig. 2 is a schematic diagram of the rf module circuit of the present invention.
Fig. 3, 4 and 5 are partially enlarged views of fig. 2.
Fig. 6 is a schematic diagram of the RFID control circuit of the present invention.
Fig. 7 is a schematic circuit diagram of a transmission module of the present invention.
Fig. 8 and 10 are schematic diagrams of the circuit of the single chip microcomputer.
Fig. 9 is a schematic circuit diagram of a data transmission portion of the present invention.
Detailed Description
As shown in the figure, the temperature measurement device comprises a temperature sensor, a temperature collector and a data transmission part, wherein the temperature collector collects temperature measurement signals sent by the temperature sensor, and a signal output port of the temperature collector is connected with a signal input port of the data transmission part.
The temperature sensor adopts a passive wireless temperature sensor (a sensor with model number of JT-CT-012430 can be adopted); the installation and the maintenance are convenient.
The passive wireless temperature sensor is fixedly connected with the equipment to be measured through the heat-conducting adhesive. The real-time temperature of the collected temperature equipment is transferred to the temperature sensor through the heat-conducting adhesive.
The temperature sensors are multiple, and the interval between every two adjacent temperature sensors is not less than 10 CM; the wireless signal interference between the sensors is effectively weakened.
The temperature collector comprises an RFID core circuit and an RFID control circuit, and a signal transmission port of the RFID control circuit is connected with a signal transmission port of the RFID core circuit.
The RFID core circuit comprises a radio frequency module, a power amplification part, an antenna, a single chip microcomputer and a power supply module, wherein a signal input port of the single chip microcomputer is connected with a signal output port of the radio frequency module, a signal input port of the radio frequency module is connected with the antenna in a branching mode through the power amplification part, and an electric energy output port of the power supply module is connected with an electric energy input port of the single chip microcomputer, an electric energy input port of the radio frequency module and an electric energy input port of the.
The radio frequency module comprises an AS3991 chip U4, a pin 49 of U4 is connected with CLKSYS, a pin 50 of U4 is connected with CLK, a pin 51 of U4 is respectively connected with a pin 38 of U4, one end of a capacitor C4, one end of a capacitor C5 and 3V3, and the other end of the capacitor C4 and the other end of the capacitor C5 are grounded;
a pin 52 of the U4 is respectively connected with one end of a capacitor C17 and one end of a capacitor C11, and the other end of the C17 is respectively connected with the other end of the C11, one end of a capacitor C16, one end of a capacitor C15, one end of a capacitor C14, one end of a capacitor C10 and the ground; the other end of the capacitor C14 and the other end of the capacitor C10 are connected with a pin 54 of the U4, and the other end of the capacitor C16 and the other end of the capacitor C15 are connected with a pin 53 of the U4;
a pin 59 of the U4 is respectively connected with one end of a capacitor C23 and one end of a capacitor C24, and the other end of the capacitor C23 and the other end of the capacitor C24 are grounded;
a pin 60 of U4 is respectively connected with one end of a capacitor C25 and one end of a resistor R9 through a resistor R8, the other end of C25 is grounded, the other end of R9 is respectively connected with one end of a resistor R10, a pin 62 of U4 and one end of a capacitor C32, the other end of C32 is grounded, the other end of R10 is respectively connected with one end of a capacitor C30 and one end of a capacitor C31, and the other end of the capacitor C30 and the other end of the capacitor C31 are grounded;
a pin 63 of the U4 is respectively connected with one end of a capacitor C33 and one end of a capacitor C34, and the other end of the capacitor C33 and the other end of the capacitor C34 are grounded;
5V is respectively connected with one end of a capacitor C52 and one end of a capacitor C53, and the other end of the capacitor C52 and the other end of the capacitor C53 are grounded;
a 64 pin of the U4 is respectively connected with one end of a capacitor C50, one end of a capacitor C43, one end of a capacitor C44, one end of a capacitor C45, a 5 pin of the U4, a 13 pin of the U4, one end of a capacitor C48, one end of a capacitor C47, one end of a capacitor C49 and a 15 pin of the U4 through a capacitor C42, the other end of the C50, the other end of the C48 and the other end of the C49 are grounded, the other end of the C43 is connected with a 1 pin of the U4, the other end of the C44 is connected with a 2 pin of the U4, the other end of the C45 is connected with a 3 pin of the U4, the other end of the C47;
a pin 16 of the U4 is respectively connected with a pin 17 of the 5V, U4, one end of a capacitor C40 and one end of a capacitor C41, and the other end of the capacitor C40 and the other end of the capacitor C41 are grounded;
a pin 19 of the U4 is respectively connected with one end of a capacitor C36, one end of a capacitor C37, one end of a capacitor C20, one end of a capacitor C21, one end of an inductor L3 and one end of an inductor L5, the other end of the capacitor C36, the other end of the capacitor C37, the other end of the capacitor C20 and the other end of the capacitor C21 are grounded, the other end of the L5 is respectively connected with a pin 32 of the U4, one end of the capacitor C28 and one end of the capacitor C13, the other end of the C28 is connected with a pin 6 of a Balun _0900BL18B100 chip T3, and a pin 4 of the T3 is respectively connected with the other end of the L3, the other;
a pin 34 of the U4 is respectively connected with one end of a capacitor C8 and one end of a capacitor C9;
a pin 37 of U4 is respectively connected with one end of a capacitor C79 and one end of a resistor R14 through a capacitor C78, the other end of C79 is grounded, the other end of R14 is connected with a pin 3 of an X1 of the TCXO chip, pins 1 and 2 of X1 are grounded, a pin 4 of X1 is respectively connected with one ends of 3V3 and the capacitor C55, and the other end of C55 is grounded;
pins 39 of U4 are connected with EN, pins 40 of U4 are connected with IRQ, and pins 41-48 of U4 are correspondingly connected with IO 0-IO 7 respectively.
The power amplification part comprises an SPA-2118 chip U11, wherein a pin 1 of U11 is respectively connected with a pin 4V5, a pin 2 of an inductor L4, a pin C70, a pin C71, a pin C73, a pin C72 and a pin L9, the other end of L4 is respectively connected with a pin 2 of a resistor R15 and a pin U11, the other end of R15 is respectively connected with a pin 3 of a capacitor C68 and a pin U11, the other end of C68 is respectively connected with a pin 2 of a capacitor C67 and a pin 2 of a Balun _0900BL18B100 chip T3, the other end of C67 is grounded, a pin 4 of U11 is respectively connected with a pin R21 and a pin C69, the other end of R21 is connected with a pin 4V5, and the other end of C69 is grounded;
the other end of the L9 is respectively connected with a pin 5 of the U11, a pin 6 of the U11, a pin 7 of the U11, a pin 8 of the U11, one end of a capacitor C75 and one end of a capacitor C74, the other end of the C75 is grounded, the other end of the C74 is connected with a pin 1 of the LFCN-1000D + chip U6, a pin 2 of the U6 is connected with a pin 4 of the Coupler _ RCP890A05 chip T2, a pin 1 of the T2 is connected with an antenna J1, a pin 2 of the T2 is respectively connected with one end of a resistor R11 and one end of a resistor R12, and the other end of the resistor R11 and the other end; the pin 3 of the T2 is connected with the pin 2 of the Balun _0900BL18B100 chip T4 through the C51, the pin 4 of the T4 is connected with the pin 9 of the AS3991 chip U4 through the capacitor C76, and the pin 6 of the T4 is connected with the pin 7 of the AS3991 chip U4 through the capacitor C77. T4 converts the single-ended rf signal to a differential signal to match the impedance of the differential signal to the single-ended signal.
The single chip microcomputer adopts a C8051F340 chip U1, a pin 11 of U1 is respectively connected with a pin 10 of 3V3 and U1 and one end of a capacitor C1, and the other end of C1 is grounded;
the 12 pins of U1 are respectively connected with 5V and one end of an inductor L1, the other end of L1 is respectively connected with 1 pin of a USB connector J46 (J46 can be used as a test point of hardware setting for convenient test), one end of a resistor R3 and 1 pin of a USB _ Mini _ B connector (USB can be used as a debugging interface) J11, and the other end of R3 is connected with J5;
the pin 13 of U1 is respectively connected with one end of a resistor R2 and one end of a resistor R4, the other end of R2 is respectively connected with one end of a capacitor C3, one end of a capacitor C2, one end of a resistor R1, one end of a Reset connector J40 and one end of a switch S1, the other end of S1 is respectively connected with the other end of J40 and the ground, the other end of R1 is connected with 3V3, the other end of the capacitor C3 and the other end of a capacitor C2 are grounded, and the other end of R4 is connected with the pin 15 of;
the 8 feet of U1 are respectively connected with the 2 feet of J46 and the 3 feet of J11;
the 9 feet of U1 are respectively connected with the 3 feet of J46 and the 2 feet of J11;
the pin 22 of U1 is connected with the cathode of LED D4 (used for reading and writing indication of equipment), the anode of D4 is connected with 3V3 through resistor R23;
the pin 21 of U1 is connected with the cathode of a light emitting diode D5 (which can be used for reading and writing indication of equipment), and the anode of D5 is connected with 3V3 through a resistor R24;
the pins 17 and 16 of the U1 are correspondingly connected with the pins 2 and 3 of the SBUS connector J45 respectively,
the pin 36 of the U1 is connected with the cathode of a light emitting diode D1 (which can be used for indicating the working state of equipment) through a resistor R5, and the anode of the D1 is connected with 3V 3;
pins 39-46 of U1 are correspondingly connected with IO 7-IO 0 respectively;
the pin 3 of U1 is connected with IRQ, and the pin 4 of U1 is connected with PA _ xON;
J2-J43 can be used as a test point of hardware, and a signal can be conveniently tested. J45 can be used for power supply connection and signal input and output.
The power module comprises an AS1340_ TDFN8 chip U7, an AS1340_ TDFN8 chip U8, an AS1326A _ TDFN10 chip U9 and an AS1364_ TDFN8 chip U10, wherein a pin 2 of U7 is respectively connected with one end of an inductor L7, one end of a capacitor C7, one end of a resistor R7, a cathode of a Schottky diode D7, one end of a fuse F7, the other end of F7 is connected with 3.6V, an anode of D7 is respectively connected with the ground, the other end of the capacitor C7, the pin 9 of the U7, the pin 7 of the U7, one end of the resistor R7, one end of the capacitor C7, the other end of the capacitor C7, one end of the capacitor U7, the other end of the capacitor U7, the pin 8 of the U10, the pin 9 of the U10, one end of a resistor R29 and one end of a capacitor C65 are connected;
the other end of the L7 is respectively connected with a pin 5 of the U7 and the anode of a Schottky diode D2, the cathode of the D2 is respectively connected with one end of a capacitor C56, one end of a resistor R16, 5.5V, the other end of a capacitor C80, the other end of a capacitor C59, the other end of a capacitor C57, a pin 3 of U8, a pin 4 of U8, a pin 2 of U8 and one end of a resistor R25, the other end of the R25 is respectively connected with a pin 6 of U8, a pin 5 of U8, one end of the resistor R28, 5V and the other end of the capacitor C58, and the other end of the R28 is respectively connected with a pin 7 of U8 and;
the other end of the L8 is connected with an 8 pin of a U9, the other end of the R22 is respectively connected with a 10 pin of PA _ xON and U9, the other end of the C9 is respectively connected with a 1 pin and a 2 pin of the U9, a 4 pin of the U9 is respectively connected with the other end of the R9 and one end of a resistor R9, the other end of the R9 is respectively connected with a 5 pin of the U9, the other end of the C9 and one end of the resistor R9, the other end of the R9 is respectively connected with a 9 pin of the U9, the other end of the C9, the other end of the 5.0 9, one end of the resistor R9, a 3 pin of the U9 and a 4 pin of the U9, the other end of the R9 is respectively connected with an EN _ PA and a 2 pin of the U9, the other end of the R9 is respectively connected with a 5 pin of the U9, a 6 pin of the U36.
The RFID control circuit comprises an SP-10S5-CE type 5V SOURCE chip, an ADUM1201 chip, an MAX485 type 485 chip and a TLV1117LV33DCYR chip, wherein a pin 1 of the 5V SOURCE chip is connected with the anode of a diode D1, the cathode of D1 is respectively connected with one end of a 5V-RF resistor R2, the other end of R2 is connected with the anode of a light-emitting diode LD2, and the cathode of LD2 is connected with GND; 3 pins of the 5V SOURCE chip are connected with L, and 4 pins of the 5V SOURCE chip are connected with N;
pins 1-7 of the 485 chip are correspondingly connected with 5Vin, RXDOUT, TXDOUT, GND, 485A, 485B and 485G respectively;
the 3 pins of the TLV1117LV33DCYR chip are respectively connected with the 5Vin, the anode of a capacitor CT1 and one end of a capacitor C3, the cathode of CT1 is respectively connected with the other end of C3, GND, the 1 pin of the TLV1117LV33DCYR chip, one end of a capacitor C4, the cathode of a capacitor CT2 and the cathode of a light-emitting diode LD1, the 2 pins of the TLV1117LV33DCYR chip are respectively connected with the other end of C4, the anode of 3V3-1, the anode of CT2 and one end of a resistor R1, and the other end of R1 is connected with the anode of LD 1.
The RFID U3 in fig. 6 represents an RFID core circuit. TXDIN and RXDIN of the RFID control circuit are respectively and correspondingly connected with 17 and 16 pins of a chip U1 of a singlechip C8051F340 of the RFID core circuit; the 5V-RF of the RFID control circuit is connected with the 3.6V of the power module of the RFID core circuit. In the RFID control circuit, the actual voltage of 5V-RF is about 3.6V-3.8V, and the 5V voltage of 5Vin is converted into 3.6V-3.8V corresponding to 5V-RF due to the voltage drop of a diode D1.
The RFID control circuit provides a power supply for the RFID core circuit, and simultaneously converts signals of serial TTL levels of the RFID into 485 levels, so that the anti-interference performance is improved.
The data transmission part comprises a power supply part, a transmission module, a single chip microcomputer and a transceiver, wherein an electric energy output port of the power supply part is respectively connected with an electric energy input port of the transmission module, an electric energy input port of the single chip microcomputer and an electric energy input port of the transceiver, a signal input port of the transceiver is connected with a signal output port of the temperature collector, a signal output port of the transceiver is connected with a signal input port of the single chip microcomputer (the single chip microcomputer can read data transmitted by the temperature sensor, unpack the data and upload the packed data), and a signal output port of the single chip microcomputer is connected with the signal input port of the.
The transmission module adopts a WH-NB73 chip U6 (U6 converts RXD and TXD corresponding signals into corresponding wireless signals, pin 41 of U6 is an interface of a radio frequency antenna), pins 1 and 2 of U6 are respectively connected with one end of a capacitor C2, the anode of a capacitor C10, the anode of a capacitor C9 and V BATT, the other end of the capacitor C2, the cathode of a capacitor C10 and the cathode of a capacitor C9 are connected with GND, pin 5 of U6 is connected with NB _ Reload, pin 9 of U6 is connected with NB _ Reset, pin 14 of U6 is connected with NB _ Work, pin 35 of U6 is respectively connected with one end of a resistor LD 12 and the cathode of a light emitting diode LD1, the other end of R12 is connected with RXD, the anode of LD1 is respectively connected with one end of VBATT and one end of a resistor R1, the other end of R1 is connected with an LD1, and the cathode 36 and the anode of U1 is respectively connected with one end of a resistor LD1 and the other end of the. LD1 and LD3 may be used to indicate transmission status.
The power supply part comprises an L5973D chip U3 and a TLV1117LV chip U7, wherein an 8 pin of the U3 is respectively connected with VCC, an anode of a capacitor C4 and an anode of a capacitor C5, a cathode of the capacitor C4 and a cathode of the capacitor C5 are respectively connected with one end of a capacitor C7, one end of a resistor R9, a 3 pin of the U3, a 7 pin of the U3, an anode of a diode D2, one end of a resistor R8, a cathode of the capacitor C6 and GND, and the other end of the R9 is respectively connected with the other end of the C7 and a 4 pin of the U3 through the capacitor C8; a pin 5 of the U3 is respectively connected with the other end of a resistor R8 and one end of a resistor R3, the other end of the R3 is respectively connected with one end of an inductor L1, the positive electrode of C6, VBATT and one end of a capacitor C3, and the other end of the C3 is connected with GND; the other end of the L1 is respectively connected with a pin 1 of the U3 and a D2 cathode;
an INPUT end of the U7 is connected with VCC, an Output end of the U7 is respectively connected with an anode of a capacitor C100, 3.3V, one end of a capacitor C22 and an anode of a light emitting diode LED2, and a cathode of the LED2 is respectively connected with the ground, the GND end of the U7, the cathode of the C100 and the other end of the C22 through a resistor R27;
VBATT is connected with the anode of the light emitting diode LD2, and the cathode of the LD2 is connected with GND through a resistor R21.
The single chip microcomputer adopts an STM32L476RGT6 chip U5, pins 16 and 17 of U5 are correspondingly connected with TXD and RXD respectively, pins 41, 42 and 43 of U5 are correspondingly connected with RS485_ EN, TXD1 and RXD1 respectively, pins 46 and 49 of U5 are correspondingly connected with SW _ DIO and SW _ CLK respectively, pin 5 of U5 is connected with pin 1 of CSCE 8M00G52 chip and one end of a resistor R13 respectively, pin 6 of U5 is connected with pin 3 of CSCE 8M00G52 chip and the other end of the resistor R13 respectively, pin 60 of U5 is connected with GND and one end of a capacitor C13 respectively through resistor R14, the other end of C13 is connected with pin 7 of U5, and 3.3 GND is connected with a capacitor C16; capacitors C23-C29 are connected between 3.3V and GND in parallel;
pins 52 and 53 of U5 are correspondingly connected with Reset and Reload respectively;
u5 has pin 29 connected to Arm _ Work.
The transceiver adopts an SN75176B chip U2, a pin 1 of U2 is connected with a cathode of a diode D1, an anode of the D1 is respectively connected with one ends of RXD1 and a resistor R2, the other end of the R2 is connected with 3.3V, a pin 2 of the U2 is respectively connected with a pin 3 of RS485_ EN and U2 and one end of a resistor R6, and a pin 4 of the U2 is connected with TXD 1;
the other end of R6 is respectively connected with ground, the 5 pin of U2 and one end of a resistor R5, the other end of R5 is respectively connected with the 7 pin of U2, the B and one end of a resistor R4, the other end of R4 is respectively connected with the A, one end of a resistor R1 and the 6 pin of U2, the other end of R1 is respectively connected with one end of a capacitor C1, the 8 pin of U2 and VCC, and the other end of C1 is grounded. A. B are correspondingly connected with 485A and 485B in the RFID control circuit respectively.
The data transmission part comprises an NPN triode Q1, the collector of the Q1 is respectively connected with one end of NB _ Reload and one end of a capacitor C12, and the other end of C12 is connected with GND; the base of Q1 is connected with one end of a resistor R17 and one end of a resistor R18 respectively, the other end of R17 is connected with Reload, and the other end of R18 is connected with the emitter of Q1 and GND respectively.
The data transmission part comprises an NPN triode Q2, the collector of the Q2 is respectively connected with NB _ Reset and one end of a capacitor C11, and the other end of the C11 is connected with GND; the base of Q2 is connected with one end of a resistor R23 and one end of a resistor R24 respectively, the other end of R23 is connected with Reset, and the other end of R24 is connected with the emitter of Q2 and GND respectively.
The data transmission part comprises an NPN triode Q3, the collector of the Q3 is respectively connected with the cathode of the LED1 and one end of a capacitor C14, the other end of the C14 is connected with GND, and the anode of the LED1 is connected with VBATT through a resistor R15; the base of Q3 is connected with one end of resistor R19 and one end of resistor R22 respectively, the other end of R19 is connected with NB _ Work, and the other end of R22 is connected with the emitter of Q3 and GND respectively.
The data transmission part comprises an NPN triode Q4, the collector of the Q4 is respectively connected with the cathode of the LED3 and one end of a capacitor C15, the other end of the C15 is connected with GND, and the anode of the LED3 is connected with VBATT through a resistor R16; the base of Q4 is connected with one end of a resistor R20 and one end of a resistor R25 respectively, the other end of R20 is connected with Arm _ Work, and the other end of R25 is connected with the emitter of Q4 and GND respectively.
The temperature collector transmits a radio frequency pulse (the radio frequency pulse is transmitted through J1 of the RFID core circuit) through the antenna to charge and activate the temperature sensor, and simultaneously sends a temperature measurement command (transmitted through J1) to the sensor, after the passive wireless temperature sensor receives the radio frequency pulse, the passive wireless temperature sensor transmits a radio frequency pulse signal containing node temperature information through the antenna of the sensor, and the temperature collector receives and demodulates (the function of a singlechip in the RFID core circuit) the radio frequency pulse signal to obtain the temperature information. The data transmission part sends the temperature information to the server, alarms and informs maintenance personnel of the information of the fault point, and the fault hidden danger is eliminated in time.
The temperature collector communicates with the temperature sensor and acquires temperature information through an internal protocol (Gen 2 protocol can be adopted) and transmits ultrahigh frequency radio frequency signals.
The invention can be applied to the temperature rise fault monitoring of the switch cabinet. The temperature measuring device is used for measuring the temperature of switch contacts, bus contacts and cable contact contacts (temperature sensors can be arranged at the positions of the switch contacts, the bus contacts and the cable contact contacts) in the power switch cabinet.
The server can set and display the current temperature uploaded by each serial number temperature sensor; storing historical data and displaying the historical data in a temperature change curve form; and setting an alarm value, alarming and informing maintenance personnel of fault point information when a temperature rise fault occurs, and eliminating fault hidden danger in time.
It should be understood that the detailed description of the present invention is only for illustrating the present invention and is not limited by the technical solutions described in the embodiments of the present invention, and those skilled in the art should understand that the present invention can be modified or substituted equally to achieve the same technical effects; as long as the use requirements are met, the method is within the protection scope of the invention.
Claims (8)
1. The temperature rise fault monitoring system comprises a temperature sensor, a temperature collector and a data transmission part, and is characterized in that the temperature collector collects temperature measurement signals sent by the temperature sensor, and a signal output port of the temperature collector is connected with a signal input port of the data transmission part;
the data transmission part comprises a power supply part, a transmission module, a single chip microcomputer and a transceiver, wherein an electric energy output port of the power supply part is respectively connected with an electric energy input port of the transmission module, an electric energy input port of the single chip microcomputer and an electric energy input port of the transceiver;
the transmission module adopts a WH-NB73 chip U6, pins 1 and 2 of U6 are respectively connected with one end of a capacitor C2, the anode of a capacitor C10, the anode of a capacitor C9 and V BATT, the other end of a capacitor C2, the cathode of a capacitor C10 and the cathode of a capacitor C9 are connected with GND, pin 5 of U6 is connected with NB _ Reload, pin 9 of U6 is connected with NB _ Reset, pin 14 of U6 is connected with NB _ Work, pin 35 of U6 is respectively connected with one end of a resistor R12 and the cathode of a light-emitting diode LD1, and the other end of R12 is connected with RXD.
2. The temperature-rise fault monitoring system according to claim 1, wherein the power supply part comprises a L5973D chip U3 and a TLV1117LV chip U7, wherein 8 pins of the U3 are respectively connected with VCC, an anode of a capacitor C4 and an anode of a capacitor C5, a cathode of a capacitor C4 and a cathode of a capacitor C5 are respectively connected with one end of a capacitor C7, one end of a resistor R9, a pin 3 of the U3, a pin 7 of the U3, an anode of a diode D2, one end of a resistor R8, a cathode of a capacitor C6 and GND, and the other end of R9 is respectively connected with the other end of C7 and a pin 4 of U3 through a capacitor C8; a pin 5 of the U3 is respectively connected with the other end of a resistor R8 and one end of a resistor R3, the other end of the R3 is respectively connected with one end of an inductor L1, the positive electrode of C6, VBATT and one end of a capacitor C3, and the other end of the C3 is connected with GND; the other end of the L1 is respectively connected with a pin 1 of the U3 and a D2 cathode;
an INPUT end of the U7 is connected with VCC, an Output end of the U7 is respectively connected with an anode of a capacitor C100, 3.3V, one end of a capacitor C22 and an anode of a light emitting diode LED2, and a cathode of the LED2 is respectively connected with the ground, the GND end of the U7, the cathode of the C100 and the other end of the C22 through a resistor R27;
VBATT is connected with the anode of the light emitting diode LD2, and the cathode of the LD2 is connected with GND through a resistor R21.
3. The temperature rise fault monitoring system according to claim 1, characterized in that the single chip microcomputer adopts an STM32L476RGT6 chip U5, pins 16 and 17 of U5 are correspondingly connected with TXD and RXD, respectively, pins 41, 42 and 43 of U5 are correspondingly connected with RS485_ EN, TXD1 and RXD1, pins 46 and 49 of U5 are correspondingly connected with SW _ DIO and SW _ CLK, respectively, pin 5 of U5 is connected with pin 1 of CSTCE8M00G52 chip and one end of a resistor R13, pin 6 of U5 is connected with pin 3 of CSTCE8M00G52 chip and the other end of resistor R13, pin 60 of U5 is connected with one end of a capacitor C13 through a resistor R14, the other end of C13 is connected with pin 7 of U5, and 3.3V is connected with GND through a capacitor C16; capacitors C23-C29 are connected between 3.3V and GND in parallel;
pins 52 and 53 of U5 are correspondingly connected with Reset and Reload respectively;
u5 has pin 29 connected to Arm _ Work.
4. The temperature-rise fault monitoring system of claim 1, wherein the transceiver adopts an SN75176B chip U2, a pin 1 of U2 is connected with a cathode of a diode D1, an anode of the D1 is respectively connected with RXD1 and one end of a resistor R2, the other end of the R2 is connected with 3.3V, a pin 2 of the U2 is respectively connected with a pin 3 of RS485_ EN and U2 and one end of the resistor R6, and a pin 4 of the U2 is connected with the TXD 1;
the other end of R6 is respectively connected with ground, the 5 pin of U2 and one end of a resistor R5, the other end of R5 is respectively connected with the 7 pin of U2, the B and one end of a resistor R4, the other end of R4 is respectively connected with the A, one end of a resistor R1 and the 6 pin of U2, the other end of R1 is respectively connected with one end of a capacitor C1, the 8 pin of U2 and VCC, and the other end of C1 is grounded.
5. The temperature rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN triode Q1, the collector of the Q1 is respectively connected with one end of NB _ Reload and one end of a capacitor C12, and the other end of C12 is connected with GND; the base of Q1 is connected with one end of a resistor R17 and one end of a resistor R18 respectively, the other end of R17 is connected with Reload, and the other end of R18 is connected with the emitter of Q1 and GND respectively.
6. The temperature rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN triode Q2, the collector of the Q2 is respectively connected with NB _ Reset and one end of a capacitor C11, and the other end of the C11 is connected with GND; the base of Q2 is connected with one end of a resistor R23 and one end of a resistor R24 respectively, the other end of R23 is connected with Reset, and the other end of R24 is connected with the emitter of Q2 and GND respectively.
7. The temperature-rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN transistor Q3, a collector of the transistor Q3 is connected to a cathode of the LED1, one end of a capacitor C14 is connected to the other end of the capacitor C14, and an anode of the LED1 is connected to VBATT through a resistor R15; the base of Q3 is connected with one end of resistor R19 and one end of resistor R22 respectively, the other end of R19 is connected with NB _ Work, and the other end of R22 is connected with the emitter of Q3 and GND respectively.
8. The temperature-rise fault monitoring system according to claim 1, wherein the data transmission part comprises an NPN transistor Q4, a collector of the transistor Q4 is connected to a cathode of the LED3, one end of a capacitor C15 is connected to the other end of the capacitor C15, and an anode of the LED3 is connected to VBATT through a resistor R16; the base of Q4 is connected with one end of a resistor R20 and one end of a resistor R25 respectively, the other end of R20 is connected with Arm _ Work, and the other end of R25 is connected with the emitter of Q4 and GND respectively.
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Application publication date: 20210126 |