CN112165780A - Expansion and contraction plate dividing method and expansion and contraction plate dividing device - Google Patents
Expansion and contraction plate dividing method and expansion and contraction plate dividing device Download PDFInfo
- Publication number
- CN112165780A CN112165780A CN202011126132.0A CN202011126132A CN112165780A CN 112165780 A CN112165780 A CN 112165780A CN 202011126132 A CN202011126132 A CN 202011126132A CN 112165780 A CN112165780 A CN 112165780A
- Authority
- CN
- China
- Prior art keywords
- plate
- expansion
- contraction
- target distance
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The application provides a method and a device for splitting expansion and contraction plates. The expansion and contraction split plate method comprises the following steps: carrying out pressing operation on the plate; obtaining the actual target distance of the plate; calculating the difference value of the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate; processing a preset number of marking grooves on the plate according to the expansion and contraction values; dividing the plate according to the number of the marking grooves; calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate; selecting a corresponding expansion and contraction tool according to the expansion and contraction coefficient of the plate and the plate dividing result so as to drill the plate; because the plate is thinned and divided, the problem that the expansion and shrinkage drilling belt is not matched with the production plate before drilling is solved by simply classifying the traditional circuit board according to whether the expansion and shrinkage are carried out, the situation of repeated proofing and debugging is avoided, and the production efficiency and the precision of the circuit board are improved.
Description
Technical Field
The invention relates to the technical field of circuit board manufacturing equipment, in particular to a method and a device for expansion and contraction board separation.
Background
With the continuous upgrade of electronic products, high-density interconnection printed boards are widely used, the thickness of the adopted core board is thinner and thinner, and the expansion and shrinkage coefficients of the boards have strict requirements, particularly the application of a layer-by-layer laminating technology. Because the manufacturing process of the circuit board is increased and the expansion and shrinkage change in the production process is large, the expansion and shrinkage management and control are very important.
In the manufacturing process of the circuit board, the internal stress accumulated on the board due to the action of the external force can be avoided, so that the purpose of reducing the internal stress can be achieved. Due to the internal stress generated by the change of the environmental temperature and humidity or the physical property of the circuit board material, the shrinkage stress generated by the resin curing of the circuit board, such as the thermal stress generated when the external temperature changes due to the mismatching of the thermal expansion coefficients of the components such as resin, glass fiber, copper foil, filler and the like. The existence of internal stress influences the dimensional stability of the board, and the board is unevenly expanded and contracted due to the wet stress generated by the change of the environmental humidity and the like.
However, since the expansion and shrinkage of the circuit board are not uniform, and the circuit board is classified only according to whether the expansion and shrinkage exist, for the circuit board with the multi-layer structure having the expansion and shrinkage, the expansion and shrinkage drill belt is not matched with the production board before drilling, which has a great influence on the production efficiency of the circuit board. In order to solve the problem that the collapsible drill belt of the circuit board is not matched with the production board before drilling, workers need to measure the hole distance of the target hole and calculate the hole distance, a new collapsible drill belt is manufactured again, the production board which is subjected to sample making in the process needs material changing production, and the waiting time in the middle is long. If the sample of the new collapsible drill belt is found to be still not in accordance with the requirements, the previous sample making process is repeated again, time and labor are wasted, and the drill belt can only take out a very small part of batch products for measurement and calculate the average value of the products, so that the production efficiency and the precision of the circuit board are low.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a collapsible splitting plate method and a collapsible splitting plate device which enable the production efficiency and the precision of a circuit board to be higher.
The purpose of the invention is realized by the following technical scheme:
a collapsible split plate method, comprising:
carrying out pressing operation on the plate;
obtaining an actual target distance of the plate;
calculating the difference value of the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate;
processing a preset number of marking grooves on the plate according to the expansion and contraction values;
dividing the plate according to the number of the marking grooves;
calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate;
and selecting a corresponding expansion and contraction tool according to the expansion and contraction coefficient of the plate and the plate dividing result so as to drill the plate.
In one embodiment, before the step of obtaining the actual target distance of the plate member, and after the step of pressing the plate member, the method further comprises:
establishing a parameter table in which the types of the plates correspond to the coordinate setting value programs one to one;
setting the type of the plate;
and calling the parameter table, and selecting the corresponding coordinate setting program according to the type of the plate.
In one embodiment, when the expansion and contraction value is 0, the number of the marking grooves is 0;
when the expansion and contraction value is larger than 0 and smaller than a first set value, the number of the marking grooves is 1;
when the expansion and contraction value is greater than or equal to a first set value and less than a second set value, the number of the marking grooves is 2;
when the expansion and contraction value is larger than or equal to a second set value, the number of the marking grooves is 3.
In one embodiment, the first set value is 0.05mm to 0.1 mm.
In one embodiment, the second predetermined value is 0.1mm to 0.15 mm.
In one embodiment, the first set value is 0.05mm, and the second set value is 0.1 mm.
In one embodiment, the first set value is 0.1mm, and the second set value is 0.15 mm.
In one embodiment, after the step of calculating the ratio of the actual target distance to the predetermined target distance to obtain the expansion coefficient of the plate, the expansion and contraction split plate method further comprises:
and marking the expansion and contraction coefficient on the plate.
In one embodiment, the step of marking the expansion and contraction coefficient on the plate is performed before the step of machining a predetermined number of marking grooves on the plate according to the expansion and contraction value, and after the step of calculating the ratio of the actual target distance to the predetermined target distance to obtain the expansion and contraction coefficient of the plate.
An expansion and contraction board dividing device adopts the expansion and contraction board dividing method of any embodiment to divide boards.
Compared with the prior art, the invention has at least the following advantages:
the invention relates to a method for splitting a plate by expansion and contraction, which comprises the following steps of firstly, carrying out pressing operation on a plate; then, obtaining the actual target distance of the plate; then, classifying the plate pieces according to the expansion and contraction values so as to refine and divide the plate pieces; then, calculating the difference value between the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate; then, processing a preset number of marking grooves on the plate according to the expansion and contraction values; then, dividing the plate according to the number of the marking grooves; then, calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate; then, according to the expansion and contraction coefficient of the plate and the plate dividing result, selecting a corresponding expansion and contraction tool to drill the plate; because a preset number of marking grooves are processed on the plate according to the expansion and contraction value, the plate is divided according to the number of the marking grooves, and corresponding expansion and contraction tools are selected according to the expansion and contraction coefficient and the plate dividing result of the plate to drill the plate, not only is the plate divided quickly, and the production efficiency of the plate is improved, but also the problem that the expansion and contraction drilling belt is not matched with the production plate before drilling because the traditional circuit board classification is simply classified according to whether the expansion and contraction occur is avoided, so that the situation of repeated sample drilling and debugging is avoided, and the production efficiency and the precision of the circuit board are improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of a collapsible split plate method according to an embodiment;
FIG. 2 is a schematic view of an embodiment of a collapsible plate apparatus;
FIG. 3 is a schematic view of a plate member being processed by the collapsible plate apparatus shown in FIG. 2;
FIG. 4 is a schematic view of the plate member shown in FIG. 3 with a marking slot and a coefficient of expansion and contraction;
FIG. 5 is an enlarged view of a portion of the collapsible plate apparatus shown in FIG. 2;
fig. 6 is a partial schematic view of the collapsible plate apparatus of fig. 2.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, the expansion and contraction splitting method of an embodiment is used for splitting plate members. The expansion and contraction split plate method comprises part or all of the following steps:
and S101, pressing the plate.
S103, obtaining the actual target distance of the plate.
And S105, calculating the difference value between the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate.
And S107, machining a preset number of marking grooves in the plate according to the expansion and contraction values.
In this embodiment, a predetermined number of marking grooves are machined in the plate according to the expansion and contraction values, and the number of marking grooves is different for plate with different expansion and contraction value intervals.
In one embodiment, the plate members are classified into four types, i.e., a first type plate, a second type plate, a third type plate and a fourth type plate, according to the range of the expansion and contraction values. If the plate is a plate, the number of the marking grooves is 0, namely the marking grooves are not formed on the plate by the grooving mechanism, and the plate is a non-expansion plate and a qualified plate. If the plate is a second-class plate, the number of the marking grooves is 1, namely, one marking groove is formed in the plate by the grooving mechanism. If the plate is a three-type plate, the number of the marking grooves is 2, namely, the grooving mechanism is used for forming two marking grooves on the plate. If the plate is a four-type plate, the number of the marking grooves is 3, namely, the grooving mechanism is provided with three marking grooves on the plate.
And S109, dividing the plate according to the number of the marking grooves.
And S111, calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate.
S113, selecting a corresponding expansion and contraction tool according to the expansion and contraction coefficient of the plate and the plate dividing result so as to drill the plate.
In the present embodiment, the collapsible tool includes a collapsible drill tape, a pattern transfer collapsible film, and a solder resist collapsible film.
The expansion and contraction plate dividing method comprises the following steps of firstly, carrying out pressing operation on plates; then, obtaining the actual target distance of the plate; then, classifying the plate pieces according to the expansion and contraction values so as to refine and divide the plate pieces; then, calculating the difference value between the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate; then, processing a preset number of marking grooves on the plate according to the expansion and contraction values; then, dividing the plate according to the number of the marking grooves; then, calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate; then, according to the expansion and contraction coefficient of the plate and the plate dividing result, selecting a corresponding expansion and contraction tool to drill the plate; because a preset number of marking grooves are processed on the plate according to the expansion and contraction value, the plate is divided according to the number of the marking grooves, and corresponding expansion and contraction tools are selected according to the expansion and contraction coefficient and the plate dividing result of the plate to drill the plate, not only is the plate divided quickly, and the production efficiency of the plate is improved, but also the problem that the expansion and contraction drilling belt is not matched with the production plate before drilling because the traditional circuit board classification is simply classified according to whether the expansion and contraction occur is avoided, so that the situation of repeated sample drilling and debugging is avoided, and the production efficiency and the precision of the circuit board are improved.
In one embodiment, before the step of obtaining the actual target distance of the plate member, and after the step of pressing the plate member, the method further comprises:
establishing a parameter table in which the types of the plates correspond to the coordinate setting value programs one to one;
setting the type of the plate;
and calling the parameter table, and selecting the corresponding coordinate setting program according to the type of the plate, so that the expansion and contraction plate dividing method can be suitable for different types of plates.
In one embodiment, when the expansion and contraction value is 0, the number of the marking grooves is 0;
when the expansion and contraction value is larger than 0 and smaller than a first set value, the number of the marking grooves is 1;
when the expansion and contraction value is greater than or equal to a first set value and less than a second set value, the number of the marking grooves is 2;
when the expansion and contraction value is larger than or equal to a second set value, the number of the marking grooves is 3. So, to the plate of the different expansion and contraction values of same type, the figure in mark groove is different, is favorable to the discernment of post production, and then realizes dividing the board fast, improves and divides board efficiency. That is, for different types of boards, four different expansion and contraction sections may be set, with the expansion and contraction value being 0 as the first expansion and contraction section, the expansion and contraction value being greater than 0 and less than the first set value as the second expansion and contraction section, the expansion and contraction value being greater than or equal to the first set value and less than the second set value as the third expansion and contraction section, and the expansion and contraction value being greater than or equal to the second set value as the fourth expansion and contraction section.
In one embodiment, the first setting is 0.05mm to 0.1mm, which makes the collapsible plate device 10 better suited for different types of plate members. In one embodiment, the second setting is 0.1mm to 0.15mm, which makes the collapsible plate device 10 better suited for different types of plate members. In one embodiment, the first setting is 0.05mm, and the second setting is 0.1mm, so that the collapsible split board apparatus 10 is better suitable for high-density interconnection printed boards. In one embodiment, the first setting is 0.1mm, and the second setting is 0.15mm, so that the collapsible printed board device 10 is better suitable for non-high-density interconnection printed boards.
In one embodiment, after the step of calculating the ratio of the actual target distance to the predetermined target distance to obtain the expansion coefficient of the plate, the expansion and contraction split plate method further comprises:
and the expansion and shrinkage coefficient is marked on the plate, so that the subsequent quick identification of the expansion and shrinkage coefficient of the plate is facilitated, and the processing efficiency of the circuit board is improved.
In one embodiment, the step of marking the expansion and contraction coefficient on the plate is performed before the step of processing the plate with the predetermined number of marking grooves according to the expansion and contraction value, and after the step of calculating the ratio of the actual target distance to the predetermined target distance to obtain the expansion and contraction coefficient of the plate, so that the flow of the expansion and contraction plate dividing method is more reasonable.
As shown in fig. 2, the present application further provides a collapsible plate device 10, which is used for plate separation by using the collapsible plate method described in any of the above embodiments. In one embodiment, the collapsible plate-separating device 10 includes a body 100, a target hole light source detection mechanism 200, a slotting mechanism 300, a control mechanism 400, a plate-aligning mechanism 500, a plate-separating mechanism 600, a blanking mechanism 700, and a feeding mechanism 800. The target hole light source detection mechanism 200 is disposed on the machine body 100, and the target hole light source detection mechanism 200 is used for measuring an actual target distance of a target hole of a plate. The slotting mechanism 300 is disposed on the machine body 100. Referring to fig. 3 and 4, the notching mechanism 300 is used to machine the mark groove 22 on the plate member 20. The control mechanism 400 is electrically connected to the control ends of the target hole light source detection mechanism 200 and the slotting mechanism 300, respectively, the control mechanism 400 obtains the expansion and contraction value of the plate by subtracting the actual target distance from the predetermined target distance, obtains the expansion and contraction coefficient of the plate by dividing the actual target distance from the predetermined target distance, and controls the slotting mechanism 300 to process a predetermined number of the mark slots according to the expansion and contraction value.
As shown in fig. 2, the plate alignment mechanism 500 includes a first plate alignment assembly 510, the first plate alignment assembly 510 is disposed on the machine body 100 and is disposed corresponding to the grooving mechanism 300, a control end of the first plate alignment assembly 510 is electrically connected to the control mechanism 400, and the first plate alignment assembly 510 is configured to push and position the plate to a processing position of the grooving mechanism 300 when the grooving mechanism 300 processes the marked groove, so that the plate is accurately moved to a position corresponding to the processing position of the grooving mechanism 300, and the grooving precision of the grooving mechanism 300 on the plate is improved. The plate separating mechanism 600 is disposed on the machine body 100, a control end of the first flush plate assembly 510 is electrically connected to the control mechanism 400, the first flush plate assembly 510 is located between the target hole light source detection mechanism 200 and the plate separating mechanism 600, and the plate separating mechanism 600 is configured to sort and output the plates according to the number of the mark slots. The blanking mechanism 700 is disposed on the machine body 100.
As shown in fig. 2, the feeding mechanism 800 is disposed on the machine body 100, and the feeding mechanism 800 is disposed along the target hole light source detection mechanism 200, the slotting mechanism 300, the plate separating mechanism 600, and the blanking mechanism 700. The control end of the feeding mechanism 800 is electrically connected with the control mechanism 400. The feeding mechanism 800 includes a first feeding assembly 810 and a second feeding assembly 820. The first feeding assembly 810 is used for conveying the plate to the detection position of the target hole light source detection mechanism 200, the second feeding assembly 820 is arranged adjacent to the output end of the first feeding assembly 810, and the second feeding assembly 820 is used for conveying the plate from the target hole light source detection mechanism 200 to the input end of the plate dividing mechanism 600. The plate separating mechanism 600 is arranged adjacent to the output end of the second feeding assembly 820, so that the plate separating mechanism 600 can classify plates provided with marking grooves. The blanking mechanism 700 is disposed adjacent to the plate dividing mechanism for receiving the plate, so that the plate dividing mechanism 600 conveys the plate divided to the blanking mechanism 700.
In one embodiment, as shown in fig. 2, the collapsible plate device 10 further includes a marking mechanism 900, the marking mechanism 900 is located between the target hole light source detection mechanism 200 and the slotting mechanism 300, a control end of the marking mechanism 900 is electrically connected to the control mechanism 400, and the marking mechanism 900 is used for marking the collapsible coefficient of the plate on the plate.
In the collapsible plate-dividing apparatus 10, when the plate is conveyed to the detection position of the target hole light source detection mechanism 200 along with the first feeding assembly 810, the target hole light source detection mechanism 200 measures the actual target distance of the target hole of the plate, and calculates the difference between the actual target distance and the predetermined target distance to obtain the collapsible value of the plate; when the second conveying assembly conveys the plate from the target hole light source detection mechanism 200 to the position corresponding to the first alignment plate assembly 510 before the second conveying assembly conveys the plate from the target hole light source detection mechanism 200 to the input end of the plate separation mechanism 600, the first alignment plate assembly 510 pushes and positions the plate to the processing position of the slotting mechanism 300, so that the slotting mechanism 300 processes the mark slots, and at this time, the control mechanism 400 controls the slotting mechanism 300 to process a predetermined number of mark slots according to the expansion and contraction value. The plate dividing mechanism 600 outputs the plates to the blanking mechanism 700 in a classified manner according to the number of the marking grooves of the plates, so that the plates are divided rapidly and accurately, the marking mechanism 900 is added to mark the expansion and contraction coefficients on the plates, the control mechanism 400 is networked to realize data sharing, corresponding expansion and contraction tools such as a drill belt and an expansion and contraction film can be manufactured in time, and the production efficiency of the plates is improved; because the plate is thinned and divided, the problem that the expansion and shrinkage drilling belt is not matched with the production plate before drilling is solved by simply classifying the traditional circuit board according to whether the expansion and shrinkage are carried out, the situation of repeated proofing and debugging is avoided, and the production efficiency and the precision of the circuit board are improved.
As shown in fig. 2, further, the target hole light source detection mechanism 200 includes an emitter 210 and a receiver 220, and the emitter 210 and the receiver 220 are respectively disposed on two sides of the first feeding assembly 810. The transmitter 210 is used to transmit signals and the receiver 220 is used to receive signals to measure the actual target distance of the board. It is understood that in other embodiments, the aperture light source detection mechanism 200 may also employ prior art aperture detection mechanisms to measure the actual target distance of the panel.
In one embodiment, the control mechanism 400 calculates the difference between the actual target distance and the predetermined target distance to obtain the expansion/contraction value of the plate, and calculates the quotient between the actual target distance and the predetermined target distance to obtain the expansion/contraction coefficient of the plate. Because the circuit board passes through the pressfitting operation when production, the plate has certain harmomegathus value after the pressfitting. After the plate is pressed and hit, the target hole light source detection mechanism 200 can measure the actual target distance of the target hole. The control mechanism 400 calculates the difference between the actual target distance and the predetermined target distance to obtain the corresponding expansion and contraction value of the plate. The principle of measuring and calculating the expansion and contraction value is as follows: as shown in FIG. 3, the plate is designed with target holes, which are a hole, b hole, c hole and d hole, respectively, where d hole is a mistake-proofing target hole, a hole and b hole are on the same straight line in the longitudinal direction, b hole and c hole are on the same straight line in the transverse direction, so that only the center points of the three holes, i.e. a hole, b hole and c hole, can be used for measurement. The designed target hole distance of the plate is X/Y, and the target hole distance obtained by actual production of the plate is X1/Y1, wherein the delta X is X1-X, and the delta Y is Y1-Y. If the absolute value of the delta X is larger than the absolute value of the delta Y, the expansion and contraction value of the plate is the absolute value of the delta X, namely the absolute value of the delta X is used as the expansion and contraction interval of the plate; on the contrary, the expansion and contraction value of the plate is the absolute value of Δ Y, i.e. the absolute value of Δ Y is used as the expansion and contraction interval of the plate. For example, when X is 563.22mm, Y is 324.26mm, X1 is 563.32mm, and Y1 is 324.20mm, Δ X is 0.1mm, Δ Y is-0.06 mm, and the plate expansion and contraction value is 0.1 mm.
In one embodiment, the plate members are classified into four types, i.e., a first type plate, a second type plate, a third type plate and a fourth type plate, according to the range of the expansion and contraction values. If the plate member is a kind of plate, the number of the marking grooves is 0, that is, the grooving mechanism 300 does not form the marking grooves on the plate member, and the kind of plate is a non-collapsible plate and is also a qualified plate. If the plate member is a second-type plate, the number of the marking grooves is 1, that is, one marking groove is formed on the plate member by the grooving mechanism 300. If the plate member is a three-type plate, the number of the marking grooves is 2, that is, the grooving mechanism 300 forms two marking grooves on the plate member. If the plate member is a four-type plate, the number of the marking grooves is 3, that is, the grooving mechanism 300 forms three marking grooves on the plate member.
In one embodiment, when the expansion and contraction value is 0, the number of the marking grooves is 0. When the expansion and contraction value is larger than 0 and smaller than a first set value, the number of the marking grooves is 1. When the expansion and contraction value is greater than or equal to a first set value and less than a second set value, the number of the marking grooves is 2. When the expansion and contraction value is larger than or equal to a second set value, the number of the marking grooves is 3. So, to the plate of the different expansion and contraction values of same type, the figure in mark groove is different, is favorable to the discernment of post production, and then realizes dividing the board fast, improves and divides board efficiency. That is, for different types of boards, four different expansion and contraction sections may be set, with the expansion and contraction value being 0 as the first expansion and contraction section, the expansion and contraction value being greater than 0 and less than the first set value as the second expansion and contraction section, the expansion and contraction value being greater than or equal to the first set value and less than the second set value as the third expansion and contraction section, and the expansion and contraction value being greater than or equal to the second set value as the fourth expansion and contraction section.
In one embodiment, the first setting is 0.05mm to 0.1mm, which makes the collapsible plate device 10 better suited for different types of plate members. In one embodiment, the second setting is 0.1mm to 0.15mm, which makes the collapsible plate device 10 better suited for different types of plate members. In one embodiment, the first setting is 0.05mm, and the second setting is 0.1mm, so that the collapsible split board apparatus 10 is better suitable for high-density interconnection printed boards. In one embodiment, the first setting is 0.1mm, and the second setting is 0.15mm, so that the collapsible printed board device 10 is better suitable for non-high-density interconnection printed boards.
In one embodiment, although the plate members are divided into four types of plates according to the size of the expansion and contraction value, the first set value and the second set value are different in size for different types of plate members, such as a high-density interconnection printed board or a non-high-density interconnection printed board. For example, for a high-density interconnection printed board, the first setting value is set to 0.05mm, and the second setting value is set to 0.1 mm. And for a non-high-density interconnection printed board, the first setting value is set to 0.1mm, and the second setting value is set to 0.15 mm.
As shown in fig. 2, 5 and 6, further, the plate separating mechanism 600 includes a conveying assembly 640, a first plate separating assembly 610, a second plate separating assembly 620 and a third plate separating assembly 630. The first, second and third splitter assemblies 610, 620 and 630 are sequentially disposed on the machine body 100 side by side, wherein the first splitter assembly 610 is adjacent to the output end of the second feeding assembly 820, and the first, second and third splitter assemblies 610, 620 and 630 are all disposed adjacent to one side of the conveying assembly 640. The blanking mechanism 700 includes a first blanking assembly 710 disposed adjacent one side of the conveyor assembly and adjacent the output end of the conveyor assembly, and three second blanking assemblies 720 disposed side-by-side and adjacent the other side of the conveyor assembly 640. Three second discharging assemblies are respectively disposed corresponding to the first dividing plate assembly 610, the second dividing plate assembly 620 and the third dividing plate assembly 630. The control ends of the first plate subassembly 610, the second plate subassembly 620, and the third plate subassembly 630 are all electrically connected to the control mechanism 400. When the plate transported by the transport assembly 640 is a first-class plate, that is, the number of the mark slots formed on the plate is 0, the first plate dividing assembly 610, the second plate dividing assembly 620 and the third plate dividing assembly 630 do not move, so that the plate is automatically transported to the first feeding assembly along with the third feeding assembly. When the plate transported by the transporting assembly 640 is a second type plate, that is, the number of the mark slots formed on the plate is 1, the first plate assembly 610 acts to push the plate of the transporting assembly 640 to the second blanking assembly corresponding to the first plate assembly 610. When the plates conveyed by the conveying assembly 640 are three types of plates, that is, the number of the marking slots formed on the plates is 2, the second plate dividing assembly 620 acts to push the plates of the conveying assembly 640 to the second blanking assembly corresponding to the second plate dividing assembly 620. When the plate conveyed by the conveying assembly 640 is a four-type plate, that is, the number of the mark grooves formed on the plate is 3, the third plate dividing assembly 630 acts to push the plate of the conveying assembly 640 to the second blanking assembly corresponding to the third plate dividing assembly 630, so that plate division of the plate is realized. In the present embodiment, the first, second, and third plate assemblies 610, 620, and 630 are all cylinder push plate assemblies.
As shown in fig. 2 and 5, in one embodiment, the first flush plate assembly 510 includes a first push plate 512, a second push plate 514 and a first driving cylinder 516, the first driving cylinder 516 is mounted on the machine body 100, and a power output end of the first driving cylinder 516 is connected to the first push plate 512 and the second push plate 514 respectively to drive the first push plate 512 and the second push plate 514 to move closer to or away from each other. The first push plate 512 and the second push plate 514 are arranged in parallel, and the first push plate 512 and the second push plate 514 are respectively positioned at two sides of the slotting mechanism 300. The first and second push plates 512 and 514 are used to push the two sides of the plate respectively to clamp and position the plate at the processing position of the slotting mechanism 300. It is understood that the first flush plate assembly 510 pushes the plate member to a different position from the processing position of the grooving mechanism 300, so that the grooving mechanism 300 processes a different number of the mark grooves on the plate member for subsequent plate division. In this embodiment, a fixing frame 110 is disposed on the machine body, the first driving cylinder is disposed on the fixing frame, and the first pushing plate and the second pushing plate are both slidably connected to the fixing frame. The first driving cylinder drives the first push plate and the second push plate to slide relative to the fixed frame respectively, so that the first push plate and the second push plate are close to or far away from each other.
In order to better mark the plate conveyed by the second feeding assembly 820 by the marking mechanism 900, in one embodiment, the marking mechanism 900 is disposed on the machine body 100 and adjacent to the second feeding assembly 820, so that the marking mechanism 900 can better mark the plate conveyed by the second feeding assembly 820.
As shown in FIG. 4, in one embodiment, the plate has a target hole distance X/Y, and the actual plate has a target hole distance X1/Y1, the expansion and contraction coefficients of the plate are: rx X1 ÷ X ÷ transverse expansion coefficient, Ry Y1 ÷ Y ÷ longitudinal expansion coefficient. For example, when X is 563.22mm, Y is 324.26mm, X1 is 563.32mm, and Y1 is 324.20mm, the lateral expansion and contraction coefficient Rx of the expansion and contraction coefficient of the plate is 100.018, and the longitudinal expansion and contraction coefficient Ry of the expansion and contraction coefficient of the plate is 99.982. The lateral expansion coefficient Rx and the longitudinal expansion coefficient Ry are both transmitted to the marking mechanism 900 through the control mechanism 400, and the marking mechanism 900 marks the plate with a mark "Rx equals 100.018, Ry equals 99.982". Specifically, the marking mechanism 900 marks the expansion and contraction coefficient of the plate member on one side of the plate member. In this embodiment, the marking mechanism 900 is a laser marking mechanism 900, so that the marking mechanism 900 can mark the plate in a non-contact manner, and the plate can be conveniently and quickly processed. In other embodiments, the marking mechanism 900 may also be a machined marking mechanism 900.
As shown in fig. 2 and 5, in one embodiment, the aligning mechanism 500 further includes a second aligning member 520, and the second aligning member 520 is disposed on the machine body 100 and corresponds to the marking mechanism 900. The second aligning plate component 520 is used for pushing the plate to a position corresponding to the marking end of the marking mechanism 900, so that the marking mechanism 900 can accurately mark the plate.
As shown in fig. 2 and 5, in an embodiment, the second flush plate assembly 520 includes a third push plate 522, a positioning plate 524, and a second driving cylinder (not shown), the second driving cylinder and the positioning plate 524 are mounted on the machine body 100, and the third push plate 522 is disposed opposite to the positioning plate 524 and parallel to each other. The power output of the second drive cylinder is coupled to the third push plate 522 to drive the third push plate 522 toward or away from the positioning plate 524. The third push plate 522 and the positioning plate 524 both correspond to the marking mechanism 900, so that the plate is clamped and positioned at a position corresponding to the marking end of the marking mechanism 900. In the present embodiment, the positioning plate 524 is fixed on the machine body 100, that is, the positioning plate 524 is stationary relative to the machine body 100. The third push plate is arranged on the machine body in a sliding manner.
In one embodiment, the second alignment plate assembly 520 is used to push one side of the plate to be directly under the marking end of the marking mechanism 900, so that one side of the plate is accurately positioned directly under the marking end of the marking mechanism 900, and the marking mechanism 900 marks the expansion and contraction coefficient of the plate on one side of the plate. The expansion and shrinkage coefficient is marked on one side of the plate, so that the subsequent quick identification of the expansion and shrinkage coefficient of the plate is facilitated, and the processing efficiency of the circuit board is improved.
In one embodiment, the collapsible plate device 10 further includes a sensing mechanism (not shown) disposed on the body 100, the sensing mechanism being electrically connected to the control mechanism 400, and the sensing mechanism being used for detecting the number of the mark slots of the plate. When the sensing mechanism detects the specific number of the marking grooves of the plate, the sensing mechanism outputs sensing signals of corresponding times to the control mechanism 400, so that the control mechanism 400 can accurately obtain the expansion and contraction classification of the current plate. In this embodiment, the sensing mechanism includes three laser sensors arranged side by side, each laser sensor being configured to detect one marking slot. When the plate moves to the position corresponding to the sensing mechanism and the three laser sensors simultaneously generate signals for detecting the marked grooves, the plate is provided with the three marked grooves. Similarly, when the plate moves to the position corresponding to the sensing mechanism and the two laser sensors simultaneously generate a signal for detecting the marked groove, the plate is provided with two marked grooves. By analogy, the sensing mechanism accurately detects the number of the marking grooves of the current plate. Specifically, a first mounting bracket is disposed on the machine body 100, the first mounting bracket is located above the second feeding assembly 820, and the sensing mechanism is disposed on the first mounting bracket.
In one embodiment, the marking groove is a V-shaped groove, so that the marking groove is simple in structure and easy to machine. It will be appreciated that in other embodiments, the marker groove may also be a U-shaped groove or a rectangular groove or other shaped groove body.
As shown in fig. 2 and 5, in one embodiment, the slotting mechanism 300 includes a lifting assembly 310, a mounting plate 320, a driving assembly 330, a rotating shaft 340 and a plurality of processing teeth 350, the lifting assembly 310 is mounted on the machine body 100, the mounting plate 320 is connected to a power output end of the lifting assembly 310, the driving assembly 330 is disposed on the mounting plate 320, the rotating shaft 340 is rotatably connected to the mounting plate 320 and connected to the power output end of the driving assembly 330, the plurality of processing teeth 350 are disposed on the rotating shaft 340 side by side, and each of the processing teeth 350 is used for processing a marking slot. When the first flush plate assembly 510 pushes the plate member to correspond to one of the machining teeth 350, the grooving mechanism 300 machines a mark groove in the plate member. Similarly, when the first flush plate assembly 510 pushes the plate member until the two processing teeth 350 correspond, the grooving mechanism 300 processes the plate member into two marking grooves. It can be understood that, according to the instruction of the control mechanism 400 for opening the specific number of the mark grooves, the first flush plate assembly 510 correspondingly pushes the plate members to a number corresponding to the tooth knives of the grooving mechanism 300, that is, the positions of the corresponding push positioning plates 524 on the second feeding assembly 820 are also different, so that the grooving mechanism 300 can process the plate members with different expansion and contraction values into the corresponding number of mark grooves. In this embodiment, the machine body 100 is provided with a second mounting bracket 120, the second mounting bracket is located above the second feeding assembly 820, and the lifting assembly 310 is fixedly mounted on the second mounting bracket.
In one embodiment, the mounting plate 320 is slidably disposed on the machine body 100, so that the driving assembly 330 drives the mounting plate 320 to slide relative to the machine body 100, thereby making the movement of the mounting plate 320 smoother, and thus making the tooth knife accurately machine the plate.
In one embodiment, the collapsible split plate apparatus 10 further comprises a drilling mechanism (not shown), a control end of the drilling mechanism is electrically connected to the control mechanism 400, and the drilling mechanism retrieves a corresponding collapsible tool according to the collapsible coefficient output by the control mechanism 400. The collapsible tool comprises a collapsible drill belt, a pattern transfer collapsible film and a resistance welding collapsible film. It can be understood that corresponding collapsible tools are different for different types of plates, and during drilling and machining, the expansion and contraction tools are directly taken for use without waiting, so that the problems that after material changing, no tool is used for drilling belts and films, or a large amount of data needs to be manually measured to obtain the expansion and contraction coefficients and the like are solved, and the production efficiency of the plate is greatly improved. In one embodiment, the drilling mechanism includes a drilling mechanism body and a retrieval box in which a plurality of different collapsible tools are stored, and an output control terminal of the retrieval box is electrically connected to the control mechanism 400. When the calling box receives the command of the expansion and contraction coefficient of the control mechanism 400, the calling box outputs the corresponding expansion and contraction tool. The user can use the harmomegathus instrument on drilling mechanism main part rapidly, makes drilling mechanism main part can be accurate processing go out blind hole or through-hole on the plate, has improved the manufacturing efficiency and the precision of circuit board.
For the high-density interconnection printed board, in one embodiment, the minimum diameter of the blind hole or the hole ring of the through hole of the board is 75 μm, so that the hole position accuracy requirement of the drilling mechanism for drilling the board is ± 50 μm. Experiments prove that when the tolerance limit of drilling is +/-50 mu m, the distance between the holes and the PAD edge is only 25 mu m, when the expansion and contraction of the whole plate reaches +/-50 mu m, the holes are just tangent to the PAD, the single sides of the plate are respectively allocated to 25 mu m, the expansion and contraction of the plate exceeds +/-50 mu m, and meanwhile, when the tolerance of drilling reaches +/-50 mu m, the holes are just tangent to the PAD of the inner layer. To ensure the accuracy of the drilling of the inner PAD, a split of + -50 μm is preferred, i.e. a first set value of 0.05mm and a second set value of 0.1 mm. When the expansion and contraction value is 0, the number of the marking grooves is 0. When the expansion and contraction value is more than 0 and less than 0.05mm, the number of the marking grooves is 1. When the expansion and contraction value is greater than or equal to 0.05mm and less than 0.1mm, the number of the marking grooves is 2. When the expansion and contraction value is greater than or equal to 0.1mm, the number of the marking grooves is 3.
For non-high density interconnect printed boards, in one embodiment, the minimum diameter of the blind or through hole ring of the board is 175 μm, so that the hole position accuracy requirement of the drilling mechanism for drilling the board is ± 100 μm. Experiments have shown that to ensure the accuracy of the inner PAD of the drilled hole, a split of ± 100 μm is preferred, i.e. the first set value is 0.1mm and the second set value is 0.15 mm. When the expansion and contraction value is 0, the number of the marking grooves is 0. When the expansion and contraction value is larger than 0 and smaller than 0.1mm, the number of the marking grooves is 1. When the expansion and contraction value is greater than or equal to 0.1mm and less than 0.15mm, the number of the marking grooves is 2. When the expansion and contraction value is greater than or equal to 0.15mm, the number of the marking grooves is 3.
In fact, for the same type of plate, like a batch of high-density interconnected printed boards of the same type, the corresponding expansion and contraction values are different due to the slight difference of the debugging ratio of the material components for manufacturing the plate, and the numerical values of the drill hole apportionment are slightly different, that is, the sizes of the first set value and the second set value which are correspondingly set are slightly different, but the difference is small. To further improve the drilling accuracy of the drilling mechanism, the control mechanism 400 further collects and calculates an average value of the first setting values of the plurality of plates as a first setting value of the type of plate, and collects and calculates an average value of the second setting values of the plurality of plates as a second setting value of the type of plate, so that the first setting value and the second setting value obtained by averaging are the expansion and contraction program of the type of plate. Like this, to same batch of plate of the same type, when dividing the board, first setting value and second setting value are the numerical value after a plurality of plates are average, have improved drilling mechanism's drilling precision and suitability greatly.
Compared with the prior art, the invention has at least the following advantages:
the invention relates to a method for splitting a plate by expansion and contraction, which comprises the following steps of firstly, carrying out pressing operation on a plate; then, obtaining the actual target distance of the plate; then, classifying the plate pieces according to the expansion and contraction values so as to refine and divide the plate pieces; then, calculating the difference value between the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate; then, processing a preset number of marking grooves on the plate according to the expansion and contraction values; then, dividing the plate according to the number of the marking grooves; then, calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate; then, according to the expansion and contraction coefficient of the plate and the plate dividing result, selecting a corresponding expansion and contraction tool to drill the plate; because a preset number of marking grooves are processed on the plate according to the expansion and contraction value, the plate is divided according to the number of the marking grooves, and corresponding expansion and contraction tools are selected according to the expansion and contraction coefficient and the plate dividing result of the plate to drill the plate, not only is the plate divided quickly, and the production efficiency of the plate is improved, but also the problem that the expansion and contraction drilling belt is not matched with the production plate before drilling because the traditional circuit board classification is simply classified according to whether the expansion and contraction occur is avoided, so that the situation of repeated sample drilling and debugging is avoided, and the production efficiency and the precision of the circuit board are improved.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method of splitting a panel, comprising:
carrying out pressing operation on the plate;
obtaining an actual target distance of the plate;
calculating the difference value of the actual target distance and the preset target distance to obtain the expansion and contraction value of the plate;
processing a preset number of marking grooves on the plate according to the expansion and contraction values;
dividing the plate according to the number of the marking grooves;
calculating the ratio of the actual target distance to the preset target distance to obtain the expansion and contraction coefficient of the plate;
and selecting a corresponding expansion and contraction tool according to the expansion and contraction coefficient of the plate and the plate dividing result so as to drill the plate.
2. The split expansion and contraction plate method according to claim 1, wherein before the step of obtaining the actual target distance of the plate members, and after the step of subjecting the plate members to a press-fitting operation, the split expansion and contraction plate method further comprises:
establishing a parameter table in which the types of the plates correspond to the coordinate setting value programs one to one;
setting the type of the plate;
and calling the parameter table, and selecting the corresponding coordinate setting program according to the type of the plate.
3. The expansion-contraction split plate method according to claim 1, wherein when the expansion-contraction value is 0, the number of the marking grooves is 0;
when the expansion and contraction value is larger than 0 and smaller than a first set value, the number of the marking grooves is 1;
when the expansion and contraction value is greater than or equal to a first set value and less than a second set value, the number of the marking grooves is 2;
when the expansion and contraction value is larger than or equal to a second set value, the number of the marking grooves is 3.
4. The collapsible panel method of claim 3, wherein the first set value is 0.05mm to 0.1 mm.
5. The collapsible panel method of claim 4, wherein the second set value is 0.1mm to 0.15 mm.
6. The collapsible panel method of claim 5, wherein the first set point is 0.05mm and the second set point is 0.1 mm.
7. The collapsible panel method of claim 5, wherein said first set point is 0.1mm and said second set point is 0.15 mm.
8. The split expansion and contraction plate method according to any one of claims 1 to 7, wherein after the step of calculating the ratio of the actual target distance to the predetermined target distance to obtain the expansion and contraction coefficient of the plate member, the split expansion and contraction plate method further comprises:
and marking the expansion and contraction coefficient on the plate.
9. The collapsible split plate method as claimed in any one of claims 1 to 7, wherein said step of marking said collapsible coefficients on said plate member is performed before said step of machining a predetermined number of said marking grooves on said plate member based on said collapsible values, and after said step of calculating a ratio of said actual target distance to said predetermined target distance to obtain said collapsible coefficients of said plate member.
10. A collapsible split plate apparatus, wherein the split plate is performed by the collapsible split plate method according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011126132.0A CN112165780B (en) | 2020-10-20 | 2020-10-20 | Expansion and contraction plate dividing device |
| PCT/CN2021/084935 WO2022083072A1 (en) | 2020-10-20 | 2021-04-01 | Expansion and contraction board classification method and expansion and contraction board classification apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011126132.0A CN112165780B (en) | 2020-10-20 | 2020-10-20 | Expansion and contraction plate dividing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112165780A true CN112165780A (en) | 2021-01-01 |
| CN112165780B CN112165780B (en) | 2022-02-22 |
Family
ID=73867644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011126132.0A Active CN112165780B (en) | 2020-10-20 | 2020-10-20 | Expansion and contraction plate dividing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112165780B (en) |
| WO (1) | WO2022083072A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112888173A (en) * | 2021-01-19 | 2021-06-01 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
| WO2022083072A1 (en) * | 2020-10-20 | 2022-04-28 | 惠州市特创电子科技股份有限公司 | Expansion and contraction board classification method and expansion and contraction board classification apparatus |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114928960A (en) * | 2022-05-12 | 2022-08-19 | 胜宏科技（惠州）股份有限公司 | Method for avoiding confusion of different collapsible PCBs |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2674401Y (en) * | 2003-12-15 | 2005-01-26 | 联星科技股份有限公司 | Target drilling, distance measuring and classifying device |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN103369836A (en) * | 2012-03-31 | 2013-10-23 | 北大方正集团有限公司 | Method and device for drilling band expansion/contraction |
| CN103635024A (en) * | 2013-11-25 | 2014-03-12 | 东莞美维电路有限公司 | Automatic partitioning board dividing method after lamination of printed wiring board |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
| CN105246258A (en) * | 2015-10-27 | 2016-01-13 | 珠海方正科技高密电子有限公司 | Circuit board expanding-shrinking proportion control method and system |
| CN206542641U (en) * | 2017-03-06 | 2017-10-03 | 红板（江西）有限公司 | A kind of equipment of circuit process automatic measurement management and control harmomegathus |
| CN107231750A (en) * | 2016-03-24 | 2017-10-03 | 全亨科技有限公司 | Circuit board harmomegathus sorting technique |
| CN107580418A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Improve the method for multi-layer sheet borehole throw |
| CN206999915U (en) * | 2017-01-18 | 2018-02-13 | 珠海市凌智测控技术有限公司 | Pcb board laser marking machine |
| CN107911943A (en) * | 2017-10-24 | 2018-04-13 | 江苏博敏电子有限公司 | A kind of harmomegathus means to save the situation of printed wiring board |
| CN108520403A (en) * | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN109657265A (en) * | 2018-10-31 | 2019-04-19 | 惠州市金百泽电路科技有限公司 | A kind of method of pcb board route and the automatic harmomegathus that drills |
| CN110267437A (en) * | 2019-06-27 | 2019-09-20 | 深圳市兴森快捷电路科技股份有限公司 | A kind of printed circuit board harmomegathus management-control method and device |
| CN210579514U (en) * | 2019-09-30 | 2020-05-19 | 佛山市广创源电子有限公司 | Device is used in circuit board processing |
| CN111372379A (en) * | 2020-04-02 | 2020-07-03 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving hole diameter precision of PTH hole |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008078464A (en) * | 2006-09-22 | 2008-04-03 | Nec Toppan Circuit Solutions Inc | Manufacturing method of printed wiring board and drilling apparatus |
| CN109121303B (en) * | 2018-09-28 | 2020-03-06 | 广州兴森快捷电路科技有限公司 | Board splitting method of pre-formed board, drilling method of pre-formed board and circuit board |
| CN112165780B (en) * | 2020-10-20 | 2022-02-22 | 惠州市特创电子科技股份有限公司 | Expansion and contraction plate dividing device |
-
2020
- 2020-10-20 CN CN202011126132.0A patent/CN112165780B/en active Active
-
2021
- 2021-04-01 WO PCT/CN2021/084935 patent/WO2022083072A1/en active Application Filing
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2674401Y (en) * | 2003-12-15 | 2005-01-26 | 联星科技股份有限公司 | Target drilling, distance measuring and classifying device |
| CN102036511A (en) * | 2010-12-01 | 2011-04-27 | 株洲南车时代电气股份有限公司 | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards |
| CN103369836A (en) * | 2012-03-31 | 2013-10-23 | 北大方正集团有限公司 | Method and device for drilling band expansion/contraction |
| CN103635024A (en) * | 2013-11-25 | 2014-03-12 | 东莞美维电路有限公司 | Automatic partitioning board dividing method after lamination of printed wiring board |
| CN103997852A (en) * | 2014-04-23 | 2014-08-20 | 奥士康精密电路（惠州）有限公司 | Expandable-shrinkable plate pile-dividing method |
| CN105246258A (en) * | 2015-10-27 | 2016-01-13 | 珠海方正科技高密电子有限公司 | Circuit board expanding-shrinking proportion control method and system |
| CN107231750A (en) * | 2016-03-24 | 2017-10-03 | 全亨科技有限公司 | Circuit board harmomegathus sorting technique |
| CN206999915U (en) * | 2017-01-18 | 2018-02-13 | 珠海市凌智测控技术有限公司 | Pcb board laser marking machine |
| CN206542641U (en) * | 2017-03-06 | 2017-10-03 | 红板（江西）有限公司 | A kind of equipment of circuit process automatic measurement management and control harmomegathus |
| CN107580418A (en) * | 2017-08-30 | 2018-01-12 | 奥士康精密电路（惠州）有限公司 | Improve the method for multi-layer sheet borehole throw |
| CN107911943A (en) * | 2017-10-24 | 2018-04-13 | 江苏博敏电子有限公司 | A kind of harmomegathus means to save the situation of printed wiring board |
| CN108520403A (en) * | 2018-04-12 | 2018-09-11 | 江苏博敏电子有限公司 | A kind of anti-welding preceding harmomegathus management method of printed wiring board |
| CN109657265A (en) * | 2018-10-31 | 2019-04-19 | 惠州市金百泽电路科技有限公司 | A kind of method of pcb board route and the automatic harmomegathus that drills |
| CN110267437A (en) * | 2019-06-27 | 2019-09-20 | 深圳市兴森快捷电路科技股份有限公司 | A kind of printed circuit board harmomegathus management-control method and device |
| CN210579514U (en) * | 2019-09-30 | 2020-05-19 | 佛山市广创源电子有限公司 | Device is used in circuit board processing |
| CN111372379A (en) * | 2020-04-02 | 2020-07-03 | 胜宏科技（惠州）股份有限公司 | Manufacturing method for improving hole diameter precision of PTH hole |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022083072A1 (en) * | 2020-10-20 | 2022-04-28 | 惠州市特创电子科技股份有限公司 | Expansion and contraction board classification method and expansion and contraction board classification apparatus |
| CN112888173A (en) * | 2021-01-19 | 2021-06-01 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
| CN112888173B (en) * | 2021-01-19 | 2023-10-31 | 珠海杰赛科技有限公司 | Processing and forming process of PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112165780B (en) | 2022-02-22 |
| WO2022083072A1 (en) | 2022-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112165780B (en) | Expansion and contraction plate dividing device | |
| US5377404A (en) | Method for fabricating a multi-layer printed circuit board | |
| CN112272449B (en) | Circuit board production system and expansion and contraction board separating device | |
| KR101660474B1 (en) | Apparatus for manufacturing a series of taping electronic components, method for manufacturing a series of taping electronic components, apparatus for conveying electronic component, method for conveying electronic component, and a series of taping electronic components | |
| CN102036511A (en) | Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards | |
| WO2008063314A2 (en) | Device and method for measuring gap between members of a structure for manufacture of a shim | |
| EP0084568A1 (en) | Iron core laminate manufacturing apparatus | |
| CN109121303B (en) | Board splitting method of pre-formed board, drilling method of pre-formed board and circuit board | |
| CN103635024A (en) | Automatic partitioning board dividing method after lamination of printed wiring board | |
| CN108304963B (en) | Expansion and shrinkage prediction method for multilayer circuit board | |
| CN103118482B (en) | There is circuit board and the discrimination method thereof of quality identification mark | |
| CN109311072A (en) | Method and apparatus for metal plate to be delivered to press machine | |
| US10477693B2 (en) | Method for manufacturing a printed circuit board element and printed circuit board element | |
| KR101932060B1 (en) | Method of increasing core matching ratio with changing guide position for X-ray drill | |
| US20230119865A1 (en) | Machining Station and Method for Machining Workpieces | |
| CN109520434B (en) | Online battery thickness measuring method and device | |
| KR100809926B1 (en) | Drilling machine for printed circuit board | |
| CN215179726U (en) | Automatic change piece stromatolite counterpoint precision test system | |
| KR101763768B1 (en) | Target board for verifying the accuracy of X-ray Drill Holes | |
| CN214592110U (en) | Multilayer printed circuit board, mould and interlayer offset measuring mechanism | |
| CN110708896B (en) | Manufacturing method of HDI board | |
| CN107148170A (en) | A kind of core material riveting bad method partially in reduction PCB multilayer board | |
| CN111182746A (en) | Circuit board layer deviation judging method, whole edition structure and deviation circuit board processing method | |
| CN219495031U (en) | Precision detection jig for target punching machine | |
| CN113453438B (en) | Etching production line speed control method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Applicant after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: 516369 jinpaishan Industrial Zone, taiyangao, Baihua Town, Huidong County, Huizhou City, Guangdong Province Applicant before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |