CN112170994A - Electrochemical deposition-electrolysis combined processing method based on mask electric field constraint - Google Patents
Electrochemical deposition-electrolysis combined processing method based on mask electric field constraint Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H5/00—Combined machining
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
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Abstract
The invention provides a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method, which comprises the steps of manufacturing array holes corresponding to the structure of a mask plate on a film on the surface of a workpiece; connecting the fixture with an external power supply to enable the tool electrode to serve as an anode, connecting the transmission roller with an external power supply to enable the workpiece to serve as a cathode, and performing microstructure electrochemical deposition; after the working time of power deposition is finished, externally connecting a power supply to the clamp to enable the tool electrode to serve as a cathode, externally connecting a power supply to the transmission roller to enable the workpiece to serve as an anode to perform electrolytic finishing, and removing redundant metal deposited on the surface of the workpiece; and after the power supply electrolysis working time is over, taking out the workpiece, placing the workpiece in absolute ethyl alcohol, and cleaning the film on the surface of the workpiece by using ultrasonic. The electrochemical deposition and the electrolytic photofinishing are combined together for processing, and the redundant metal layer on the surface after the electrochemical deposition is removed, so that the processing precision of the electrodeposited microstructure is ensured, and the processing requirements of various micro parts are met.
Description
Technical Field
The invention relates to the technical field of special processing, in particular to a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method.
Background
With the rapid development of scientific technology, miniaturization and miniaturization equipment and parts with small sizes are increasingly used in the fields of aerospace, national defense and military industry, advanced medical instruments and the like, and the parts with small sizes can reach micron-sized characteristic dimensions, are complex in shape and structure, high in forming precision, small in surface roughness, free of microcracks and internal stress, and further require special surface properties in the use occasions of acid and alkali, high temperature, high pressure and the like, so that the traditional material increase manufacturing method cannot meet the processing requirements easily.
In recent years, special machining methods for micro-sized parts have been developed, such as spark deposition, chemical vapor deposition, spray deposition, and the like. Although the electric spark deposition can improve the wear resistance and corrosion resistance of parts and can deposit a micro structure, the electric spark deposition has the problems of recast layer, surface roughness is increased, the deposition rate of chemical vapor deposition is low, impurities are easy to generate, the requirement of jet deposition on a deposition material is limited, and the important factors restrict the wide application of the chemical vapor deposition.
The electrochemical deposition-electrolysis combined machining based on mask electric field constraint utilizes the advantages of high forming precision and replication precision of electrochemical deposition and combines the characteristic of no recasting layer of electrolysis machining to form a special process for machining a micro-size structure, so that the electrochemical deposition-electrolysis combined machining has the advantages of high machining precision, good surface quality and the like.
In 2019, 12, 17 and CN201910975503.3, the method adopts a surface electrochemical pretreatment-in-situ electrodeposition technique, firstly carries out electrochemical pretreatment on the surface of a substrate, then adopts the in-situ technique to maintain the surface state of the pretreated substrate, and directly enters the electrodeposition process to carry out the growth of an electrodeposition layer, so that the bonding strength between the electrodeposition layer and the substrate can be obviously improved, and can even be higher than the tensile strength of the substrate. However, this method is mainly directed to depositing metal thin films and cannot deposit arrays of micro-structures.
Chinese patent No. CN201610828397.2, 1/25/2017, discloses a method for preparing patterned ordered alpha # Fe2O3 nanoparticle arrays by electrochemical deposition, and the method utilizes double-beam single exposure to pre-pattern electrodes to prepare large-area patterned ordered structure nanoparticle arrays. In the electrochemical deposition process, a cathode electrodeposition method is used, the equipment is simple, the preparation cost is low, high-temperature heating or annealing treatment is not needed, the used chemicals are non-toxic and harmless, and the prepared patterned ordered alpha # Fe2O3 nano-particle array has good reproducibility and good stability. However, the method has complicated operation steps and low processing efficiency.
Chinese patent No. CN201810658609.6, 16.10.2018 discloses a method and apparatus for horizontal electrochemical deposition of metal, in which a semiconductor device is moved horizontally, an upper electrode is contacted with the upper surface of the semiconductor device by a full-surface contact or a multi-point contact, the metal surface to be electrochemically deposited below the semiconductor device is contacted with an electrolyte solution, and metal ions in the electrolyte solution acquire electrons and deposit on the surface. However, the deposited shape of the method is consistent with the shape of the semiconductor device, and a specific shape combination cannot be deposited on the semiconductor device.
Chinese patent No. CN201911039489.2, 11/2/2020, discloses a method for fabricating a microlens array by using photolithography and electroforming processes, which comprises performing photolithography on a photoresist plate, performing electroforming replication on the photoresist plate, and performing electroforming replication on a nickel plate obtained by electroforming to obtain a nickel working plate; adhering a nickel working plate to a glass plate, coating a thin layer of ultraviolet curing adhesive on the surface of the nickel working plate with a honeycomb structure, and completely filling the ultraviolet curing adhesive in a cavity of the honeycomb structure by a vacuumizing method; the liquid level of the ultraviolet curing glue in each honeycomb cavity becomes a spherical surface with a curvature radius, the cured micro-lens array nickel working plate of the ultraviolet curing glue is subjected to electroforming replication to obtain a nickel template, and the micro-lens array is replicated and produced in large batch. However, the array produced by the method cannot realize the deposition and the combination with the surface of the metal substrate.
Chinese patent application No. CN200610039407.0, 9/6/2006, discloses a layered micro-electroforming method and apparatus, which alternately performs three processes of cathode deposition of an electroformed product, coating of the electroformed product, and planarization of a coating layer to expose the bottom surface of the electroformed product under the restriction of a mask, and circulates until a whole three-dimensional micro part is manufactured, and finally, the coating material is removed to obtain the three-dimensional micro part. Because of the adoption of the independent mask plate, the flow field condition of the layered micro electroforming is greatly improved, the variety of electroforming materials is enriched, and the electroforming speed is increased. However, the parts electroformed by the method have the problems of recast layers and poor surface quality.
With the development of miniaturization, light weight and intellectualization of core components in the fields of aerospace, weaponry and the like, the requirements on the volume, the processing precision, the processing quality and the surface performance of parts are more and more strict, and particularly, the realization of micron-sized additive manufacturing of complex fine parts with high forming precision, high surface quality and excellent performance becomes the key of the development of the advanced technology field.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a method for processing a micro part, which adopts a processing mode of restraining electrochemical deposition-electrolysis combination by a mask electric field, thereby not only ensuring the processing precision, but also realizing the processing requirement of no recast layer of the micro part.
In a first aspect, the invention discloses a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method, which comprises the following steps: pasting a film on the surface of the workpiece, exposing the film by a photoetching machine according to the structure of a mask plate, and removing an unexposed area through development to obtain an array hole corresponding to the structure of the mask plate;
after the array holes are manufactured, one end of the workpiece is arranged in the whole fixture, the other end of the workpiece is arranged between two transmission rollers, the workpiece is transmitted to a machining area through the transmission rollers, the fixture is externally connected with a power supply to enable a tool electrode to serve as an anode, the transmission rollers are externally connected with the power supply to enable the workpiece to serve as a cathode, and microstructure electrochemical deposition is carried out: setting the deposition working time of a power supply, flowing electrochemical deposition working fluid into the processing area, driving a tool electrode to do reciprocating scanning motion by a screw rod of the clamp, and performing layer-by-layer deposition on the surface of the workpiece, wherein a film on the surface of the workpiece is made of an insulating material and is used for restraining an electric field in the deposition process and depositing corresponding microstructures in array holes on the surface of the workpiece;
and after the power deposition working time is over, completing the electrochemical deposition of the microstructure, enabling the external power supply of the clamp to enable a tool electrode to serve as a cathode, and enabling the external power supply of the transmission roller to enable a workpiece to serve as an anode to perform electrolytic polishing: setting the electrolytic working time of a power supply, changing the steering direction of the transmission roller, flowing electrolytic finishing working fluid into the processing area, and removing redundant metal deposited on the surface of the workpiece by taking the workpiece as an anode;
and after the electrolytic working time of the power supply is over, finishing the electrolytic polishing, taking out the workpiece, placing the workpiece in absolute ethyl alcohol, and cleaning the film on the surface of the workpiece by using ultrasonic.
Further, in one implementation, the film is made of any one of a photolithographic film, a photoresist, or an insulating plate;
wherein the material of the photoetching film is a photosensitive organic material; the material of the photoresist is suitable for photoetching by a photoetching machine, and the material of the photoresist is SU-8; the insulating plate material is suitable for recycling array holes, and is resin, plastic and high molecular polymer.
Further, in one implementation, the method includes: adhering the film on the surface of a workpiece for processing;
or, the film is adhered with a tool electrode above the workpiece for processing;
alternatively, the membrane is replaced by making a dedicated template that does not adhere to the workpiece.
Further, in one implementation, the electrochemically deposited microstructures include an array combination of any one of cylindrical, triangular, square, and other shaped structures;
alternatively, the electrochemically deposited microstructures are an array combination of any of a variety of structures.
Further, in one implementation, the processing area of the electrochemical deposition and electropolishing fixture is sealed and the gap between the tool electrode and the workpiece is adjustable, the gap adjustment range being 0.1-3 mm.
Further, in one implementation, the processing method of the mask plate for manufacturing the array holes includes photolithography, mechanical micro-milling and laser processing.
Further, in one implementation mode, the voltage amplitude range adopted by the electrochemical deposition is 20-60V, and the voltage amplitude range adopted by the electrolytic polishing is 5-40V.
Further, in an implementation manner, when the electrochemical deposition working solution and the electrolytic polishing working solution adopt the same working solution, the working solution is a mixed solution of different metal agents and additives according to the manufacturing requirements of different metal material microstructures, and the additives include a mixed solution of H3BO3, C12H25SO4Na, and three neutral salt solutions of NaCl, NaNO3 and NaClO 3;
or the electrochemical deposition working solution is a composite solution only containing a metal agent and an additive, and the electrolytic finishing working solution is a composite solution only containing a neutral salt solution.
Further, in one implementation mode, the liquid supply forms of the electrochemical deposition working solution and the electrolytic polishing working solution comprise a static liquid, a flushing liquid and a liquid absorption liquid.
In a second aspect, the invention discloses a clamp for realizing the mask electric field constraint-based electrochemical deposition-electrolysis combined machining method, which comprises a transmission roller wheel, a servo motor and an external power supply, wherein the transmission roller wheel is used for placing a workpiece in the middle; the tool electrode is connected with the screw rod above a workpiece in the machining area, and the screw rod is driven by the servo motor to drive the tool electrode to perform reciprocating scanning motion; the left side and the right side of the clamp are provided with a water inlet and a water outlet, and the workpiece is provided with a flushing sealing device through the positions of the water inlet and the water outlet of the processing area.
The invention has the beneficial effects that:
1. the invention adopts a mask electric field-based constrained electrochemical deposition-electrolysis combined processing method, and realizes that a workpiece completes electrochemical deposition and electrolysis combined processing on the premise of not disassembling a clamp, namely, a power supply cathode and an anode are externally connected to the clamp and a roller, electrochemical deposition composite working solution flows into a processing area, the workpiece is taken as a cathode, a film is laid on the cathode to constrain an electric field, the workpiece is driven by the roller to pass through the processing area, a screw is driven by a servo motor to drive a tool electrode to do reciprocating scanning motion, and corresponding micro-structure electrochemical deposition is carried out according to the structure on the film; after the electrochemical deposition is finished, the cathode and the anode of the external power supply are reversely connected, the transmission roller changes the turning direction, the electrolytic finishing composite working solution flows into a processing area, the workpiece is taken as the anode, and the redundant metal deposited on the surface of the workpiece is removed by electrolysis, so that the surface roughness of the electrochemical deposited microstructure is reduced.
2. Compared with the traditional deposition method, the deposition processing method adopting the mask electric field constraint can deposit micro-size high-precision structures of various shapes on the metal surface, can process cylindrical, triangular, square and other special-shaped structures, and can also process array combinations of any various structures.
3. Adopt the combination of electrochemical deposition working solution and electrolytic polishing working solution, be different from traditional electrochemical deposition processing, its beneficial effect who brings includes: (1) the combined working solution can avoid high-degree corrosion to equipment, and plays a role in protecting the equipment; (2) the solution can greatly improve the processing efficiency during electrolytic processing.
4. In the mask electric field constraint electrochemical-electrolytic machining method adopted by the invention, the film is placed in a mode of being adhered to the surface of a workpiece for machining, or being adhered to a tool electrode above the workpiece for machining, and a special template can be manufactured, is not adhered to the workpiece, and is different from the phenomenon that electric spark is easy to occur in small-gap machining by traditional electrochemical deposition.
5. In the electrochemical-electrolytic machining method based on mask electric field constraint, a large-area workpiece is used, so that the workpiece is driven by a roller to pass through a machining area to complete electrodeposition and electrolytic machining of the whole workpiece.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of an application of a mask electric field constraint-based electrochemical deposition-electrolysis combined machining method provided in the embodiment of the present invention;
FIG. 2a is a schematic diagram of a first processing principle of a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method according to an embodiment of the present invention;
FIG. 2b is a schematic diagram of a second processing principle of a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method according to an embodiment of the present invention;
FIG. 3 is a schematic view of a fixture used in a mask electric field constraint-based electrochemical deposition-electrolysis combined machining method according to an embodiment of the present invention;
FIG. 4a is a schematic diagram of a first processing part array shape based on a mask electric field constraint electrochemical deposition-electrolysis combined processing method provided in the embodiment of the invention;
FIG. 4b is a schematic diagram of a second processing part array shape based on a mask electric field constraint electrochemical deposition-electrolysis combined processing method according to an embodiment of the present invention;
FIG. 4c is a schematic diagram of a third processing part array shape based on a mask electric field constraint electrochemical deposition-electrolysis combined processing method according to an embodiment of the present invention;
FIG. 4d is a schematic diagram of a fourth processing part array shape based on a mask electric field constrained electrochemical deposition-electrolysis combined processing method according to an embodiment of the present invention;
wherein, 1-turbid liquid tank, 2-first filter, 3-multistage centrifugal pump, 4-second filter, 5-clean liquid tank, 6-plunger type metering pump, 7-overflow valve, 8-fine filter, 9-one-way valve, 10-pressure regulating valve, 11-pressure gauge, 12-clamp, 13-water inlet, 14-tool electrode, 15-combined power supply, 16-screw, 17-water outlet, 18-flushing liquid sealing device, 19-driving roller, 20-membrane, 21-workpiece, 22-workbench, 23-servo motor, 24-electrochemical deposition working solution, 25-redundant metal layer, 26-processing area, 27-metal cation, 28-structure, 29-electrolysis product, 30-electrolytic polishing working solution.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
The embodiment of the invention discloses a mask electric field constraint-based electrochemical deposition-electrolysis combined machining method, which is applied to machining of surface microstructures of micro-sized parts of various miniaturized and miniaturized devices in the fields of aerospace, national defense and military industry and advanced medical instruments.
The embodiment provides a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method, which comprises the following steps: pasting a film on the surface of the workpiece, exposing the film by a photoetching machine according to the structure of a mask plate, and removing an unexposed area through development to obtain an array hole corresponding to the structure of the mask plate;
after the array holes are manufactured, one end of the workpiece is arranged in the whole fixture, the other end of the workpiece is arranged between two transmission rollers, the workpiece is transmitted to a machining area through the transmission rollers, the fixture is externally connected with a power supply to enable a tool electrode to serve as an anode, the transmission rollers are externally connected with the power supply to enable the workpiece to serve as a cathode, and microstructure electrochemical deposition is carried out: setting the deposition working time of a power supply, flowing electrochemical deposition working fluid into the processing area, driving a tool electrode to do reciprocating scanning motion by a screw rod of the clamp, and performing layer-by-layer deposition on the surface of the workpiece, wherein a film on the surface of the workpiece is made of an insulating material and is used for restraining an electric field in the deposition process and depositing corresponding microstructures in array holes on the surface of the workpiece;
in this embodiment, the setting of the power deposition operation time is to set the electrodeposition processing parameters on the used pulse power parameter setting interface, and the set processing parameters ensure that the height of the electrodeposition microstructure exceeds the thickness of the film. And the screw of the clamp drives the tool electrode to do reciprocating scanning motion, so that the cross-scale large-area layer-by-layer deposition can be realized.
And after the power deposition working time is over, completing the electrochemical deposition of the microstructure, enabling the external power supply of the clamp to enable a tool electrode to serve as a cathode, and enabling the external power supply of the transmission roller to enable a workpiece to serve as an anode to perform electrolytic polishing: setting the electrolytic working time of a power supply, changing the steering direction of the transmission roller, flowing electrolytic finishing working fluid into the processing area, and removing redundant metal deposited on the surface of the workpiece by taking the workpiece as an anode; in this embodiment, the external power source includes a dc power source and a pulse power source.
In this embodiment, the setting of the power supply electrolysis operation time is to set the electrochemical machining parameters on the parameter setting interface of the used pulse power supply, and the set electrochemical machining parameters should ensure that the electrodeposited microstructure is removed by electrolysis to exceed the film part and improve the surface roughness of the microstructure.
And after the electrolytic working time of the power supply is over, finishing the electrolytic polishing, taking out the workpiece, placing the workpiece in absolute ethyl alcohol, and cleaning the film on the surface of the workpiece by using ultrasonic.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined processing method provided by this embodiment, the film is made of any one of a photolithographic film, a photoresist or an insulating plate;
wherein the material of the photoetching film is a photosensitive organic material; the material of the photoresist is suitable for photoetching by a photoetching machine, and the material of the photoresist is SU-8; the insulating plate material is suitable for recycling array holes, and is resin, plastic and high molecular polymer.
In the electrochemical deposition-electrolysis combined processing method based on mask electric field constraint, the method includes: adhering the film on the surface of a workpiece for processing;
or, the film is adhered with a tool electrode above the workpiece for processing;
alternatively, the membrane is replaced by making a dedicated template that does not adhere to the workpiece.
In this embodiment, the dedicated template can replace the function of the film, the film is not needed when the template is used, the film is replaced by the template, and the template is attached to the workpiece for processing on the premise that the template is not adhered to the workpiece. The method is different from the phenomenon that electric sparks are easy to generate in small-gap machining by traditional electrochemical deposition, and the film and the template used by the method are non-metal, so that the influence of inter-electrode spark discharge is reduced.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined processing method provided by this embodiment, the electrochemically deposited microstructure includes an array combination of any one of cylindrical, triangular, square and other special-shaped structures;
alternatively, the electrochemically deposited microstructures are an array combination of any of a variety of structures.
Compared with the traditional deposition method, the method can deposit the micro-size high-precision structures in various shapes on the metal surface, can process cylindrical, triangular, square and other special-shaped structures, and can also process array combinations of any various structures.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined machining method provided by this embodiment, the machining area of the clamp for electrochemical deposition and electrolytic polishing is closed, and the gap between the tool electrode and the workpiece is adjustable, where the adjustment range of the gap is 0.1-3 mm. In this embodiment, the upper and lower clamps are tightly attached to each other by screw-fastening, so that the whole clamp machining area is closed.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined machining method provided by this embodiment, the machining modes for manufacturing the mask plate of the array holes include photolithography, mechanical micro-milling, and laser machining.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined processing method provided by this embodiment, the voltage amplitude range adopted by the electrochemical deposition is 20-60V, and the voltage amplitude range adopted by the electrolytic finishing is 5-40V.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined processing method provided by this embodiment, when the electrochemical deposition working solution and the electrolytic polishing working solution adopt the same working solution, the working solution is a mixed solution of different metal agents and additives selected according to the manufacturing requirements of different metal material microstructures, and the additives include a mixed solution of H3BO3, C12H25SO4Na, and three neutral salt solutions of NaCl, NaNO3, and NaClO 3;
or the electrochemical deposition working solution is a composite solution only containing a metal agent and an additive, and the electrolytic finishing working solution is a composite solution only containing a neutral salt solution.
In the embodiment, the electrochemical deposition working solution and the electrolytic polishing working solution can avoid high-degree corrosion to equipment, and play a role in protecting the equipment; in addition, the electrochemical deposition working solution and the electrolytic finishing working solution can greatly improve the processing efficiency during electrolytic processing.
In the mask electric field constraint-based electrochemical deposition-electrolysis combined processing method provided by this embodiment, the liquid supply forms of the electrochemical deposition working solution and the electrolytic finishing working solution include a static liquid, a flushing liquid and a liquid suction.
On the basis of the mask electric field constraint-based electrochemical deposition-electrolysis combined machining method provided by the embodiment, the embodiment also provides a clamp for realizing the mask electric field constraint-based electrochemical deposition-electrolysis combined machining method, wherein the clamp comprises a transmission roller for placing a workpiece in the middle, and the transmission roller is driven by a servo motor and is externally connected with a power supply; the tool electrode is connected with the screw rod above a workpiece in the machining area, and the screw rod is driven by the servo motor to drive the tool electrode to perform reciprocating scanning motion; the left side and the right side of the clamp are provided with a water inlet and a water outlet, and the workpiece is provided with a flushing sealing device through the positions of the water inlet and the water outlet of the processing area.
Fig. 1 is a schematic application diagram of a mask electric field constraint-based electrochemical deposition-electrolysis combined processing method according to an embodiment of the present invention. The electrochemical deposition-electrolysis combined machining working solution circulating system based on mask electric field constraint is composed of a liquid purifying tank 5, a turbid liquid tank 1, a first filter 2, a second filter 4, a plunger type metering pump 6, a multistage centrifugal pump 3, an overflow valve 7, a one-way valve 9, a fine filter 8, a pressure regulating valve 10, a pressure gauge 11, a clamp 12, a water inlet 13, a water outlet 17, a liquid flushing sealing device 18 and a pipeline, the working solution circulating system based on mask electric field constraint electrochemical deposition-electrolysis combined machining guarantees that the working solution in machining is supplied fully and machined products are discharged timely, a combined power supply 15, a workbench 22, the clamp 12, a screw 16, a tool electrode 14, a workpiece 21, a membrane 20, a transmission roller 19 and a servo motor 23 form the electrochemical deposition-electrolysis combined machining platform based on mask.
Fig. 2a and 2b are a schematic view of a first processing principle and a schematic view of a second processing principle of the present invention. In the electrochemical deposition processing stage, the tool electrode 14 is externally connected with the anode of the combined power supply, the transmission roller 19 is externally connected with the cathode of the combined power supply 15, the workpiece 21 is in contact with the transmission roller 19 and is transmitted by the transmission roller 19 to pass through the processing area 26, the tool electrode 14 makes reciprocating scanning movement, then the electrochemical deposition working solution 24 is introduced, and finally the power supply is switched on, at the moment, the metal cations 27 in the electrochemical deposition working solution 24 are orderly stacked and deposited on the surface of the electrode 21 under the action of an electric field, and due to the electric field constraint action of the film 20 on the electrode 21, the metal cations 27 can be stacked at a specified position to deposit a specific shape, and the process at the moment is shown in figure; after the electrochemical deposition is finished, a redundant metal layer 25 is arranged on the surface, the polarity of the workpiece 21 and the polarity of the tool electrode 14 are exchanged, the rotation direction of the transmission roller 19 is changed by controlling the servo motor 23, then the electrolytic finishing working solution 30 is switched on to carry out electrochemical dissolution, a reduction reaction is generated near the cathode in the electrochemical finishing processing process, the redundant metal layer 25 is removed in an ion form by electrolysis, an electrolysis product 29 is discharged along with the working solution, and finally the removal of the redundant metal layer 25 on the deposition surface is finished, wherein the process is shown in figure 2 b; the result is a surface finished structure 28 as shown in fig. 2 b. Therefore, the method can be used for depositing and obtaining the micro structure with low surface roughness of the specified shape, and can meet the requirements of the aero-engine on the structure and the surface quality of the micro part.
FIG. 3 is a diagram of a fixture apparatus used in the present invention. The device comprises a transmission roller 19 with a workpiece 21 placed in the middle, wherein the transmission roller 19 is driven by a servo motor 23 and is externally connected with a combined power supply 15, a tool electrode 14 is connected with a screw 16 and driven by the screw to do reciprocating scanning motion above the workpiece 21, the screw 16 is externally connected with the combined power supply and is positioned in the middle of a clamp 12, a water inlet 13 and a water outlet 17 are formed in the left side and the right side of the clamp 12, and a flushing liquid sealing device 18 is arranged at the positions of the water inlet and the water outlet of the workpiece 21 passing through a processing.
FIGS. 4a to 4d are diagrams showing the shape of an array of machined parts according to the present invention. The invention can process round, rectangular, triangular, special-shaped structures and arrays of various structures according to the structures on the film.
With reference to fig. 1 to 4d, the electrochemical deposition working solution 24 is pumped into the processing region 26 by a pipeline under the action of the multistage centrifugal pump, then flows out of the processing region 26 from the water outlet 17, the transmission roller 19 is externally connected with the cathode of the combined power supply 15, the tool electrode 14 is connected with the anode of the combined power supply 15, the workpiece 21 is in contact with the transmission roller 19 and is transmitted by the roller to pass through the processing region 26, and the screw 16 drives the tool electrode 14 to do reciprocating scanning motion to perform electrochemical deposition; after the electrochemical deposition is finished, the cathode and the anode of the tool electrode 14 and the transmission roller 19 are exchanged, the transmission roller 19 changes the turning direction, the electrolytic polishing working solution 30 is introduced, the working solution circulating system is started, and the power supply is switched on to start the electrochemical dissolution polishing processing process. The method effectively combines electrochemical deposition and electrolytic machining together by utilizing the principles of cathode deposition and anode dissolution, gives full play to the respective advantages of the electrochemical deposition machining and the electrolytic machining to the maximum extent, and can meet the requirements of the aero-engine on the structure and the surface quality of the micro parts.
The invention has the beneficial effects that:
1. the invention adopts a mask electric field-based constrained electrochemical deposition-electrolysis combined processing method, and realizes that a workpiece completes electrochemical deposition and electrolysis combined processing on the premise of not disassembling a clamp, namely, a power supply cathode and an anode are externally connected to the clamp and a roller, electrochemical deposition composite working solution flows into a processing area, the workpiece is taken as a cathode, a film is laid on the cathode to constrain an electric field, the workpiece is driven by the roller to pass through the processing area, a screw is driven by a servo motor to drive a tool electrode to do reciprocating scanning motion, and corresponding micro-structure electrochemical deposition is carried out according to the structure on the film; after the electrochemical deposition is finished, the cathode and the anode of the external power supply are reversely connected, the transmission roller changes the turning direction, the electrolytic finishing composite working solution flows into a processing area, the workpiece is taken as the anode, and the redundant metal deposited on the surface of the workpiece is removed by electrolysis, so that the surface roughness of the electrochemical deposited microstructure is reduced.
2. Compared with the traditional deposition method, the deposition processing method adopting the mask electric field constraint can deposit micro-size high-precision structures of various shapes on the metal surface, can process cylindrical, triangular, square and other special-shaped structures, and can also process array combinations of any various structures.
3. Adopt the combination of electrochemical deposition composite working solution and low concentration neutral salt solution, be different from traditional electrochemical deposition processing, its beneficial effect who brings includes: (1) the combined working solution can avoid high-degree corrosion to equipment, and plays a role in protecting the equipment; (2) the solution can greatly improve the processing efficiency during electrolytic processing.
4. In the mask electric field constraint electrochemical-electrolytic machining method adopted by the invention, the film is placed in a mode of being adhered to the surface of a workpiece for machining, or being adhered to a tool electrode above the workpiece for machining, and a special template can be manufactured, is not adhered to the workpiece, and is different from the phenomenon that electric spark is easy to occur in small-gap machining by traditional electrochemical deposition.
5. In the electrochemical-electrolytic machining method based on mask electric field constraint, a large-area workpiece is used, so that the workpiece is driven by a roller to pass through a machining area to complete electrodeposition and electrolytic machining of the whole workpiece.
While the invention has been described in terms of its preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The electrochemical deposition-electrolysis combined processing method based on mask electric field constraint is characterized by comprising the following steps: pasting a film on the surface of the workpiece, exposing the film by a photoetching machine according to the structure of a mask plate, and removing an unexposed area through development to obtain an array hole corresponding to the structure of the mask plate;
after the array holes are manufactured, one end of the workpiece is arranged in the whole fixture, the other end of the workpiece is arranged between two transmission rollers, the workpiece is transmitted to a machining area through the transmission rollers, the fixture is externally connected with a power supply to enable a tool electrode to serve as an anode, the transmission rollers are externally connected with the power supply to enable the workpiece to serve as a cathode, and microstructure electrochemical deposition is carried out: setting the deposition working time of a power supply, flowing electrochemical deposition working fluid into the processing area, driving a tool electrode to do reciprocating scanning motion by a screw rod of the clamp, and performing layer-by-layer deposition on the surface of the workpiece, wherein a film on the surface of the workpiece is made of an insulating material and is used for restraining an electric field in the deposition process and depositing corresponding microstructures in array holes on the surface of the workpiece;
and after the power deposition working time is over, completing the electrochemical deposition of the microstructure, enabling the external power supply of the clamp to enable a tool electrode to serve as a cathode, and enabling the external power supply of the transmission roller to enable a workpiece to serve as an anode to perform electrolytic polishing: setting the electrolytic working time of a power supply, changing the steering direction of the transmission roller, flowing electrolytic finishing working fluid into the processing area, and removing redundant metal deposited on the surface of the workpiece by taking the workpiece as an anode;
and after the electrolytic working time of the power supply is over, finishing the electrolytic polishing, taking out the workpiece, placing the workpiece in absolute ethyl alcohol, and cleaning the film on the surface of the workpiece by using ultrasonic.
2. The mask electric field constraint-based electrochemical deposition-electrolysis combined processing method according to claim 1, wherein the film is made of any one of a photolithographic film, a photoresist or an insulating plate;
wherein the material of the photoetching film is a photosensitive organic material; the material of the photoresist is suitable for photoetching by a photoetching machine, and the material of the photoresist is SU-8; the insulating plate material is suitable for recycling array holes, and is resin, plastic and high molecular polymer.
3. The mask electric field constraint-based electrochemical deposition-electrolysis combined machining method according to claim 1, wherein the method comprises the following steps: adhering the film on the surface of a workpiece for processing;
or, the film is adhered with a tool electrode above the workpiece for processing;
alternatively, the membrane is replaced by making a dedicated template that does not adhere to the workpiece.
4. The mask electric field constraint-based electrochemical deposition-electrolysis combined processing method according to claim 1, wherein the electrochemically deposited microstructures comprise an array combination of any one of cylindrical, triangular, square and other irregular structures;
alternatively, the electrochemically deposited microstructures are an array combination of any of a variety of structures.
5. The mask electric field constraint-based electrochemical deposition-electrolysis combined machining method according to claim 1, wherein the machining area of the electrochemical deposition and electrolytic polishing clamp is closed, and the gap between the tool electrode and the workpiece is adjustable, wherein the adjustment range of the gap is 0.1-3 mm.
6. The mask electric field constraint-based electrochemical deposition-electrolysis combined machining method according to claim 1, wherein the machining modes of the mask plate for manufacturing the array holes comprise photoetching, mechanical micro-milling and laser machining.
7. The mask electric field constraint-based electrochemical deposition-electrolysis combined machining method according to claim 1, wherein the voltage amplitude range adopted by the electrochemical deposition is 20-60V, and the voltage amplitude range adopted by the electrolytic polishing is 5-40V.
8. The mask electric field constraint-based electrochemical deposition-electrolysis combined processing method according to claim 1, wherein when the electrochemical deposition working solution and the electrolytic polishing working solution are the same working solution, the working solution is a mixed solution of different metal agents and additives according to the manufacturing requirements of different metal material microstructures, and the additives comprise H3BO3, C12H25SO4Na and a mixed solution of three neutral salt solutions of NaCl, NaNO3 and NaClO 3;
or the electrochemical deposition working solution is a composite solution only containing a metal agent and an additive, and the electrolytic finishing working solution is a composite solution only containing a neutral salt solution.
9. The combined mask electric field constrained electrochemical deposition-electrolysis processing method according to claim 1, wherein the liquid supply forms of the electrochemical deposition working solution and the electrolytic polishing working solution comprise a static solution, a flushing solution and a liquid suction.
10. A clamp is used for realizing a mask electric field constraint-based electrochemical deposition-electrolysis combined machining method and is characterized by comprising a transmission roller wheel, a servo motor and an external power supply, wherein the transmission roller wheel is used for placing a workpiece in the middle; the tool electrode is connected with the screw rod above a workpiece in the machining area, and the screw rod is driven by the servo motor to drive the tool electrode to perform reciprocating scanning motion; the left side and the right side of the clamp are provided with a water inlet and a water outlet, and the workpiece is provided with a flushing sealing device through the positions of the water inlet and the water outlet of the processing area.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113084279A (en) * | 2021-03-12 | 2021-07-09 | 河南航天液压气动技术有限公司 | High-precision micro electrochemical machining device and method for surface of floating shaft sleeve |
| CN113579378A (en) * | 2021-07-19 | 2021-11-02 | 南京工业大学 | Step-by-step electrolytic machining method for micro-conical array structure |
| CN114457404A (en) * | 2021-12-23 | 2022-05-10 | 南京工业大学 | Roller electrode-based large-area processing method and device for surface microtexture |
| CN114561672A (en) * | 2022-02-18 | 2022-05-31 | 南京工业大学 | Electrochemical additive manufacturing method and device for preparing limited-area pattern based on photoetching layering |
| CN114959806A (en) * | 2022-06-02 | 2022-08-30 | 江苏理工学院 | Array through hole electroforming processing device and two-dimensional material modification method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB952719A (en) * | 1961-11-21 | 1964-03-18 | Gen Electric | Improvements in or relating to electrode tools for electrical machinery |
| US6315883B1 (en) * | 1998-10-26 | 2001-11-13 | Novellus Systems, Inc. | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing |
| CN1917743A (en) * | 2005-08-18 | 2007-02-21 | 新光电气工业株式会社 | Method of forming metal plate pattern and circuit board |
| CN104128683A (en) * | 2014-07-21 | 2014-11-05 | 江苏海迅实业集团股份有限公司 | Method for grinding and finishing surface of cam of internal combustion engine camshaft through electrochemical composite polishing wheel with reverse pulses |
| CN108893771A (en) * | 2018-07-25 | 2018-11-27 | 河南理工大学 | A kind of method that regular polygon cylinder anode and electro-deposition prepare large-area metal micro-structure |
| CN110842308A (en) * | 2019-12-11 | 2020-02-28 | 河南理工大学 | In-situ liquid-sharing electrochemical composite processing device and method |
-
2020
- 2020-09-27 CN CN202011030601.9A patent/CN112170994B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB952719A (en) * | 1961-11-21 | 1964-03-18 | Gen Electric | Improvements in or relating to electrode tools for electrical machinery |
| US6315883B1 (en) * | 1998-10-26 | 2001-11-13 | Novellus Systems, Inc. | Electroplanarization of large and small damascene features using diffusion barriers and electropolishing |
| CN1917743A (en) * | 2005-08-18 | 2007-02-21 | 新光电气工业株式会社 | Method of forming metal plate pattern and circuit board |
| CN104128683A (en) * | 2014-07-21 | 2014-11-05 | 江苏海迅实业集团股份有限公司 | Method for grinding and finishing surface of cam of internal combustion engine camshaft through electrochemical composite polishing wheel with reverse pulses |
| CN108893771A (en) * | 2018-07-25 | 2018-11-27 | 河南理工大学 | A kind of method that regular polygon cylinder anode and electro-deposition prepare large-area metal micro-structure |
| CN110842308A (en) * | 2019-12-11 | 2020-02-28 | 河南理工大学 | In-situ liquid-sharing electrochemical composite processing device and method |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113084279A (en) * | 2021-03-12 | 2021-07-09 | 河南航天液压气动技术有限公司 | High-precision micro electrochemical machining device and method for surface of floating shaft sleeve |
| CN113579378A (en) * | 2021-07-19 | 2021-11-02 | 南京工业大学 | Step-by-step electrolytic machining method for micro-conical array structure |
| CN114457404A (en) * | 2021-12-23 | 2022-05-10 | 南京工业大学 | Roller electrode-based large-area processing method and device for surface microtexture |
| CN114457404B (en) * | 2021-12-23 | 2023-12-22 | 南京工业大学 | Surface microtexture large-area processing method and device based on roller electrode |
| CN114561672A (en) * | 2022-02-18 | 2022-05-31 | 南京工业大学 | Electrochemical additive manufacturing method and device for preparing limited-area pattern based on photoetching layering |
| CN114959806A (en) * | 2022-06-02 | 2022-08-30 | 江苏理工学院 | Array through hole electroforming processing device and two-dimensional material modification method |
| CN114959806B (en) * | 2022-06-02 | 2024-05-07 | 江苏理工学院 | Array through hole electroforming device and two-dimensional material modification method |
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Application publication date: 20210105 Assignee: NANJING KESUO ENVIRONMENT TECHNOLOGY CO.,LTD. Assignor: Nanjing Tech University Contract record no.: X2023980054722 Denomination of invention: Electrochemical deposition electrochemical machining method based on mask electric field constraint Granted publication date: 20211228 License type: Common License Record date: 20240103 |