CN112188757A - Circuit board manufacturing method for local convex welding disc - Google Patents
Circuit board manufacturing method for local convex welding disc Download PDFInfo
- Publication number
- CN112188757A CN112188757A CN201910588486.8A CN201910588486A CN112188757A CN 112188757 A CN112188757 A CN 112188757A CN 201910588486 A CN201910588486 A CN 201910588486A CN 112188757 A CN112188757 A CN 112188757A
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- CN
- China
- Prior art keywords
- circuit board
- film
- manufacturing
- copper
- copper deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 36
- 238000003466 welding Methods 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 43
- 230000008021 deposition Effects 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims abstract description 16
- 238000005111 flow chemistry technique Methods 0.000 claims abstract description 6
- 238000006087 Brown hydroboration reaction Methods 0.000 claims abstract description 5
- 229910000679 solder Inorganic materials 0.000 claims abstract description 5
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 238000004806 packaging method and process Methods 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000012805 post-processing Methods 0.000 claims abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 11
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 239000010931 gold Substances 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000005553 drilling Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000012360 testing method Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000010923 batch production Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007849 functional defect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A method for manufacturing a circuit board with local convex welding pads comprises the following steps: (1) pre-flow processing; (2) after the board is electrified, a film laminating machine carries out film pressing on the circuit board, and an outer layer circuit of the circuit board is etched after the film pressing; (3) secondary copper deposition, copper wire deposition, and circuit and bonding pad on the circuit board are electrically conducted through a circuit formed by copper deposition; (4) manufacturing an outer layer pattern II; (5) the film sticking machine sticks a film on the circuit board, a preset boss position is exposed and developed, the boss position is subjected to pattern electricity, and the copper thickness on the boss position is increased to form a convex welding disc; (6) removing the film after the pattern is electrified, and carrying out brown oxidation treatment on the circuit board to remove a copper deposition layer formed by secondary copper deposition on the surface; (7) AOI and solder mask; (8) post-processing, and finally packaging. The invention carries out film pressing through a common film sticking machine, reduces the manufacturing cost, firstly presses the film and then manufactures the convex bonding pad, avoids the condition that the film is suspended, separated or cracked, and ensures the performance and quality of the product.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to a method for manufacturing a circuit board with local convex bonding pads.
Background
The circuit board is an important electronic component, the existing circuit board develops towards the direction of high precision, high density, performance improvement and cost reduction, the existing circuit board has various designs according to the actual situation, the design of a local convex pad on the circuit board is one of the designs, and the conventional manufacturing methods related to the convex pad in the PCB industry have two types as follows: (1) firstly, a boss is manufactured and then a circuit is manufactured, however, according to the traditional flow design, the outer layer circuit is difficult to manufacture, namely, due to the boss, a dry film pressed by a traditional film pressing machine cannot be completely fit with a plate surface, and the dry film can be suspended and separated; (2) the outer lamination film adopts vacuum film pressing machine processing, and this kind of method can satisfy the degree of agreeing with of dry film and face, but vacuum film pressing machine's equipment price is expensive, is used for the comparison more in the FPC preparation at present, but can appear the dry film phenomenon of rupture behind the vacuum film pressing machine press film to lead to the excessive problem of etching, influence the performance and the quality of product.
Disclosure of Invention
The invention provides a method for manufacturing a circuit board with a local convex bonding pad, aiming at solving the problems that the manufacturing cost of the circuit board with the local convex bonding pad is high and a dry film is suspended, separated or cracked after film pressing.
A method for manufacturing a circuit board with local convex welding pads comprises the following steps:
(1) pre-flow processing;
(2) after the board is electrified, a film laminating machine carries out film pressing on the circuit board, and an outer layer circuit of the circuit board is etched after the film pressing;
(3) secondary copper deposition, copper wire deposition, and circuit and bonding pad on the circuit board are electrically conducted through a circuit formed by copper deposition;
(4) manufacturing an outer layer pattern II;
(5) the film sticking machine sticks a film on the circuit board, a preset boss position is exposed and developed, the boss position is subjected to pattern electricity, and the copper thickness on the boss position is increased to form a convex welding disc;
(6) removing the film after the pattern is electrified, and carrying out brown oxidation treatment on the circuit board to remove a copper deposition layer formed by secondary copper deposition on the surface;
(7) AOI and solder mask;
(8) post-processing, and finally packaging.
In one embodiment, the pre-flow process sequentially comprises the following steps: cutting, drilling, copper deposition and outer layer pattern manufacturing.
In one embodiment, the post-process sequentially comprises the following steps: characters, dry film, gold melting, film stripping, forming, testing, FQC and cleaning.
In one embodiment, during the secondary copper deposition, the surface of the board is isolated by clean white paper after the copper deposition is finished.
In one embodiment, the exposed alignment PE value is set below 75.
In one embodiment, the time between the second copper deposition and the manufacture of the outer layer pattern is controlled within 30 min.
In one embodiment, the bump pad is a BGA pad.
In one embodiment, the upper surface of the projection pad is provided with a conductive layer, and the conductive layer sequentially comprises a copper layer, a nickel layer and a gold layer from bottom to top.
In one embodiment, the thickness of the copper layer is at least 1mil, the thickness of the nickel layer is 100-200 μm, and the thickness of the gold layer is 35-45 μm.
The invention provides a circuit board manufacturing method of a local convex bonding pad, which is characterized in that a common film sticking machine is used for film pressing, so that the cost of equipment is low, and the manufacturing cost is reduced; the convex welding disc is manufactured after the film is pressed, so that the condition that the film is suspended, separated or cracked is avoided, and the performance and the quality of the product are ensured; the circuit board manufactured by the invention is provided with the local convex bonding pad, the conductivity of the convex bonding pad is good, the method is suitable for batch production of the circuit board, each step is easy to control, and the quality of the product is improved.
Detailed Description
The present invention will be further described with reference to the following examples.
A method for manufacturing a circuit board with local convex welding pads comprises the following steps:
(1) the front flow processing comprises the following steps in sequence: cutting, drilling, copper deposition and outer layer pattern manufacturing; cutting a substrate into a board according to a preset size, drilling holes to form holes with various functions on the circuit board, such as positioning holes for positioning, buried holes or blind holes for electrically connecting circuits of each layer, forming copper layers in the hole walls of partial holes by copper deposition, carrying out pattern transfer in the outer layer pattern manufacturing, and transferring images on the film to the board.
(2) Carrying out board electrification on the circuit board, after the board electrification, carrying out film pressing on the circuit board by using a film sticking machine, etching an outer layer circuit of the circuit board after the film pressing, and etching away an excessive copper layer;
(3) secondary copper deposition, copper wire deposition, forming a path for the circuit and the bonding pad on the circuit board through copper deposition to be electrically conducted, and isolating the board surface by using clean white paper after the copper wire deposition to prevent oxidation;
(4) manufacturing an outer layer pattern II, controlling the time between the secondary copper deposition and the manufacturing of the outer layer pattern II within 30min, firstly transferring the image to a board through pattern transfer, and then carrying out pattern electroplating;
(5) the film sticking machine sticks a film to the circuit board, a preset boss position is exposed and developed, the boss position is subjected to pattern electricity, the copper thickness on the boss position is increased to form a convex welding disc, the exposure contraposition PE value is set to be below 75, so that the consistency of the preset boss position and the convex welding disc position is improved, and the precision of the boss position is improved;
(6) the circuit board is subjected to film drawing and back, the copper deposition layer formed by secondary copper deposition on the surface is removed by brown oxidation treatment, the copper is removed by micro etching in the brown oxidation treatment, and the copper thickness after the micro etching is consistent with the deposited copper thickness, so that the condition of micro etching of bottom copper is avoided;
(7) AOI and solder mask; AOI inspects the circuit board, screens out the circuit board that is out of specification, ensures the quality of product, and solder mask keeps the good insulating nature of face.
(8) Post-flow processing, wherein the post-flow processing sequentially comprises the following steps: characters, dry films, gold melting, film stripping, forming, testing, FQC, cleaning and finally packaging; the characters form marks which are easy to distinguish on the circuit board, dry films are pasted on the circuit board for gold melting, the dry films are removed after the gold melting, the circuit board with functional defects is detected through the forming of the shape required by a client through die stamping or a numerical control milling machine, the quality of the finished product is ensured, and finally, the dust on the circuit board is cleaned and then packaged.
In one embodiment, the bump pad is a BGA pad, the upper surface of the bump pad is provided with a conductive layer, the conductive layer comprises a copper layer, a nickel layer and a gold layer from bottom to top in sequence, the thickness of the copper layer is at least 1mil, the thickness of the nickel layer is 100-200 μm, and the thickness of the gold layer is 35-45 μm.
Aiming at the difficulty in manufacturing an outer layer circuit caused by the lug boss arranged on the circuit board, the technical scheme is also suitable for the problem of lead of an independent PAD. The invention provides a circuit board manufacturing method of a local convex bonding pad, which is characterized in that a common film sticking machine is used for film pressing, so that the cost of equipment is low, and the manufacturing cost is reduced; the convex welding disc is manufactured after the film is pressed, so that the condition that the film is suspended, separated or cracked is avoided, and the performance and the quality of the product are ensured; the circuit board manufactured by the invention is provided with the local convex bonding pad, the conductivity of the convex bonding pad is good, the method is suitable for batch production of the circuit board, each step is easy to control, and the quality of the product is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention shall fall within the protection scope of the present invention.
Claims (9)
1. A method for manufacturing a circuit board with local convex welding pads is characterized in that: the method comprises the following steps:
(1) pre-flow processing;
(2) after the board is electrified, a film laminating machine carries out film pressing on the circuit board, and an outer layer circuit of the circuit board is etched after the film pressing;
(3) secondary copper deposition, copper wire deposition, and circuit and bonding pad on the circuit board are electrically conducted through a circuit formed by copper deposition;
(4) manufacturing an outer layer pattern II;
(5) the film sticking machine sticks a film on the circuit board, a preset boss position is exposed and developed, the boss position is subjected to pattern electricity, and the copper thickness on the boss position is increased to form a convex welding disc;
(6) removing the film after the pattern is electrified, and carrying out brown oxidation treatment on the circuit board to remove a copper deposition layer formed by secondary copper deposition on the surface;
(7) AOI and solder mask;
(8) post-processing, and finally packaging.
2. The method for manufacturing a circuit board with a local bump pad according to claim 1, wherein: the pre-flow treatment sequentially comprises the following steps: cutting, drilling, copper deposition and outer layer pattern manufacturing.
3. The method for manufacturing a circuit board with a local bump pad according to claim 1, wherein: the post-flow treatment sequentially comprises the following steps: characters, dry film, gold melting, film stripping, forming, testing, FQC and cleaning.
4. The method for manufacturing a circuit board with a local bump pad according to claim 1, wherein: and during secondary copper deposition, after the copper deposition wire is passed, the board surface is isolated by clean white paper.
5. The method for manufacturing a circuit board with a local bump pad according to claim 1, wherein: the para-PE value of the exposure is set to 75 or less.
6. The method for manufacturing a circuit board with a local bump pad according to claim 1, wherein: and the time between the secondary copper deposition and the manufacture of the outer layer pattern is controlled within 30 min.
7. The method for manufacturing a circuit board with a local bump pad according to claim 1, wherein: the convex welding plate is a BGA welding plate.
8. The method for manufacturing a circuit board with local bumps as claimed in claim 1 or 7, wherein: the upper surface of the convex welding disk is provided with a conducting layer, and the conducting layer is sequentially a copper layer, a nickel layer and a gold layer from bottom to top.
9. The method for manufacturing a circuit board with a local bump pad according to claim 8, wherein: the thickness of the copper layer is at least 1mil, the thickness of the nickel layer is 100-200 mu m, and the thickness of the gold layer is 35-45 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910588486.8A CN112188757A (en) | 2019-07-02 | 2019-07-02 | Circuit board manufacturing method for local convex welding disc |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910588486.8A CN112188757A (en) | 2019-07-02 | 2019-07-02 | Circuit board manufacturing method for local convex welding disc |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112188757A true CN112188757A (en) | 2021-01-05 |
Family
ID=73914839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910588486.8A Pending CN112188757A (en) | 2019-07-02 | 2019-07-02 | Circuit board manufacturing method for local convex welding disc |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112188757A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001251042A (en) * | 2000-03-06 | 2001-09-14 | Denso Corp | Method of forming land of printed board |
| KR20060101716A (en) * | 2005-03-21 | 2006-09-26 | 삼성전기주식회사 | Method for forming solder ball pad in bga printed circuit board and bga printed circuit board manufactured therefrom |
| CN203015285U (en) * | 2012-12-25 | 2013-06-19 | 大连崇达电路有限公司 | Selective local electroplating thick gold printed circuit board |
| CN103974561A (en) * | 2013-01-24 | 2014-08-06 | 深南电路有限公司 | Manufacturing method for ball grid array (BGA) of super-thick copper circuit board |
| CN106793583A (en) * | 2016-11-25 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of pcb board local electric thick gold with it is non local electricity gold wiring preparation method |
| CN107645844A (en) * | 2017-08-25 | 2018-01-30 | 深南电路股份有限公司 | A kind of preparation method gold-plated for PCB BGA part pads |
-
2019
- 2019-07-02 CN CN201910588486.8A patent/CN112188757A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001251042A (en) * | 2000-03-06 | 2001-09-14 | Denso Corp | Method of forming land of printed board |
| KR20060101716A (en) * | 2005-03-21 | 2006-09-26 | 삼성전기주식회사 | Method for forming solder ball pad in bga printed circuit board and bga printed circuit board manufactured therefrom |
| CN203015285U (en) * | 2012-12-25 | 2013-06-19 | 大连崇达电路有限公司 | Selective local electroplating thick gold printed circuit board |
| CN103974561A (en) * | 2013-01-24 | 2014-08-06 | 深南电路有限公司 | Manufacturing method for ball grid array (BGA) of super-thick copper circuit board |
| CN106793583A (en) * | 2016-11-25 | 2017-05-31 | 深圳崇达多层线路板有限公司 | A kind of pcb board local electric thick gold with it is non local electricity gold wiring preparation method |
| CN107645844A (en) * | 2017-08-25 | 2018-01-30 | 深南电路股份有限公司 | A kind of preparation method gold-plated for PCB BGA part pads |
Non-Patent Citations (4)
| Title |
|---|
| 刘长春;高团芬;王京华;: "选择性化金PCB焊点失效分析及改善", 印制电路信息, no. 02, 10 February 2016 (2016-02-10) * |
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