CN112259442A - 晶圆双面减薄的方法和装置、存储介质 - Google Patents
晶圆双面减薄的方法和装置、存储介质 Download PDFInfo
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- CN112259442A CN112259442A CN202010956315.9A CN202010956315A CN112259442A CN 112259442 A CN112259442 A CN 112259442A CN 202010956315 A CN202010956315 A CN 202010956315A CN 112259442 A CN112259442 A CN 112259442A
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- 238000000034 method Methods 0.000 title claims abstract description 45
- 238000003860 storage Methods 0.000 title claims abstract description 11
- 238000005259 measurement Methods 0.000 claims description 30
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000004590 computer program Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 117
- 230000008859 change Effects 0.000 description 7
- 238000004364 calculation method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02013—Grinding, lapping
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
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CN202010956315.9A CN112259442B (zh) | 2020-09-11 | 2020-09-11 | 晶圆双面减薄的方法和装置、存储介质 |
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CN112259442A true CN112259442A (zh) | 2021-01-22 |
CN112259442B CN112259442B (zh) | 2024-05-24 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060009125A1 (en) * | 2002-10-09 | 2006-01-12 | Kenji Okura | Both side grinding method and both side grinder of thin disc-like work |
CN101909817A (zh) * | 2007-12-31 | 2010-12-08 | Memc电子材料有限公司 | 使用来自翘曲数据的反馈的纳米形貌控制和优化 |
CN107984375A (zh) * | 2017-11-27 | 2018-05-04 | 德淮半导体有限公司 | 晶圆加工装置及其加工方法 |
CN110010458A (zh) * | 2019-04-01 | 2019-07-12 | 徐州鑫晶半导体科技有限公司 | 控制半导体晶圆片表面形貌的方法和半导体晶片 |
CN110394727A (zh) * | 2019-07-29 | 2019-11-01 | 武汉新芯集成电路制造有限公司 | 一种晶圆的研磨控制方法及装置、研磨设备 |
CN111360608A (zh) * | 2020-03-06 | 2020-07-03 | 徐州鑫晶半导体科技有限公司 | 双面减薄研削水流量的控制方法 |
-
2020
- 2020-09-11 CN CN202010956315.9A patent/CN112259442B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060009125A1 (en) * | 2002-10-09 | 2006-01-12 | Kenji Okura | Both side grinding method and both side grinder of thin disc-like work |
CN101909817A (zh) * | 2007-12-31 | 2010-12-08 | Memc电子材料有限公司 | 使用来自翘曲数据的反馈的纳米形貌控制和优化 |
CN107984375A (zh) * | 2017-11-27 | 2018-05-04 | 德淮半导体有限公司 | 晶圆加工装置及其加工方法 |
CN110010458A (zh) * | 2019-04-01 | 2019-07-12 | 徐州鑫晶半导体科技有限公司 | 控制半导体晶圆片表面形貌的方法和半导体晶片 |
CN110394727A (zh) * | 2019-07-29 | 2019-11-01 | 武汉新芯集成电路制造有限公司 | 一种晶圆的研磨控制方法及装置、研磨设备 |
CN111360608A (zh) * | 2020-03-06 | 2020-07-03 | 徐州鑫晶半导体科技有限公司 | 双面减薄研削水流量的控制方法 |
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Country or region after: China Address after: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant after: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Applicant after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: 221004 No.1 Xinxin Road, Xuzhou Economic and Technological Development Zone, Jiangsu Province Applicant before: Zhonghuan Leading (Xuzhou) Semiconductor Materials Co.,Ltd. Country or region before: China Applicant before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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