CN112147490A - Method and system for laser chip integration test - Google Patents
Method and system for laser chip integration test Download PDFInfo
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- CN112147490A CN112147490A CN202011342433.7A CN202011342433A CN112147490A CN 112147490 A CN112147490 A CN 112147490A CN 202011342433 A CN202011342433 A CN 202011342433A CN 112147490 A CN112147490 A CN 112147490A
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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Abstract
The invention discloses a method and a system for laser chip integration test, wherein the method comprises the following steps: acquiring first requirement information and first test environment information of a first laser chip; judging whether the first test environment information meets a first preset condition or not; if the first operation command is satisfied, obtaining a first operation command; respectively obtaining a first influence degree and a second influence degree of the first temperature gradient difference value and the second temperature gradient difference value on the temperature of the first laser chip; judging whether the first and second influence degrees are in a preset influence degree threshold range; if the laser chips are all in the same position, connecting the spectrum tester with the first laser chip; acquiring real-time spectral data information of a first laser chip; obtaining real-time chip junction temperature information and preset chip junction temperature information of a first laser chip; judging whether the real-time chip junction temperature information is within a preset chip junction temperature information range or not; if so, obtaining a second operation command. The technical problems that two devices are needed to carry out requirement testing and manual intervention testing is needed in the prior art are solved.
Description
Technical Field
The invention relates to the technical field of chip testing, in particular to a method and a system for laser chip integration testing.
Background
With the increasing demand of internet and multimedia communication, the hardware demand of network is also increasing, optical fiber communication is gradually applied to the fields of network communication and the like, the development of optoelectronic devices including laser chips and the like is also maturing, and therefore, the test of the laser chips is particularly important.
However, in the process of implementing the technical solution of the invention in the embodiments of the present application, the inventors of the present application find that the above-mentioned technology has at least the following technical problems:
the traditional laser chip testing method can only complete spectrum testing, cannot meet the requirement of aging testing at the same time, and cannot test the laser chips in large batch.
Disclosure of Invention
The embodiment of the application provides a method for laser chip integration test, solves the technical problems that two devices are required to carry out requirement test and manual intervention test is required in the prior art, and achieves the technical effects of improving the device utilization rate, improving the laser chip test efficiency and the test automation degree and reducing the manual intervention.
The embodiment of the application provides a method for laser chip integration test, which is applied to an intelligent test system, wherein the intelligent test system is provided with a test device, the test device is provided with a temperature control module, an electric control module and a chip clamp, the test device is in communication connection with a spectrum tester, and the method comprises the following steps: acquiring first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested; acquiring first test environment information of the first laser chip according to the first requirement information; judging whether the first test environment information meets a first preset condition or not; if the first preset condition is met, obtaining a first operation command, wherein the first operation command is used for obtaining a first temperature gradient difference value between the chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively heats and powers on the first laser chip through the temperature control module and the electric control module; respectively obtaining the first temperature gradient difference value and the second temperature gradient difference value, and obtaining a first influence degree and a second influence degree of the temperature of the first laser chip; sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range; if the laser chips are all in the preset state, the spectrum tester is connected with the first laser chip after the real-time electrical parameter information of the first laser chip is obtained according to a first preset strategy; according to the spectrum tester, in a first preset time period and according to a first preset frequency, obtaining real-time spectrum data information of the first laser chip; obtaining real-time luminous power information of the laser according to the first preset time period; obtaining real-time chip junction temperature information of the first laser chip according to the real-time luminous power information; obtaining preset chip junction temperature information of the first laser chip according to the first requirement information; judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range or not; if so, acquiring a second operation command; and according to the second operation command, after the real-time electrical parameter information and the real-time spectral data information are stored, marking a first label on the first laser chip, wherein the first label is a qualified test label.
In another aspect, the present application further provides a system for laser chip integration test, wherein the system includes: a first obtaining unit: the first obtaining unit is used for obtaining first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested; a second obtaining unit: the second obtaining unit is used for obtaining first test environment information of the first laser chip according to the first requirement information; a first judgment unit: the first judging unit is used for judging whether the first testing environment information meets a first preset condition or not; a third obtaining unit: the third obtaining unit is configured to obtain a first operation command if the first preset condition is met, where the first operation command is used for obtaining a first temperature gradient difference value between a chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively performs heating and power-up operations on the first laser chip through the temperature control module and the electronic control module; a fourth obtaining unit: the fourth obtaining unit is configured to obtain the first temperature gradient difference, the second temperature gradient difference, and a first influence degree and a second influence degree on the temperature of the first laser chip, respectively; a second judgment unit: the second judging unit is used for sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range; a fifth obtaining unit: the fifth obtaining unit is used for connecting the spectrum tester with the first laser chip after obtaining the real-time electrical parameter information of the first laser chip according to a first preset strategy if the first laser chip is in the first preset strategy; a sixth obtaining unit: the sixth obtaining unit is configured to obtain real-time spectral data information of the first laser chip according to the spectrum tester within a first preset time period and according to a first preset frequency; a seventh obtaining unit: the seventh obtaining unit is used for obtaining real-time luminous optical power information of the laser according to the first preset time period; an eighth obtaining unit: the eighth obtaining unit is configured to obtain real-time chip junction temperature information of the first laser chip according to the real-time light emitting power information; a ninth obtaining unit: the ninth obtaining unit is configured to obtain preset chip junction temperature information of the first laser chip according to the first requirement information; a third judging unit: the third judging unit is used for judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range; a tenth obtaining unit: the tenth obtaining unit is used for obtaining a second operation command if the operation command is in the first operation command; a first storage unit: and the first storage unit is used for marking a first label on the first laser chip after storing the real-time electrical parameter information and the real-time spectral data information according to the second operation command, wherein the first label is a qualified test label.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:
the temperature of the laser chip can be controlled through integrated test of the aging and the spectrum of the laser chip, the light-emitting spectrum of the laser chip at different temperatures can be tested, and the chip junction temperature of the laser chip can be accurately measured through the light-emitting power of the laser, so that the technical effects of improving the test efficiency and the degree of automation at the moment and reducing manual intervention are achieved.
The foregoing description is only an overview of the technical solutions of the present application, and the present application can be implemented according to the content of the description in order to make the technical means of the present application more clearly understood, and the following detailed description of the present application is given in order to make the above and other objects, features, and advantages of the present application more clearly understandable.
Drawings
FIG. 1 is a schematic flow chart illustrating a method for laser chip integration testing according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a laser chip integration test system according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an exemplary electronic device according to an embodiment of the present application.
Description of reference numerals: a first obtaining unit 11, a second obtaining unit 12, a first judging unit 13, a third obtaining unit 14, a fourth obtaining unit 15, a second judging unit 16, a fifth obtaining unit 17, a sixth obtaining unit 18, a seventh obtaining unit 19, an eighth obtaining unit 20, a ninth obtaining unit 21, a third judging unit 22, a tenth obtaining unit 23, a first storage unit 24, a bus 300, a receiver 301, a processor 302, a transmitter 303, a memory 304, and a bus interface 305.
Detailed Description
The embodiment of the application provides a method for laser chip integration test, solves the technical problems that two devices are required to carry out requirement test and manual intervention test is required in the prior art, and achieves the technical effects of improving the device utilization rate, improving the laser chip test efficiency and the test automation degree and reducing the manual intervention.
Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are merely some embodiments of the present application and not all embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein.
Summary of the application
With the increasing demand of internet and multimedia communication, the hardware demand of network is also increasing, optical fiber communication is gradually applied to the fields of network communication and the like, the development of optoelectronic devices including laser chips and the like is also maturing, and therefore, the test of the laser chips is particularly important. The traditional laser chip testing method can only complete spectrum testing, cannot meet the requirement of aging testing at the same time, and cannot test the laser chips in large batch.
In view of the above technical problems, the technical solution provided by the present application has the following general idea:
the embodiment of the application provides a method for laser chip integration test, which is applied to an intelligent test system, wherein the intelligent test system is provided with a test device, the test device is provided with a temperature control module, an electric control module and a chip clamp, the test device is in communication connection with a spectrum tester, and the method comprises the following steps: acquiring first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested; acquiring first test environment information of the first laser chip according to the first requirement information; judging whether the first test environment information meets a first preset condition or not; if the first preset condition is met, obtaining a first operation command, wherein the first operation command is used for obtaining a first temperature gradient difference value between the chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively heats and powers on the first laser chip through the temperature control module and the electric control module; respectively obtaining the first temperature gradient difference value and the second temperature gradient difference value, and obtaining a first influence degree and a second influence degree of the temperature of the first laser chip; sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range; if the laser chips are all in the preset state, the spectrum tester is connected with the first laser chip after the real-time electrical parameter information of the first laser chip is obtained according to a first preset strategy; according to the spectrum tester, in a first preset time period and according to a first preset frequency, obtaining real-time spectrum data information of the first laser chip; obtaining real-time luminous power information of the laser according to the first preset time period; obtaining real-time chip junction temperature information of the first laser chip according to the real-time luminous power information; obtaining preset chip junction temperature information of the first laser chip according to the first requirement information; judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range or not; if so, acquiring a second operation command; and according to the second operation command, after the real-time electrical parameter information and the real-time spectral data information are stored, marking a first label on the first laser chip, wherein the first label is a qualified test label.
For better understanding of the above technical solutions, the following detailed descriptions will be provided in conjunction with the drawings and the detailed description of the embodiments.
Example one
As shown in fig. 1, the present application provides a method for laser chip integration test, which is applied to an intelligent test system, and the intelligent test system has a test apparatus, and the test apparatus has a temperature control module, an electronic control module, and a chip clamp, and the test apparatus is communicatively connected to a spectrum tester, wherein the method includes:
step S100: acquiring first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested;
specifically, the first laser chip is a chip to be tested, the laser device and a device capable of emitting laser light, the laser device is divided into a gas laser device, a solid laser device, a semiconductor laser device, a dye laser device and the like according to working media, and the first requirement information is information of various parameters of the first laser chip, information of a working environment, information of temperature and the like.
Step S200: acquiring first test environment information of the first laser chip according to the first requirement information;
specifically, the first test environment information of the first laser chip is environment information required for testing the first laser chip, and includes environment, temperature, humidity, dust removal, and the like.
Step S300: judging whether the first test environment information meets a first preset condition or not;
step S400: if the first preset condition is met, obtaining a first operation command, wherein the first operation command is used for obtaining a first temperature gradient difference value between the chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively heats and powers on the first laser chip through the temperature control module and the electric control module;
specifically, the first preset condition is that the first test environment information satisfies the standard test environment information, the first operation command is that the test equipment passes through the temperature control module and the electronic control module respectively give the first laser chip to heat and power up, then obtain a first temperature gradient difference between the chip clamp and the temperature control module and a second temperature gradient difference between the chip clamp and the first laser chip, wherein the temperature control module is a module for performing temperature control, the electronic control module is a module for performing power control, the first temperature gradient difference is a difference between the chip clamp and the temperature control module, and the second temperature gradient difference is a difference between the chip clamp and the first laser chip. In actual test, the laser chip needs to be loaded in a clamp, then a probe is used for being pressed on a pin of the chip to be powered on, then the clamp is installed on a heat sink, namely a temperature control module, the temperature of the clamp is further controlled by controlling the temperature of the heat sink, and the temperature of the chip is controlled by heat conduction of the clamp. In this heat-conducting chain, there is a temperature gradient between the heat sink, the holder, and the chip due to contact gaps and material differences, in other words, there is a temperature difference between the temperature of the heat sink and the actual temperature of the chip. An error check may thus be performed by obtaining the first temperature gradient difference and the second temperature gradient difference.
Step S500: respectively obtaining the first temperature gradient difference value and the second temperature gradient difference value, and obtaining a first influence degree and a second influence degree of the temperature of the first laser chip;
specifically, the first influence degree is an influence of the first temperature gradient difference value on the temperature of the first laser chip, the second influence degree is an influence of the second temperature gradient difference value on the temperature of the first laser chip, and the influence of the temperature gradient on the chip detection can be specifically known by obtaining the first influence degree and the second influence degree.
Step S600: sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range;
step S700: if the laser chips are all in the preset state, the spectrum tester is connected with the first laser chip after the real-time electrical parameter information of the first laser chip is obtained according to a first preset strategy;
specifically, the preset influence degree threshold range is a range in which both the first influence degree and the second influence degree are in a normal range, the detection of the chip is not greatly influenced, if the first influence degree and the second influence degree are both in a preset influence degree threshold range, it is indicated that the first and second influence levels do not have a large influence on the detection of the chip, and may be determined according to a first preset condition, namely when the test environment meets the condition, the spectrum tester is connected with the first laser chip after the real-time electrical parameter information of the first laser chip is obtained, the real-time electrical parameter information comprises parameter information such as current and voltage, a spectrum tester can be used for measuring light reflected by the surface of an object, and subsequent detection can be performed after the spectrum tester is connected with the first laser chip.
Step S800: according to the spectrum tester, in a first preset time period and according to a first preset frequency, obtaining real-time spectrum data information of the first laser chip;
specifically, the spectrum tester is an instrument for performing spectrum testing, is a scientific instrument for decomposing light with complex components into spectral lines, and is composed of a prism, a diffraction grating and the like, and a spectrometer can be used for measuring light rays reflected by the surface of an object. And detecting the spectrum of the laser according to the first preset time period and the first preset frequency, so as to obtain the real-time spectrum data information of the first laser chip.
Step S900: obtaining real-time luminous power information of the laser according to the first preset time period;
specifically, at preset time intervals, the computer program controls the multi-channel optical fiber MUX and the spectrometer to test the spectrum condition of the current laser, so that the light-emitting spectrum of the laser chip is continuously tested in the whole aging process, and the real-time light-emitting optical power information of the laser can be obtained according to the first preset time period and the real-time spectrum data information of the first laser chip, wherein the optical power is the work done by light in unit time.
Step S1000: obtaining real-time chip junction temperature information of the first laser chip according to the real-time luminous power information;
specifically, the junction temperature is an actual working temperature of a semiconductor in the electronic device, and in the whole test process, the current chip junction temperature of the laser can be accurately obtained by monitoring light intensity information of the laser and calculating through a computer program algorithm, so that the real-time chip junction temperature information of the first laser chip, namely the real-time chip temperature information of the first laser chip, can be obtained according to the real-time light power information.
Step S1100: obtaining preset chip junction temperature information of the first laser chip according to the first requirement information;
specifically, through the first requirement information, preset chip junction temperature information of the first laser chip, that is, preset temperature information of the first laser chip, can be obtained, and then real-time chip temperature information of the first laser chip is determined based on the preset chip junction temperature information of the first laser chip.
Step S1200: judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range or not;
step S1300: if so, acquiring a second operation command;
and S1400, according to the second operation command, after the real-time electrical parameter information and the real-time spectral data information are stored, marking a first label on the first laser chip, wherein the first label is a qualified test label.
Specifically, the real-time chip junction temperature information is judged, whether the real-time chip junction temperature information is within the preset chip junction temperature information range, whether the real-time chip junction temperature information exceeds the highest temperature of the preset chip junction temperature information range or is lower than the lowest temperature of the preset chip junction temperature information range is judged, when the real-time chip junction temperature information is within the preset chip junction temperature information range, the temperature is normal, a second operation command can be obtained, the second operation command is that after the real-time electrical parameter information and the real-time spectral data information are stored, a first label is marked on the first laser chip, the first label is a qualified test label, data support is provided for the subsequent checking of the marked laser chip by storing the real-time electrical parameter information and the real-time spectral data information, and when the temperature and the power supply meet the requirements of a test environment, the laser chip aging test device can not only carry out spectrum test on the laser chip, but also meet the requirement of aging test of the laser chip.
Judging whether the first testing environment information meets a first preset condition, wherein the step S300 further includes:
step S310: obtaining first image information of the first test environment;
step S320: inputting the first image information into a first neural network model, the first neural network model being trained using a plurality of sets of training data, each set of training data in the plurality of sets comprising: first image information and identification information identifying a first judgment result;
step S330: obtaining output information of the first neural network model, wherein the output information includes the first judgment result, and the first judgment result is result information of whether the first test environment information meets a first preset condition.
Specifically, the first image information is input into the first neural network model and is continuously trained, so that the output training result can be more accurate. The training model is a Neural network model, namely a Neural network model in machine learning, and a Neural Network (NN) is a complex Neural network system formed by widely interconnecting a large number of simple processing units (called neurons), reflects many basic characteristics of human brain functions, and is a highly complex nonlinear dynamical learning system. Neural network models are described based on mathematical models of neurons. Artificial Neural Networks (Artificial Neural Networks) are a description of the first-order properties of the human brain system. Briefly, it is a mathematical model. In the embodiment of the application, the first image information is input into a first neural network model, and the neural network model is trained by using the identified first judgment result information.
Further, the process of training the neural network model is substantially a process of supervised learning. The plurality of groups of training data are specifically: first image information and identification information identifying a first judgment result. The neural network model outputs the first judgment result by inputting the first image information, wherein the first judgment result is whether the first test environment information meets a first preset condition, the output information and the first judgment result information playing a role in identification are verified, and if the output information is consistent with the first judgment result information playing a role in identification, the data supervised learning is finished, and then the next group of data supervised learning is carried out; and if the output information is inconsistent with the information requirement of the first judgment result playing the role of identification, the neural network learning model adjusts itself until the output result of the neural network learning model is consistent with the information requirement of the first judgment result playing the role of identification, and then the supervised learning of the next group of data is carried out. The neural network learning model is continuously corrected and optimized through training data, the accuracy of the neural network learning model in processing the information is improved through the process of supervised learning, and the technical effect that whether the obtained first test environment information meets the result information of the first preset condition or not is more accurate is achieved.
Before connecting the spectrum tester to the first laser chip, step S700 further includes:
step S710: the testing equipment obtains a first temperature value sent by the temperature control module after heating the first laser chip through the temperature control module, wherein the first temperature value is the temperature of the chip clamp, and the chip clamp is connected with the temperature control module;
step S720: obtaining a preset temperature range of the first laser chip, wherein the preset temperature range comprises a first temperature upper limit value and a first temperature lower limit value;
step S730: judging whether the first temperature value meets the preset temperature range or not;
step S740: if so, performing power-up operation on the first laser chip through the electronic control module, and obtaining a first electrical parameter value sent by the electronic control module according to a second preset frequency;
step S750: obtaining a preset electrical parameter range of the first laser chip;
step S760: judging whether the first electrical parameter value meets the preset electrical parameter value;
step S770: and if so, connecting the spectrum tester with the first laser chip.
Specifically, the first temperature value is a temperature of the chip holder, the holder is a device for fixing a processing object to occupy a correct position for receiving construction or detection in a machine manufacturing process, the chip holder is connected to the temperature control module, after the first laser chip is heated by the temperature control module, the test equipment can obtain a first temperature value sent by the temperature control module, and further obtain a preset temperature range of the first laser chip, the preset temperature range includes a first temperature upper limit value and a first temperature lower limit value, and whether the first temperature value meets the preset temperature range is determined, because when the chip carrier is mounted on the heat sink and the heating module, the chip carrier is heated until the temperature is stabilized at a preset temperature value, power-up operation can be performed, that is, when the first temperature value meets the preset temperature range, the first laser chip is powered up through the electric control module, first electric parameter information sent by the electric control module is obtained according to a second preset frequency, the first electric parameter information comprises information such as current and voltage, a preset electric parameter range of the first laser chip is obtained, the preset electric parameter range comprises upper and lower extreme values of the current and upper and lower extreme values of the voltage, whether the first electric parameter value meets the preset electric parameter value is judged, namely the single chip microcomputer sets corresponding current and voltage values for each chip through the power-up control and current-voltage monitoring module, actual current and voltage values on chip pins are read back until the current and the voltage on the chip are stabilized at the preset current and voltage values, the spectrum tester is connected with the first laser chip, and the temperature control module and the electric control module are controlled, the information such as temperature, voltage and current is controlled within a preset range, and the spectrum tester is connected with the first laser chip, so that the technical effect of improving the testing efficiency of the laser chip is achieved.
In order to make the real-time temperature value and the real-time electrical parameter value satisfy a preset value range, the embodiment of the application further includes:
step 1210: obtaining a real-time temperature value of the first laser chip according to the first preset strategy;
step S1220: respectively judging whether the real-time temperature value meets the preset temperature range and whether the real-time electric parameter value meets the preset electric parameter value;
step S1230: when the real-time temperature value does not meet the preset temperature range and/or the real-time electric parameter value does not meet the preset electric parameter value, a first adjusting instruction is obtained;
step S1240: and adjusting the real-time temperature value and/or the real-time electric parameter value of the first laser chip according to the first adjusting instruction.
Specifically, in order to enable the real-time temperature value and the real-time electrical parameter value to meet a preset value range, after the real-time temperature value of the first laser chip is obtained according to the first preset strategy, whether the real-time temperature value meets the preset temperature range and whether the real-time electrical parameter value meets the preset electrical parameter value are respectively judged, and when three conditions that the real-time temperature value does not meet the preset temperature range, the real-time electrical parameter value does not meet the preset electrical parameter value, and neither the real-time temperature value nor the real-time electrical parameter value meets the preset value occur, a first adjustment instruction is obtained, wherein the first adjustment instruction is used for adjusting the real-time temperature value, the real-time electrical parameter value, the real-time temperature value and the real-time electrical parameter value of the first laser chip so that the real-time. It can be further understood that when the temperature, the current and the voltage exceed the upper limit or the lower limit configured in the test condition, the control circuit board needs to inform a computer through a communication interface, so that corresponding protective measures are taken, generally, the chip with the fault is cooled, the power is reduced, the fault reason is stored and an alarm is sent to inform relevant personnel, and then the technical effects of enabling the real-time temperature value and the real-time electrical parameter value to meet the preset value range and improving the test efficiency of the laser chip are achieved.
In order to maintain the junction temperature of the laser chip at a preset value, step S1200 further includes:
step 1210: when the real-time chip junction temperature information exceeds the preset chip junction temperature information range, obtaining a second adjustment instruction;
step S1220: and adjusting the real-time chip junction temperature information by the temperature control module according to the second adjustment instruction so that the real-time chip junction temperature information meets the preset chip junction temperature information range.
Specifically, whether the real-time chip junction temperature information is within the preset chip junction temperature information range or not is judged, and when the real-time chip junction temperature information exceeds the preset chip junction temperature information range, that is, the real-time chip junction temperature information exceeds the maximum value of the preset chip junction temperature information range, it can be further understood that when the laser is powered on to emit light, the laser chip junction temperature exceeds the preset value, obtaining a second adjustment instruction, wherein the second adjustment instruction is used for adjusting the real-time chip junction temperature information and taking measures such as temperature reduction and the like, adjusting the real-time chip junction temperature information by the temperature control module according to the second adjustment instruction so that the real-time chip junction temperature information meets the preset chip junction temperature information range, thereby achieving the technical effect of keeping the junction temperature of the laser chip at the preset value.
According to the spectrum tester, in a first preset time period and according to a first preset frequency, obtaining real-time spectrum data information of the first laser chip, wherein the step S800 further includes:
step S810: obtaining a first performance change of the first laser chip according to the real-time spectral data information;
step S820: judging whether the first performance change meets a third preset condition or not;
step S830: if not, obtaining a third operation command;
and step 840, stopping testing the first laser chip according to the third operation command, and sending alarm information to a worker.
Specifically, the real-time spectrum data information of the first laser chip may be obtained according to the spectrum tester within a first preset time period and according to a first predetermined frequency, and then the first performance change of the first laser chip may be obtained according to the real-time spectrum data information, that is, in the process of testing spectrum data, the change condition of the first performance parameter, such as an optical parameter, a color parameter, and the like, of the first laser chip is determined, whether the first performance change satisfies a third preset condition, that is, whether the first performance change is within a normal range is determined, if the first performance change does not satisfy the third preset condition, that is, the first performance change is not within the normal range, a third operation command is obtained, and then the test on the first laser chip is stopped according to the third operation command, and the alarm information of data abnormality is sent to the operator, and processing the abnormal state in the test process by judging whether the first performance change meets a third preset condition so as to further process, thereby achieving the technical effects of ensuring that the first performance of the first laser chip is kept stable and further improving the test efficiency of the laser chip.
In order to test the temperature data of a plurality of points and ensure that the data is true and reliable, the embodiment of the application further comprises:
step S1510: obtaining first request information;
step S1520: determining a plurality of test temperature points according to the first request information;
step S1530: obtaining a fourth operation command according to the plurality of test temperature points, wherein the fourth operation command is used for the temperature control module to sequentially adjust the first laser chip to the plurality of test temperature points;
step S1540: and obtaining the spectrum test result of the first laser chip under a plurality of test temperature points.
Specifically, the first request information is request information for performing a multi-point temperature test, a plurality of test temperature points are determined according to the first request information, and then a fourth operation command is obtained according to the plurality of test temperature points, the fourth operation command is used for the temperature control module to sequentially adjust the first laser chip to the plurality of test temperature points, it can be further understood that when the laser light emission spectrum conditions under different temperature conditions need to be tested, only a test program needs to be preset, the system can automatically complete temperature setting and execute the test, the whole process is the operation of automatically cycling for multiple times, and finally the spectrum test results of the first laser chip under the plurality of test temperature points are obtained, so that the technical effects of testing the temperature data of the plurality of points and ensuring the data to be true and reliable are achieved.
In order to ensure the security of the first tag information, an encryption operation based on a block chain is performed on the first tag information, and it is ensured that data is secure and reliable and is not tampered, the embodiment of the application further includes:
step S1410: generating a first verification code according to the first label information, wherein the first verification code corresponds to the first label information one to one;
step S1420: generating a second verification code according to the second label information and the first verification code, and generating an Nth verification code according to the Nth label information and the (N-1) th verification code by analogy, wherein the Nth verification code corresponds to the Nth label information one to one;
step S1430: and respectively copying and storing the label information and the verification codes on M electronic devices, wherein M is a natural number greater than 1.
Specifically, to ensure the security of the tag information and to ensure that it is not tampered with, a blockchain-based encryption operation may be performed. Generating a first verification code according to the first label information; generating a second verification code according to the second label information and the first verification code, and generating an Nth verification code according to the Nth label information and the (N-1) th verification code by analogy; and respectively copying and storing the label information and the verification codes on the M pieces of electronic equipment. And encrypting and storing the label information, wherein each device corresponds to one node, all the nodes are combined to form a block chain, and the block chain forms a total account book which is convenient for verification (the Hash value of the last block is verified to be equivalent to the verification of the whole version) and cannot be changed (the Hash value of all the following blocks can be changed by changing any transaction information, so that the transaction information cannot pass the verification).
The block chain system adopts a distributed data form, each participating node can obtain a complete database backup, and unless 51% of nodes in the whole system can be controlled simultaneously, modification of the database by a single node is invalid, and data contents on other nodes cannot be influenced. Therefore, the more nodes participating in the system, the more powerful the computation, and the higher the data security in the system. The encryption processing of the tag information based on the block chain effectively ensures the storage safety of the tag information, and achieves the technical effect of safely recording and storing the tag information.
To sum up, the method and the system for laser chip integration test provided by the embodiment of the present application have the following technical effects:
1. the temperature of the laser chip can be controlled through integrated test of the aging and the spectrum of the laser chip, the light-emitting spectrum of the laser chip at different temperatures can be tested, and the chip junction temperature of the laser chip can be accurately measured through the light-emitting power of the laser, so that the technical effects of improving the test efficiency and the degree of automation at the moment and reducing manual intervention are achieved.
2. The first image information is input into the first neural network model, so that the neural network learning model is continuously corrected and optimized, the accuracy of the neural network learning model for processing the information is improved through the process of supervised learning, and the technical effects of enabling the obtained result information whether the first test environment information meets the first preset condition to be more accurate and further improving the test efficiency of the laser chip are achieved.
Example two
Based on the same inventive concept as the method for laser chip integration test in the previous embodiment, the present invention also provides a system for laser chip integration test, as shown in fig. 2, the system comprising:
the first obtaining unit 11: the first obtaining unit 11 is configured to obtain first requirement information of a first laser chip, where the first laser chip is a chip to be tested;
the second obtaining unit 12: the second obtaining unit 12 is configured to obtain first test environment information of the first laser chip according to the first requirement information;
the first judgment unit 13: the first judging unit 13 is configured to judge whether the first testing environment information satisfies a first preset condition;
the third obtaining unit 14: the third obtaining unit 14 is configured to obtain a first operation command if the first preset condition is met, where the first operation command is used for obtaining a first temperature gradient difference value between a chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively performs heating and powering-on operations on the first laser chip through the temperature control module and the electronic control module;
the fourth obtaining unit 15: the fourth obtaining unit 15 is configured to obtain the first temperature gradient difference, the second temperature gradient difference, and a first influence degree and a second influence degree for the first laser chip temperature, respectively;
second determination unit 16: the second judging unit 16 is configured to sequentially judge whether the first influence degree and the second influence degree are within a preset influence degree threshold range;
the fifth obtaining unit 17: the fifth obtaining unit 17 is configured to, if both the first laser chip and the second laser chip are in the same state, obtain real-time electrical parameter information of the first laser chip according to a first preset policy, and then connect the spectrum tester with the first laser chip;
sixth obtaining unit 18: the sixth obtaining unit 18 is configured to obtain real-time spectral data information of the first laser chip according to the spectrum tester within a first preset time period and according to a first preset frequency;
the seventh obtaining unit 19: the seventh obtaining unit 19 is configured to obtain real-time light emitting optical power information of the laser according to the first preset time period;
the eighth obtaining unit 20: the eighth obtaining unit 20 is configured to obtain real-time chip junction temperature information of the first laser chip according to the real-time light emitting power information;
the ninth obtaining unit 21: the ninth obtaining unit 21 is configured to obtain preset chip junction temperature information of the first laser chip according to the first requirement information;
third judging unit 22: the third judging unit 22 is configured to judge whether the real-time chip junction temperature information is within the preset chip junction temperature information range;
the tenth obtaining unit 23: the tenth obtaining unit 23 is configured to, if yes, obtain a second operation command;
first storage unit 24: the first storage unit 24 is configured to print a first label on the first laser chip after storing the real-time electrical parameter information and the real-time spectral data information according to the second operation command, where the first label is a test-qualified label.
Further, the system further comprises:
an eleventh obtaining unit: the eleventh obtaining unit is configured to obtain first image information of the first test environment;
a first input unit: the first input unit is used for inputting the first image information into a first neural network model;
a twelfth obtaining unit: the twelfth obtaining unit is configured to obtain output information of the first neural network model.
Further, the system further comprises:
a thirteenth obtaining unit: the thirteenth obtaining unit is configured to obtain the first temperature value sent by the temperature control module after the test device heats the first laser chip through the temperature control module;
a fourteenth obtaining unit: the fourteenth obtaining unit is configured to obtain a preset temperature range of the first laser chip, where the preset temperature range includes a first upper temperature limit and a first lower temperature limit;
a fourth judging unit: the fourth judging unit is used for judging whether the first temperature value meets the preset temperature range or not;
a fifteenth obtaining unit: the fifteenth obtaining unit is configured to, if the first electrical parameter value is satisfied, perform power-up operation on the first laser chip through the electronic control module, and obtain a first electrical parameter value sent by the electronic control module according to a second predetermined frequency;
a sixteenth obtaining unit: the sixteenth obtaining unit is used for obtaining a preset electrical parameter range of the first laser chip;
a fifth judging unit: the fifth judging unit is used for judging whether the first electrical parameter value meets the preset electrical parameter value;
a first connection unit: the first connection unit is used for connecting the spectrum tester and the first laser chip if the first connection unit is satisfied.
Further, the system further comprises:
a seventeenth obtaining unit: the seventeenth obtaining unit is configured to obtain a real-time temperature value of the first laser chip according to the first preset policy;
a sixth judging unit: the sixth judging unit is used for respectively judging whether the real-time temperature value meets the preset temperature range and whether the real-time electric parameter value meets the preset electric parameter value;
a seventeenth obtaining unit: the seventeenth obtaining unit is configured to obtain a first adjustment instruction when the real-time temperature value does not satisfy the preset temperature range and/or the real-time electrical parameter value does not satisfy the preset electrical parameter value;
a first adjusting unit: the first adjusting unit is used for adjusting the real-time temperature value and/or the real-time electric parameter value of the first laser chip according to the first adjusting instruction.
Further, the system further comprises:
an eighteenth obtaining unit: the eighteenth obtaining unit is configured to obtain a second adjustment instruction when the real-time chip junction temperature information exceeds the preset chip junction temperature information range;
a second adjusting unit: the second adjusting unit is used for adjusting the real-time chip junction temperature information by the temperature control module according to the second adjusting instruction, so that the real-time chip junction temperature information meets the preset chip junction temperature information range.
Further, the system further comprises:
a nineteenth obtaining unit: the nineteenth obtaining unit is used for obtaining the first performance change of the first laser chip according to the real-time spectral data information;
a seventh judging unit: the seventh judging unit is used for judging whether the first performance change meets a third preset condition;
a twentieth obtaining unit: the twentieth obtaining unit is configured to obtain a third operation command if the first operation command does not satisfy the first operation command;
a first stopping unit: the first stopping unit is used for stopping the test of the first laser chip according to the third operation command and sending alarm information to a worker.
Further, the system further comprises:
a twenty-first obtaining unit: the twenty-first obtaining unit is configured to obtain first request information;
a first determination unit: the first determining unit is used for determining a plurality of test temperature points according to the first request information;
a twenty-second obtaining unit: the twenty-second obtaining unit is configured to obtain a fourth operation command according to the plurality of test temperature points, where the fourth operation command is used for the temperature control module to sequentially adjust the first laser chip to the plurality of test temperature points;
a twenty-third obtaining unit: the twenty-third obtaining unit is configured to obtain a spectrum test result of the first laser chip at a plurality of test temperature points.
Various variations and specific examples of a method for laser chip integration test in the first embodiment of fig. 1 are also applicable to a system for laser chip integration test in the present embodiment, and a method for implementing a system for laser chip integration test in the present embodiment is clear to those skilled in the art from the foregoing detailed description of a method for laser chip integration test, and therefore, for the brevity of the description, detailed description is omitted again.
EXAMPLE III
The electronic device of the embodiment of the present application is described below with reference to fig. 3.
Fig. 3 illustrates a schematic structural diagram of an electronic device according to an embodiment of the present application.
Based on the inventive concept of a method for laser chip integration testing as in the previous embodiments, the present invention also provides a system for laser chip integration testing, having stored thereon a computer program which, when being executed by a processor, carries out the steps of any one of the methods for laser chip integration testing as described above.
Where in fig. 3 a bus architecture (represented by bus 300), bus 300 may include any number of interconnected buses and bridges, bus 300 linking together various circuits including one or more processors, represented by processor 302, and memory, represented by memory 304. The bus 300 may also link together various other circuits such as peripherals, voltage regulators, power management circuits, and the like, which are well known in the art, and therefore, will not be described any further herein. A bus interface 305 provides an interface between the bus 300 and the receiver 301 and transmitter 303. The receiver 301 and the transmitter 303 may be the same element, i.e., a transceiver, providing a means for communicating with various other apparatus over a transmission medium. The processor 302 is responsible for managing the bus 300 and general processing, and the memory 304 may be used for storing data used by the processor 302 in performing operations.
The embodiment of the application provides a method for laser chip integration test, which is applied to an intelligent test system, wherein the intelligent test system is provided with a test device, the test device is provided with a temperature control module, an electric control module and a chip clamp, the test device is in communication connection with a spectrum tester, and the method comprises the following steps: acquiring first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested; acquiring first test environment information of the first laser chip according to the first requirement information; judging whether the first test environment information meets a first preset condition or not; if the first preset condition is met, obtaining a first operation command, wherein the first operation command is used for obtaining a first temperature gradient difference value between the chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively heats and powers on the first laser chip through the temperature control module and the electric control module; respectively obtaining the first temperature gradient difference value and the second temperature gradient difference value, and obtaining a first influence degree and a second influence degree of the temperature of the first laser chip; sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range; if the laser chips are all in the preset state, the spectrum tester is connected with the first laser chip after the real-time electrical parameter information of the first laser chip is obtained according to a first preset strategy; according to the spectrum tester, in a first preset time period and according to a first preset frequency, obtaining real-time spectrum data information of the first laser chip; obtaining real-time luminous power information of the laser according to the first preset time period; obtaining real-time chip junction temperature information of the first laser chip according to the real-time luminous power information; obtaining preset chip junction temperature information of the first laser chip according to the first requirement information; judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range or not; if so, acquiring a second operation command; and according to the second operation command, after the real-time electrical parameter information and the real-time spectral data information are stored, marking a first label on the first laser chip, wherein the first label is a qualified test label.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A method for laser chip integration test is applied to an intelligent test system, the intelligent test system is provided with a test device, the test device is provided with a temperature control module, an electric control module and a chip clamp, and the test device is in communication connection with a spectrum tester, wherein the method comprises the following steps:
acquiring first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested;
acquiring first test environment information of the first laser chip according to the first requirement information;
judging whether the first test environment information meets a first preset condition or not;
if the first preset condition is met, obtaining a first operation command, wherein the first operation command is used for obtaining a first temperature gradient difference value between the chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively heats and powers on the first laser chip through the temperature control module and the electric control module;
respectively obtaining the first temperature gradient difference value and the second temperature gradient difference value, and obtaining a first influence degree and a second influence degree of the temperature of the first laser chip;
sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range;
if the laser chips are all in the preset state, the spectrum tester is connected with the first laser chip after the real-time electrical parameter information of the first laser chip is obtained according to a first preset strategy;
according to the spectrum tester, in a first preset time period and according to a first preset frequency, obtaining real-time spectrum data information of the first laser chip;
obtaining real-time luminous power information of the laser according to the first preset time period;
obtaining real-time chip junction temperature information of the first laser chip according to the real-time luminous power information;
obtaining preset chip junction temperature information of the first laser chip according to the first requirement information;
judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range or not;
if so, acquiring a second operation command;
and according to the second operation command, after the real-time electrical parameter information and the real-time spectral data information are stored, marking a first label on the first laser chip, wherein the first label is a qualified test label.
2. The method of claim 1, wherein the determining whether the first test environment information satisfies a first preset condition comprises:
obtaining first image information of the first test environment;
inputting the first image information into a first neural network model, the first neural network model being trained using a plurality of sets of training data, each set of training data in the plurality of sets comprising: first image information and identification information identifying a first judgment result;
obtaining output information of the first neural network model, wherein the output information includes the first judgment result, and the first judgment result is result information of whether the first test environment information meets a first preset condition.
3. The method of claim 1, wherein prior to said connecting said spectral tester to said first laser chip, said method further comprises:
the testing equipment obtains a first temperature value sent by the temperature control module after heating the first laser chip through the temperature control module, wherein the first temperature value is the temperature of the chip clamp, and the chip clamp is connected with the temperature control module;
obtaining a preset temperature range of the first laser chip, wherein the preset temperature range comprises a first temperature upper limit value and a first temperature lower limit value;
judging whether the first temperature value meets the preset temperature range or not;
if so, performing power-up operation on the first laser chip through the electronic control module, and obtaining a first electrical parameter value sent by the electronic control module according to a second preset frequency;
obtaining a preset electrical parameter range of the first laser chip;
judging whether the first electrical parameter value meets the preset electrical parameter value;
and if so, connecting the spectrum tester with the first laser chip.
4. The method of claim 1, wherein the method further comprises:
obtaining a real-time temperature value of the first laser chip according to the first preset strategy;
respectively judging whether the real-time temperature value meets the preset temperature range and whether the real-time electric parameter value meets the preset electric parameter value;
when the real-time temperature value does not meet the preset temperature range and/or the real-time electric parameter value does not meet the preset electric parameter value, a first adjusting instruction is obtained;
and adjusting the real-time temperature value and/or the real-time electric parameter value of the first laser chip according to the first adjusting instruction.
5. The method of claim 1, wherein the method further comprises:
when the real-time chip junction temperature information exceeds the preset chip junction temperature information range, obtaining a second adjustment instruction;
and adjusting the real-time chip junction temperature information by the temperature control module according to the second adjustment instruction so that the real-time chip junction temperature information meets the preset chip junction temperature information range.
6. The method of claim 1, wherein the obtaining real-time spectral data information of the first laser chip at a first predetermined frequency for a first predetermined time period based on the spectral tester, the method further comprises:
obtaining a first performance change of the first laser chip according to the real-time spectral data information;
judging whether the first performance change meets a third preset condition or not;
if not, obtaining a third operation command;
and stopping testing the first laser chip according to the third operation command, and sending alarm information to a worker.
7. The method of claim 1, wherein the method further comprises:
obtaining first request information;
determining a plurality of test temperature points according to the first request information;
obtaining a fourth operation command according to the plurality of test temperature points, wherein the fourth operation command is used for the temperature control module to sequentially adjust the first laser chip to the plurality of test temperature points;
and obtaining the spectrum test result of the first laser chip under a plurality of test temperature points.
8. A system for laser chip integration testing, wherein the system comprises:
a first obtaining unit: the first obtaining unit is used for obtaining first requirement information of a first laser chip, wherein the first laser chip is a chip to be tested;
a second obtaining unit: the second obtaining unit is used for obtaining first test environment information of the first laser chip according to the first requirement information;
a first judgment unit: the first judging unit is used for judging whether the first testing environment information meets a first preset condition or not;
a third obtaining unit: the third obtaining unit is configured to obtain a first operation command if the first preset condition is met, where the first operation command is used for obtaining a first temperature gradient difference value between a chip clamp and the temperature control module and a second temperature gradient difference value between the chip clamp and the first laser chip after the test equipment respectively performs heating and power-up operations on the first laser chip through the temperature control module and the electronic control module;
a fourth obtaining unit: the fourth obtaining unit is configured to obtain the first temperature gradient difference, the second temperature gradient difference, and a first influence degree and a second influence degree on the temperature of the first laser chip, respectively;
a second judgment unit: the second judging unit is used for sequentially judging whether the first influence degree and the second influence degree are in a preset influence degree threshold range;
a fifth obtaining unit: the fifth obtaining unit is used for connecting the spectrum tester with the first laser chip after obtaining the real-time electrical parameter information of the first laser chip according to a first preset strategy if the first laser chip is in the first preset strategy;
a sixth obtaining unit: the sixth obtaining unit is configured to obtain real-time spectral data information of the first laser chip according to the spectrum tester within a first preset time period and according to a first preset frequency;
a seventh obtaining unit: the seventh obtaining unit is used for obtaining real-time luminous optical power information of the laser according to the first preset time period;
an eighth obtaining unit: the eighth obtaining unit is configured to obtain real-time chip junction temperature information of the first laser chip according to the real-time light emitting power information;
a ninth obtaining unit: the ninth obtaining unit is configured to obtain preset chip junction temperature information of the first laser chip according to the first requirement information;
a third judging unit: the third judging unit is used for judging whether the real-time chip junction temperature information is within the preset chip junction temperature information range;
a tenth obtaining unit: the tenth obtaining unit is used for obtaining a second operation command if the operation command is in the first operation command;
a first storage unit: and the first storage unit is used for marking a first label on the first laser chip after storing the real-time electrical parameter information and the real-time spectral data information according to the second operation command, wherein the first label is a qualified test label.
9. A system for laser chip integration testing comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the steps of the method of any one of claims 1 to 7 are implemented when the program is executed by the processor.
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