CN111515480B

CN111515480B - Particle-assisted mask electrolytic machining device and method

Info

Publication number: CN111515480B
Application number: CN202010319991.5A
Authority: CN
Inventors: 杜立群; 王舒萱; 翟科; 刘军山; 温义奎; 白志鹏; 张希; 曹强
Original assignee: Dalian University of Technology
Current assignee: Dalian University of Technology
Priority date: 2020-04-22
Filing date: 2020-04-22
Publication date: 2021-07-02
Anticipated expiration: 2040-04-22
Also published as: CN111515480A

Abstract

A device and a method for particle-assisted mask electrochemical machining belong to the field of micro electrochemical machining. The device fixes the cathode plate and the anode plate through the cathode-anode clamp, and the cathode-anode clamp is fixedly connected through the bolt group to form a closed reaction cavity, so that particles stably circulate along with electrolyte in the processing process. The method comprises the steps of substrate pretreatment, anode substrate mask manufacturing and particle-assisted electrolytic machining, wherein the particles are added into the electrolyte to assist the mask electrolytic machining, the particles obtain kinetic energy under the action of fluid and circularly move along with the electrolyte to impact the anode machining surface, a passivation film generated on the anode metal surface in the machining process can be effectively removed, the contact area of the anode metal surface and the electrolyte is increased, the electrolytic reaction rate is accelerated, and meanwhile, machining products are attached to the anode metal surface and are discharged out of a machining gap. The particle-assisted mask electrolytic machining improves the deep etching capability of electrolytic machining, ensures the machining precision, improves the machining localization, and has particularly obvious improvement effect when machining a high depth-to-width ratio microstructure.

Description

Particle-assisted mask electrolytic machining device and method

Technical Field

The invention relates to a device and a method for particle-assisted mask electrolytic machining, belonging to the field of micro electrolytic machining.

Background

With the rapid development of micro-electro-mechanical systems, metal microstructures are applied more and more widely. At present, the machining method of the metal microstructure mainly comprises mechanical micromachining, electric spark machining, laser machining, electron beam machining, electrolytic machining and the like. The electrolytic machining has the outstanding advantages of wide machining range, high production efficiency, good surface quality, no residual stress, no deformation, no tool loss and the like. The mask electrolytic machining as a class of electrolytic machining technology has the advantages of low production cost, capability of one-time mass forming machining, capability of ensuring higher machining precision and repeatability precision and the like, and has wide application prospect in metal microstructure machining.

In the mask electrolytic processing, the precipitable metal hydroxide in the anode electrolysis product and the metal oxide generated by the reaction are deposited on the surface of the workpiece along with the reaction to form a layer of insulating passivation film, so that the flow rate of electrolyte on the surface of the workpiece is reduced, meanwhile, reactant particles generated on the interface of the metal and the solution are difficult to migrate to the bulk solution, and the electrode reaction is limited to be carried out. Meanwhile, due to the isotropic property of the etching material, stray corrosion can occur in the processing process, and the processing precision of the mask electrolytic processing is difficult to guarantee due to the serious side etching problem.

In order to solve the above problems, the invention patent CN 104551282 a discloses a system and a method for improving the localization of array micro-pit electrochemical machining by using a flexible template. The method adopts high-speed electrolyte to positively impact the flexible template to provide pre-pressure to ensure that the flexible template is attached to a workpiece, and improves the localization of the micro-pit array electrolytic machining. However, due to the adoption of the flexible template, the deformation of the flexible template can make the processing precision difficult to guarantee. In addition, because the gap between the cathode and the anode is too small, the pressure of the electrolyte on the surface of the anode workpiece after passing through the cathode tool group seam is different, so that the flow field of each area on the surface of the workpiece becomes uneven, and the phenomenon of inconsistent processing precision can be caused.

The invention patent CN 106064261A discloses a system and a method for micro-pit array electrolytic machining based on a magnetic PDMS mask. According to the method, the PDMS mask containing the magnetic particles is prepared, the magnetic field force is utilized to enhance the bonding of the mask and the workpiece, the stray corrosion around the micro-pits generated by the lateral erosion is effectively weakened, and the locality of the micro-pit array electrolytic machining is improved. On the one hand, however, the preparation process of the magnetic mask is complex and has high process requirements; on the other hand, the extension rate of the mask is limited under the action of the magnetic field force, and the laminating effect of the mask and the workpiece is difficult to ensure to meet the processing requirement.

A test study on the micro-grooves of the mask electrochemical machining was carried out in the period 1-24 of 2015, which proposes to use a composite electrolyte to improve the localization of the mask electrochemical machining, and to add NaNO with a mass fraction of 15%₃Adding 0.1mol/L H into the electrolyte₂SO₄And (3) solution. H₂SO₄The solution can dissolve the anode reaction by-products to a certain extent, relieve the limiting effect of the passive film on the reaction and accelerate the cyclic update of the electrolyte. But when the working material is isotropic, H₂SO₄The solution is added to dissolve the passive film on the non-processing direction of the workpiece at the same time, so that the processing precision is seriously reduced. Therefore, the method has no general applicability and is not suitable for processing high aspect ratio microstructures.

In summary, the existing method for improving the localization of the mask electrochemical machining has certain limitations. Due to poor processing localization and insufficient deep etching capability, the existing mask electrolytic processing is often limited to surface texture processing or thin plate through hole processing, and the processing requirement of a microstructure device on a microstructure with a high depth-to-width ratio is difficult to meet. Therefore, it is necessary to invent a new device and method for improving the deep etching capability of mask electrochemical machining while ensuring the machining precision.

Disclosure of Invention

Aiming at the problems in the prior art, the invention provides a device and a method for particle-assisted mask electrolytic machining, aiming at reducing the limit of a passivation film on electrolytic reaction and overcoming the problems of weak deep etching capability and poor machining localization in the existing mask electrolytic machining.

In order to achieve the purpose, the technical scheme adopted by the invention is as follows:

a device for carrying out electrochemical machining on a particle-assisted mask comprises a cathode plate 1, an anode plate 4, a cathode clamp 10, an anode clamp 11, a sealing gasket 20, a conductive screw 15, a plastic screw 13, a fastening bolt 17 and a fastening nut 18.

The cathode clamp 10 and the anode clamp 11 are made of non-conductive materials, the cathode clamp 10 is provided with four cathode clamp through holes 19, and the anode clamp 11 is provided with four anode clamp counter bores 16. The cathode clamp 10 and the anode clamp 11 are fixedly connected through a sealing gasket 20, four groups of fastening bolts 17 and fastening nuts 18, and a reaction cavity is formed inside the cathode clamp and the anode clamp. Cathode anchor clamps 10 and positive pole anchor clamps 11 all be equipped with a top countersunk head screw hole 14 and four inside screw holes 12, countersunk head screw hole 14 is located

cathode anchor clamps

10 and 11 middle parts of positive pole anchor clamps, inside screw hole 12 is located countersunk head screw hole 14 all around.

The cathode plate 1 and the anode plate 4 are made of conductive materials, four electrode plate through holes 23 for passing plastic screws are formed in the cathode plate 1 and the anode plate 4, and the cathode plate 1 and the anode plate 4 are fixedly connected with the cathode clamp 10 and the anode clamp 11 through four plastic screws 13 in a threaded fit mode through internal threaded holes 12. The two conductive screws 15 are respectively surrounded at countersunk positions through conducting wires and in threaded fit with top countersunk threaded holes 14 on the cathode clamp 10 and the anode clamp 11 to realize the electric conduction of the cathode plate 1 and the anode plate 4 and the external power supply 6. The right side of the cathode clamp 10 is provided with a liquid inlet 7, and the left side of the anode clamp 11 is provided with a liquid outlet 8. Here, the cathode plate 1 is a cathode metal plate, and the anode plate 4 is an anode metal substrate.

The sealing gasket 20 is made of non-conducting materials, is provided with four gasket through holes for fastening the bolts 17, has the same aperture size as the diameter of the bolts 17, and is provided with gasket square holes 22 with the same size as the reaction cavity, so that the reaction cavity is communicated and sealing is ensured.

Furthermore, the conductive materials of the cathode plate 1 and the anode plate 4 comprise copper, stainless steel and the like, and the aperture size of the through holes 23 of the four electrode plates is the same as the diameter of the plastic screws 13.

Further, the non-conductive materials of the cathode clamp 10 and the anode clamp 11 include nylon, polypropylene, polyvinyl chloride, glass, and the like.

Further, the conductive screw 15 is made of a metal material, such as copper, carbon steel, or the like. The plastic screws 13 are of a non-conductive and corrosion resistant material such as nylon, polypropylene, polyvinyl chloride, and the like.

Further, the sealing gasket 20 is made of rubber.

A method for realizing particle-assisted mask electrolytic machining based on the device comprises the following machining steps:

step one, preprocessing a metal substrate

Adopting sand paper with different models to respectively perform coarse grinding, fine grinding and polishing treatment on the two metal substrates; ultrasonically cleaning the metal substrate by using acetone and ethanol solution, cleaning the metal substrate by using deionized water, drying the metal substrate, and cooling the dried metal substrate to room temperature for later use. And one of the pretreated metal substrates is directly used as a cathode metal plate.

Step two, manufacturing an anode substrate mask

And (3) spin-coating a photoresist on the surface of the other metal substrate pretreated in the first step, carrying out prebaking, determining the exposure dose according to the specific photoresist thickness and the manufacturing precision after the prebaking is finished, developing the exposed substrate, carrying out postbaking after the development, and then cooling to room temperature to obtain the anode metal substrate with the photoresist mask 3.

Step three, carrying out particle-assisted mask electrolytic machining

And (3) carrying out a mask electrolytic machining experiment, preparing an electrolyte solution, adding the particles 2 with the selected particle size and content into the electrolyte 5, enabling the electrolyte 5 to flow into a machining area from a liquid inlet 7 and flow out from a liquid outlet 8, and realizing circular updating in a pumping mode.

Connecting the anode metal substrate with the photoresist mask 3 with the power supply anode of an external power supply 5 to be used as an anode of electrolytic machining, and connecting the cathode metal substrate with the power supply cathode to be used as an electrolytic machining cathode; and then putting the cathode plate and the anode plate into the electrolyte 5 and completely immersing the processing area, and setting power supply parameters for electrolytic processing. In the processing process, an oxidation reaction is carried out on the anode metal substrate, metal at the exposed part of the photoresist mask 3 is oxidized into metal ions, the metal ions enter into the electrolyte and react with solution ions to generate metal oxides and metal hydroxides, a passivation film 9 is formed on the surface of the anode, particles 2 in the electrolyte 5 impact the surface of the anode plate 4 along with the electrolyte 5 under the action of pump pressure to erode the passivation film 9 attached to the metal surface and prevent the passivation film 9 from being further accumulated, so that the electrolysis reaction is continuously carried out.

The photoresist mask 3 on the surface of the anode metal substrate is a group hole array with the aperture size of 50-150 microns, the particle size of the added particles 2 is ten percent to sixty percent of the aperture size of the photoresist mask 3, and under the limitation of the aperture size of the photoresist mask 3 and the particle size of the particles, the particles 2 only impact the processing surface in the processing depth direction, so that the lateral corrosion is reduced, the processing localization is improved, and the processing of a high-aspect-ratio microstructure is realized.

The particles 2 can be made of hard materials such as silicon carbide, aluminum oxide, boron nitride and diamond, the effect that the particles collide with the processing surface is guaranteed, the particles do not react with electrolyte components, and the particles attach reaction ions to the surface of the anode metal when moving, so that the concentration of the particles is increased, the reaction rate is accelerated, meanwhile, the processing products can be attached to the processing gap, the mass transfer efficiency is improved, and meanwhile, the uniformity of an electric field is improved.

The power supply is a pulse power supply, and the intermittent processing is realized by adopting the pulse power supply, so that heat, bubbles and the like generated in the processing process can be relieved, the updating of electrolyte is facilitated, the products are timely discharged, and the particles are circularly supplemented. The use of the pulse power supply can effectively improve the roughness of the processed surface and the shape precision of the processing.

The flow rate of the electrolyte is 2-5L/min. The particles are circulated with the electrolyte in a pumping mode, the particles obtain kinetic energy under the action of fluid and impact a machined surface, the flow rate of the electrolyte ensures that the particles achieve the required kinetic energy, and the electrolyte circulation mode can adopt a lateral liquid filling mode (parallel to the surface of an anode workpiece) or a forward liquid filling mode (electrolyte is introduced from the inside of a cathode).

The invention has the beneficial effects that: the device and the method have the advantages that the particles are added into the electrolyte to assist electrolytic machining, the high-hardness particles obtain kinetic energy under the action of fluid to impact the machined surface of a workpiece, a passivation film on the machined surface of an anode is eroded, the circulation updating of the electrolyte on the surface of the anode is accelerated, and the reaction is promoted to continue. The processing device ensures that the cathode plate and the anode plate are completely immersed in the electrolyte to react, and the cathode plate and the anode plate are kept fixed under the impact of particles, the device is well sealed, and the stable circulation of the electrolyte can be ensured. The grain diameter of the added particles is ten percent to sixty percent of the aperture of the mask, so that the particles only remove the passivation film on the surface of the anode in the etching depth direction, the lateral corrosion is reduced, the processing localization is improved, the processing precision is ensured, and the processing of the microstructure with high depth-to-width ratio is realized.

Drawings

FIG. 1 is a three-dimensional view of a cathode holder;

FIG. 2 is a three-dimensional view of an anode clamp;

FIG. 3 is a general view of a particle assisted mask electrochemical machining apparatus;

FIG. 4 is a front cross-sectional view of the particle-assisted mask electrochemical machining apparatus;

FIG. 5 is a left side view of the particle assisted mask electrochemical machining apparatus;

FIG. 6 is a top view of the particle assisted mask electrochemical machining apparatus;

FIG. 7 is a schematic view of a gasket seal;

FIG. 8 is a schematic view of a cathode (anode) plate;

FIG. 9 is a schematic illustration of a particle assisted mask electrochemical machining reaction;

FIG. 10 is a schematic view of particles impinging on the surface of an anode;

FIG. 11 is a schematic view of particle removal of a partial passivation film;

FIG. 12 is a schematic view of a portion of the machined surface with increased depth;

FIG. 13 is a schematic view showing the deep etching strengthening effect of the processed surface;

in the figure: the device comprises a cathode plate 1, particles 2, a photoresist mask 3, an anode plate 4, an electrolyte 5, an external power supply 6, a liquid inlet 7, a liquid outlet 8, a passivation film 9, a cathode clamp 10, an anode clamp 11, an internal threaded hole 12, a plastic screw 13, a countersunk threaded hole 14, a conductive screw 15, an anode clamp countersunk hole 16, a fastening bolt 17, a fastening nut 18, a cathode clamp through hole 19, a sealing gasket 20, a gasket through hole 21, a gasket square hole 22 and an electrode plate through hole 23.

Detailed Description

The following detailed description of the invention refers to the accompanying drawings.

FIG. 1 is a three-dimensional view of a cathode holder, wherein four nylon cathode holders 10 are provided

A cathode clamp through hole 19, four M3 internal threaded holes 12 and an M6 countersunk threaded hole 14, the side surface of which is provided with

Deep 2 counter bore

A liquid inlet 7 of the through hole. FIG. 2 is a three-dimensional view of an anode clamp, wherein four nylon anode clamps 11 are arranged

Deep 2 anode clamp counter bore

Four M3 internal threaded holes 12 and one M6 countersunk threaded hole 14, the side of which is provided with

Deep 2 counter bore

A liquid outlet 8 of the through hole. Fig. 3 is a general view of the particle-assisted mask electrochemical machining device, wherein an anode clamp 11 with an anode clamp counterbore 16 is arranged at the lower layer, a cathode clamp 10 with a cathode clamp through hole 19 is arranged at the upper layer, and the cathode clamp 10 is fixedly connected with the anode clamp 11 through a rubber sealing gasket 20, a fastening bolt 17 of M8 and a nut 18 of M8, and good sealing is ensured. FIG. 4 is a front cross-sectional view of the device, a cathode clamp 10 is fastened with an anode clamp 11 to form a reaction chamber, a stainless steel cathode plate 1 is fixed with an internal threaded hole 12 in the cathode clamp 10 through four groups of nylon screws 13 of M3 in a threaded fit manner, a copper anode plate 4 is also fixedly connected with the anode clamp 11, and the cathode plate 1 and the anode plate 4 are respectively communicated withThe copper conductive screw 15 passing through the M6 is matched with the countersunk head threaded hole 14 of the M6 in the male and

female clamps

10 and 11, and is connected with the external power supply 6 through a lead. The liquid inlet 7 is arranged on the left side of the cathode clamp 10, and the liquid outlet 8 is arranged on the right side of the anode clamp 11, so that the positive flushing of the anode plate is realized. Fig. 5 and 6 are a left side view and a top view, respectively, of a particle assisted mask electrochemical machining apparatus. Fig. 7 is a schematic diagram of a sealing gasket, and fig. 8 is a schematic diagram of a cathode (anode) plate.

Fig. 9 is a schematic diagram of the particle-assisted mask electrochemical machining reaction, in which an anode plate 4 with a photoresist mask 3 is connected with an anode of an external power supply 6 to serve as an anode of electrochemical machining, a cathode plate 1 is connected with a cathode of the external power supply 6 to serve as an cathode of the electrochemical machining, particles 2 are added into an electrolyte 5, and then the electrolyte flows into a machining area from a liquid inlet 7 and flows out from a liquid outlet 8, and cyclic updating is achieved in a pumping mode. As the reaction proceeds, a passivation film 9 is formed on the metal surface of the anode plate 4 to limit the reaction to continue, fig. 10 is a schematic view showing that particles collide with the surface of the anode workpiece along with the movement of the electrolyte, fig. 11 is a schematic view showing that the passivation film is partially removed by the particles, and the passivation film 9 in the erosion area of the particles 2 is removed, so that the electrolytic reaction continues. Fig. 12 is a schematic view showing an increase in the partial etching depth of the processed surface as the reaction proceeds, and fig. 13 is a schematic view showing an effect of strengthening the etching depth of the processed surface.

The method for realizing the particle-assisted mask electrolytic machining based on the device comprises the following specific steps:

(1) substrate pretreatment

Respectively grinding and polishing the stainless steel substrate and the copper substrate by using abrasive paper until the surfaces are bright and have no scratches; wiping the surface of the substrate by using an acetone cotton ball, then putting the substrate into an acetone solution for ultrasonic cleaning, then putting the substrate into an ethanol solution for ultrasonic cleaning, washing the substrate by using deionized water, drying the substrate by using nitrogen, and then putting the substrate into a vacuum oven for drying; and taking out the dried and cooled metal substrate for later use, and directly taking the stainless steel substrate as a cathode metal plate for later use.

(2) Anode substrate mask fabrication

Spin-coating BN303 photoresist on the surface of a pretreated copper substrate by using a table type spin coater, placing the copper substrate coated with the BN303 photoresist on a horizontal hot plate for prebaking, cooling to room temperature after the prebaking is finished, then carrying out exposure, adopting an array pit mask plate with the aperture of 100 mu m for exposure, developing the exposed substrate by using negative photoresist developing solution, negative photoresist cleaning agent and acetone solution respectively, placing on the horizontal hot plate for postbaking after the development, and then cooling to room temperature, thus obtaining the anode metal substrate with the photoresist mask 3, wherein the anode metal substrate is an anode plate 4.

(3) Particle-added assisted mask electrochemical machining

Preparing an electrolytic machining experiment by preparing 1L of NaNO with the mass fraction of 15%₃Adding SiC micropowder with particle size of 20 μm into electrolyte 5, wherein the concentration of dispersed phase is 10%, the flow rate of the electrolyte is 3L/min, allowing the electrolyte 5 to flow in parallel with an anode metal substrate in a lateral liquid filling manner, allowing a cathode plate to be a stainless steel plate, putting an anode plate and a cathode plate into the electrolyte 5, allowing the electrolyte 5 to completely submerge a processing region, adjusting the positions of the two plates to allow the two plates to be in parallel and opposite, connecting a copper metal substrate with a photoresist mask 3 with a pulse power supply anode, connecting the stainless steel cathode plate with the pulse power supply cathode, and setting the current density to be 3A/cm²And starting a power supply to perform electrolytic machining, wherein the duty ratio is set to 30%, and the machining time is 2 min.

Compared with the mask electrolytic machining without adding particles, the method for electrolytic machining by adding the particle-assisted mask has the advantages that the locality is obviously improved, the deep etching capacity is greatly improved, the average value of the aperture obtained by electrolytic machining of the particle-free assisted mask is 150.15 micrometers, the average etching depth is 29.57 micrometers, the average value of the machining aperture obtained by electrolytic machining of the particle-assisted mask is 132.75 micrometers, the average etching depth is 34.25 micrometers, the etching factor EF is improved by 77.38%, the uniformity of array group holes is obviously improved, and the quality of the machined surface is also obviously improved compared with the particle-free assisted machining. The method can effectively remove the passive film generated on the surface of the anode metal in the processing process, promote the reaction to continue, discharge the processed product attached to the particles out of the processing area, improve the mass transfer efficiency of the electrolyte, limit the particles to impact the processing surface in the processing depth direction by the particle size and the mask aperture, reduce the lateral corrosion, improve the deep etching capability, improve the processing localization, provide a feasible method for processing the microstructure with the high depth-to-width ratio, improve the quality of the processing surface, and have the characteristics of simplicity, high efficiency and economy.

The above-mentioned embodiments only express the embodiments of the present invention, but not should be understood as the limitation of the scope of the invention patent, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the concept of the present invention, and these all fall into the protection scope of the present invention.

Claims

1. The device for the electrolytic machining of the particle auxiliary mask is characterized by comprising a cathode plate (1), an anode plate (4), a cathode clamp (10), an anode clamp (11), a sealing gasket (20), a conductive screw (15), a plastic screw (13) and a fastening bolt (17);

the cathode clamp (10) and the anode clamp (11) are both made of non-conductive materials, the cathode clamp (10) is provided with four cathode clamp through holes (19), and the anode clamp (11) is provided with four anode clamp counter bores (16); the cathode clamp (10) is fixedly connected with the anode clamp (11) through a sealing gasket (20) and four groups of fastening bolts (17) and fastening nuts (18), and a reaction cavity is formed inside the cathode clamp and the anode clamp; the cathode clamp (10) and the anode clamp (11) are respectively provided with a top countersunk threaded hole (14) and four internal threaded holes (12), the countersunk threaded holes (14) are positioned in the middle of the cathode clamp (10) and the anode clamp (11), and the internal threaded holes (12) are positioned around the countersunk threaded holes (14);

the cathode plate (1) and the anode plate (4) are made of conductive materials, four electrode plate through holes (23) are formed in the cathode plate (1) and the anode plate (4), and the cathode plate (1) and the anode plate (4) are fixedly connected with internal threaded holes (12) in the cathode clamp (10) and the anode clamp (11) in a threaded fit mode through four plastic screws (13); the two conductive screws (15) are respectively encircled at countersunk positions through conducting wires and are in threaded fit with top countersunk threaded holes (14) on the cathode clamp (10) and the anode clamp (11) to realize the conduction of the cathode plate (1), the anode plate (4) and the external power supply (6); a liquid inlet (7) is formed in the right side surface of the cathode clamp (10), and a liquid outlet (8) is formed in the left side surface of the anode clamp (11); preparing an electrolyte (5) solution, adding particles (2) into the electrolyte (5), wherein the electrolyte (5) flows into a processing area from a liquid inlet (7) and flows out from a liquid outlet (8);

the sealing gasket (20) is made of non-conductive material, is provided with four gasket through holes and is provided with a gasket square hole (22) with the same size as the reaction cavity.

2. A method for performing particle assisted mask electrochemical machining based on the apparatus of claim 1, comprising the steps of:

step one, preprocessing a metal substrate

Respectively carrying out coarse grinding, fine grinding and polishing treatment on the two metal substrates, and drying after ultrasonic cleaning; one of the pretreated metal substrates is directly used as a cathode metal plate, and the cathode metal plate is used as a cathode plate (1);

step two, manufacturing an anode substrate mask

Spin-coating photoresist on the surface of the other metal substrate pretreated in the first step, carrying out prebaking, determining exposure dose according to specific photoresist thickness and manufacturing precision after the prebaking is finished, developing the exposed substrate, carrying out postbaking after the development, and then cooling to room temperature to obtain an anode metal substrate with a photoresist mask (3), wherein the anode metal substrate is an anode plate (4);

step three, carrying out particle-assisted mask electrolytic machining

Adding the particles (2) into electrolyte (5), preparing electrolyte solution, enabling the electrolyte (5) to flow into a processing area from a liquid inlet (7) and flow out from a liquid outlet (8), realizing circular updating in a pumping mode, and performing a mask electrochemical machining experiment;

connecting the anode metal substrate with the anode of an external power supply, and connecting the cathode metal substrate with the cathode; then putting the cathode plate and the anode plate into the electrolyte (5) and completely immersing the processing area, and setting power supply parameters for electrolytic processing;

in the processing process, an oxidation reaction is carried out on the anode metal substrate, metal at the exposed part of the photoresist mask (3) is oxidized into metal ions, a passivation film (9) is formed on the surface of the anode after the metal ions enter the electrolyte, particles (2) in the electrolyte (5) impact the surface of the anode plate (4) along with the electrolyte (5) under the action of pump pressure, the passivation film (9) attached to the surface of the metal is eroded, the passivation film (9) is prevented from being further accumulated, and therefore the electrolytic reaction is continuously carried out.

3. The method for realizing particle-assisted mask electrochemical machining based on the device of claim 1, according to claim 2, characterized in that the photoresist mask (3) is a group hole array with a pore size of 50-150 μm; the added particles (2) have a particle size of ten to sixty percent of the aperture size of the photoresist mask (3).

4. A method for performing particle-assisted mask electrochemical machining according to claim 1, based on the device according to claim 2 or 3, characterized in that the particles (2) are silicon carbide, aluminum oxide, boron nitride or diamond.

5. The method for realizing particle-assisted mask electrochemical machining based on the device of claim 1 according to claim 2 or 3, characterized in that the power supply is a pulse power supply.

6. The method of claim 4, wherein the power source is a pulsed power source.

7. The method for realizing the particle assisted mask electrolytic machining based on the device of claim 1 is characterized in that the flow rate of the electrolyte is 2-5L/min.

8. The method for realizing particle assisted mask electrolytic machining based on the device of claim 1 according to claim 4, wherein the flow rate of the electrolyte is 2-5L/min.

9. The method for realizing particle assisted mask electrolytic machining based on the device of claim 1 according to claim 5, wherein the flow rate of the electrolyte is 2-5L/min.

10. The method for realizing particle assisted mask electrolytic machining based on the device of claim 1 according to claim 6, wherein the flow rate of the electrolyte is 2-5L/min.