CN112146796A - Flexible stress sensor and preparation method thereof - Google Patents
Flexible stress sensor and preparation method thereof Download PDFInfo
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- CN112146796A CN112146796A CN202010980512.4A CN202010980512A CN112146796A CN 112146796 A CN112146796 A CN 112146796A CN 202010980512 A CN202010980512 A CN 202010980512A CN 112146796 A CN112146796 A CN 112146796A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
Abstract
The invention discloses a flexible stress sensor which comprises a strain sensing layer, an electrode and a flexible packaging layer, wherein the strain sensing layer is electrically connected with the electrode, the flexible packaging layer wraps the strain sensing layer and the electrode, the electrode comprises silver paste and a lead, one end of the lead is bonded to the strain sensing layer through the silver paste, and the other end of the lead is led to the outside of the flexible packaging layer. The preparation method of the flexible stress sensor comprises the following steps: coating the graphene ink on a lower-layer flexible polymer substrate, and naturally drying the graphene ink to form a graphene film; coating silver paste on two ends of the graphene film respectively, bonding one end of the lead on the silver paste coated on one end of the graphene film, and leading the other end of the lead to the outside of the flexible packaging layer; and the flexible polymer substrate is used for insulating and packaging the naturally air-dried graphene film and the electrode. The invention has low cost, simple and easy operation and good durability, and can adapt to large-scale production regardless of the size.
Description
Technical Field
The invention belongs to the field of sensors, and particularly relates to a flexible stress sensor and a preparation method thereof.
Background
In recent years, with the continuous development of flexible wearable electronics, flexible stress sensors have been developed effectively as basic detection units of flexible wearable devices. The flexible stress sensor has the characteristics of large measurable strain range, high sensitivity, stability, convenience in processing and the like. However, there is a contradiction between the measurable strain range and the sensitivity, and when the measurable strain range of the sensor is sufficiently large, the sensitivity of the sensor to response to a slight stress tends to be poor; while when the sensitivity of the sensor is high, it tends to be out of the measurable range of the sensor at strains greater than 30%. Therefore, how to solve the contradiction between the measurable strain range and the sensitivity, and realizing a wide strain range and high sensitivity becomes a difficulty in the current research of flexible stress sensors.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a flexible stress sensor and a preparation method thereof, the flexible stress sensor can realize large strain range, high sensitivity and large-scale application, and can be applied to the fields of human body physiological monitoring, flexible electronic equipment and the like.
The invention adopts the following technical scheme:
the utility model provides a flexible stress sensor, its characterized in that, the sensor is including straining response layer (1), electrode and flexible encapsulating layer, strain response layer (1) with the electrode electricity is connected, flexible encapsulating layer includes upper flexible polymer base (2) and lower floor flexible polymer base (3), flexible encapsulating layer parcel strain response layer (1) the electrode, the electrode includes silver thick liquid (4) and wire (5), the one end of wire (5) is passed through silver thick liquid (4) and is bonded on straining response layer (1), the other end of wire (5) is introduced flexible encapsulating layer's outside.
The flexible stress sensor is characterized in that the strain sensing layer (1) is a graphene film with a multilayer structure, and the graphene film is obtained by coating graphene ink, and the graphene ink is composed of high-conductivity thin-layer graphene micro-sheets.
The flexible stress sensor is characterized in that the sheet diameter of the high-conductivity thin-layer graphene microchip is 1-5 μm.
The flexible stress sensor is characterized in that the flexible packaging layer is made of high-molecular polymer platinum catalytic silicone rubber.
The flexible stress sensor is characterized in that the sensitivity coefficient of the flexible stress sensor is 592-715, and the strain range of the flexible stress sensor when the flexible stress sensor is stretched is 50% -65%.
The preparation method of the flexible stress sensor is characterized by comprising the following steps of:
step (I): coating the graphene ink on a lower-layer flexible polymer substrate, and naturally drying the graphene ink to form a graphene film;
step (II): coating silver paste on two ends of the graphene film respectively, taking a first lead and a second lead, bonding one end of the first lead to the silver paste coated on one end of the graphene film, and leading the other end of the first lead to the outside of the flexible packaging layer; bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and leading the other end of the second lead to the outside of the flexible packaging layer;
step (three): insulating and packaging the naturally air-dried graphene film and the electrode by adopting an upper-layer flexible polymer substrate; the insulation packaging comprises the following processes: bonding one end of a first lead to the silver paste coated on one end of the graphene film, drying at 65-75 ℃ for 30-60 min, bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and drying at 65-75 ℃ for 30-60 min; preparing a flexible packaging layer material into a flexible packaging layer material solution; and curing the flexible packaging layer material solution for 15-30 min, packaging the graphene film, the silver paste and the lead, and demolding after curing to obtain the flexible stress sensor.
The preparation method of the flexible stress sensor is characterized in that the flexible packaging layer is made of high-molecular polymer platinum-catalyzed silicone rubber, the high-molecular polymer platinum-catalyzed silicone rubber comprises a platinum-catalyzed silicone rubber substrate and a platinum-catalyzed silicone rubber curing agent, and the mass ratio of the platinum-catalyzed silicone rubber substrate to the platinum-catalyzed silicone rubber curing agent is 1: 1.
the invention has the beneficial technical effects that: the flexible stress sensor is simple in preparation process and suitable for large-scale popularization and application; the flexible film stress sensor has the characteristics of light weight, high flexibility, high mechanical strength, excellent response sensitivity and the like, and has wide application prospects in wearable electronic equipment and industrial detection. According to the method, the flexible stress sensor is prepared by adopting the low-cost graphene ink in a coating mode, and the sensitivity of the stress sensor is improved by utilizing the abundant characteristics of the multi-lamellar structure of the graphene ink; meanwhile, the graphene film is packaged by the flexible packaging layer, the sensing characteristic can be realized in a large strain range, the graphene film is good in durability, large in strain range during stretching and high in sensitivity, can be flexibly and conveniently attached to surfaces with various shapes, is light in weight and has strong environmental adaptability, and the method is low in cost, simple and easy to implement, and can be suitable for large-scale production regardless of size.
Drawings
FIG. 1 is a schematic structural diagram of a flexible stress sensor of the present invention;
FIG. 2 is a scanning electron microscope image of a multilayer structure of a graphene thin film prepared according to the present invention;
FIG. 3 is a graph of the change in the coefficient of sensitivity of the flexible stress sensor of the present invention at different strains;
FIG. 4 is a graph of the cyclic stability of the flexible stress sensor of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4;
FIG. 6 is a diagram of the flexible stress sensor of the present invention for detecting the variation of the wrist pulse signal;
FIG. 7 is a graph of the change in throat voicing signal detection for the flexible stress sensor of the present invention;
fig. 8 is a diagram of the flexible stress sensor of the invention for detecting the change of elbow bending signals.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments, but is not meant to limit the scope of the present invention.
Referring to fig. 1, the flexible stress sensor of the present invention includes a strain sensing layer, an electrode and a flexible packaging layer, wherein the strain sensing layer is a graphene film with a multilayer structure obtained by coating graphene ink, and the graphene ink has characteristics of good conductivity, easy acquisition and wide application range. Fig. 2 is a scanning electron microscope image of a multilayer structure of the graphene film, and as can be seen from fig. 2, graphene nanoplatelets are staggered to form the multilayer structure film. The strain sensing layer is formed by using the graphene ink, the sensitivity of the flexible stress sensor is improved by utilizing the abundant characteristics of the multi-sheet structure of the graphene ink, the sensing characteristic can be realized under the condition of large strain, and meanwhile, the method is low in cost, simple, convenient and feasible, and can be suitable for large-scale production regardless of the size. The graphene ink consists of high-conductivity thin-layer graphene micro-sheets, and the sheet diameter of the high-conductivity thin-layer graphene micro-sheets is 1-5 microns. Strain response layer and electrode electricity and be connected, flexible packaging layer includes flexible polymer base in upper strata and the flexible polymer base of lower floor, and flexible packaging layer wraps up strain response layer, electrode, and the electrode includes silver thick liquid and wire, and the one end of wire is passed through the silver thick liquid and is bonded on strain response layer, and the other end of wire is introduced the outside of flexible packaging layer. The flexible packaging layer is made of a material which can deform greatly under the action of tensile force and recovers the original shape after the tensile force disappears. Fig. 3 shows the sensing performance of the prepared flexible stress sensor under different strains, and as can be seen from fig. 3, the prepared graphene film stress sensor has a wider strain response range and high response sensitivity; the sensitivity coefficient of the flexible stress sensor is 592-715, and the strain range of the flexible stress sensor when the flexible stress sensor is stretched is 50% -65%. The sensor can be used in the field of industrial monitoring or human physiology monitoring.
The sensitivity coefficient can be calculated by the following method: clamping a stress sensor sample on two sides of an electric displacement table, reading the moving distance of the displacement table, measuring the real-time resistance of the film sample through a digital source meter, and then calculating according to the following formula to obtain the stress sensor sample:
GF＝(ΔR/R)/(ΔL/L)
wherein GF represents a sensitivity coefficient; r represents an initial resistance (Ω); Δ R represents a relative resistance change (Ω); l represents an initial length (mm); Δ L represents the relative length change (mm).
Fig. 4 shows the cycling stability of the flexible stress sensor at 40% strain, and it can be seen from fig. 4 that the prepared flexible stress sensor has excellent cycling stability. The flexible stress sensor can be used in the field of industrial monitoring or human body physiological monitoring, for example, can be widely applied in the fields of pulse detection, sound signal identification, joint bending detection and the like. Fig. 5 is an enlarged view of a portion of fig. 4. FIG. 6 is a diagram of the flexible stress sensor of the present invention for detecting the variation of the wrist pulse signal; FIG. 7 is a graph of the change in throat voicing signal detection for the flexible stress sensor of the present invention; fig. 8 is a diagram of the flexible stress sensor of the invention for detecting the change of elbow bending signals. As can be seen from the figures 6-8, the prepared flexible stress sensor can well detect characteristic physiological signals of human body, such as pulse, sound, joint bending and the like.
The preparation method of the flexible stress sensor comprises the following steps: step (1): adopting graphene ink as an initial raw material; and coating the graphene ink on the lower-layer flexible polymer substrate, and naturally drying the graphene ink to form a graphene film. Step (2): coating silver paste on two ends of the graphene film respectively, taking a first lead and a second lead, bonding one end of the first lead to the silver paste coated on one end of the graphene film, and leading the other end of the first lead to the outside of the flexible packaging layer; and bonding one end of the second lead on the silver paste coated on the other end of the graphene film, and leading the other end of the second lead to the outside of the flexible packaging layer. And (3): insulating and packaging the naturally air-dried graphene film and the electrode by adopting an upper-layer flexible polymer substrate; the insulation packaging comprises the following processes: bonding one end of a first lead to the silver paste coated on one end of the graphene film, drying at 65-75 ℃ for 30-60 min, bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and drying at 65-75 ℃ for 30-60 min; mixing a flexible packaging layer material and a curing agent in a volume ratio of 1:1 to obtain a solution of the flexible packaging layer material; and pouring the solution of the flexible packaging layer material into a round vessel, curing for 15-30 min, packaging the graphene film, the silver paste and the lead, and demolding after curing to obtain the flexible stress sensor. The flexible packaging layer is made of high-molecular polymer platinum-catalyzed silicone rubber, the high-molecular polymer platinum-catalyzed silicone rubber comprises a platinum-catalyzed silicone rubber substrate and a platinum-catalyzed silicone rubber curing agent, and the mass ratio of the platinum-catalyzed silicone rubber substrate to the platinum-catalyzed silicone rubber curing agent is 1: 1.
example 1
Coating graphene ink consisting of high-conductivity thin-layer graphene micro-sheets on a lower-layer flexible polymer substrate, and naturally drying the graphene ink to form a graphene film. The sheet diameter of the graphene nanoplatelets with high conductivity is about 2 μm. Coating silver paste on two ends of the graphene film respectively, taking a first lead and a second lead, bonding one end of the first lead to the silver paste coated on one end of the graphene film, and leading the other end of the first lead to the outside of the flexible packaging layer; and bonding one end of the second lead on the silver paste coated on the other end of the graphene film, and leading the other end of the second lead to the outside of the flexible packaging layer. Insulating and packaging the naturally air-dried graphene film and the electrode by adopting an upper-layer flexible polymer substrate; the insulation packaging comprises the following processes: bonding one end of a first lead to the silver paste coated on one end of the graphene film, and then drying at 65 ℃ for 60min, bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and then drying at 65 ℃ for 60 min; preparing high-molecular polymer platinum-catalyzed silicone rubber into a high-molecular polymer platinum-catalyzed silicone rubber solution, wherein the high-molecular polymer platinum-catalyzed silicone rubber comprises a platinum-catalyzed silicone rubber substrate and a platinum-catalyzed silicone rubber curing agent, and the mass ratio of the platinum-catalyzed silicone rubber substrate to the platinum-catalyzed silicone rubber curing agent is 1: 1. and curing the high-molecular polymer platinum-catalyzed silicon rubber solution for 15min, packaging the graphene film, the silver paste and the lead, and demolding after curing to obtain the flexible stress sensor. The sensitivity coefficient of the flexible stress sensor obtained in example 1 was 645, and the strain range of the flexible stress sensor when stretched was 52%.
Example 2
Coating graphene ink consisting of high-conductivity thin-layer graphene micro-sheets on a lower-layer flexible polymer substrate, and naturally drying the graphene ink to form a graphene film. The sheet diameter of the high-conductivity thin-layer graphene microchip is 5 micrometers. Coating silver paste on two ends of the graphene film respectively, taking a first lead and a second lead, bonding one end of the first lead to the silver paste coated on one end of the graphene film, and leading the other end of the first lead to the outside of the flexible packaging layer; and bonding one end of the second lead on the silver paste coated on the other end of the graphene film, and leading the other end of the second lead to the outside of the flexible packaging layer. Insulating and packaging the naturally air-dried graphene film and the electrode by adopting an upper-layer flexible polymer substrate; the insulation packaging comprises the following processes: bonding one end of a first lead to the silver paste coated on one end of the graphene film, and then drying at 65 ℃ for 60min, bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and then drying at 65 ℃ for 60 min; preparing high-molecular polymer platinum-catalyzed silicone rubber into a high-molecular polymer platinum-catalyzed silicone rubber solution, wherein the high-molecular polymer platinum-catalyzed silicone rubber comprises a platinum-catalyzed silicone rubber substrate and a platinum-catalyzed silicone rubber curing agent, and the mass ratio of the platinum-catalyzed silicone rubber substrate to the platinum-catalyzed silicone rubber curing agent is 1: 1. and curing the high-molecular polymer platinum-catalyzed silicon rubber solution for 15min, packaging the graphene film, the silver paste and the lead, and demolding after curing to obtain the flexible stress sensor. The sensitivity coefficient of the flexible stress sensor obtained in example 1 was 715, and the strain range of the flexible stress sensor when it was stretched was 57%.
Claims (7)
1. The utility model provides a flexible stress sensor, its characterized in that, the sensor is including straining response layer (1), electrode and flexible encapsulating layer, strain response layer (1) with the electrode electricity is connected, flexible encapsulating layer includes upper flexible polymer base (2) and lower floor flexible polymer base (3), flexible encapsulating layer parcel strain response layer (1) the electrode, the electrode includes silver thick liquid (4) and wire (5), the one end of wire (5) is passed through silver thick liquid (4) and is bonded on straining response layer (1), the other end of wire (5) is introduced flexible encapsulating layer's outside.
2. The flexible stress sensor according to claim 1, wherein the strain sensitive layer (1) is a graphene film with a multilayer structure coated with a graphene ink consisting of highly conductive thin-layer graphene micro-sheets.
3. The flexible stress sensor of claim 2, wherein the highly conductive thin-layer graphene micro-sheets have a sheet diameter of 1-5 μm.
4. The flexible stress sensor of claim 1, wherein the flexible encapsulation layer is made of high molecular polymer platinum catalyzed silicone rubber.
5. The flexible stress sensor of claim 1, wherein the flexible stress sensor has a sensitivity coefficient ranging from 592 to 715, and wherein the flexible stress sensor has a strain in tension ranging from 50% to 65%.
6. A method for preparing a flexible stress sensor according to claim 1, wherein the method comprises the following steps:
step (I): coating the graphene ink on a lower-layer flexible polymer substrate, and naturally drying the graphene ink to form a graphene film;
step (II): coating silver paste on two ends of the graphene film respectively, taking a first lead and a second lead, bonding one end of the first lead to the silver paste coated on one end of the graphene film, and leading the other end of the first lead to the outside of the flexible packaging layer; bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and leading the other end of the second lead to the outside of the flexible packaging layer;
step (three): insulating and packaging the naturally air-dried graphene film and the electrode by adopting an upper-layer flexible polymer substrate; the insulation packaging comprises the following processes: bonding one end of a first lead to the silver paste coated on one end of the graphene film, drying at 65-75 ℃ for 30-60 min, bonding one end of a second lead to the silver paste coated on the other end of the graphene film, and drying at 65-75 ℃ for 30-60 min; preparing a flexible packaging layer material into a flexible packaging layer material solution; and curing the flexible packaging layer material solution for 15-30 min, packaging the graphene film, the silver paste and the lead, and demolding after curing to obtain the flexible stress sensor.
7. The method for preparing the flexible stress sensor according to claim 6, wherein the flexible packaging layer is made of high-molecular polymer platinum-catalyzed silicone rubber, the high-molecular polymer platinum-catalyzed silicone rubber comprises a platinum-catalyzed silicone rubber substrate and a platinum-catalyzed silicone rubber curing agent, and the mass ratio of the platinum-catalyzed silicone rubber substrate to the platinum-catalyzed silicone rubber curing agent is 1: 1.
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Application publication date: 20201229 |