CN112233894A - 合金材积层电感制法 - Google Patents
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Abstract
本发明公开了一种合金材积层电感制法，其包含下列步骤：材料制备步骤，粉末珠击步骤，粉末混合步骤，印刷泥浆制作步骤，制带/裁片步骤，薄带整平步骤，打孔步骤，印刷步骤，堆栈步骤，压合步骤，切割步骤，烧除步骤，烧结步骤，移转印刷端电极步骤，电镀步骤。采用本发明的电感制法可使合金粉末之间间隙更小进而达到提升磁导率的功效。
Description
技术领域
本发明涉及一种电感制法，特别涉及一种合金材积层电感制法。
背景技术
一般积层电感制法，请参阅图1所示，其主要是由数个薄带11堆栈，且该薄带11上具有电感线圈图形，该数个薄带11堆栈藉由导电浆料12让电感线圈图形连接，进而达到电感小型化的效能。
该一般积层电感制法，其虽可制作出小型化的积层电感，然却因小型化导致磁导量不足，而当欲提升磁导量时，往往因圆形合金粉末111与圆形合金粉末111间隙，致使固定体积的磁导率提升效果有限，因而造成需变换材料或增大体积的不便。
因此，本案发明人鉴于上述的缺失，因而乃亟思加以创新开发，并经多年苦心孤诣潜心研究，终于研发出一种可提升磁导率，同时无需增大积层电感体积的方法。
发明内容
本发明的主要目的是提供一种合金材积层电感制法，其包含下列步骤：
材料制备步骤，该材料制备步骤准备铁合金粉末，其中该铁合金粉末粒径为1～20μm，该铁合金粉末为铁硅铬合金粉末或铁硅铝合金粉末，该铁硅铬合金粉末组成为82～97wt％铁(wt％为质量百分浓度或为重量百分浓度)、2～9wt％硅、1～9wt％铬，又该铁硅铝合金粉末组成为82～97wt％铁、2～9wt％硅、1～9wt％铝。
粉末珠击步骤，将材料制备步骤的铁合金粉末放置于磨桶内，并将球体放入磨桶内，该球体直径为1～10mm，该球体为氧化锆珠或氧化铝珠，该磨桶上具有一马达，该马达连接一搅拌棒，该搅拌棒上具有数个扰动部，该搅拌棒转动使该扰动部扰动该磨桶内的球体撞击该铁合金粉，使该铁合金粉被撞击成扁平合金粉末，该搅拌棒转动速度为50～200rpm(Revolution Per Minute，每分钟转速)且该搅拌棒转动时间为2～8小时。
粉末混合步骤，将粉末珠击步骤产生的扁平合金粉末对比该黏结剂及溶剂以1:5～1:10混合制成浆料，该黏结剂为PVB(聚乙烯醇缩丁醛)，该溶剂为酒精或甲苯。
印刷泥浆制作步骤，将粉末混合步骤的浆料经由均匀混合搅拌制成印刷泥浆。
制带/裁片步骤，将粉末混合步骤的浆料经由卷对卷涂布设备及烤箱烘烤制成厚度10～50μm的生胚薄带，该生胚薄带再裁成15*15～22*22cm2的片状薄带，该卷对卷涂布设备带动速度为1～10m/min，该烤箱烘烤温度为40～90℃。
薄带整平步骤，将制带/裁片步骤的片状薄带经由油压方式将表面压平，使该片状薄带更为平整，以利后续印刷时银浆接触面更为密合，该油压的压力为1～2吨/cm2。
打孔步骤，将薄带整平步骤的片状薄带经由雷射或机械打出所需孔部。
印刷步骤，将打孔步骤的片状薄带是经由对位印刷导电浆料，并将印刷泥浆制作步骤的印刷泥浆在片状薄带上印刷成电感线圈图形，再经烤箱烘烤，该烤箱烘烤温度为55～80℃烘烤时间为30～60min，该导电浆料是供上下层片状薄带的电感线圈图形相连接，该导电浆料为银浆或铜浆。
堆栈步骤，将经由印刷步骤的片状薄带堆栈至所需厚度形成多个电感线圈图形。
压合步骤，将堆栈步骤形成的堆栈片状薄带加热、加压使堆栈片状薄带与电感线圈图形压实密合，该加热温度为40～85℃且该加压压力为50000～150000psi(Pound perSquare Inch，磅每平方英寸)。
切割步骤，将压合步骤的堆栈片状薄带以切割成型，形成共烧组件生胚。
烧除步骤，将切割步骤的共烧组件生胚经250～450℃持续2～6hr将电感线圈图形和片状薄带内的黏结剂和脂类烧除。
烧结步骤，经由烧除步骤后进行600～800℃持续2～6hr的烧结，以形成一高强度、高硬度的合金材积层电感本体。
移转印刷端电极步骤，经由烧结步骤形成的合金材积层电感本体使用导电浆料移转印刷端电极，该导电浆料为银浆或铜浆，该端电极形成可测试、焊接的脚位再经由烤箱55～80℃烘烤30～60min。
电镀步骤，经由移转印刷端电极步骤后在端电极上镀上镍做保护，在镍上方再镀锡使端电极具有良好的焊性。
藉由铁合金粉末经由球体撞击成扁平合金粉末，再将该扁平合金粉末制成薄带，再将薄带堆栈热压烧结制成积层电感，其可因扁平合金粉末之间间隙更小进而达到提升磁导率的功效。
附图说明
图1为现有积层电感结构示意图；
图2为本发明的制作流程示意图；
图3为本发明的粉末珠击步骤示意图；
图4为本发明的薄带堆栈示意图；
图5为本发明结构示意图。
符号说明：
S1材料制备步骤 S2粉末珠击步骤
S3粉末混合步骤 S41印刷泥浆制作步骤
S42制带/裁片步骤 S43薄带整平步骤
S5打孔步骤 S6印刷步骤
S7堆栈步骤 S8压合步骤
S9切割步骤 S10烧除步骤
S11烧结步骤 S12移转印刷端电极步骤
S13电镀步骤 1现有积层电感
11薄带 111圆形合金粉末
12导电浆料 2马达
21搅拌棒 22扰动部
3磨桶 4铁合金粉末
41球体 5合金材积层电感
51薄带 511扁平合金粉末
52电感线圈图形 53孔部
54导电浆料
具体实施方式
为使本发明的其他特征内容与优点及其所达成的功效能够更为显现，兹将本发明配合附图，详细说明如下：
请参阅图2所示，本发明的主要目的是提供一种合金材积层电感制法，其包含下列步骤：
材料制备步骤S1，该材料制备步骤S1准备铁合金粉末4，其中该铁合金粉末4粒径为1～20μm，该铁合金粉末4为铁硅铬合金粉末或铁硅铝合金粉末，该铁硅铬合金粉末组成为82～97wt％铁(wt％为质量百分浓度或为重量百分浓度)、2～9wt％硅、1～9wt％铬，又该铁硅铝合金粉末组成为82～97wt％铁、2～9wt％硅、1～9wt％铝。
粉末珠击步骤S2，将材料制备步骤S1的铁合金粉末4放置于磨桶3内，并将球体41放入磨桶3内，该球体41直径为1～10mm，该球体41为氧化锆珠或氧化铝珠，该磨桶3上具有一马达2，该马达2连接一搅拌棒21，该搅拌棒21上具有数个扰动部22，该搅拌棒21转动使该扰动部22扰动该磨桶3内的球体41撞击该铁合金粉末4，使该铁合金粉末4被撞击成扁平合金粉末511，该搅拌棒21转动速度为50～200rpm且该搅拌棒21转动时间为2～8小时，如图3配合图5所示。
粉末混合步骤S3，将粉末珠击步骤S2产生的扁平合金粉末511对比该黏结剂及溶剂以1:5～1:10混合制成浆料，该黏结剂为PVB，该溶剂为酒精或甲苯。
印刷泥浆制作步骤S41，将粉末混合步骤S3的浆料经由均匀混合搅拌制成印刷泥浆。
制带/裁片步骤S42，将粉末混合步骤S3的浆料经由卷对卷涂布设备及烤箱烘烤制成厚度10～50μm的生胚薄带，该生胚薄带51再裁成15*15～22*22cm2的片状薄带51，该卷对卷涂布设备带动速度为1～10m/min，该烤箱烘烤温度为40～90℃。
薄带整平步骤S43，将制带/裁片步骤S42的片状薄带51经由油压方式将表面压平，使该片状薄带51更为平整，以利后续印刷步骤S6时导电浆料接触面更为密合，该油压的压力为1～2吨/cm2。
打孔步骤S5，将薄带整平步骤S43的片状薄带51经由雷射或机械打出所需孔部53，如图4所示。
印刷步骤S6，将打孔步骤S5的片状薄带51是经由对位印刷导电浆料54，并将印刷泥浆制作步骤S41的印刷泥浆在片状薄带51上印刷成电感线圈图形52，再经烤箱烘烤，该烤箱烘烤温度为55～80℃烘烤时间为30～60min，该导电浆料54是供上下层片状薄带51的电感线圈图形52相连接，该导电浆料54为银浆或铜浆。
堆栈步骤S7，将经由印刷步骤S6的片状薄带51堆栈至所需厚度形成多个电感线圈图形52。
压合步骤S8，将堆栈步骤S7形成的堆栈片状薄带51加热、加压使堆栈片状薄带51与电感线圈图形52压实密合，该加热温度为40～85℃且该加压压力为50000～150000psi。
切割步骤S9，将压合步骤S8的堆栈片状薄带51以切割成型，形成共烧组件生胚。
烧除步骤S10，将切割步骤S9的共烧组件生胚经250～450℃持续2～6hr将电感线圈图形52和片状薄带内的黏结剂和脂类烧除。
烧结步骤S11，经由烧除步骤S10后进行600～800℃持续2～6hr的烧结，以形成一高强度、高硬度的合金材积层电感本体，如图5所示。
移转印刷端电极步骤S12，经由烧结步骤S11形成的合金材积层电感本体使用导电浆料移转印刷端电极，该导电浆料为银浆或铜浆，该端电极形成可测试、焊接的脚位再经由烤箱55～80℃烘烤30～60min。
电镀步骤S13，经由移转印刷端电极步骤S12后在端电极上镀上镍做保护，在镍上方再镀锡使端电极具有良好的焊性。
藉由铁合金粉末经由球体撞击成扁平合金粉末，再将该扁平合金粉末制成薄带，再将薄带堆栈热压烧结制成积层电感，其可因扁平合金粉末的间间隙更小进而达到提升磁导率的功效。
上列详细说明是针对本发明的一可行实施例的具体说明，该实施例并非用以限制本发明的专利范围，而凡未脱离本发明精神所为的等效实施或变更，均应包含于本案的专利范围中。
Claims (6)
1.一种合金材积层电感制法，其特征在于，包含下列步骤：
材料制备步骤，该材料制备步骤准备铁合金粉末，该铁合金粉末粒径为1～20μm，其中该铁合金粉末为铁硅铬合金粉末或铁硅铝合金粉末，该铁硅铬合金粉末组成为82～97wt％铁、2～9wt％硅、1～9wt％铬，又该铁硅铝合金粉末组成为82～97wt％铁、2～9wt％硅、1～9wt％铝；
粉末珠击步骤，将材料制备步骤的铁合金粉末放置于磨桶内，并将数个球体放入磨桶内，该磨桶上具有一马达，该马达连接一搅拌棒，该搅拌棒上具有数个扰动部，该粉末珠击步骤的搅拌棒转动速度为50～200rpm，且该搅拌棒转动时间为2～8hr；
粉末混合步骤，将粉末珠击步骤产生的扁平合金粉末对比该黏结剂及溶剂以1:5～1:10混合制成浆料；
印刷泥浆制作步骤，将粉末混合步骤的浆料经由均匀混合搅拌制成印刷泥浆；
制带/裁片步骤，将粉末混合步骤的浆料经由卷对卷涂布设备及烤箱烘烤制成厚度10～50μm的生胚薄带，该生胚薄带再裁成片状薄带，该烤箱烘烤温度为40～90℃；
薄带整平步骤，将制带/裁片步骤的片状薄带经由油压方式将表面压平，该油压的压力为1～2吨/cm2；
打孔步骤，将薄带整平步骤的片状薄带经由雷射或机械打出所需孔部；
印刷步骤，将打孔步骤的片状薄带经对位印刷导电浆料，并将印刷泥浆制作步骤的印刷泥浆在片状薄带上印刷成电感线圈图形，再经烤箱烘烤，该烘烤为55～80℃持续30～60min；
堆栈步骤，将经由印刷步骤的片状薄带堆栈形成电感线圈图形；
压合步骤，将堆栈步骤形成的堆栈片状薄带加热、加压，该加热温度为40～85℃，该加压压力为50000～150000psi；
切割步骤，将压合步骤的堆栈片状薄带以切割成型，形成共烧组件生胚；
烧除步骤，将切割步骤的共烧组件生胚经烧除将黏结剂和脂类烧除，该烧除温度为250～450℃且持续2～6hr；
烧结步骤，经由烧除步骤后进行烧结形成一合金材电感本体，该烧结温度为600～800℃且持续2～6hr；
移转印刷端电极步骤，经由烧结步骤形成的合金材积层电感本体使用导电浆料移转印刷端电极，该合金材积层电感本体再经烘烤，该烘烤温度为55～80℃且持续30～60min；
电镀步骤，经由移转印刷端电极步骤后在端电极上先镀镍再镀锡。
2.如权利要求1所述的合金材积层电感制法，其特征在于，该粉末珠击步骤的球体直径为1～10mm，该球体为氧化锆珠或氧化铝珠。
3.如权利要求1所述的合金材积层电感制法，其特征在于，该粉末混合步骤的黏结剂为PVB，该粉末混合步骤的溶剂为酒精或甲苯。
4.如权利要求1所述的合金材积层电感制法，其特征在于，该制带/裁片步骤的该卷对卷涂布设备带动速度为1～10m/min。
5.如权利要求1所述的合金材积层电感制法，其特征在于，该印刷步骤的导电浆料为银浆或铜浆。
6.如权利要求1所述的合金材积层电感制法，其特征在于，该移转印刷端电极步骤的导电浆料为银浆或铜浆。
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| JPH10106839A (ja) * | 1996-10-02 | 1998-04-24 | Tokin Corp | 積層型高周波インダクタ |
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